2.5Gbps/ch两通道并行时钟数据恢复电路

采用TSMC公司标准的0.18μm CMOS工艺,结合锁相环和延迟锁相环技术,设计并制作了一个全集成的2.5Gbps/ch并行时钟数据恢复电路.与传统并行数据恢复电路相比,该电路不需要本地参考时钟,并且恢复出的并行数据是位同步的.输入2路并行的231-1 PRBS数据,恢复出的2.5GHz时钟的均方抖动值为2.6ps,恢复出的两路2.5Gb/s数据的均方抖动值分别为3.3ps和3.4ps.     

2.5Gb/s 0.18μm CMOS时钟数据恢复电路

采用TSMC公司标准的0.18μm CMOS工艺,设计并实现了一个全集成的2.5Gb/s时钟数据恢复电路.时钟恢复由一个锁相环实现.通过使用一个动态的鉴频鉴相器,优化了相位噪声性能.恢复出2.5GHz时钟信号的均方抖动为2.4ps,单边带相位噪声在10kHz频偏处为-111dBc/Hz.恢复出2.5Gb/s数据的均方抖动为3.3ps.芯片的功耗仅为120mW.     

2.5Gb/s/ch 0.18μm CMOS数据恢复电路

设计了一个应用于SFI-5接口的2.5Gb/s/ch数据恢复电路.应用一个延迟锁相环,将数据的眼图中心调整为与参考时钟的上升沿对准,因而同步了并行恢复数据,并降低了误码率.采用TSMC标准的0.18μm CMOS工艺制作了一个单通道的2.5Gb/s/ch数据恢复电路,其面积为0.46mm2.输入231-1伪随机序列,恢复出2.5Gb/s数据的均方抖动为3.3ps.在误码率为10-12的条件下,电路的灵敏度小于20mV.     

2.5Gb/s/ch 0.18μm CMOS数据恢复电路

设计了一个应用于SFI-5接口的2.5Gb/s/ch数据恢复电路.应用一个延迟锁相环,将数据的眼图中心调整为与参考时钟的上升沿对准,因而同步了并行恢复数据,并降低了误码率.采用TSMC标准的0.18μm CMOS工艺制作了一个单通道的2.5Gb/s/ch数据恢复电路,其面积为0.46mm^2.输入231-1伪随机序列,恢复出2.5Gb/s数据的均方抖动为3.3ps.在误码率为10-12的条件下,电路的灵敏度小于20mV.     

2.5Gb/s 0.18μm CMOS时钟数据恢复电路

采用TSMC公司标准的0．18μm CMOS工艺，设计并实现了一个全集成的2．5Gb／s时钟数据恢复电路．时钟恢复由一个锁相环实现．通过使用一个动态的鉴频鉴相器，优化了相位噪声性能．恢复出2．5GHz时钟信号的均方抖动为2．4ps，单边带相位噪声在10kHz频偏处为-111dBc／Hz．恢复出2．5Gb／s数据的均方抖动为3．3ps．芯片的功耗仅为120mW．     

一种5 Gb/s双信道并行时钟数据恢复电路

基于0.18 μm CMOS工艺,设计了一种双信道并行时钟数据恢复(CDR)电路,它由1个锁相环(PLL)型CDR和1个相位选择/相位插值(PS/PI)型CDR结合实现。与传统的并行CDR相比,该CDR电路不需要本地参考时钟。PLL型CDR中环形压控振荡器的延迟单元采用电感峰化技术,拓展了带宽,实现了较高的振荡频率;电荷泵采用自举基准和运放,改善了充放电电流匹配。PS/PI型CDR中Bang-Bang型鉴相器结构简单,具有较好的鉴相功能;PS/PI电路比传统结构少2个相位选择器。仿真结果表明,当输入并行数据速率为5 Gb/s时,恢复出的2组时钟与数据的峰峰抖动值分别为6.1 ps,8.1 ps和8.7 ps,11.2 ps。电路核心模块的功耗为172.4 mW,整体电路版图面积为(1.7×1.585) mm²。     

基于DVI的时钟数据恢复电路设计

设计了一种实现DVI(digital visual interface)数字视频信号接收器的新型时钟数据恢复电路.通过在过采样电路和数字锁相环之间增加弹性缓冲电路,在实现10bit数据恢复的同时,使采样时钟频率减小为数据频率的2.5倍,DPLL同时对10bit并行的数据进行相位检测判断,提高了判断的正确率,使数据传输的误码率得到改善.采用SMIC0.18μm CMOS工艺流片,测试结果表明,输入三路并行的1.65Gbps/ch UXGA格式像素数据和传输电缆长度2m条件下,输出系统时钟信号最大抖动峰.峰值为183ps,均方值为24ps,满足DVI规范要求.     

基于DVI的时钟数据恢复电路设计

设计了一种实现DVI(digital visual interface)数字视频信号接收器的新型时钟数据恢复电路.通过在过采样电路和数字锁相环之间增加弹性缓冲电路,在实现10bit数据恢复的同时,使采样时钟频率减小为数据频率的2.5倍,DPLL同时对10bit并行的数据进行相位检测判断,提高了判断的正确率,使数据传输的误码率得到改善.采用SMIC0.18μm CMOS工艺流片,测试结果表明,输入三路并行的1.65Gbps/ch UXGA格式像素数据和传输电缆长度2m条件下,输出系统时钟信号最大抖动峰.峰值为183ps,均方值为24ps,满足DVI规范要求.     

高性能数字时钟数据恢复电路

设计了一个数字时钟数据恢复电路,采用相位选择锁相环进行相位调整,在不影响系统噪声性能的前提下大大降低了芯片面积。该电路应用于100 MHz以太网收发系统中,采用中芯国际0.18μm标准CMOS工艺实现,核心电路相位选择锁相环的芯片面积小于0.12 mm2,电流消耗低于4 mA。仿真与测试结果表明,恢复时钟抖动的峰峰值小于350 ps,相位偏差小于400 ps,以太网接收误码率小于10-12,电路可以满足接收系统的要求。     

一种电流失配自适应补偿宽带锁相环设计

针对宽带自偏置锁相环(PLL)中存在严重的电荷泵电流失配问题,提出了一种电流失配自适应补偿自偏置锁相环。锁相环通过放大并提取参考时钟与反馈时钟的锁定相位误差脉冲,利用误差脉冲作为误差判决电路的控制时钟,通过逐次逼近方法自适应控制补偿电流的大小,逐渐减小鉴相误差,从而减小了锁相环输出时钟信号抖动。锁相环基于40 nm CMOS工艺进行设计,后仿真结果表明,当输出时钟频率为5 GHz时,电荷泵输出噪声从-115.7 dBc/Hz@1 MHz降低至-117.7 dBc/Hz@1 MHz,均方根抖动从4.6 ps降低至1.6 ps,峰峰值抖动从10.3 ps降低至4.7 ps。锁相环输出时钟频率为2～5 GHz时,补偿电路具有良好的补偿效果。     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Teleportation of an arbitrary unknown N-qubit entangled state under the controlling of M controllers

A new quantum protocol to teleport an arbitrary unknown N-qubit entangled state from a sender to a fixed receiver under M controllers(M < N) is proposed. The quantum resources required are M non-maximally entangled Greenberger-Home-Zeilinger (GHZ) state and N-M non-maximally entangled Einstein-Podolsky-Rosen (EPR) pairs. The sender performs N generalized Bell-state measurements on the 2N particles. Controllers take M single-particle measurement along x-axis, and the receiver needs to introduce one auxiliary two-level particle to extract quantum information probabilistically with the fidelity unit if controllers cooperate with it.     

Diode-end-pumped Nd:YVO4/LBO lasers with 4.2W continuous-wave output at 457 nm

A continuous-wave (CW) 457 nm blue laser operating at the power of 4.2 W is demonstrated by using a fiber coupled laser diode module pumped Nd: YVO4 and using LBO as the intra-cavity SHG crystal With the optimization of laser cavity and crystal parameters, the laser operates at a very high efficiency. When the pumping power is about 31 W, the output at 457nm reaches 4.2 W, and the optical to optical conversion efficiency is about 13.5% accordingly. The stability of the out putpower is better than 1.2% for 8 h continuously working.     

Call for Papers

正Wireless Body-area Networks The last decade has witnessed the convergence of three giant worlds:electronics,computer science and telecommunications.The next decade should follow this convergence in most of our activities with the generalization of sensor networks.In particular with the progress in medicine,people live longer and the aging of population will push the development of wireless personal networks     

Call for Papers—Feature Topic,Vol.12,No.7,2015

正Information Centric Networking Information-Centric Networking(ICN) is an emerging direction in Future Internet architecture research,gaining significant tractions among academia and industry.Aiming to replace the conventional host-to-host communication model by a data-centric model,ICN treats data content as the first