非金属材料化学镀的应用新进展

化学镀作为表面强化的途径,已受到广泛的重视.本文简要介绍了非金属材料化学镀工艺中基体表面活化的几种方法,包括光化学法、自催化活化法、介电层放电法和气相沉积法,综述了化学镀技术在多种非金属材料上的最新进展及应用前景.     

非金属粉体化学镀银的研究进展

介绍了非金属粉体化学镀银的发展趋势和特点。综述了非金属粉体如空心玻璃微珠、SnO2、A l2O3、纤维、碳纳米管、石墨、BaTiO3等粉体化学镀银的工艺研究现状及应用。讨论了非金属粉体化学镀银的影响因素,包括前处理、表面活性剂、主盐浓度、温度、银离子滴加的速度等。     

工艺因素对SLA原型表面化学镀铜速率的影响

化学镀铜可以作为SLA原型装饰防护或快速模具制造的表面处理方法。为优化化学镀铜工艺,考察了硫酸铜、还原剂、配位剂和添加剂以及温度和pH值等工艺因素对SLA原型表面化学镀铜速率的影响。结果表明:硫酸铜、pH值和乙二胺四乙酸二钠对镀铜速率的影响最大,而添加剂可以明显改善沉积铜层的质量和镀液的稳定性。综合考虑镀铜速率和镀液稳定性,得出了SLA原型表面化学镀铜的优化工艺。     

"考本"液在钢铁上直接化学镀铜

指出了普通镀铜工艺的缺点通过对铜原子结构的分析,提出了得到良好结合力的化学镀铜层的可能性,进而给出了使用“考本”液在钢铁上直接化学镀铜的工艺。该工艺操作简单、安全性好、成本低,得到的镀层与钢铁基体结合力好,表面可以达到镜面光泽。     

PE塑料化学镀铜的研究

采用锉刀实验法和划线划格实验两种镀层结合力测试方法,对化学镀铜层与塑料基体之间结合力的优劣进行了定性评价;通过沉积速率的计算,研究了镀铜时间对塑料化学镀铜沉积速率的影响。结果表明,镀层与基体之间的结合力良好塑料表面可通过化学镀形成铜镀层,且随着镀铜时间的增加,沉积速率增加(30 min内)。镀铜10~15 min时,沉积速率相对较低,而镀铜15 min后,沉积速率急剧增大。     

新型配位剂对化学镀铜工艺的影响

在以柠檬酸钠为配位剂、次磷酸钠为还原剂的化学镀铜工艺的基础上,加入一种新型配位剂,研究了新的化学镀铜工艺。比较了新化学镀铜工艺与传统的化学镀铜、化学镀镍工艺的不同。结果表明:新型化学镀铜工艺沉积速率快、镀液稳定性好、成本低,是很好的代镍工艺。     

ABS塑料化学镀铜工艺

介绍了ABS塑料表面化学镀铜的工艺流程,讨论了粗化温度和时间、敏化和活化时间、硫酸铜质量浓度、甲醛体积浓度、酒石酸钾钠质量浓度、镀液温度和镀液pH对镀层质量以及化学镀铜沉积速率的影响。确定了最佳工艺条件为15~20g/L硫酸铜、15mL/L甲醛、14g/L酒石酸钾钠,镀液温度为323K,镀液的pH为11~12。扫描电镜表明,所得镀层均匀、光亮,结合力好。     

2-巯基苯并噻唑对化学镀铜的影响

以甲醛为还原剂,研究了2-巯基苯并噻唑(2-MBT)对ABS塑料化学镀铜沉积速率、铜镀层表面形貌、纯度、平整度及晶型的影响.化学镀铜的工艺条件为:CuSO4·5H2O 10g/L,EDTA-2Na30g/L,HCHO3mL/L,PEG-10002mg/L,2-MBT0～2mg/L,温度70℃或40℃,pH 12.5,时...     

化学镀镍-铜-磷三元合金工艺的研究

为提高化学镀镍－磷合金镀层的性能及获得多种性能的合金镀层以拓宽其应用范围。在化学镀镍－磷合金液中加入硫酸铜制得镍－铜－磷三元合金。研究了镀液中硫酸镍、次磷酸钠、柠檬酸钠、硫酸铜、稳定剂、光亮剂的含量以及pH值和温度等因素对合金镀层的外观、沉积速度及铜含量的影响。通过5％氯化钠溶液和10％硫酸溶液浸泡试验比较了所得镍－铜－磷合金镀层与镍－磷合金镀层以及前人制得的镍－磷合金镀层的耐蚀性，同时比较了上述镀层的其它性能。结果表明，所得镍－铜－磷合金镀层的耐蚀性、外观、结合力、孔隙率、沉积速度、硬度和耐磨性等性能优于镍－磷合金及前人制得的镍－铜－磷合金镀层。     

TiB2表面镀铜工艺

利用化学镀覆技术成功在TiB2颗粒表面均匀化学镀覆铜。透射电子显微镜观察表明：通过严格的镀前预处理工艺的优化设计以增加活化点,对传统镀液配方的调整以降低镀速,能够成功地在TiB2颗粒表面镀覆一层铜,从而培强了其和铜基体之间的界面结合力,为TiB2在复合材料领域之中的应用打下了坚实基础。     

添加聚四氟乙烯对化学沉积复使度层性能的影响

在化学镀Ｃｕ（Ｎｉ）－Ｐ合金镀液中添加碳化硅和聚国烯制得Ｃｕ（Ｎｉ）－Ｐ－ＳｉＣ－ＰＴＥＥ复合镀层。研究了碳化硅、聚四氟乙烯的添加量对镀层沉积速度、硬度、磨损及减摩性能的影响。结果表明：碳化硅和聚四氟乙烯的加入能提高Ｃｕ（Ｎｉ）－Ｐ合金镀层的沉积速度、硬度、耐磨及减摩性。     

Design and achievement of a complete bottom-up electroless copper filling for sub-micrometer trenches

The bottom-up filling of electroless copper usually depends on inhibiting the Cu deposition at the surface or accelerating the Cu deposition in the bottom of trenches to achieve a relative high deposition rate of electroless copper in the bottom of trenches. In this paper, a complete bottom-up filling of electroless copper, in which the deposition rates of the electroless copper were not only inhibited at the surface of the substrate, but also were accelerated in the bottom of the trenched, was designed and achieved in the plating bath with an addition of bis (3-sulfopropyl) disulfide (SPS) and polyethylene glycol (PEG). The cross-sectional SEM observation of trenches indicated that all trenches with different widths ranging from 100 to 290 nm were filled completely by electroless copper, and no void was found. This was attributed to three factors, the electroless Cu deposition was accelerated markedly by an addition SPS only; but it was suppressed sharply by a combination addition SPS and PEG-4000; the large molecular weight and lower diffusion coefficient of PEG-4000 resulted in concentration gradient of PEG-4000 in the trenches. The effects of PEG-4000 and SPS on the polarization behaviors of the electroless copper plating bath were investigated by the linear sweep voltammetry method and mixed potential theory.     

影响化学镀铜液稳定性和镀速的因素

研究了影响化学铜镀速和镀液稳定性的诸因素,并根据实验确定了适宜的化学镀铜液配方及其工艺。硫铜,甲醛,氢氧化钠含量的增加均会提高化学镀铜的镀速,降低镀液稳定性;     

化学沉积法制备功能性化学镀锡层的研究

在紫铜表面制备了功能性化学镀锡层。用扫描电镜观察了化学镀锡层的表面形貌,用X射线衍射仪分析了化学镀锡层的物相,并用电化学工作站对化学镀锡层的耐蚀性进行了测试。结果表明:化学镀锡层表面比较致密,呈不规则的柱状结构;化学镀锡层的XRD图谱中出现了六个明显的锡衍射峰;化学镀锡层能为紫铜提供有效的保护,提高紫铜在质量分数为3.5%的氯化钠溶液中的耐蚀性。     

陶瓷基上化学镀铜

为提高化学镀铜液的稳定性,在化学镀铜液中加入亚铁氰化钾和a,a′-联吡啶作为添加剂,研究了温度与陶瓷基体上化学镀铜沉积速度的关系,计算出铜沉积的活化能。当镀液中含有亚铁氰化钾或a,a′-联吡啶时,铜沉积活化能提高,铜沉积速率降低,镀铜层外观及镀液稳定性均得到改善。此外,镀液中同时含有亚铁氰化钾和a,a′-联吡啶时,镀液、镀层性能得到进一步提高。     

铝硅镁合金化学镀镍

研究了在铝硅镁合金基体上直接化学镀镍和在基体上电镀铜后再化学镀镍2种工艺.采用扫描电子显微镜分析技术,盐雾法、锉刀法等试验方法比较了2种工艺所得镀层的表面形貌,耐蚀性和结合力,结果表明:2种样品的镍镀层都具有很好的耐蚀性及较好的结合力,对铝硅镁基体具有良好的保护作用.与铝硅镁合金直接化学镀镍相比,铝硅镁合金基体电镀铜后化学镀镍所得的镍层组织更致密,结合力更好,耐蚀性更优异.     

化学镀铜原理、应用及研究展望

化学镀铜技术主要用作印制线路板孔金属化和塑料电镀,其镀层具有良好的延展性、导热性和导电性,介绍了化学镀铜的应用范围与发展,强调了化学镀铜预处理的必要性及要注意的几个方面：应用易清洗的油脂作防锈剂,低碳钢件用阳极电解除油,酸洗除油与碱性除油互补等。介绍了化学镀铜的一些常用体系及其主要组分。讨论了添加剂的影响,对非金属表面化学镀铜的研究进展进行了报道,提出了化学镀铜今后的研究重点。     

Solvent extraction of copper in a reciprocating plate column

Equilibrium data for the distribution of copper between an aqueous solution and a 20% solution of di-(2 ethyl hexyl) phosphoric acid in kerosene has been obtained by shake-flask experiments. The capacity of the organic phase for copper is greatly improved when the ammonium salt of D2EHPA is used. The performance of a 5 cm diameter Karr reciprocating plate extraction column for continuous counter-current extraction of copper by ammoniated D2EHPA has been measured. The results, expressed as heights of a transfer unit, have been compared with data for a non-metallic system (kerosene/acetic acid/water) in the same column. The lowest H.T.U. values measured were 43 cm for copper transfer and 23 cm for acetic acid transfer, with the difference being attributed mainly to the lower molecular diffusivity in the copper/D2EHPA system.     

Electroless Plating of Carbon Nanotubes with Copper

A simple chemical method was employed to coat carbon nanotubes with a layer of copper. Due to the hydrophobic nature, large surface curvature, small diameter and large aspect ratio, it is difficult to gain continuous electroless plating layer on the surface of carbon nanotubes. In this paper, a series methods (oxidization, sensiti-zation and activation) are used to add active sites before electroless plating, and the adjustment of the traditional composition of copper electroless plating bath and operating condition can decelerate electroless plating rate. The samples before and after coating were analyzed using transmission electron microscopy and energy-dispersive X-ray spectroscopy. The results showed that the surface of carbon nanotubes was successfully coated with continuous layer of copper, which lays a good foundation for applying carbon nanotubes in composites.     

碳纳米管的化学镀铜

A simple chemical method was employed to coat carbon nanotubes with a layer of copper. Due to the hydrophobic nature, large surface curvature, small diameter and large aspect ratio, it is difficult to gain continuous electroless plating layer on the surface of carbon nanotubes. In this paper, a series methods (oxidization, sensitization and activation) are used to add active sites before electroless plating, and the adjustment of the traditional composition of copper electroless plating bath and operating condition can decelerate electroless plating rate. The samples before and after coating were analyzed using transmission electron microscopy and energy-dispersive X-ray spectroscopy. The results showed that the surface of carbon nanotubes was successfully coated with continuous layer of copper, which lays a good foundation for applying carbon nanotubes in composites.