一种采用电压检测器的无片外电容FVF-LDO

提出了一种基于翻转电压跟随器(FVF)的无片外电容低压差线性稳压器(LDO)。采用电压检测器来检测输出电压,大幅改善了瞬态响应,克服了常规LDO面积大、需要使用片内大电容的缺点,仅消耗了额外的静态电流。该LDO采用90 nm CMOS工艺进行设计与仿真,面积为0.009 6 mm²,输入电压为1.2 V,压差为200 mV。结果表明,在50 pF负载电容、3～100 mA负载电流、300 ns跃迁时间的条件下,产生的上冲电压为65 mV,瞬态恢复时间为1 μs,产生下冲电压为89 mV,瞬态恢复时间为1.4 μs,且将负载调整率性能改善到0.02 mV/mA。     

一种低静态电流高瞬态响应无片外电容LDO设计

基于SMIC 0.18 μm BCD工艺设计了一种低静态电流、高瞬态响应的无片外电容 低压差线性稳压器(Low Dropout Regulator, LDO)。误差放大器采用一种跨导提升技术,在低静态电流的情况下,实现更高的环路增益及单位增益带宽。由于采用高增益误差放大器,可以通过适当减少功率管尺寸来增强瞬态响应。采用有源反馈,在不引入额外静态电流情况下,增大环路的次极点。同时当LDO输出电压变化时,能够增大功率管栅极的动态电流,实现高瞬态响应。此外在有源反馈的基础上,采用反馈电阻并联小电容的方式,以提高环路稳定性。利用Cadence Spectre软件对LDO进行仿真验证。结果显示,LDO的静态电流仅为10 μA;在负载电流为1 mA的情况下,相位裕度最高可达70.9°;LDO负载电流在500 ns内从1 mA切换到100 mA时,下冲电压为134.7 mV,下冲电压恢复时间为1 μs;负载电流在500 ns内从100 mA切换到1 mA时,过冲电压为155.5 mV,过冲电压恢复时间为430 ns。     

一种无片外电容的快速响应FVF-LDO北大核心

提出了一种无片外电容、快速瞬态响应、宽输入电压范围的低压差线性稳压器(LDO)。该电路基于翻转电压跟随器(FVF)结构，不需额外增加辅助电路，仅使用两个电容作为检测模块，以动态调整瞬态响应，能够弥补传统LDO集成度低、面积大、功耗高、瞬态响应差的不足。电路基于TSMC 180 nm CMOS工艺。仿真结果表明，该LDO的压差为200 mV,静态电流为36μA,输入电压范围为2～4 V,低频时PSRR为-59 dB。在30 pF负载电容、0～10 mA负载电流、150 ns阶跃时间条件下，产生的上冲电压为50 mV,下冲电压为66 mV,瞬态电压恢复时间为300 ns。     

基于双环调节的快速瞬态响应无片外电容LDO

基于双环路控制构建推挽结构,增强了功率管栅端的摆率,改善了无片外电容LDO的瞬态响应。此外,结合A类复合放大器特性,降低了功率管栅端阻抗,有利于提升LDO的频率稳定性。该LDO输入电压范围为2.0~3.5 V,输出电压为1.8 V,最大负载电流为100 mA。当负载电流在1 μs内从100 μA跳变到100 mA以及从100 mA跳变到100 μA时,最大下冲电压为128 mV,最大上冲电压为170 mV,建立时间分别为2.5 μs和2.4 μs,电路工作时消耗的静态电流仅为12.6 μA。     

一种瞬态增强的无片外电容LDO设计

针对无片外电容型低压差线性稳压器(LDO)瞬态响应差的问题,基于40 nm CMOS工艺设计了一种带瞬态负载变化感知的无片外电容型LDO电路。采用有源前馈频率补偿,实现了电路稳定;瞬变检测电路感应负载的变化,为功率管栅极提供充、放电通路,减弱了输出电压波动。仿真结果表明,负载电流在0~100 mA范围内,该LDO的输出过冲电压和下冲电压分别为100 mV和140 mV,稳定时间在1 μs以内。全负载电流范围内,瞬态性能大幅提升。     

一种缓冲器阻抗动态调整的LDO

提出了一种缓冲器阻抗动态调整的LDO结构。采用并联负反馈和阻抗动态调整技术,显著降低了缓冲级的输出阻抗,没有增加额外的静态电流,功率管栅极极点始终远在单位增益带宽之外,对稳定性没有影响。该缓冲级增大了功率管栅极的摆率,提高了LDO瞬态响应性能。基于TSMC 0.18 μm 3.3 V CMOS工艺进行设计,该LDO的输出电压为1.8 V,压差电压为0.2 V,最大输出电流为100 mA。仿真结果显示,LDO的静态电流只有5 μA,当负载电流在10 ns内从0 mA跳变到100 mA时,输出欠冲和过冲电压分别为88.2 mV和34.8 mV。     

一种快速瞬态响应的无片外电容型LDO

设计了一种快速瞬态响应的无片外电容型LDO。采用高增益高带宽的超级跨导结构(STC)的误差放大器,利用动态偏置技术与电容耦合技术,极大地增强了摆率。引入额外的快速响应环路,进一步提升了瞬态响应速度。基于0.18 μm CMOS工艺进行设计。结果表明,该LDO的最低供电电压为1 V,漏失电压仅为200 mV,可提供最大100 mA的负载电流,能在最大输出电容为100 pF、最低负载为50 μA的条件下保证电路稳定。负载电流在0.5 μs内由50 μA跳变至100 mA时,LDO输出导致的过冲电压和下冲电压分别为200 mV和306 mV。     

适用于高频开关芯片的快速瞬态响应LDO设计

设计了一种片外大电容快速瞬态响应低压差线性稳压器。该LDO电路基于跨导线性结构设计,在输出级引入推挽结构,有效地减小过冲的幅值和恢复时间,提高了LDO的瞬态响应速度;利用浮动缓冲器驱动功率管,有效地提高了LDO的电流效率;采用动态零点补偿技术,保证了LDO在全负载范围内的环路稳定性。该LDO电路基于0.35μm BCD工艺设计与仿真验证。结果表明,在1.2 V~3 V输入电压范围,LDO的输出电压为1 V,静态电流约为50μA,可提供0~300 mA的负载。在上升下降沿为500 ns、幅度为300 mA、轻载持续时间为50μs的负载瞬态跳变下,过冲和下冲均小于20 mV。电路满足高频负载跳变的应用需求。     

一种无片外电容LDO的瞬态增强电路设计

利用RC高通电路的思想,针对LDO提出了一种新的瞬态增强电路结构。该电路设计有效地加快了LDO的瞬态响应速度,而且瞬态增强电路工作的过程中,系统的功耗并没有增加。此LDO芯片设计采用SMIC公司的0.18μmCMOS混合信号工艺。仿真结果表明:整个LDO是静态电流为3.2μA;相位裕度保持在90.19°以上;在电源电压为1.8 V,输出电压为1.3 V的情况下,当负载电流在10 ns内由100 mA降到50 mA时,其建立时间由原来的和28μs减少到8μs;而在负载电流为100 mA的条件下,电源电压在10 ns内,由1.8 V跳变到2.3 V时,输出电压的建立时间由47μs降低为15μs。     

基于电流环路控制方法的快速响应LDO

LDO电路的瞬态响应能力是评价LDO性能的一个重要指标。本文借鉴电荷泵式锁相环的环路控制方法,提出了一种基于电流控制环路的LDO结构,将典型LDO电路中的电压比较改为电流比较,利用跨导放大器和环路滤波器产生功率管的控制栅压,使得环路具有优化的阻尼因子ζ和固有频率ωn,有效提高了LDO环路的瞬态响应能力,并且输出电压可以低至1V以下,且不受基准电压的限制。基于0.13μm CMOS工艺的实现结果表明,在使用1μF去耦电容,LDO输出1.0V的情况下,负载100μA→100mA瞬态变化时,输出超调5.11mV,稳定输出的压降4.25mV,稳定时间8.2μs,而负载100mA→100μA时,输出超调6.21mV,稳定输出的压降4.25mV,稳定时间23.3μs。结果表明,该电路各项性能指标均有明显的提高,FOM指数达到0.0097。     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Teleportation of an arbitrary unknown N-qubit entangled state under the controlling of M controllers

A new quantum protocol to teleport an arbitrary unknown N-qubit entangled state from a sender to a fixed receiver under M controllers(M < N) is proposed. The quantum resources required are M non-maximally entangled Greenberger-Home-Zeilinger (GHZ) state and N-M non-maximally entangled Einstein-Podolsky-Rosen (EPR) pairs. The sender performs N generalized Bell-state measurements on the 2N particles. Controllers take M single-particle measurement along x-axis, and the receiver needs to introduce one auxiliary two-level particle to extract quantum information probabilistically with the fidelity unit if controllers cooperate with it.     

Diode-end-pumped Nd:YVO4/LBO lasers with 4.2W continuous-wave output at 457 nm

A continuous-wave (CW) 457 nm blue laser operating at the power of 4.2 W is demonstrated by using a fiber coupled laser diode module pumped Nd: YVO4 and using LBO as the intra-cavity SHG crystal With the optimization of laser cavity and crystal parameters, the laser operates at a very high efficiency. When the pumping power is about 31 W, the output at 457nm reaches 4.2 W, and the optical to optical conversion efficiency is about 13.5% accordingly. The stability of the out putpower is better than 1.2% for 8 h continuously working.     

Call for Papers

正Wireless Body-area Networks The last decade has witnessed the convergence of three giant worlds:electronics,computer science and telecommunications.The next decade should follow this convergence in most of our activities with the generalization of sensor networks.In particular with the progress in medicine,people live longer and the aging of population will push the development of wireless personal networks     

Call for Papers—Feature Topic,Vol.12,No.7,2015

正Information Centric Networking Information-Centric Networking(ICN) is an emerging direction in Future Internet architecture research,gaining significant tractions among academia and industry.Aiming to replace the conventional host-to-host communication model by a data-centric model,ICN treats data content as the first