掺杂GaAs/Al0.3Ga0.7As超晶格的光致发光特性分析

在室温下,通过光致发光实验研究了用MBE生长的GaAs/Al0.3Ga0.7As超晶格材料的光致发光特性,对测得的发光峰进行了指认.理论计算和实验结果符合很好.     

Photoluminescence studies of In0.7Al0.3As/In0.75Ga0.25As/In0.7Al0.3As metamorphic heterostructures on GaAs substrates

The influence of the design of the metamorphic buffer of In_0.7Al_0.3As/In_0.75Ga_0.25As metamorphic nanoheterostructures for high-electron-mobility transistors (HEMTs) on their electrical parameters and photoluminescence properties is studied experimentally. The heterostructures are grown by molecular-beam epitaxy on GaAs (100) substrates with linear or step-graded In _x Al_{1 ? x} As metamorphic buffers. For the samples with a linear metamorphic buffer, strain-compensated superlattices or inverse steps are incorporated into the buffer. At photon energies ?ω in the range 0.6–0.8 eV, the photoluminescence spectra of all of the samples are identical and correspond to transitions from the first and second electron subbands to the heavy-hole band in the In_0.75Ga_0.25As/In_0.7Al_0.3As quantum well. It is found that the full width at half-maximum of the corresponding peak is proportional to the two-dimensional electron concentration and the luminescence intensity increases with increasing Hall mobility in the heterostructures. At photon energies ?ω in the range 0.8–1.3 eV corresponding to the recombination of charge carriers in the InAlAs barrier region, some features are observed in the photoluminescence spectra. These features are due to the difference between the indium profiles in the smoothing and lower barrier layers of the samples. In turn, the difference arises from the different designs of the metamorphic buffer.     

GaAs/Al0.3Ga0.7As 量子阱红外探测器光谱特性研究

采用金属有机物化学气相沉积法(MOCVD)生长GaAs/Al0.3Ga0.7As量子阱材料,制备300 m300 m台面,内电极压焊点面积为20 m20 m,外电极压焊点面积为80 m80 m单元量子阱器件两种。利用傅里叶光谱仪对1#,2#样品进行77K液氮温度光谱响应测试。实验结果显示1#,2#样品峰值响应波长分别为8.43 m,8.32 m,与根据薛定谔方程得到器件理论峰值波长8.5 m间误差分别为1.0%,2.1%。实验结果说明MOCVD技术可以满足QWIP生长制备工艺要求,且器件电极压焊点位置与面积大小对器件峰值波长影响不大,而对峰值电流有一定影响。     

Hot-hole lateral transport in a two-dimensional GaAs/Al0.3Ga0.7As structure

A narrow peak at the leading edge of the current pulse was found in samples of p-GaAs/Al_0.3Ga_0.7As structures subjected to a high electric field. An analysis of the shape and height of the peak as a function of the electric field, as well as the field redistribution along the sample, allows us to conclude that domain instability exists under these conditions. It is also shown that the energy of holes heated in moderate electric fields can significantly exceed the optical phonon energy.     

Very high-transconductance short-channel GaAs MESFETs with Ga0.3Al0.7As buffer layer

MESFETs with 0.17?m gate length were manufactured with an n+GaAs active layer (3 × 1018cm-3) and an undoped Ga0.3Al0.7As buffer layer grown by molecular-beam epitaxy. The deives showed very high transconductance (700mS/mm) with good pinchoff characteristics. The experimental transconductance values were compared with calculated ones using a model that assumed total carrier confinement within the active layer by a barrier potential at the GaAs/GaAlAs interface. The results suggest that very high-transconductance short-gate-length MESFETs can be fabricated with a heavily doped GaAs active layer provided that the carrier density in the active layer is maintained at the doping level.     

Hydrogen plasma passivation of bulk GaAs and Al0.3Ga0.7As/GaAs multiple-quantum-well structures on Si substrates

Hydrogen (H) plasma passivation effects on GaAs grown on Si substrates (GaAs on Si) are investigated in detail. H plasma exposure effectively passivates both the shallow and deep defects in GaAs on Si, which improves both the electrical and optical properties. It was found that the minority carrier lifetime is increased and the deep level concentration is decreased by the H plasma exposure. In addition, after H plasma exposure, room temperature photoluminescence (PL) for Al_0.3Ga_0.7As/GaAs multiple-quantum-well (MQW) on Si is enhanced with a decrease in the spectral width.     

DX centers in Sn-doped Ga0.7Al0.3As

We have measured and analyzed the extended fine structure on the Sn K-shell x-ray absorption spectra of GaAs and Ga_0.7Al_0.3As doped with ∼5 x 10¹⁸ cm⁻³ Sn. Our results and their implications for the atomic structure of DX centers are discussed.     

Effect of GaAs (100) substrate misorientation on the electrical parameters and surface morphology of metamorphic In0.7Al0.3As/In0.75Ga0.25As/In0.7Al0.3As HEMT nanoheterostructures

The results of studies of the effect of GaAs (100) substrate misorientation on the electrical parameters and surface morphology of high electron mobility In_0.7Al_0.3As/In_0.75Ga_0.25As/In_0.7Al_0.3As/GaAs nanoheterostructures are reported. Using molecular-beam epitaxy, two identical structures with a stepped compositional profile of the metamorphic In _x Al_{1 ? x} As (Δ _x = 0.05) buffer are grown on substrates of two types: a singular GaAs substrate with the orientation (100) ± 0.5° and a GaAs (100) substrate misoriented by (2 ± 0.5)° in the $\left[ {0\bar 1\bar 1} \right]$ direction. It is found that, in the case of the misoriented substrate, the concentration of the two-dimensional electron gas is ～40% higher. Broadening of the photoluminescence spectra and a shift of the peaks to lower photon energies, as experimentally observed in the case of the misoriented substrate, are attributed to the increased roughness of the heterointerfaces and strengthened fluctuations of the quantum-well width.     

Optimization of the In0.3Ga0.7As-Layer Thickness in a Triple-Junction In0.3Ga0.7As/GaAs/In0.5Ga0.5P Solar Cell

Semiconductors - The optimum absorbing-layer thickness in the bottom In0.3Ga0.7As subcell of a triple-junction In0.3Ga0.7As/GaAs/In0.5Ga0.5P solar cell is sought for using the Sentaurus TCAD...     

Characteristics of Si3N4/GaAs metal-lnsulator-semiconductor interfaces with coherent Si/Al0.3Ga0.7As interlayers

Si₃N₄/GaAs metal-insulator-semiconductor (MIS) interfaces with Si(10Å)/ Al_0.3Ga_0.7As (20Å) interface control layers have been characterized using capacitance-voltage (C-V) and conductance methods. The structure was in situ grown by a combination of molecular beam epitaxy and chemical vapor deposition. A density of interface states in the 1.1 × 10¹¹ eV^-1 cm^-2 range near the GaAs midgap as determined by the conductance loss has been attained with an ex situ solid phase annealing of 600°C in N₂ ambient. A dip quasi-static C-V demonstrating the inversion of the minority-carrier verifies the decent interface quality of GaAs MIS interface. The hysteresis and frequency dispersion of the MIS capacitors were lower than 100 mV, some of them as low as 50 mV under a field swing of about ±2 MV/cm. The increase of the conductance loss at higher frequencies was observed when employing the surface potential toward conduction band edge, suggesting the dominance of faster traps. Self-aligned gate depletion mode GaAs metal-insulator-semiconductor field-effect transistors with Si/Al_0.3Ga_0.7As interlayers having 3 μm gate lengths exhibited a transconductance of about 114 mS/mm. The present article reports the first application of pseudomorphic Si/ Al_0.3Ga_0.7As interlayers to ideal GaAs MIS devices and demonstrates a favorable interface stability.     

120-nm gate-length In0.7Ga0.3As/In0.52Al0.48As InP-based HEMT

120 nm gate-length In_(0.7)Ga_(0.3)As/In_(0.52)Al_(0.48) As InP-based high electron mobility transitions(HEMTs) are fabricated by a new T-shaped gate electron beam lithograph(EBL) technology,which is achieved by the use of a PMMA/PMGI/ZEP520/PMGI four-layer photoresistor stack.These devices also demonstrate excellent DC and RF characteristics:the transconductance,maximum saturation drain-to-source current,threshold voltage,maximum current gain frequency,and maximum power-gain cutoff frequency of InGaAs/I...     

High uniformity of Al0.3Ga0.7As/ln0.15Ga0.85As doped-channel structures grown by molecular beam epitaxy on 3″ GaAs substrates

Al_0.3Ga_0.7As/ln_0.15Ga_0.85As doped-channel structures were grown by molecular beam epitaxy on 3″ GaAs substrates. The uniformities of electrical and optical properties across a 3″ wafer were evaluated. A maximum 10% variation of sheet charge density and Hall mobility was achieved for this doped-channel structure. A1 μm long gate field-effect transistor (FET) built on this layer demonstrated a peak transconductance of 350 mS/mm with a current density of 470 mA/mm. Compared to the high electron mobility transistors, this doped-channel FET provides a higher current density and higher breakdown voltage, which is very suitable for high-power microwave device applications.     

Very low-noise Al/sub 0.3/Ga/sub 0.7/As/Ga/sub 0.65/In/sub 0.35/As/GaAs single quantum-well pseudomorphic HEMTs

AlGaAs/GaInAs/GaAs pseudomorphic HEMTs with an InAs mole fraction as high as 35% in the channel has been successfully fabricated. The device exhibits a maximum extrinsic transconductance of 700 mS/mm. At 18 GHz, a minimum noise figure of 0.55 dB with 15.0 dB associated gain was measured. At 60 GHz, a minimum noise figure as low as 1.6 dB with 7.6 dB associated gain was also obtained. This is the best noise performance yet reported for GaAs-based HEMTs.<>     

Study of grown-in defects and effect of thermal annealing in Al0.3Ga0.7As and GaAs LPE layers

Studies of the grown-in deep-level defects in the undoped n-Al_xGa_1-xAs (x = 0.3) and GaAs epitaxial layers prepared by the liquid phase epitaxy (LPE) techniques have been made, using DLTS, I-V and C-V measurements. The effect of 300 °C thermal annealing on the grown-in defects was investigated as a function of annealing time. The results showed that significant reduction in these grown-in defects can be achieved via low temperature thermal annealing process. The main electron and hole traps observed in the Al_0.3Ga_0.7As LPE layer were due to the E_c-0.31 eV and E_v+0.18 eV level, respectively, while for the GaAs LPE layer, the electron traps were due to the E_c-0.42 and 0.60 eV levels, and the hole traps were due to E_v+0.40 and 0.71 eV levels. Research supported in part by the Air Force Wright Aeronautical Laboratories, Aeropropulsion Lab., Wright Patterson Air Force Base, Ohio, subcontract through SCEEE, contract F33615-81-C-2011, task-4, and in part by AFOSR grant no. 81-0187.     

Transient current spectroscopy and frequency dispersion studies of low temperature GaAs and Al0.3Ga0.7As metal-insulator-semiconductor diodes

Low temperature (LT)-grown GaAs and Al_0.3Ga_0.7As metal-insulator-n⁺-GaAs (MIN) diodes have been fabricated and their electrical properties analyzed. Studies were carried out to evaluate the interfacial quality of the LT layer and the underlying n⁺-GaAs layer using transient current spectroscopy (TCS) and capacitance-frequency (C-f) characterization. TCS studies on LT-GaAs revealed a high concentration of a continuum of states anda dominant electron trap with an activation energy of 0.52eV. In LT-Al_0.3Ga_0.7As, a shallow trap at 0.36eV and two deep level traps at 0.85eV and 1.12eV were observed. Frequency dispersion was observed to be less for LT-GaAs samples with an AlAs barrier layer than without an AlAs barrier layer. However, LT-Al_0.3Ga_0.7As MIN diodes displayed a smaller frequency dispersion than LT-GaAs MIN diodes. Upon further investigation into MISFET devices, it was found that LT-Al_0.3Ga_0.7As MISFET devices had better transconductance frequency dispersion characteristics than LT-GaAs MISFET devices did.     

Rectification at n-n GaAs:(Ga,Al)As heterojunctions

n-n Ga0.7Al0.3As: GaAs heterojunction structures have been grown by l.p.e., with 1 × 1015 cm-3 net carriers in the ternary. N/W profiling across the heterojunction shows an accumulation region on the GaAs side and a depletion region on the (Ga, Al)As side. I/V characteristics at room temperature show significant rectification.     

Nanorelief of an oxidized cleaved surface of a grid of alternating Ga0.7Al0.3As and GaAs heterolayers

The morphology of an oxidized cleaved surface of a grid of alternating GaAs and Ga_0.7Al_0.3As layers was investigated by atomic-force microscopy. It was found that the surface of the native oxide film on a cleaved surface possesses a quasistationary nanorelief that reflects the composition of the layers of the heterostructure. The oxide regions above the GaAlAs layers are 0.5 nm higher than the regions above the GaAs layers. Etching off the oxide film shows that a nanorelief, which is inverted with respect to the relief of the oxide surface, also forms on the bared cleaved surface. The appearance of nanoreliefs on the surface and at the bottom boundary of the native oxide film is explained by the different oxidation depths of GaAs and Ga_0.7Al_0.3As and by an oxidation-induced increase in the volume. Fiz. Tekh. Poluprovodn. 33, 594–597 (May 1999)     

InAs/GaAs quantum dot infrared photodetector (QDIP) with double Al/sub 0.3/Ga/sub 0.7/As blocking barriers

The ten stacked self-assembled InAs/GaAs quantum dot infrared photodetectors (QDIP) with different Al/sub 0.3/Ga/sub 0.7/As barrier widths and growth temperatures were prepared. Asymmetric current-voltage (I-V) characteristics and 2/spl sim/7.5 /spl mu/m detection window were observed. Peak responsivity of 84 mA/W at -0.4 V and peak specific detectivity of 2.5/spl times/10/sup 9/ cm-Hz/sup 1/2//W at zero bias were observed at 50 K. The characteristics of polarization insensitivity over the incident light and the high background photocurrent suggest that the self-assembled QDIP can be operated at higher temperature (/spl sim/250 K) under normal incidence condition in contrast to quantum well infrared photodetector (QWIP).     

大应变In0.3Ga0.7As/GaAs量子阱激光器的生长和研究

金属有机物化学气相沉积(MOCVD)方法生长应变InGaAs／GaAs量子阱，应变缓冲层结合生长中断改善量子阱的PL谱特性．用该量子阱制备的激光器有很低的阈值电流密度(43A／cm^2)和较高的斜率效率(0．34W／A，per facet)．