Laser‐fired contact for n‐type crystalline Si solar cells

Laser‐fired contacts to n‐type crystalline silicon were developed by investigating novel metal stacks containing Antimony (Sb). Lasing conditions and the structure of metals stacks were optimized for lowest contact resistance and minimum surface damage. Specific contact resistance for firing different metal stacks through either silicon nitride or p‐type amorphous silicon was determined using two different models and test structures. Specific contact resistance values of 2–7 mΩcm² have been achieved. Recombination loss due to laser damage was consistent with an extracted local surface recombination velocity of ~20 000 cm/s, which is similar to values for laser‐fired base contact for p‐type crystalline silicon. Interdigitated back contact silicon heterojunction cells were fabricated with laser‐fired base contact and proof‐of‐concept efficiencies of 16.9% were achieved. This localized base contact technique will enable low cost back contact patterning and innovative designs for n‐type crystalline solar cell. Copyright © 2014 John Wiley & Sons, Ltd.     

Optimizing the diffused regions of interdigitated backside buried contact solar cells

Recombination and a number of other important factors must be considered in the optimization of the diffused regions of high‐efficiency silicon solar cells. In this paper, we examine issues related to the four types of diffusions used in rear‐junction, interdigitated backside buried contact solar cells made on n‐type silicon wafers: the phosphorus‐diffused front‐surface field (FSF), the boron‐diffused emitter, and the boron and the phosphorus diffused contact regions. Dark saturation current density, effective lifetime, implied open‐circuit voltage and sheet resistance are characterized for the optimization of the above‐mentioned diffused regions. Diffusion uniformity and the avoidance of the diffusion‐induced dislocations are also discussed for the heavily diffused, metal coated contact diffusions. It is found that the optimal sheet resistances of the FSF for planar and textured surfaces are 120 Ω/□ and 105 Ω/□ respectively, whereas the optimal post‐processing sheet resistance for the boron emitter is approximately 100 Ω/□. Moreover, sheet resistance as heavy as 10–20 Ω/□ for the boron groove diffusion and 5–10 Ω/□ for the phosphorus groove diffusion have been achieved without introducing the diffusion‐induced misfit dislocations. Careful consideration of the issues discussed here led to an absolute efficiency improvement on the planar n‐type IBBC solar cell of more than 0·6%. Copyright © 2006 John Wiley & Sons, Ltd.     

Laser‐fired contact optimization in c‐Si solar cells

In this work we study the optimization of laser‐fired contact (LFC) processing parameters, namely laser power and number of pulses, based on the electrical resistance measurement of an aluminum single LFC point. LFC process has been made through four passivation layers that are typically used in c‐Si and mc‐Si solar cell fabrication: thermally grown silicon oxide (SiO₂), deposited phosphorus‐doped amorphous silicon carbide (a‐SiC_x/H(n)), aluminum oxide (Al₂O₃) and silicon nitride (SiN_x/H) films. Values for the LFC resistance normalized by the laser spot area in the range of 0.65–3 mΩ cm² have been obtained. Copyright © 2011 John Wiley & Sons, Ltd.     

19% efficient n‐type Czochralski silicon solar cells with screen‐printed aluminium‐alloyed rear emitter

High and stable lifetimes recently reported for n‐type silicon materials are an important and promising prerequisite for innovative solar cells. To exploit the advantages of the excellent electrical properties of n‐type Si wafers for manufacturing simple and industrially feasible high‐efficiency solar cells, we focus on back junction n⁺np⁺ solar cells featuring an easy‐to‐fabricate full‐area screen‐printed aluminium‐alloyed rear p⁺ emitter. Independently confirmed record‐high efficiencies have been achieved on n‐type phosphorus‐doped Czochralski‐grown silicon material: 18·9% for laboratory‐type n⁺np⁺ solar cells (4 cm²) with shadow‐mask evaporated front contact grid and 17·0% for front and rear screen‐printed industrial‐type cells (100 cm²). The electrical cell parameters were found to be perfectly stable under illumination. Copyright © 2006 John Wiley & Sons, Ltd.     

Series resistance imaging in solar cells by lock‐in thermography

Two operation modes of lock‐in thermography are introduced to detect regions of high series resistance in solar cells. These are differential techniques, working in the dark and under illumination, where images taken under two different conditions are used to calculate an image, which is especially sensitive to series resistance variations. Though the series resistance cannot be measured quantitatively by these techniques, regions of increased emitter contact resistance can be reliably detected. A realistic electrothermal modelling of a series resistance defect in a solar cell with and without illumination is presented. The new thermographic techniques are compared with established techniques for series resistance imaging. Especially the technique working under illumination gives results that agree very well with those of other methods. Copyright © 2005 John Wiley & Sons, Ltd.     

Passivation of n‐type emitter and p‐type base in solar cells via oxygen terminated silicon nanoparticles

Various measurements and experiments are performed to establish the mechanism of passivation on emitter and base of conventionally manufactured solar cell with p‐type base. The surface coatings on the emitter are removed. The bare surface is then coated with silicon (Si) nanoparticles (NPs) with oxygen termination. It shows an increase in the cell efficiency up to 14% over bare surface of solar cell. The NPs show enhancement in light scattering from the surface, but shows an increase in the recombination lifetime indicating an improved passivation. When back contact is partially removed, the coating on bare back side ( p‐type) of the solar cell also improves the cell efficiency. This is also attributable to the increased recombination lifetime from the measurements. Same NPs are seen to degrade the surface of n and p‐type Si wafers. This apparently contradictory behaviour is explained by studying and comparing the emitter (n‐type) surface of the solar cell with that of n‐type Si wafer and the back surface ( p‐type) with that of p‐type Si wafer. The emitter surface is distinctly different from the n‐type wafer because of the shallow p–n junction causing the surface depletion. Back surface has aluminium (Al) metal trace, which plays an important role in forming complexes with the oxygen‐terminated Si NPs (Si–O NPs). With these studies, it is observed that increase in the efficiency can potentially reduce the thermal budget in solar cell preparation. Copyright © 2013 John Wiley & Sons, Ltd.     

Buried contact solar cells with innovative rear localised contacts

A new rear contacting scheme using low‐temperature processes to form localised contacts without the use of photolithography has been developed. It uses randomly nucleated, aluminium‐induced, localised regions of solid phase epitaxial growth of p ⁺ silicon onto the rear surface of a wafer through a thick rear surface passivating oxide. This rear contacting technique has been applied on solar cells with front buried contacts and results have shown that a suitable ohmic contact to the rear can be formed through oxide as thick as 3000 Å and using only low temperature sintering below the eutectic temperature of silicon and aluminium. This low‐temperature sintering avoids the destruction of the interfacial oxide which has been shown to provide good surface passivation for the rear of the solar cells. Microscopic images indicate the possibility of forming p ⁺ rear contacts with aluminium‐induced crystallisation, but without requiring any additional deposition of silicon. The source of silicon for the latter appears to be from the reduction of the silicon dioxide by the aluminium. Copyright © 2004 John Wiley & Sons, Ltd.     

Comparison of TiO2 and other dielectric coatings for buried‐contact solar cells: a review

This paper compares the optical, electronic, physical and chemical properties of dielectric thin films that are commonly used to enhance the performance of bulk silicon photovoltaic devices. The standard buried‐contact (BC) solar cell presents a particularly challenging set of criteria, requiring the dielectric film to act as: (i) an anti‐reflection (AR) coating; (ii) a film compatible with surface passivation; (iii) a mask for an electroless metal plating step; (iv) a diffusion barrier for achieving a selective emitter; (v) a film with excellent chemical resistance; (vi) a stable layer during high‐temperature processing. The dielectric coatings reviewed here include thermally grown silicon dioxide (SiO₂), silicon nitride deposited by plasma‐enhanced chemical vapour deposition (a‐ SiN_x :H) and low‐pressure chemical vapour deposition (Si₃N₄), silicon oxynitride (SiON), cerium dioxide (CeO₂), zinc sulphide (ZnS), and titanium dioxide (TiO₂). While TiO₂ dielectric coatings exhibit the best optical performance and a simple post‐deposition surface passivation sequence has been developed, they require an additional sacrificial diffusion barrier to survive the heavy groove diffusion step. A‐ SiN_x :H affords passivation through its high fixed positive charge density and large hydrogen concentration; however, it is difficult to retain these electronic benefits during lengthy high‐temperature processing. Therefore, for the BC solar cell, Si₃N₄ films would appear to be the best choice of dielectric films common in industrial use. Copyright © 2004 John Wiley & Sons, Ltd.     

Investigation of laser ablation on boron emitters for n‐type rear‐junction PERT type silicon wafer solar cells

n‐type silicon wafer solar cells are receiving increasing attention for industrial application in recent years, such as the n‐type rear‐junction Passivated Emitter Rear Totally‐diffused (PERT) solar cells. One of the main challenges in fabricating the n‐PERT solar cells is the opening of the rear dielectric for localized contacts. In this work laser ablation is applied to locally ablate the rear dielectric. We investigate the laser damage to the emitter at the laser‐ablated regions using the emitter saturation current density, J_0e,laser, extracted by two approaches. J_0e,laser is observed to be injection dependent due to high J₀₂ recombination caused by laser damage to the space charge region. By using the optimized laser ablation parameters, n‐PERT solar cells with an efficiency of up to 21.0% are realized. Copyright © 2015 John Wiley & Sons, Ltd.     

Enhanced lateral current transport via the front N+ diffused layer of n‐type high‐efficiency back‐junction back‐contact silicon solar cells

N‐type back‐contact back‐junction solar cells were processed with the use of industrially relevant structuring technologies such as screen‐printing and laser processing. Application of the low‐cost structuring technologies in the processing of the high‐efficiency back‐contact back‐junction silicon solar cells results in a drastic increase of the pitch on the rear cell side. The pitch in the range of millimetres leads to a significant increase of the lateral base resistance. The application of a phosphorus doped front surface field (FSF) significantly reduces the lateral base resistance losses. This additional function of the phosphorus doped FSF in reducing the lateral resistance losses was investigated experimentally and by two‐dimensional device simulations. Enhanced lateral majority carrier's current transport in the front n⁺ diffused layer is a function of the pitch and the base resistivity. Experimental data show that the application of a FSF reduces the total series resistance of the measured cells with 3.5 mm pitch by 0.1 Ω cm² for the 1 Ω cm base resistivity and 1.3 Ω cm² for the 8 Ω cm base resistivity. Two‐dimensional simulations of the electron current transport show that the electron current density in the front n⁺ diffused layer is around two orders of magnitude higher than in the base of the solar cell. The best efficiency of 21.3% was obtained for the solar cell with a 1 Ω cm specific base resistivity and a front surface field with sheet resistance of 148 Ω/sq. Copyright © 2008 John Wiley & Sons, Ltd.     

Novel approach for characterizing the specific shunt resistance caused by the penetration of the front contact through the p-n junction in solar cell

on process was completely compatible with the industrial silicon fabrication sequence, which was of great convenience. The measurement results give informations on the solar cell structure, material ingredients, and process parameters.     

High‐efficiency black silicon interdigitated back contacted solar cells on p‐type and n‐type c‐Si substrates

This work demonstrates the high potential of Al₂O₃ passivated black silicon in high‐efficiency interdigitated back contacted (IBC) solar cells by reducing surface reflectance without jeopardizing surface passivation. Very low reflectance values, below 0.7% in the 300–1000 nm wavelength range, together with striking surface recombination velocities values of 17 and 5 cm/s on p‐type and n‐type crystalline silicon substrates, respectively, are reached. The simultaneous fulfillment of requirements, low reflectance and low surface recombination, paves the way for the fabrication of high‐efficiency IBC Si solar cells using black silicon at their front surface. Outstanding photovoltaic efficiencies over 22% have been achieved both in p‐type and n‐type 9‐cm² cells. 3D simulations suggest that efficiencies of up to 24% can be obtained in the future with minor modifications in the baseline fabrication process. Copyright © 2015 John Wiley & Sons, Ltd.     

Silicon solar cells based on all‐laser‐transferred contacts

Crystalline silicon solar cells based on all‐laser‐transferred contacts (ALTC) have been fabricated with both front and rear metallization achieved through laser induced forward transferring. Both the front and rear contacts were laser‐transferred from a glass slide coated with a metal layer to the silicon substrate already processed with emitter formation, surface passivation, and antireflection coating. Ohmic contacts were achieved after this laser transferring. The ALTC solar cells were fabricated on chemically textured p‐type Cz silicon wafers. An initial conversion efficiency of over 15% was achieved on a simple cell structure with full‐area emitter. Further improvements are expected with optimized laser transferring conditions, front grid pattern design, and surface passivation. The ALTC process demonstrates the advantage of laser processing in simplifying the solar cell fabrication by a one‐step metal transferring and firing process. Copyright © 2013 John Wiley & Sons, Ltd.     

Industrially feasible,dopant‐free,carrier‐selective contacts for high‐efficiency silicon solar cells

Dopant‐free, carrier‐selective contacts (CSCs) on high efficiency silicon solar cells combine ease of deposition with potential optical benefits. Electron‐selective titanium dioxide (TiO₂) contacts, one of the most promising dopant‐free CSC technologies, have been successfully implemented into silicon solar cells with an efficiency over 21%. Here, we report further progress of TiO₂ contacts for silicon solar cells and present an assessment of their industrial feasibility. With improved TiO₂ contact quality and cell processing, a remarkable efficiency of 22.1% has been achieved using an n‐type silicon solar cell featuring a full‐area TiO₂ contact. Next, we demonstrate the compatibility of TiO₂ contacts with an industrial contact‐firing process, its low performance sensitivity to the wafer resistivity, its applicability to ultrathin substrates as well as its long‐term stability. Our findings underscore the great appeal of TiO₂ contacts for industrial implementation with their combination of high efficiency with robust fabrication at low cost. Copyright © 2017 John Wiley & Sons, Ltd.     

Effect of carbon containing SiNx antireflection coating on the screen‐printed contact and low illumination performance of silicon solar cell

Screen‐printed metal contact formation through a carbon containing antireflection coating was investigated for silicon solar cells by fabricating conventional carbon‐free SiN_x and carbon‐rich SiC_xN_y film. An appreciable difference was found in the average shunt resistance (R_sh), which was about an order of magnitude higher for SiC_xN_y‐coated solar cells relative to the counterpart SiN_x‐coated solar cells. Series resistance (R_s) and fill factor (FF) were comparable for both antireflection coatings but the starting efficiency of SiC_xN_y‐coated cell was ~0·2% lower because of slightly inferior surface passivation. However, SiC_xN_y‐coated solar cells showed less degradation under lower illumination (<1000 W/m²) compared with the SiN_x‐coated cells due to reduced FF degradation under low illumination. Theoretical calculations in this paper support that this is a direct result of high R_sh. Detailed photovoltaic system and cost modeling is performed to quantify the enhanced energy production and the reduced levelized cost of electricity due to higher shunt resistance of the SiC_xN_y‐coated cells. It is shown that R_sh value below 30 Ω (7000 Ω cm² for 239 cm² cell) can lead to appreciable loss in energy production in regions of low solar insolation. Copyright © 2011 John Wiley & Sons, Ltd.     

Back‐contacted back‐junction n‐type silicon solar cells featuring an insulating thin film for decoupling charge carrier collection and metallization geometry

In this study, back‐contacted back‐junction n‐type silicon solar cells featuring a large emitter coverage (point‐like base contacts), a small emitter coverage (point‐like base and emitter contacts), and interdigitated metal fingers have been fabricated and analyzed. For both solar cell designs, a significant reduction of electrical shading losses caused by an increased recombination in the non‐collecting base area on the rear side was obtained. Because the solar cell designs are characterized by an overlap of the B‐doped emitter and the P‐doped base with metal fingers of the other polarity, insulating thin films with excellent electrical insulation properties are required to prevent shunting in these overlapping regions. Thus, with insulating thin films, the geometry of the minority charge carrier collecting emitter diffusion and the geometry of the interdigitated metal fingers can be decoupled. In this regard, plasma‐enhanced chemical vapor deposited SiO₂ insulating thin films with various thicknesses and deposited at different temperatures have been investigated in more detail by metal‐insulator‐semiconductor structures. Furthermore, the influence of different metal layers on the insulation properties of the films has been analyzed. It has been found that by applying a SiO₂ insulating thin film with a thickness of more than 1000 nm and deposited at 350 °C to solar cells fabricated on 1 Ω cm and 10 Ω cm n‐type float‐zone grown silicon substrates, electrical shading losses could be reduced considerably, resulting in excellent short‐circuit current densities of more than 41 mA/cm² and conversion efficiencies of up to 23.0%. Copyright © 2012 John Wiley & Sons, Ltd.     

Two‐dimensional modeling of front contact silicon solar cells

The modeling of a new type of silicon solar cell intended for operation at very high concentration, with all the contacts at its front face, is presented. The two‐dimensional model developed makes use of the theory of the complex variable, and is able to explain the main features of the operation of these cells. It is shown that if all the parameters reach good state‐of‐the‐art values, and with the appropriate layout, this structure can reach 25% efficiency for a range of concentrations wider than any other known silicon cell. Copyright © 2004 John Wiley & Sons, Ltd.     

Heterojunction solar cells with 23% efficiency on n‐type epitaxial kerfless silicon wafers

We present a heterojunction (HJ) solar cell on n‐type epitaxially grown kerfless crystalline‐silicon with an in‐house‐measured conversion efficiency of 23%. The total cell area is 243.4 cm². The cell has a short‐circuit current density of 39.6 mA cm⁻², an open‐circuit voltage of 725 mV, and a fill factor of 0.799. The effect of stacking faults (SFs) is examined by current density (J) mapping measurements as well as by spectral response mapping. The J mapping images show that the localized lower J regions of the HJ solar cells are associated with recombination sites originating from SFs, independent of whether SFs are formed on the emitter or absorber side. The solar cell results and our analysis suggest that epitaxially grown wafers based on kerfless technology could be an alternative for low‐cost industrial production of Si HJ solar cells. Copyright © 2016 John Wiley & Sons, Ltd.     

On the detection of shunts in silicon solar cells by photo‐ and electroluminescence imaging

Recently electroluminescence (EL) and photoluminescence (PL) imaging were reported to allow detection of strong ohmic shunts in silicon solar cells. Comparing lock‐in thermography (LIT) images with luminescence images of various shunted cells, measured under different conditions, the ability of luminescence techniques for shunt detection is investigated. Luminescence imaging allows identifying ohmic shunts only if they reach a certain strength. The detection limit for PL measurements of linear shunts was estimated to be in the order of 15 mA at 0·5 V bias for a point‐like shunt in multicrystalline (mc) cells. Pre‐breakdown sites can also be detected by electroluminescence under reverse bias. Copyright © 2007 John Wiley & Sons, Ltd.