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胶粘耐磨涂层的研制及其磨损机理分析 总被引:1,自引:0,他引:1
本文介绍了JNT90系列涂层的研制过程及计算机辅助涂层配方优化方法,分析了影响胶粘胶耐磨涂层耐磨性的主要因素,并通过扫描电镜对粘涂层的结构形貌,磨损机理进行了研究,提出了提高涂层性能折途径和见解。 相似文献
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耐磨胶粘涂层及其磨损机理分析 总被引:8,自引:0,他引:8
对耐磨胶粘涂层的组成、影响涂层性能的因素进行了研究,并通过扫描电镜对涂层的结构形貌、涂层磨损失效机理进行了分析,认为涂层磨损失效,主要是由于强度(或刚性)不足而造成的变形磨损,以及韧性不足造成的脆性破坏,并提出了提高涂层性能的途径和见解。 相似文献
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随着化学工业技术的进步与发展,硅酸盐粘结剂作为一种常见的无机胶,其被广泛的应用于社会各个领域之中,在建筑、化工、包装等行业中发挥着重要作用。目前,虽然硅酸盐粘结剂在材料性能上具有良好的环保性、抗腐蚀性、粘接性强等特点,但是,随着硅酸盐粘结剂粘接时间的推移,其材料性能容易降低,尤其是对于一些陶瓷、玻璃、金属等粘接要求高的产品,更无法充分发挥出硅酸盐粘结剂的化学效能。主要以K2Ti6O13晶须为化学物,对硅酸盐粘结剂进行一定的改良,通过硅酸盐粘结剂的化学改良与制备,分析其改良后的综合性能,以期促进硅酸盐粘结剂更好的使用。 相似文献
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纳米填料对环氧胶粘涂层冲蚀磨损性能的影响 总被引:4,自引:0,他引:4
在环氧胶粘涂层中加入填料可提高其强度和耐磨性。研究了转角、转速对填料分别为纳米SiO2、粉煤灰的环氧树脂涂层冲蚀磨损性能的影响。通过实验推荐了具有较好耐冲蚀能力的环氧树脂胶粘涂层的最佳配方。 相似文献
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混合硅酸盐无机胶粘剂的研制 总被引:5,自引:1,他引:5
采用正交试验和改变加料量试验相结合的方法研制了一种满足陶瓷粘接和修复要求的硅酸盐系无机胶粘剂。采用电子精密材料试验机测试其粘接力及常温水浸实验测其耐水性和高温灼烧骤冷检测其抗热震能力。结果表明,该胶粘剂粘接陶瓷拉伸强度大、抗热震性能好,且具有室温即可固化、易于施工、原料易得和价格低廉的特点。 相似文献
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以丙烯酸丁酯(BA)、聚丙烯酰胺(PAM)和硅烷偶联剂等作为硅酸钠的改性剂,制备改性硅酸盐无机胶粘剂。采用正交试验法和单因素试验法考察了各种改性剂用量、固化温度和固化时间等对胶粘剂力学性能、耐水性等影响,并对胶粘剂的耐热性和耐腐蚀性进行了研究。结果表明:当m(BA)=0.1 g、m(硅酸钠)=50 g、m(PAM)=0.05 g、w(硅烷偶联剂)=0.6%、固化温度120℃和固化时间3 h时,改性胶粘剂的综合性能最佳,其粘接强度超过2.0 MPa、水浸泡24 h后的粘接强度保持率达83%、1 000℃时不分解且对钢材具有良好的防腐保护作用。 相似文献
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通过正交试验和单因素试验确定了水性聚氨酯(WPU)的合成工艺条件:异佛尔酮二异氰酸酯(IPDI)与聚丙二醇(PPG-1000)的反应条件为85°C/2h,加入二羟甲基丙酸(DMPA)和1,4丁二醇(BDO)后的反应条件为80°C/2h,n(─NCO)/n(─OH)=(3.8~4.6)∶1,DMPA质量分数为5%~6%,BDO质量分数为8%~9%。通过红外光谱对合成的产物进行了表征,发现异氰酸酯基特征峰消失,氨基甲酸酯键吸收峰形成,说明合成了水性聚氨酯。所合成的水性聚氨酯乳液固含量为34%,具有较好的贮存稳定性。所得涂膜吸水率低(为15%),其耐水、耐碱和耐洗刷性能良好。 相似文献
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Epoxy-based conductive adhesives have been widely used in the electronic field given the lead-free development of electronic packaging. The conductive adhesive joints must be subjected to shear loads during the service of electronic products considering the mismatch in mechanical properties between packaged chip and substrate. In this study, INSTRON 5544 universal material testing machine was used for tensile–shear tests of isotropic conductive adhesive joint specimens, which were prepared using pure copper plate adherend in the form of single-lap joints. Four loading rates, that is, 0.05, 0.5, 5, and 10 mm/min, were adopted. The relationship between shear load and displacement of two overlapping copper plates is deduced from a mechanical perspective. A mechanical model of the conductive adhesive shear specimen was developed by introducing dimensionless parameters, which are obtained from interfacial fracture energy and shear strength, to interpret the effect of loading rate on the shear properties of the conductive adhesive specimen considering the loading rate. Results show that this model can effectively reflect the relationship between shear load and displacement in the range of 0.05–10 mm/min. 相似文献
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Siriwat Radabutra Sayan Saengsuwan Rukkiat Jitchati Morakot Kalapat 《Journal of Adhesion Science and Technology》2013,27(24):2682-2696
Telechelic natural rubber (TNR) was prepared by the use of potassium persulfate and propanal at 70 °C and various degradation times from 0 to 30 h. These samples were then grafted by maleic anhydride (MA) in toluene solution before modification with 3-amino-1,2,4-triazole (ATA) to produce modified TNRs (AMTNRs). Attenuated total reflectance Fourier transform infrared spectroscopy (ATR-FTIR) was used to identify the chemical compositions. Carboxyl and hydroxyl groups of TNRs were clearly observed, due to chain scission, oxidation, and modified chain ends. The viscosities of TNRs were dropped greatly after 5 h and then decreased slowly as a function of degradation time. ATR-FTIR spectra of AMTNRs showed amide bonds between ATA and MA groups, and then the multiple hydrogen bonding arrays were formed. The glass transition temperatures (Tg) of AMTNRs were determined by differential scanning calorimetry. The Tg of AMTNR_0 moved to a higher temperature of –55 °C after modification by ATA, confirming the formation of multiple hydrogen bonding arrays. However, the Tg of AMTNR_5 to AMTNR_30 decreased slightly due to chain scission in the degradation process. The adhesive properties of AMTNR-based pressure-sensitive adhesive were evaluated by a Lloyd adhesion tester. The tack of AMTNRs depended on wettability whereas peel and shear strengths were responded by a combination between wettability and multiple hydrogen bonding arrays. 相似文献