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着重讨论光互连技术在多芯片组件中的潜在应用。分析结果表明光互连技术在多芯片组件中应用应包括:组件的输入、输出、时钟分布以及内部芯片间互连等。 相似文献
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高性能的电子系统中,其内部互连网络所产生的影响对系统性能的作用表现得尤为明显。随着系统集成朝着更大规模的方向发展,电子系统内部电路的互连延迟已经成为限制其发展的主要障碍之一。光互连技术以其独特的传输性质对克服电互连产生的问题有较好的针对性。本文介绍了几种光学互连方式以及采用光互连方式的光电子多芯片组件。 相似文献
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光电多芯片组件(OEMCM)以其高速、高抗扰和高组装密度等特点,在军事 大规模并行计算机方面有着广阔的应用前景。本文简要介绍光电MCM在国内外的研究进展,光互连是实现光电MCM的关键,与电互连相比,光互连具有功耗低、极高的带宽、互连数大、互连密度高、无接触互连,以及抗电磁干扰等优点。指出了光电MCM物理设计的三个关键问题,散热、系统工作速度和最大光互连距离,而这些解决核心是芯片级最优分割算法的实现 相似文献
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本文首先指出研究多芯片组件用薄膜多层互连技术的必要性,然后对此类薄膜多层互连的材料、结构及工艺进行详细介绍,最后举例说明它在多芯片组件中的应用情况。 相似文献
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研究光电子多芯片组件中基于自由空间光互连实现的多级互连网络(MIN)处理单元划分算法,指出该划分算法可以看作是二次指派问题(QAP),为此提出一种新型的混合算法,并给出了算法运用实例。 相似文献
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片内光通信技术综述 总被引:3,自引:3,他引:0
在纳米工艺水平下,传统的铜线互连已经很难满足集成电路芯片在延迟、带宽、功耗等方面的要求,片内通信问题已经成为集成电路设计的瓶径.文中根据片内光器件集成技术的最新进展,介绍了采用片内光互连代替电互连的最新技术及其性能方面的优势.文中重点总结了片内光互连的三种典型应用.首先,介绍了片内光时钟分布网络;其次,从应用的角度分析了光电总线结构相对于单纯电总线在性能上的提升;最后,介绍了一种新的片上光网络,它集成了片内电的包交换控制网络和宽带电路交换光网络.仿真和实验结果表明,光互连能够为高集成度纳米级芯片提供高带宽、低延迟,小功耗的片内通信服务. 相似文献
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首先对多芯片组件互连线进行建模,然后通过对MCM互连线传输函数的降阶分析,给出了含负载情况下信号实现“快速”和“平稳”传输的互连长度及传输延迟计算算式,结果与SPICE模拟结果相吻合。 相似文献
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一种基于标准CMOS工艺的单片光互连 总被引:2,自引:2,他引:0
探索了采用标准CMOS工艺实现单片光互连的可行性。采用特许(Chartered)半导体公司3.3V、0.35μm标准模拟CMOS工艺设计并制造了一种单片光互连系统,并用两种结构研究了衬底噪声耦合对互连性能的影响。测试结果表明:该光互连系统可工作于几×103Hz,验证了基于标准CMOS工艺的单片光互连系统是可行的。 相似文献
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为克服光通信、电子计算技术等的速度限制,采用光互连是一种有效途径。光互连也是光计算机的基本技术。文中对光互连技术进行了分析,并介绍了一种有利于光互连的最理想光源——面发射激光二极管。 相似文献
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现代集成电路系统采用的互连技术中,电互连和光互连各有优缺点,OEMCM可以根据实际情况将二者的特点结合起来。目前国际上流行的自由空间光互连技术已经应用于异步传输模式和并行处理计算机结构中。着重介绍采用自由空间光互连OE MCM的结构和设计考虑。 相似文献
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Han Seo Cho Kun-Mo Chu Saekyoung Kang Sung Hwan Hwang Byung Sup Rho Weon Hyo Kim Joon-Sung Kim Jang-Joo Kim Hyo-Hoon Park 《Advanced Packaging, IEEE Transactions on》2005,28(1):114-120
An optical interconnection plate was developed in order to achieve a compact and cost-effective interconnection module for an optical data link between chips on printed circuit boards. On the silica substrate, transmission lines and solder bumps are formed on the top surface of the substrate, and polymer waveguide array with 45/spl deg/ mirror planes is formed on the back side. This optical interconnection plate technique makes the alignment procedure quite simple and economical, because all the alignment steps between the optical components can be achieved in wafer processes and a high accuracy flip-chip bonding technique. We confirmed the sufficiently high coupling efficiency and low optical crosstalk using the simplified experimental setup. Flip-chip bonding of the vertical-cavity surface-emitting laser and photodiode arrays on the top surface of the optical interconnection plate was performed using indium bumps in order to avoid thermal damage of the polymer waveguide. The fully packaged optical interconnection plate showed an optical data link at rates of 455 Mb/s. Improvement of the mirror surface roughness and the mirror angle accuracy could lead to an optical link at higher rates. In addition, the interconnection system can be easily constructed by inserting the optical interconnection plate between the processing chips or data lines requiring optical links. 相似文献
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Demands for increased interconnection density and higher bandwidth, coupled with stringent cost constraints of advanced wide bandwidth telecommunication switching equipment, are exhausting conventional electrical interconnection capabilities. The requirement for greater interconnection capabilities, spawned in part by the advances in integrated circuit technologies and the need for enhanced digital services, dictate that technology advancement must occur in traditional electronic packaging and/or interconnection techniques. The resolution of these technological needs is paramount for the successful competitive introduction of these systems. Presently, a “bottle-neck” occurs at the board-to-board level of the interconnection hierarchy. Therefore, an opportunity exists for the development of new optical interconnection techniques which can be incorporated into system designs beginning at this interconnection level and beyond. The strategic insertion of optical interconnection technology into these electronic processing systems not only meets projected performance requirements, but potentially offers them at a competitive cost. This paper describes some of the new optical strategies switching equipment designers are incorporating into today's products. These strategies range from optical data links to an implementation of a flexible optical backplane called OptiFlex 相似文献
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The use of optical interconnections between processors, boards, chips, and gates in electronic digital systems to overcome the current performance limitations is described. The advantages of optical interconnections in relation to the interconnection distance, the data capacity, and the interconnection functions are presented. The devices which will support practical implementation of optical interconnections and the integration of optical interconnection devices are discussed. The development of future integrated optoelectronic materials, processing, and fabrication technologies to support integrated optical electronics is also discussed 相似文献
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人们对无线宽带通信技术的需求在近些年稳步增长.无线电波频谱的带宽限制和频带拥堵,通过微波无线网络的发展已经有了明显的改善.然而,无线光互连技术才能使得数据传输带宽达到理想的要求.作为许多无线通讯系统的最终方案,无线光互连也被选择为长期的解决策略.并且,无线光互连的大量优势还没有得到完全的发掘,许多基础性和应用性的研究还需要在实验层面和商业应用层面加以深入.国外,Gb/s的无线光传输已经在实验室中得到了验证,然而,可用的室内无线光互连系统也仅仅达到了155Mb/s的速度.下面将着重从收发系统、性能及安全性方面对无线光互连技术作一概况阐述. 相似文献