立方GaAs（100）衬底上制备单相六方GaN薄膜

立方GaAs（100）衬底上制备的GaN薄膜多为立方结构且立方相为亚稳相,采用水平常压MOCVD方法在立方GaAs（100）衬底上制备出了GaN薄膜．XRD测试表明,薄膜具有单一的相．结合对工艺条件的分析,认为薄膜具有六方结构．最后,通过Raman光谱测试,证实在立方GaAs衬底上制备出了单相六方GaN薄膜．还对立方GaAs衬底上制备出六方GaN薄膜的原因进行了讨论．     

GaAs衬底上等离子体增强原子层沉积GaN薄膜

采用等离子体增强原子层沉积(PEALD)技术在斜切的砷化镓(GaAs)衬底上低温沉积了氮化镓(GaN)薄膜,对生长过程、表面机制以及界面特性等进行分析,得到GaN在215～270℃的温度窗口内生长速度(Growth-Per-Cycle, GPC)为0.082 nm/cycle,并从表面反应动力学和热力学方面对GPC的变化进行了分析。研究发现,生长的GaN薄膜为多晶,具有六方纤锌矿结构,且出现(103)结晶取向。在GaN/GaAs界面处观察到约1 nm厚的非晶层,这可能与生长前衬底表面活性位点的限制和前驱体的空间位阻效应有关。值得注意的是,在沉积的GaN薄膜中,所有的N皆与Ga以Ga-N键结合生成GaN,但是存在少部分Ga形成了Ga-O键和Ga-Ga键。这种成键方式,可能与GaN薄膜中存在的缺陷和杂质有关。     

(001)GaAs衬底上异质外延的立方GaN薄膜与界面

用电子回旋共振微波等离子体辅助金属有机化学气相沉积（ＥＣＲ－ＰＡＭＯＣＶＤ）法，在低温条件下，在（００１）ＧａＡｓ衬底上异质外延，生长了立方晶ＧａＮ薄膜．高分辩电镜（ＨＲＥＭ）观测与Ｘ射线衍射（ＸＲＤ）测量结果表明：ＧａＮ薄膜具有典型的闪锌矿结构；三种方法测得其晶格常数为０．４５１～０．４５７ｎｍ；在ＧａＮ／ＧａＡｓ界面处的生长模式为异质外延；ＧａＮ薄膜中的位错主要为堆垛层错与刃形位错；随着远离界面，ＧａＮ中位错密度与镶嵌组织迅速减少．     

玻璃衬底上低温沉积GaN薄膜研究

采用电子回旋共振.等离子体增强金属有机物化学气相沉积(ECR-PEMOCVD)方法在康宁7101型普通玻璃衬底上沉积了GaN薄膜,利用反射高能电子衍射(RHEED)、X射线衍射(XRD)、原子力显微镜(AFM)和霍尔测量系统对样品进行了检测,研究了其结晶性和电学特性随沉积温度的变化.结果表明,当沉积温度为250-430℃时,得到的GaN薄膜都呈现高度的C轴择优取向,结晶性较好;薄膜表面形貌较为平整且呈n型导电.     

GaAs(001)衬底上MOCVD生长的立方相GaN外延薄膜的光学性质研究

本文报道了利用MOCVD方法,在GaAs衬底(001)面制备的立方GaN薄膜的光学性质.利用光致发光(PL)光谱的半高宽确定制备的样品具有不同的晶体质量.利用喇曼散射(RS)光谱研究了立方GaN薄膜中的光学声子模式.横向(TO)和纵向(LO)声子在立方GaN中的散射峰分别位于552cm-1和739cm-1.另外还观察到来自界面无序层的TOB和LOB.根据喇曼频移和选择定则可识别GaN中的相组成.其来自六方相GaN的E2声子模,可作为识别立方GaN中六方相的标志.随着退火温度的升高,样品中的界面层的效应减弱,六方相增加     

蓝宝石图形衬底上生长GaN的微区拉曼光谱研究(英文)

采用微区拉曼光谱对生长在湿法腐蚀获得的无掩膜周期性图形蓝宝石衬底上GaN材料做了研究,结果显示,侧向外延生长区域具有较低的压应力。采用湿法腐蚀结合原子力显微镜对材料的位错进行了表征,侧向外延区域显示了低的位错密度,具有较高的晶体质量。另外通过对不同生长区域的拉曼纵光学声子与等离子体激元形成的耦合模高频支进行拟合,结果显示侧向外延区域具有较低的背底载流子浓度。研究认为,由于采用图形衬底,侧向外延区域悬空生长降低了位错密度,同时侧向外延区域不与蓝宝石接触,因此采用该方法生长的GaN材料具有较低的压应力和较低的背底载流子浓度。     

100mm直径硅衬底上MOCVD外延生长无裂纹GaN

为实现在100 mm直径硅衬底上金属有机物化学气相外延(MOCVD)生长无裂纹GaN,系统研究了预铺铝时间参数对AlN成核质量的影响、不同厚度条件下AlN层对GaN生长的影响以及Al组分渐变的AlGaN缓冲层对GaN裂纹抑制的效果。实验结果表明,适当的预铺铝时间可以显著提高AlN成核层晶体质量,合理的AlN层厚度有助于上层GaN的生长,AlN与GaN之间AlGaN缓冲层的引入可以有效抑制GaN裂纹的产生。最后,采用高分辨率X射线衍射(HRXRD)测试了MOCVD外延生长的无裂纹GaN材料,得到AlN(002)面、GaN(002)面和GaN(102)面的衍射峰半峰宽(FWHM)分别为1 382,550和746 arcsec。     

图形化蓝宝石衬底表面原位处理对GaN外延薄膜的影响

采用预铺Ga或NH_3氮化等方式原位处理图形化蓝宝石衬底(PSS)表面,然后外延生长了GaN薄膜,研究了PSS表面预处理对GaN薄膜表面形貌、晶体质量以及残余应力的影响。结果显示,PSS经过预铺Ga后生长的GaN薄膜具有平滑的表面和清晰平直的原子台阶,且位错密度最低;氮化后生长的GaN薄膜原子台阶较宽,螺型位错密度较低;衬底未经表面处理生长的GaN薄膜,原子台阶模糊,位错密度最高;同时,与氮化或未经预处理的方法相比,经过预铺Ga的方式预处理PSS表面后生长的GaN薄膜残余应力最小。分析认为,预铺Ga、氮化等方式处理衬底表面,改变了PSS微结构,有利于生长表面平滑、晶体质量高、残余应力小的GaN薄膜。     

(111)Si上外延生长六方GaN的TEM观察

利用衍衬、ＳＡＥＤ、ＨＲＴＥＭ对在 (111)Ｓｉ上外延生长的六方ＧａＮ进行了观察分析。ＧａＮ外延层与缓冲层和基底的取向关系为 (0 0 0 1) ＧａＮ (0 0 0 1) ＡｌＮ (111) Ｓｉ,[112 0 ]ＧａＮ [112 0 ]ＡｌＮ [110 ]Ｓｉ。ＧａＮ外延层中存在倒反畴。ＧａＮ中位错以刃型位错为主。Ｉｎ0 1Ｇａ0 9Ｎ ＧａＮ的多重量子阱结构 (ＭＱＷ )具有阻挡穿透位错 ,降低位错密度的作用。由于在室温下具有 3 4ｅＶ的直接带隙 ,ＧａＮ已经成为制备一些光电子器件如蓝色、紫色、紫外发光二极管及激光二极管等的最佳候选材料[1,2 ] 。通常是在各种…     

MOCVD growth of cubic GaN on 3C-SiC deposited on Si (100) substrates

The growth of cubic GaN on 3C-SiC/Si(100) by metal-organic chemical vapor deposition (MOCVD) under various growth temperatures, thicknesses of 3C-SiC, and V/III ratios was studied. The fractions of cubic and hexagonal phases in the films were estimated from the integrated x-ray diffraction intensities of the cubic (002) and hexagonal (1011) planes. A smooth SiC layer, a high growth temperature, and a moderate V/III ratio are three key factors for the nucleation of the cubic phase and its subsequent growth. Hexagonal GaN with its c-axis perpendicular to the substrate preferentially grows at the low temperature of 750°C. The inclusion of the cubic phase increases with increasing growth temperature. The optimum growth conditions for dominant cubic GaN formation were a growth temperature of 950°C, a 1.5 μm thick SiC layer, and a V/III ratio of 1500. With these growth conditions, a cubic GaN layer with the cubic component of 91% was obtained.     

缓冲层用于改善硅基氮化镓外延薄膜质量

介绍了GaN材料的基本特性及重要意义,讨论了在Si衬底上外延GaN的可取之处以及存在的主要问题.详细阐述了各种不同材料以及不同结构的缓冲层应用于MOCVD方法在Si衬底上外延GaN,及其所取得的最新成果.对缓冲层降低应力的机制进行了说明.     

缓冲层用于改善硅基氮化镓外延薄膜质量

介绍了GaN材料的基本特性及重要意义,讨论了在Si衬底上外延GaN的可取之处以及存在的主要问题。详细阐述了各种不同材料以及不同结构的缓冲层应用于MOCVD方法在Si衬底上外延GaN,及其所取得的最新成果。对缓冲层降低应力的机制进行了说明。     

The effect of substrate tilt on MOCVD growth of {100}CdTe on {100}GaAs

Epitaxial layers of CdTe were grown by metalorganic chemical vapor deposition on surfaces of single crystal, {100} GaAs which had been ground, polished, and etched to a spherically shaped done. This dome-shaped surface allowed the morphological and structural properties of the epitaxial CdTe layers to be determined for all 360° of azimuth and up to 15° of polar angle from the [100] axis within a single growth experiment. At two growth temperatures, approximately 275 and 375°C, the results show distinct twofold rotational symmetry in both morphology and crystal perfection as determined by x-ray rocking curve measurement. Surface morphology is superior at azimuths near tilts toward the <111>A pole. Four-sided pyramidal hillocks appear at other azimuths and at 0° tilt; the symmetry of the hillocks diminishes as the tilt increases. The orientations for growth which simultaneously minimize the surface defects and rocking curve full-width half-maximum appear to be at locations on the surface where the surface normal is tilted 3–4° toward the <111>A or <111>B, depending on the temperature regime chosen. Epitaxial layers grown on planar wafers of {100}GaAs tilted toward <111>Ga and <111>As show surface morphology essentially identical to the dome at these orientations. The surface morphology of CdTe growth on GaAs/Si wafers suggests that these layers are tilted toward the <111>B.     

MOCVD生长GaN的喇曼散射谱

对在ＧａＡｓ（００１）、Ａｌ２Ｏ３（０００１）和Ｓｉ（１１１）等衬底上ＭＯＣＶＤ技术生长的ＧａＮ薄膜进行了背散射几何配置下的喇曼散射测试分析和比较，观察到了α相ＧａＮ的Ａ１（ＬＯ）模、Ａ１（ＴＯ）模、Ｅ１（ＬＯ）模和Ｅ２模．结合Ｘ射线衍射谱，分析了因不同生长工艺导致ＧａＮ／ＧａＡｓ样品的不同结构相的喇曼谱的差异，发现ＧａＮ的喇曼谱与ＧａＮ外延层的结构相、完整性及工艺条件有关，可利用其作为检测ＧａＮ外延层结构特性的一种有用手段．对含有少量β相ＧａＮ样品，观测到了包含有β相ＧａＮ贡献的声子模式（７４０ｃｍ－１）．     

Initial stages of GaN/GaAs (100) growth by metalorganic chemical vapor deposition

We have investigated the growth of GaN buffers by metalorganic chemical vapor deposition (MOCVD) on GaAs (100) substrates. Atomic force microscope (AFM) and reflection high-energy electron diffraction (RHEED) were employed to study the dependence of the nucleation on the growth temperature, growth rate, annealing effect, and growth time. A two-step growth sequence must be used to optimize and control the nucleation and the subsequent growth independently. The size and distribution of islands and the thickness of buffer layers have a crucial role on the quality of GaN layers. Based on the experimental results, a model was given to interpret the formation of hexagonal-phase GaN in the cubic-phase GaN layers. Using an optimum buffer layer, the strong near-band emission of cubic GaN with full-width at half maximum (FWHM) value as small as 5.6 nm was observed at room temperature. The background carrier concentration was estimated to be in the range of 10¹³ ∼ 10¹⁴ cm⁻³.     

Low ohmic contact AIN/GaN HEMTs grown by MOCVD

AlN/GaN high-electron-mobility transistors （HEMTs） on SiC substrates were fabricated by metalorganic chemical vapor deposition （MOCVD） and then characterized. An Si/Ti/Al/Ni/Au stack was used to reduce ohmic contact resistance （0.33 g2.mm） at a low annealing temperature. The fabricated devices exhibited a maximum drain current density of 1.07 A/mm （Vows = I V） and a maximum peak extrinsic transconductance of 340 mS/mm. The off-state breakdown voltage of the device was 64 V with a gate-drain distance of 1.9 μm. The current gain extrinsic cutoff frequency fT and the maximum oscillation frequency fmax were 36 and 80 GHz with a 0.25 μm gate length, respectively.     

ECR-PEMOCVD法在GaAs(001)衬底上制备GaN量子点

报道了用电子回旋共振(ECR)等离子体增强金属有机化学气相沉积(PEMOCVD)方法在GaAs(001)衬底上成功地制备出GaN量子点.原子力显微镜(AFM)测量表明成核密度高达1010cm-2,量子点直径约为30nm.采用300℃低温氮化,600℃退火和500℃缓冲层,600℃退火工艺制备.GaN量子点的密度和大小由制备温度和时间所控制.最后讨论了量子点成核的机制.