一种用于超高频RFID阅读器的正交下变频混频器的分析与设计

分析了共用跨导级的正交下变频混频器的性能,包括电压转换增益、线性度、噪声系数和镜象抑制比,分析表明其在电流开关模式下比传统的Gilbert混频器对具有更好的性能.设计并优化了一个基于共用跨导级结构的用于超高频RFID阅读器的正交下变频混频器.在915MHz频段上,该混频器测得12.5dB的转换增益,10dBm的ⅡP3,58dBm的ⅡP2和17.6dB的SSB噪声系数.芯片采用0.18μm 1P6M RF CMOS工艺实现,在1.8V的电源电压下仅消耗3mA电流.     

2.45 GHz有源标签接收机中的下变频混频器

设计了一种用于2.45 GHz有源标签接收机的低中频正交下变频混频器。改进了传统的吉尔伯特结构, 采用了共享跨导正交结构和电流注入技术, 以提高混频器的增益, 减小混频器的噪声。该混频器采用UMC 0.18 μm CMOS工艺设计。仿真结果表明, 该混频器在1.8 V电压下, 电流消耗为3.1 mA, 转换增益为17.18 dB, 输入1 dB压缩点Pin-1dB与输入3阶截点IIP3分别为-13.5 dBm, -3.23 dBm, 在2 MHz中频下的噪声系数为14 dB。     

应用于SAW-less LTE接收机中的高线性度下变频器

本文提出一种基于0.18 μm CMOS 工艺的高线性度下变频器。该下变频器应于直接下变频架构的LTE接收机中,并可以使之省去高成本的深表面波(SAW)滤波器。所提出的下变频器由跨导级、无源混频器、电流缓冲器、跨阻级和直流失调消除环路等五部分组成。其中,电流缓冲器为无源滤波器在高频范围内提供低阻抗负载,减小了由带外阻塞信号引起的电压摆幅,从而改善了下变频器的线性度。与传统电路结构相比,该方法可以提高输入三阶交调截断点(IIP3)4.5 dB以及输入二阶交调截断点(IIP2)11 dB。测试结果表明,该下变频器转换增益为29.5 dB,噪声系数为12.7 dB,IIP3为13 dBm,IIP2大于62 dBm。     

一种电流注入式零中频正交混频器

设计了一种用于900MHz RFID阅读器的零中频正交下变频混频器,该混频器采用共跨导级正交结构,并利用电流注入技术减小噪声,在UMC0.18μmCMOS工艺下实现。整个芯片分为三部分,混频器、带隙基准以及缓冲器,总面积为1.1mm2。混频器在1.8V电压下消耗电流3.7mA,带宽范围880～940MHz,增益16.42dB,三阶截点为-4.625dBm,在100kHz处噪声系数为15.2dB。芯片能够达到阅读器的性能要求。     

一种K波段高增益低噪声折叠式双平衡混频器

基于130 nm RF CMOS工艺,设计了一种适用于K波段的高增益低噪声折叠式下变频混频器。采用折叠式双平衡电路结构,混频器的跨导级和开关级可以在不同的偏置条件下工作,为优化两级的噪声提供了极大的自由度。采用电流复用技术,混频器的转换增益和噪声系数得以显著改善。后仿真结果表明,该混频器在本振功率为-3 dBm时,实现了27.8 dB的转换增益和7.36 dB的噪声系数。在射频信号为24 GHz处的输入1 dB压缩点P1dB为-18.8 dBm,本振端口对射频端口的隔离度大于60.2 dB。该电路工作于1.5 V的电源电压,总直流电流为12 mA,功耗为18 mW。该混频器以适中的功耗获得了极高的整体性能,适用于低功耗、低噪声24 GHz雷达接收机。     

高线性度的CMOS下变频混频器的设计

采用正交反馈的跨导级设计了一种基于数字电视调谐芯片中的高线性度的下变频混频器,该混频器在3.3V的工作电压下,采用改进的Gilbert单元,使用基于Chartered0.25μm标准CMOS工艺进行流片测试,结果表明该混频器IIP3可达到15dBm,增益达到9dB。     

一种应用于LTE直接变频无声表滤波器接收机的1.2-V CMOS前端设计

本文提出了一种应用于LTE直接变频接收机的CMOS射频前端电路。电路由低噪声跨导放大器（LNA）,电流型无源混频器和跨阻运算放大器（TIA）组成,该结构对于LTE多频带应用具有高集成,高线性,并实现简单的频率配置。电路采用多个电流舵跨导级实现了大的可变增益控制范围。电流型无源混频器采用25%占空比本振改善了电路增益、噪声和线性性能。为了抑制带外干扰,采用直接耦合电流输入滤波器。该射频前端电路采用0.13-μm CMOS工艺设计制造。测试结果表明电路在2.3GHz到2.7GHz工作频率范围,具有45dB电压转换增益,噪声系数为2.7dB,IIP3为-7dBm以及校准后的IIP2为 60dBm。电路采用1.2V单电压供电,整个电路工作电流为40mA。     

1.2V高线性度低噪声折叠混频器设计

设计一种工作在1.2 V低电源电压下的折叠混频器。混频器电路采用折叠结构和电流复用技术,降低电源电压,减小直流功耗,降低噪声、提高增益和线性度。跨导级采用交流耦合互补跨导进一步降低电源电压。混频器设计基于SMIC0.18μm标准CMOS工艺。仿真结果表明:输入射频频率和输出中频频率为2.5 GHz和100 MHz时,IIP3为3.857 dBm,NF为5.257 dB,转换增益为9.787 dB,功耗为5.22 mW。     

一种高线性度CMOS有源混频器的设计

设计了一个用于数字电视ZERO-IF结构接收机射频前端的CMOS下变频混频器。基于对有源混频器的噪声机制及线性度的物理理解,对传统的有源混频器电路采用电流注入技术,实现了增益,噪声和线性度折中。电路采用UMC0.18RFCMOS工艺实现,SSB噪声系数为18dB,1/f噪声拐角频率100kHz。电压转换增益为5dB和8dB两档增益,输入1dB压缩点为0dBm,IIP3为15dBm（5dB增益）,7dBm（8dB增益）。全差分电路在1.8V供电电压下的功耗不到7mW,可以满足数字电视零中频结构射频前端对高线性度、低闪烁噪声和可变增益的要求。     

一种高线性度低噪声下变频混频器

采用SMIC 0.18 μm RF CMOS工艺,设计了一种高线性度、低噪声下变频混频器。通过分析跨导级电流3阶展开项系数,优化跨导级偏置电压,在跨导级与开关级之间增加谐振频率为射频信号频率的LC并联谐振电路,在提高电路线性度的同时优化了信噪比。后仿真结果表明,在射频频率为1.575 GHz,本振频率为1.571 GHz,中频频率为4 MHz时,本振功率为0 dBm,电压转换增益为19.22 dB,输入3阶交调点为21.93 dBm,单边带噪声系数为11.74 dB。混频器工作电压为1.8 V,功耗为3.66 mW,核心电路版图面积为0.207 5 mm²。     

A CMOS passive mixer with low flicker noise for low-power direct-conversion receiver

A CMOS passive mixer is designed to mitigate the critical flicker noise problem that is frequently encountered in constituting direct-conversion receivers. With a unique single-balanced passive mixer design, the resulted direct-conversion receiver achieves an ultralow flicker-noise corner of 45 kHz, with 6 dB more gain and much lower power and area consumption than the double-balanced counterpart. CMOS switches with a unique bias-shifting network to track the LO DC offset are devised to reduce the second-order intermodulation. Consequently, the mixer's IIP2 has been greatly enhanced by almost 21 dB from a traditional single-balanced passive mixer. An insertion compensation method is also implemented for effective dc offset cancellation. Fabricated in 0.18 /spl mu/m CMOS and measured at 5 GHz, this passive mixer obtains 3 dB conversion gain, 39 dBm IIP2, and 5 dBm IIP3 with LO driving at 0 dBm. When the proposed mixer is integrated in a direct-conversion receiver, the receiver achieves 29 dB overall gain and 5.3 dB noise figure.     

基于CMOS工艺的改进型电流注入混频器

设计了一种改进型电流注入混频器.通过在吉尔伯特混频器电路的本振开关管源极引入电感形成谐振电路,消除了开关管源极寄生电容的影响,降低了混频器电路的闪烁噪声,增大了混频器电路的增益.混频器电路的设计采用SMIC 0.35 μm CMOS 工艺库,本振功率为-3 dBm.仿真结果表明,与改进前的混频器电路相比,当本振功率为-3 dBm时,改进型电流注入混频器电路的增益提高了1.76 dB,IIP3提高2.1 dBm,噪声系数降低了0.5 dB.     

应用于软件无线电接收机中的无源下变频混频器

设计了一个应用于软件无线电接收机中的宽带无源下变频混频器,采用SMIC 0.13μm RF工艺实现,芯片面积0.42 mm<'2>.测试结果表明:在1.2 V电源电压下消耗了9 mA电流,工作频段0.9～2.2 GHz,电压转换增益17 dB,HP3 6～7 dBm,IIP2 40～42 dBm,DSB NF 17.5...     

用于蓝牙收发机的低电压CMOS Gilbert混频器

对已报道的Gilbert混频器工作在低电压时存在的问题进行了分析,在此基础上,描述了利用改进的低电压设计技术,用于2.4GHz蓝牙收发机的上混频器/下混频器的设计.利用适用于低电压工作的负反馈与电流镜技术提高上混频器的线性度;而通过采用折叠级联输出,增加了低电压时下混频器的设计自由度,从而降低了噪声,提高了转换增益.基于0.35μm CMOS工艺技术,在2V电源电压下,对电路进行了仿真.结果表明:上混频器消耗的电流为3mA,输入三阶截距点达到20dBm,输出的信号幅度为87mV;下混频器消耗的电流为3.5mA,得到的转换增益是20dB,输入参考噪声电压是6.5nV/ Hz,输入三阶截距点为4.4dBm.     

A 2.4-GHz ISM-Band Sliding-IF Receiver With a 0.5-V Supply

We report an ultra-low-voltage RF receiver for applications in the 2.4 GHz band, designed in a 90 nm CMOS technology. The sliding-IF receiver prototype includes an LNA, an image-reject LC filter with single-ended to differential conversion, an RF mixer, an LC IF filter, a quadrature IF mixer, RF and IF LO buffers, and an I/Q baseband section with a VGA and a low-pass channel-select filter in each path, all integrated on-chip. It has a programmable overall gain of 30 dB, noise figure of 18 dB, out-of-channel IIP3 of -22 dBm. The 3.4 mm² chip consumes 8.5 mW from a 0.5 V supply.     

Design of a High Performance 2-GHz Direct-Conversion Front-End With a Single-Ended RF Input in 0.13 $mu$m CMOS

A 2.1 GHz CMOS front-end with a single-ended low-noise amplifier (LNA) and a double balanced, current-driven passive mixer is presented. The LNA drives an on-chip transformer load that performs single-ended to differential conversion. A detailed comparison in gain, noise, and second and third order linearity performance is presented to motivate the choice of a current-driven passive mixer over an active mixer. The front-end prototype was implemented on a 0.13 $mu$m CMOS process and occupies an active chip area of 1.1 mm $^{2}$. It achieves 30 dB conversion gain, a low noise figure of 3.1 dB (integrated from 40 KHz to 1.92 MHz), an in-band IIP3 of ${-}$12 dBm, and IIP2 better than 39 dBm, while consuming only 12 mW from a 1.5 V power supply.      

A 76-dBm IIP2 down-conversion mixer for TD-SCDMA/RFID applications

This paper presents a semi-active in-phase/quadrature inductor-less down-conversion mixer. The mixer consists of an active trans-conductance stage, a passive current switching stage, and a trans-impedance stage. A complementary input architecture has been used to increase the trans-conductance for a given bias current. An on-chip prescaler is added to provide the balanced LO signals, while the CMFB circuit in trans-conductance stage is designed to enhance linearity. The chip was achieved in a 0.13???m CMOS technology. It features 5?dB conversion gain over a broad range from 800?MHz to 2.1?GHz, which supports Chinese TD-SCDMA/RFID standards simultaneously. The maximum IIP2 is +76?dBm at 2.1?GHz and suitable for application within a direct-conversion receiver.     

A 1.2-V RF front-end with on-chip VCO for PCS 1900 direct conversion receiver in 0.13-/spl mu/m CMOS

In this paper, a 1.2-V RF front-end realized for the personal communications services (PCS) direct conversion receiver is presented. The RF front-end comprises a low-noise amplifier (LNA), quadrature mixers, and active RC low-pass filters with gain control. Quadrature local oscillator (LO) signals are generated on chip by a double-frequency voltage-controlled oscillator (VCO) and frequency divider. A current-mode interface between the downconversion mixer output and analog baseband input together with a dynamic matching technique simultaneously improves the mixer linearity, allows the reduction of flicker noise due to the mixer switches, and minimizes the noise contribution of the analog baseband. The dynamic matching technique is employed to suppress the flicker noise of the common-mode feedback (CMFB) circuit utilized at the mixer output, which otherwise would dominate the low-frequency noise of the mixer. Various low-voltage circuit techniques are employed to enhance both the mixer second- and third-order linearity, and to lower the flicker noise. The RF front-end is fabricated in a 0.13-/spl mu/m CMOS process utilizing only standard process options. The RF front-end achieves a voltage gain of 50 dB, noise figure of 3.9 dB when integrated from 100 Hz to 135 kHz, IIP3 of -9 dBm, and at least IIP2 of +30dBm without calibration. The 4-GHz VCO meets the PCS 1900 phase noise specifications and has a phase noise of -132dBc/Hz at 3-MHz offset.