Nitride-Based High-Power Flip-Chip LED With Double-Side Patterned Sapphire Substrate

A nitride-based high-power flip-chip (FC) light-emitting diode (LED) with a double-side patterned sapphire substrate (PSS) was proposed and realized. Under 350-mA current injection, it was found that forward voltages were 3.24, 3.26, and 3.25 V for the conventional FC LED, FC LED prepared on PSS, and FC LED with double-side PSS, respectively. It was found that the 350-mA LED output powers were 79.3, 98.1, and 121.5 mW for the conventional FC LED, FC LED prepared on PSS, and FC LED with double-side PSS, respectively. In other words, we can enhance the electroluminescence intensity by 53% without increasing operation voltage of the fabricated LED     

图形化蓝宝石衬底形貌对GaN基LED出光性能的影响

近年来,图形化蓝宝石衬底(PSS)作为GaN基LED外延衬底材料被广泛应用.通过干法刻蚀和湿法腐蚀制备了不同规格和形状的蓝宝石衬底图形,并进行外延生长、芯片制备和封装验证,采用扫描电子显微镜(SEM)和3D轮廓仪进行形貌表征,研究了不同规格和形状的衬底图形对LED芯片出光性能影响,并与外购锥形衬底(PSSZ2)进行对比.结果表明,在20 mA工作电流下,PSSZ2的LED光通量为8.33 lm.采用类三角锥和盾形衬底的LED光通量分别为7.83 lm和7.67 lm,分别比PSSZ2衬底低6.00％和7.92％.对锥形形貌进行优化,采用高1.69 μm、直径2.62 μm、间距0.42 μm的锥形衬底(PSSZ3)的LED光通量为8.67 lm,比PSSZ2衬底高4.08％,优化的PSSZ3能有效地提高LED出光性能.     

Effect of Residual Stress and Sidewall Emission of InGaN-Based LED by Varying Sapphire Substrate Thickness

The effect of residual stress and the sidewall emission in InGaN–GaN films with different thickness of sapphire substrate were investigated. The peak wavelength of electroluminescence was blue-shifted as thinning the sapphire substrate, because the wafer bowing-induced mechanical stress alters the piezoelectric field in the InGaN–GaN multiple quantum-well active region of the light-emitting diode (LED). A sideview LED with 170-$muhbox{m}$ -thick sapphire exhibited the highest output power of 14.04 mW at a forward current of 20 mA, improved by 7% compared to that with 80-$muhbox{m}$-thick sapphire. The maximum output power can be obtained by considering both the photon escaping probability from the edges of the sapphire and the photon absorption probability in the sapphire as well as the residual mechanical stress induced by the wafer bowing.      

蓝宝石衬底nm级CMP技术研究

介绍了蓝宝石衬底的化学机械抛光工艺,讨论分析了影响蓝宝石衬底化学机械抛光的因素,定量确定了最佳CMP工艺。提出先以重抛过程提高蓝宝石抛光速率,然后以轻抛过程降低最终表面粗糙度的工艺路线。在配制抛光液时加入FA/OⅠ型活性剂保护SiO2胶粒的双电子层结构。在轻抛过程之前抛光垫用原液浸泡20～30min,抛光磨料直径为20～40nm。实验最佳工艺条件下的抛光速率达231.6nm/min,粗糙度降至0.34nm。     

Enhancement of InGaN-Based Vertical LED With Concavely Patterned Surface Using Patterned Sapphire Substrate

To improve the external quantum efficiency, we have proposed a new method utilizing surface roughening of vertical-type light-emitting diodes (VT-LEDs) fabricated on hemispherical patterned sapphire substrate by using a laser lift-off technique. The advantages of this method are simple and reproducible in transferring the well-defined patterns on sapphire into GaN layer. The VT-LED with concavely patterned surface showed a nearly twofold increase in the output power compared to the normal planar surface. This improvement in the VT-LED performances is attributed to the increase in the escaping probability of photons from the LED surface.     

蓝宝石衬底上HVPE-GaN厚膜生长

采用氢化物气相外延(HVPE)方法,以蓝宝石作衬底,分别在MOCVD-GaN模板和蓝宝石衬底上直接外延生长GaN.模板上的GaN生长表面平整、光亮,但开裂严重.其(0002)的双晶衍射半高宽最低为141″;蓝宝石衬底上直接生长GaN外延层质量较差,其双晶衍射半高宽为1688″,但不发生开裂.HCl的载气流量对预反应有很大的影响.应力产生于外延层和衬底之间的界面处,界面孔洞的存在可以释放应力,减少开裂.光致发光(PL)谱中氧杂质引起强黄光发射.     

蓝宝石衬底上HVPE-GaN厚膜生长

采用氢化物气相外延(HVPE)方法,以蓝宝石作衬底,分别在MOCVD-GaN模板和蓝宝石衬底上直接外延生长GaN.模板上的GaN生长表面平整、光亮,但开裂严重.其(0002)的双晶衍射半高宽最低为141″;蓝宝石衬底上直接生长GaN外延层质量较差,其双晶衍射半高宽为1688″,但不发生开裂.HCl的载气流量对预反应有很大的影响.应力产生于外延层和衬底之间的界面处,界面孔洞的存在可以释放应力,减少开裂.光致发光(PL)谱中氧杂质引起强黄光发射.     

Coupled Slots on an Anisotropic Sapphire Substrate

Two analytical approaches are presented for coupled slots on an anisotropic sapphire substrate using the network analytical methods of electromagnetic fields. One is based on the quasi-static approximation and it derives the transformation from the case with the anisotropic substrate to the case with the isotropic substrate. The other is based on the hybrid mode formulation and it gives the dispersion characteristics.     

表面处理对蓝宝石衬底的影响

采用熔融的KOH溶液腐蚀蓝宝石衬底,获得具有三角形图案的腐蚀坑形貌,并对腐蚀坑的三角形形状给出了理论解释。在不同温度和不同的腐蚀时间进行对比结果分析,发现在280℃下腐蚀60 min左右,显示的位错清晰、准确,且最适合随后的横向外延生长。采用高分辨率双晶X线衍射(DCXRD)测试分析,结果表明,预处理对蓝宝石衬底的晶体质量和折射率色散关系几乎没影响,所以,预处理获得一定图案的蓝宝石可作为GaN横向外延的衬底,为降低GaN薄膜的位错密度,获得高质量的GaN薄膜提供有利的保障。     

Comparison of InGaN-Based LEDs Grown on Conventional Sapphire and Cone-Shape-Patterned Sapphire Substrate

To improve the external quantum efficiency, a high-quality InGaN/GaN film was grown on a cone-shape-patterned sapphire substrate (CSPSS) by using metal-organic chemical vapor deposition. The surface pattern of the CSPSS seems to be more helpful for the accommodative relaxation of compressive strain related to the lattice mismatch between GaN and a sapphire substrate because the growth mode of GaN on the CSPSS was similar to that of the epitaxial lateral overgrowth. The output power of a light-emitting diode (LED) grown on the CSPSS was estimated to be 16.5 mW at a forward current of 20 mA, which is improved by 35% compared to that of a LED grown on a conventional sapphire substrate. The significant enhancement in output power is attributed to both the increase of the extraction efficiency, resulted from the increase in photon escaping probability due to enhanced light scattering at the CSPSS, and the improvement of the crystal quality due to the reduction of dislocation.     

Polymer Inverter Fabricated by Inkjet Printing and Realized by Transistors Arrays on Flexible Substrates

We have fabricated organic thin-film transistors (OTFTs) and implemented inverters on flexible substrates using polythiophene (PHT) as the semiconductor and polyvinylphenol (PVP) as the gate dielectric. The semiconductor was defined by inkjet printing. The poor consistency of the printing process has affected the uniformity of inkjet-printed OTFTs enormously. We also proposed a method to increase the yield by incorporating a pre-testing step during circuit fabrication. We designed and fabricated a basic unit of circuits called a thin-film transistor (TFT) array. These devices were then connected to each other to form a gate via printed nano-silver. To verify the implementation flow, we designed and measured bootstrap inverters and ring oscillator composed of them. The five-stage ring oscillator has been fabricated and oscillated at the frequency, 60 Hz, when the supply voltage is 40 V      

LED蓝宝石图形化衬底的研究进展及发展趋势

图形化蓝宝石衬底作为GaN基LED照明外延衬底材料,由于其能降低GaN外延薄膜的线位错密度和提高LED的光萃取效率的显著性能在近几年来引起国内外许多科研机构和厂商的广泛兴趣。从衬底的制备工艺、图形尺寸角度出发,综述了图形化蓝宝石衬底GaN基LED的研究进展,并对其未来在大功率照明市场的应用进行了展望。     

蓝宝石衬底上单晶InAlGaN外延膜的RF-MBE生长

利用射频等离子体辅助分子束外延技术在蓝宝石衬底上外延了晶体质量较好的单晶InAlGaN薄膜.在生长InAlGaN外延层时,获得了外延膜的二维生长.卢瑟福背散射测量结果表明,InAlGaN外延层中In,Al和Ga的组分分别为2%,22%和76%,并且元素的深度分布比较均匀.InAlGaN(0002)三晶X射线衍射摇摆曲线的半高宽为4.8′.通过原子力显微镜观察外延膜表面存在小山丘状的突起和一些小坑,测量得到外延膜表面的均方根粗糙度为2.2nm.利用光电导谱测量InAlGaN的带隙为3.76eV.     

蓝宝石衬底上单晶InAlGaN外延膜的RF-MBE生长

利用射频等离子体辅助分子束外延技术在蓝宝石衬底上外延了晶体质量较好的单晶InAlGaN薄膜.在生长InAlGaN外延层时,获得了外延膜的二维生长.卢瑟福背散射测量结果表明,InAlGaN外延层中In,Al和Ga的组分分别为2%,22%和76%,并且元素的深度分布比较均匀.InAlGaN(0002)三晶X射线衍射摇摆曲线的半高宽为4.8′.通过原子力显微镜观察外延膜表面存在小山丘状的突起和一些小坑,测量得到外延膜表面的均方根粗糙度为2.2nm.利用光电导谱测量InAlGaN的带隙为3.76eV.     

体硅衬底上的CMOS Fin FET

介绍了一种制作在普通体硅上的 CMOS Fin FET.除了拥有和原来 SOI上 Fin FET类似的 Fin FET结构 ,器件本身在硅衬底中还存在一个凹槽平面 MOSFET,同时该器件结构与传统的 CMOS工艺完全相容 ,并应用了自对准硅化物工艺 .实验中制作了多种应用该结构的 CMOS单管以及 CMOS反相器、环振电路 ,并包括常规的多晶硅和 W/Ti N金属两种栅电极 .分析了实际栅长为 110 nm的硅基 CMOS Fin FET的驱动电流和亚阈值特性 .反相器能正常工作并且在 Vd=3V下 2 0 1级 CMOS环振的最小延迟为 14 6 ps/门 .研究结果表明在未来 VL SI制作中应用该结构的可行性     

体硅衬底上的CMOS FinFET

介绍了一种制作在普通体硅上的CMOS FinFET.除了拥有和原来SOI上FinFET类似的FinFET结构,器件本身在硅衬底中还存在一个凹槽平面MOSFET,同时该器件结构与传统的CMOS工艺完全相容,并应用了自对准硅化物工艺.实验中制作了多种应用该结构的CMOS单管以及CMOS反相器、环振电路,并包括常规的多晶硅和W/TiN金属两种栅电极.分析了实际栅长为110nm的硅基CMOS FinFET的驱动电流和亚阈值特性.反相器能正常工作并且在Vd=3V下201级CMOS环振的最小延迟为146ps/门.研究结果表明在未来VLSI制作中应用该结构的可行性.     

SiO2/Si衬底上制备增强型ZnO薄膜晶体管

在NH3和O2的混合气氛下,采用激光分子束外延法(L-MBE)在SiO2/p-Si衬底上制备了氮掺杂ZnO薄膜.XRD分析表明ZnO薄膜掺入微量的氮后仍有很高的结晶质量和高度的c轴择优取向性,(0002)面摇摆曲线的半峰宽仅为1.89.在此基础上制备了以氮掺杂ZnO薄膜为沟道层、以SiO2为绝缘层的底栅式薄膜晶体管.电学测试表明该晶体管工作在n沟道增强模式,阈值电压为5.15V,电流开关比为104,电子的场迁移率达到2.66cm2/(V·s).     

SiO2/Si衬底上制备增强型ZnO薄膜晶体管

在NH3和O2的混合气氛下,采用激光分子束外延法(L-MBE)在SiO2/p-Si衬底上制备了氮掺杂ZnO薄膜.XRD分析表明ZnO薄膜掺入微量的氮后仍有很高的结晶质量和高度的c轴择优取向性,(0002)面摇摆曲线的半峰宽仅为1.89.在此基础上制备了以氮掺杂ZnO薄膜为沟道层、以SiO2为绝缘层的底栅式薄膜晶体管.电学测试表明该晶体管工作在n沟道增强模式,阈值电压为5.15V,电流开关比为104,电子的场迁移率达到2.66cm2/(V·s).     

MgZnO/ZnO p-n异质结的制备与特性

通过金属有机化学气相沉积(MOCVD)法在GaAs衬底上制备出了MgZnO/Zn0的p-n异质结,并研究了其I-V特性:开启电压约为3.6V,结特性良好.比较了n型ZnO层与P型MgxZn1-xO层的电阻率、迁移率和载流子浓度.ZnO层的电阻率很小,载流子浓度很大;而Mgxzn1-xO层的电阻率却大幅度的增加,载流子浓度较ZnO层小了一个数量级.通过对其n型与P型层的光致发光(PL)谱的测试发现,ZnO层与Mgxzn1-xO层分别在382和370nm处存在着由自由激子复合而导致的紫外发光峰,为近带边发光.MgxZn1-xO的紫外峰明显弱于ZnO样品的,这是由于MgZnO合金中易形成分相所造成的,所以现阶段其晶体质量还不能与ZnO的相比.另外,两样品在480nm附近都存在着比较弱的深能级发光峰,这是晶体的本征缺陷或其他杂质的引入造成的,并对样品进行了X射线衍射(XRD)谱与电致发光(EL)谱等测试与分析.     

蓝宝石图形衬底上GaN低温缓冲层的研究

低温下,在蓝宝石图形衬底上使用金属有机化学气相沉积(MOCVD)生长低温GaN(LT-GaN)缓冲层,并对其表面形貌进行了细致的观察,发现了不同于已报道的GaN选择性成核生长现象。基于不同厚度的低温GaN缓冲层生长了n型GaN(n-GaN),发现过厚或者过薄的缓冲层都会对n-GaN晶体质量产生负面影响,并结合初始成核阶段进行了原因分析。制备了基于不同厚度的n-GaN的发光二极管(LED)样品,分析了GaN晶体质量对LED输出功率的影响。同时发现,晶体质量较差的时候,光提取效率可能主导着对LED器件性能的影响。