95GHz低相噪锁相源技术研究

基于毫米波锁相源相位噪声理论,明确指出采用低相位噪声的微波频率源可以有效改善毫米波锁相源相噪指标。利用低相位噪声的微波倍频源,结合谐波混频方式,设计出95GHz低相位噪声锁相频率源。测试结果表明,其相位噪声可以低至-90.44dBc/Hz@10kHz,验证了该设计方案的可行性。     

3mm锁相源研究及系统应用

采用双环数字锁相方式完成3mm波锁相源研究,并成功应用于国内第一套“95GHz毫米波干涉仪”测速系统。提出了一种新的毫米波双环锁相源相位噪声估测方法。实验结果表明:该毫米波锁相源工作在95GHz时,输出功率大于10mW,相位噪声达到-59dBc/Hz@10kHz,在-10℃~ 45℃温度范围内的频率稳定度为1.2×10-6,完全满足测速系统对毫米波发射源的高稳定、高精确度技术要求。     

3.1~4.9 GHz宽带低相位噪声频率源的研制

基于LTC6946-2频率合成器设计了3.1~4.9 GH频率源,给出了参数设计过程和实物测试结果。该频率源具有宽带、低相位噪声、低杂散、低成本和占用面积小等特点。经过硬件调试达到的主要指标为:输出频率3.1~4.9 GHz,步进10 MHz,相位噪声优于-97.8 dBc/Hz@1 kHz和-99.3 dBc/Hz@10 kHz,杂散优于-90 dBc。     

基于锁相环的L波段频率源设计与实现

介绍了一种L波段的频率合成源的设计与实现方法,采用电荷泵锁相环来实现.该法设计的频率源具有低相位噪声、低杂散和高频率稳定度等特点,经过测量所做实物表明:相位噪声为-80.4dBc/Hz@1kHz;杂散抑制优于-55dBc;输出功率大于6dBm.满足项目的指标要求,并且,电路结构简单,体积小巧,性能优良,能够用于实际电路...     

低相位噪声微波频率源的研究

通过对微波频率源相位噪声的分析,针对一个C波段微波频率源低相位噪声的要求,对比分析了直接倍频、数字锁相以及高频鉴相之后再倍频三种方案之间的相位噪声差别。最终得出采用直接在超高频(UHF)波段对输入信号进行模拟鉴相并锁定之后再倍频才能达到所要求的相位噪声指标。对制成的样品进行了测试,取得了预期的相位噪声指标。该C波段微波频率源的相位噪声可以达到:≤-120 dBc/Hz@1 kHz,≤-125 dBc/Hz@10 kHz,≤-130dBc/Hz@100kHz,≤-140 dBc/Hz@1 MHz。直接在UHF波段进行高频鉴相的技术,通过提高鉴相频率大幅降低了微波锁相频率源的相位噪声。     

基于锁相环技术的X 波段频率源的研制

介绍了一种X 波段频率源的设计方案及相关理论。采用数字锁相环内混频技术实现的该X 波段频率源具有频带宽,相位噪声低,杂散低等特点。其主要技术指标如下：输出频率范围为9.8GHz～10.8GHz,频率步进为5MHz,在偏离1KHz 处相位噪声优于-85dBc/Hz,在偏离10KHz 处相位噪声优于-88dBc/Hz,杂散抑制优于60dBc。由最后的测试结果可 知,采用该方法设计的频率源既能保证低杂散又能显著改善相位噪声水平,可广泛用于通信设备和测试系统中。     

低相噪捷变频毫米波频率源的研制

基于整数和小数分频锁相原理,采用双锁相源+混频方案,实现了一种可用于毫米波雷达系统的低相噪、小步进、捷变频毫米波频率源。实测结果表明:该频率源产品在31.0~32.5GHz频带范围内,相位噪声可达-90dBc/Hz@1kHz,跳频时间小于10μs,跳频步进100kHz,最低杂散抑制低于-60dBc。     

P波段频率源的设计

文中介绍了一种P波段频率源的设计和实现方法及相关理论,采用锁相技术实现的该P波段频率源具有相位噪声低,杂散低等特点,已经用于某通信设备中。其主要技术指标如下:输出频率为800MHz,在10kHz处的相位噪声优于-90dBc/Hz,杂散抑制优于65dBc,由最后的测试结果可知,采用该方法设计的频率源能保证低杂散的指标要求同时又能显著地改善相位噪声水平,可广泛用于通信设备和测试系统中。     

一种C波段低相噪锁相频率源的研制

提出了一种采用同轴介质谐振压控振荡器(CDRVCO)模式的锁相频率源设计方案,利用其低相噪、高Q值和高频率稳定度的优点,通过对锁相源合理的电路设计、仿真与实验,研制了一款C波段低相噪、单点频率为7 850 MHz的频率源。对样品的测试表明该频率源达到了预期的技术指标,测试结果为:工作频率为7 850 MHz时,相位噪声为-96dBc/Hz/1kHz、-98dBc/Hz/10kHz、-120dBc/Hz/100kHz、-143dBc/Hz/1MHz,近端参考杂散抑制>-95dBc。     

基于锁相环原理的X波段频率源的设计与实现

介绍了一种X波段频率源的设计方法。该文采用2个数字锁相频率合成单环,再环外混频的方法实现了该X波段频率源的设计。该频率源具有相位噪声低,杂散低,频率稳定度高等特点。经试验测试结果表明,该频率源的相位噪声为-94.3dBc@1kHz,-99dBc@10kHz;输出功率大于13dBm,实现了一个性能较好的频率源。     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Development of the readout system for waveguide multilayer optical card

Waveguide multilayer optical card （WMOC） is a novel storage device of three-dimensional optical information. An advanced readout system fitting for the WMOC is introduced in this paper. The hardware mainly consists of the light source for reading, WMOC, motorized stages addressing unit, microscope imaging unit, CCD detecting unit and PC controlling ＆ processing unit. The movement of the precision motorized stage is controlled by the computer through Visual Basic （VB） language in software. A control panel is also designed to get the layer address and the page address through which the position of the motorized stages can be changed. The WMOC readout system is easy to manage and the readout result is directly displayed on computer monitor.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Collinear phase-matching study of terahertz-wave generation via difference frequency mixed in GaAs and Inp

The collinearly phase-matching condition of terahertz-wave generation via difference frequency mixed in GaAs and InP is theoretically studied. In collinear phase-matching, the optimum phase-matching wave hands of these two crystals are calculated. The optimum phase-matching wave bands in GaAs and lnP are 0.95-1.38μm and 0.7-0.96μm respectively. The influence of the wavelength choice of the pump wave on the coherent length in THz-wave tuning is also discussed. The influence of the temperature alteration on the phase-matching and the temperature tuning properties in GaAs crystal are calculated and analyzed. It can serve for the following experiments as a theoretical evidence and a reference as well.     

Effects of the alloy compositions on the phonon-polaritons in ternary mixed crystals

Composition dependence of bulk and surface phonon-polaritons in ternary mixed crystals are studied in the framework of the modified random-element-isodisplacement model and the Bom-Huang approximation. The numerical results for Several Ⅱ - Ⅵ and Ⅲ- Ⅴ compound systems are performed, and the polariton frequencies as functions of the compositions for ternary mixed crystals AlxGa1-xAs, GaPxAS1-x, ZnSxSe1-x, GaAsxSb1-x, GaxIn1-xP, and ZnxCd1-xS as examples are given and discussed. The results show that the dependence of the energies of two branches of bulk phonon-polaritons which have phonon-like characteristics, and surface phonon-polaritons on the compositions of ternary mixed crystals are nonlinear and different from those of the corresponding binary systems.     

New insert layer structure OLEDs

An insert layer structure organic electroluminescent device（OLED） based on a new luminescent material （Zn（salen）） is fabricated. The configuration of the device is ITO/CuPc/NPD/Zn（salen）/Liq/LiF/A1/CuPc/NPD/Zn（salen）/Liq/LiF/A1. Effective insert electrode layers comprising LiF（1nm）/Al（5 nm） are used as a single semitransparent mirror, and bilayer cathode LiF（1 nm）/A1（100 nm） is used as a reflecting mirror. The two mirrors form a Fabry-Perot microcavity and two emissive units. The maximum brightness and luminous efficiency reach 674 cd/m^2 and 2.652 cd/A, respectively, which are 2.1 and 3.7 times higher than the conventional device, respectively. The superior brightness and luminous efficiency over conventional single-unit devices are attributed to microcavity effect.