两步合金法制作p-GaN高反电极

利用两步合金法获得了能与p-GaN形成良好欧姆接触的高反射电极.电极的构成采用透明电极 高反射金属方案,厚的Ag层或Al层覆盖在合金后的Ni/Au上以提高电极的反射率,以Pt和Au作为覆盖层,可有效地防止Ag的氧化和团聚,短时间的热处理有助于Ag基电极反射率的提高.可靠性测试表明Ag基电极的稳定性较好,对于Al基电极,热处理后反射镜上出现暗斑,导致其反射率的下降.最终获得了波长在460nm处反射率为74%的Ag基高反射电极.     

Ohmic contacts to n-type GaSb and n-type GalnAsSb

An investigation with the objective of improving n-type ohmic contacts to GaSb-based devices is described. This study involves a series of n-GaInAsSb and n-GaSb samples with varying doping, grown on semi-insulating (SI) GaAs substrates. These samples were fabricated into mesa-etched, transfer-length method (TLM) structures, and the specific-contact resistivity and sheet resistance of these layers as a function of majority electron concentration were measured. Extremely low specific-contact resistivities of about 2 × 10⁻⁶ Ω-cm² and sheet resistances of about 4 Ω/▭ are found for n-type GaInAsSb doped at about 3 × 10¹⁸ cm⁻³.     

Ohmic contacts to n-type GaN using Pd/Al metallization

Ohmic contacts to n-type GaN grown by metalorganic chemical vapor deposition were formed using a Pd/Al-based metallization. Ohmic contact resistances and specific contact resistances were investigated as a function of rapid thermal annealing temperature, Pd interlayer thickness, and annealing time. As-deposited Pd/AI was found to produce rectifying contacts while the metallization exhibited ohmic characteristics after annealing at temperatures as low as 400°C. A minimum contact resistance of 0.9 ohm-mm (specific contact resistance = 1.2 × 10⁻⁵ ohm-cm²) was obtained upon annealing at 650°C for 30 s. For comparison, Al and Ti/Al contacts were also investigated. Auger electron spectroscopy, secondary ion mass spectrometry, and x-ray diffraction were used to investigate metallurgical reactions.     

Ohmic contacts formation of silicon schottky diodes by screen printing and rapid isothermal processing

Rapid isothermal processing based on incoherent radiation as the source of optical and thermal energy is playing a major role in flexible fast-cycle time integrated circuits manufacturing. In this paper, we present the dark and illuminated current-voltage characteristics of silicon Schottky barrier diodes where the ohmic contacts are formed by screen printing and rapid isothermal annealing. These results are compared with evaporated contacts followed by furnace annealing or rapid isothermal annealing. In this paper, we have shown that the ohmic contacts formed by screen printing and rapid isothermal annealing are compatible with the contacts formed by evaporation process. The processing time of the screen printed ohmic contacts is significantly lower than the contacts formed by evaporation process.     

高Al组分N-AlxGa1-xN材料的欧姆接触

基于各层金属间在快速热退火时容易合金化及Ti,Al易被氧化的特点,在高Al组分N-AlxGa1-xN(x≥0.45)材料上溅射生长多层金属Ti/Al/Ti/Au,并且变化Ti,Al比例以及改变退火温度和时间,得到了金属与高Al组分N-AlxGa1-xN(x≥0.45)材料间的欧姆接触,由传输线模型方法测试得比接触电阻为4.9×10-2 Ω·cm2.实验中用到的样品为P(Al0.45Ga0.55N)/i(Al0.45Ga0.55N)/N-Al0.63Ga0.37N多层结构的材料.最后,利用伏安特性和俄歇电子能谱深度分布(AES)研究金属与高Al组分的材料之间形成欧姆接触的原因.     

高Al组分N—AlxGa1-xN材料的欧姆接触

基于各层金属间在快速热退火时容易合金化及Ti，Al易被氧化的特点，在高Al组分N-AlxGa1-xN（x≥0．45）材料上溅射生长多层金属Ti／Al／Ti／Au，并且变化Ti，Al比例以及改变退火温度和时间，得到了金属与高Al组分N-AlxGa1-xN（x≥0．45）材料间的欧姆接触，由传输线模型方法测试得比接触电阻为4．9×10^-2Ω·cm^2。实验中用到的样品为P（Al0.45Ga0．55N）／i（Al0.45Ga0.55N）／N-Al0.63Ga0．37N多层结构的材料。最后，利用伏安特性和俄歇电子能谱深度分布（AES）研究金属与高Al组分的材料之间形成欧姆接触的原因。     

高Al组分N-AlxGa1-xN材料的欧姆接触

基于各层金属间在快速热退火时容易合金化及Ti，Al易被氧化的特点，在高Al组分NAlxGa1xN(x≥0．45)材料上溅射生长多层金属Ti／Al／Ti／Au，并且变化Ti，Al比例以及改变退火温度和时间，得到了金属与高Al组分N-AlxGa1-xN(x≥0．45)材料间的欧姆接触，由传输线模型方法测试得比接触电阻为4.9×10-2Ω·cm2。实验中用到的样品为P(Al0．45Ga0．55N)/i(Al0.45Ga0．55N)／N-Al0．63Ga0．37N多层结构的材料。最后，利用伏安特性和俄歇电子能谱深度分布(AES)研究金属与高Al组分的材料之间形成欧姆接触的原因。     

Ohmic contacts to n-type GaN

Ohmic contacts to n-GaN using Ag, Au, TiN, Au/Ti, Au/Mo/Ti, and Au/Si/Ti have been studied. The Fermi level of GaN appears to be unpinned, and metals and compounds with work functions less than the electron affinity resulted in ohmic contacts. Reactively sputter deposited TiN was ohmic as deposited. However, Au/Ti, Au/Mo/Ti, and Au/Si/Ti required heat treatments to form ohmic contacts, with the best being an RTA at 900°C. Ag and Au were shown to diffuse across the GaN surface at T>500°C; therefore, they are unstable, poor ohmic contact metallizations as single metals. The other contact schemes were thermally stable up to 500°C for times of 30 min.     

Formation of ohmic contacts to p-ZnTe

Formation and temperature stability of sputter deposited gold ohmic contacts to molecular beam epitaxially grown p-type ZnTe (doped with nitrogen to a free hole concentration of ≈3 × 1018 cm³) have been studied using current-voltage (I-V), Auger electron spectroscopy, secondary ion mass spectrometry, and optical and scanning electron microscopy. The I-V characteristics of ≈1500Å Au/p-ZnTe contacts were measured as-deposited and after heat treatments at 150, 200, 250, and 350°C for 15 min intervals up to 90 min. As deposited, the contacts were poor Schottky contacts, but became ohmic after 15 min at all temperatures. There was an increased resistance at t>15 min for T≤250°C, and a very large resistance increase upon heat treatment for all times at 350°C. The interface between the metallization and ZnTe was initially very planar, and remained planar upon formation of the ohmic contact. Upon heating at T>250°C, Au diffused into ZnTe. The ohmic behavior of the Au/p-ZnTe contacts is attributed to this diffusion which created a highly doped near-surface region in the ZnTe. Microscopy showed that Au also migrated across the ZnTe surface forming an extended reaction zone (≈100 μm) around the dot contact at T≥250°C.     

AlGaN/GaN HEMT欧姆接触的研究进展

从欧姆接触形成的机理出发,介绍了在AlGaN/GaN HEMT中实现源和漏区欧姆接触的各种方法,如表面处理技术、金属化系统和重掺杂技术等.回顾了近年来这些方法的研究进展.     

AlGaN/GaN异质结构欧姆接触的研制

研究了 Ga N高温宽禁带半导体外延层上欧姆接触的制备工艺 ,讨论了几种测试方法的优缺点 ,并根据器件制作的工艺兼容性 ,在 n-Ga N样品上获得了 4× 1 0 - 6 Ω·cm2的欧姆接触 ,在 Al Ga N/Ga N异质结构样品上获得了 4× 1 0 - 4Ω· cm2 的欧姆接触。实验结果表明 ,Al Ga N/Ga N上低阻欧姆接触的制备及其工艺兼容性是Ga N HFET器件研制的技术难点     

硅-金刚石系统的离子束混合和欧姆接触

用离子束混合Si(700A)/C样品,在天然Ⅱb型金刚石上形成了梯度能带接触。选用Ge~+为注入离子,在能量120keV,剂量2.0×10~(16)cm~(-2),温度700℃下进行离子束混合。Rutherford背散射显示:有3—4％的Si与金刚石混合。红外吸收谱发现了Si—C键的形成,这表明形成了Si/SiC/C的梯度结构。Ⅰ—Ⅴ特性说明了离子束混合和高温热退火有助于欧姆接触的形成。而没有经过离子束混合的样品显示了Ⅰ—Ⅴ开路特性。     

磷注入4H-SiC（0001）的欧姆接触特性

摘要: 研究了不同剂量的磷注入4H–SiC层经高温退火处理后的电学特性。通过在1650 ?C 退火30分钟激活了注入的磷离子。TLM及Hall法测试的结果表明,尽管随着磷注入浓度的增加而产生的位错环使得Ni/SiC界面处势垒增高,仍形成了良好的镍欧姆接触,表面接触电阻率为1.30?10-6Ω.cm2。磷注入层电阻率随着磷掺杂浓度的升高而减小。通过对不同注入剂量下电子浓度随温度的变化曲线进行测试,结果表明在200–500K的温度范围内,磷注入层的电子浓度与温度基本无关。     

Ohmic contacts ton-type In0.5Ga0.5P

The contact properties of alloyed Ni/Au-Ge/Mo/Au metallization to npoststagger+In_0.5Ga_0.5P epilayers grown by gas-source molecular beam epitaxy on GaAs substrates are reported. A minimum specific contact resistance of 10⁻⁵ Ωcm² was obtained forn = 2 × 10¹⁹ cm⁻³ material after alloying at 360° C for 20 sec. Above this temperature outdiffusion of lattice elements and reactions of the metallization with the In_0.5Ga_0.5P lead to severe morphological changes and degraded contact properties. From the temperature dependence of the contact resistance, thermionic emission was identified as the predominant current transport mechanism in these contacts.     

长波长VCSEL结构中的欧姆接触工艺

简要叙述了欧姆接触工艺在长波长垂直腔面发射激光器(VCSEL)制作中的重要作用.采用圆环传输线方法(CTLM)研究了应用于长波长VCSEL结构的p型InGaAsP和InP材料与Ti-Au的接触特性,发现p-InGaAsP与Ti-Au经高温退火后能获得欧姆接触,其最低比接触电阻值可达6.49×10-5Ω·cm2.将此工艺结果应用于1.3 μm VCSEL结构中,发现其开启电压和串联电阻显著减小.     

Mechanisms for the formation of low temperature,non-alloyed Au-Ge ohmic contacts to n-GaAs

Low temperature, non-alloyed Au-Ge contact formation ton-GaAs is a multi-step pro-cess. During the first 5 min of annealing at 320° C the Au and Ge segregate into regions a few microns in size and extend over the entire thickness of the metal layer and sig-nificant in-diffusion of the Au and Ge and out-diffusion of the Ga and As occurs. This intermixing reduces the barrier height from 0.75 to 0.40 eV. The contact does not show ohmic behavior until it has been annealed for 3 hr. During this time Ge continues to in-diffuse but at a slower rate than it did initially. The rate of Ge in-diffusion is en-hanced by the presence of Au since samples containing less Au require longer anneals to show ohmic behavior and have higher specific contact resistances. The presence of excess As, which is prevented from evaporating by a Si₃N₄ cap has the opposite effect since capped layers have higher specific contact resistances. Au-Ge phases appear after approximately 3 hr of annealing, therefore, Au-Ge phases cannot be responsible for the reduction in barrier height. The interface morphology is smooth, differing from that of pure Au and alloyed contacts that often contain spiking of the metals into the semi-conductor. The orientation relationship for the Au grains differs from that of pure Au. Work performedat U.S. Army ETDL, Fort Monmouth, NJ 07703. Work performed at U.S.Army ETDL, Fort Monmouth, NJ 07703.     

A Novel Stress Characterization Technique for the Development of Low-Stress Ohmic Contacts to HgCdTe

HgCdTe material intended for long-wavelength infrared detection is particularly susceptible to damage from stress. As a result, an ideal ohmic contact needs to have good adhesion and low specific contact resistance. The contact should act as a diffusion barrier and induce the least amount of stress in the underlying material. In this paper we present a set of stress measurements from different ohmic contact materials deposited on short- and long-wavelength HgCdTe films grown by liquid-phase epitaxy (LPE). Using a new experimental technique we remove the substrate and measure the stress induced on single- and multilayered HgCdTe cantilevers. To interpret our results, we develop a theoretical model that describes the physics of elastic deformation in HgCdTe layers. Our model is based on classical thin-plate bending theory and explicitly takes into account the realistic boundary conditions that are present in the experimental setup by using a variational approach.     

Ohmic contact using the Si nano-interlayer for undoped-AlGaN/GaN heterostructures

Excellent ohmic characteristics for undoped-AlGaN/GaN heterostructures have been achieved by using a Si nano-interlayer: a 1-nm Si layer has been evaporated followed by Ti/Al/Mo/Au evaporation. A contact transfer resistance of 0.18 Ω-mm and a specific contact resistivity of 1 × 10⁻⁶ Ω-cm² have been achieved along with excellent surface morphology at an optimized annealing temperature (800°C). Both ohmic contact characteristics and surface morphology are significantly better than those obtained without the Si nano-interlayer. Auger depth profiles and temperature-dependent current-voltage characteristics were investigated to understand ohmic formation. It is suggested that titanium silicide formation at the interface during rapid thermal annealing lowers the barrier height and enhances thermionic emission current.     

Ohmic contacts to p-CuInSe2 crystals

We report here on the optimization of ohmic contacts to p-CuInSe₂ (CISe) single crystals. A low resistance ohmic contact is required to minimize current losses due to series resistance; e.g. in Schottky diodes. Both In-Ga (eutectic)/CISe and gold (evaporatedVCISe contacts have been fabricated on crystals with different orientations and bulk properties. Gold contacts were found to have a lower resistance and to be more stable than In-Ga ones, from the slope of the linear current-voltage plot of the junctions. The resistance of the Au/CISe ohmic contact was decreased by etching the CISe crystal surface chemically in a 0.5% solution of Br₂ in methanol for 30 sec at room temperature, prior to gold deposition, while that of the In-Ga contact increased by this etch. Wetting experiments and contact angle measurements showed evidence for changes in the polarity of the surface due to chemical etches.