复合电沉积工艺参数对镍晶微铸件表面性能的影响

目的将超声波、磁场引入到微电铸过程中,改善电沉积镍晶微构件的表面性能。方法改变电流密度、脉冲占空比、超声波功率、磁场强度的方向和强度,进行电沉积镍晶微铸件,分析这些工艺参数对微铸件表面形貌和显微硬度的影响。结果微铸件的显微硬度随磁场强度的增大而显著提高,随着阴极电流密度、超声波功率及脉冲占空比的增大呈现出先升高、后下降的规律,其中脉冲占空比对电铸层显微硬度的影响较弱。优选的工艺参数为:垂直磁场强度0.8 T,阴极电流密度2 A/dm2,超声波功率240W,脉冲占空比20%。结论引入超声波和磁场后可优化电沉积环境,细化电铸层晶粒尺寸,改善电铸层微观形貌,提高微铸件显微硬度。     

基于电铸工艺的微型模具制造方法研究

以具有超疏水性的荷叶、梭鱼草为研究对象,用扫描电镜对两种植物表面微结构进行表征,观察其形貌;采用磁控溅射仪对其表面进行导电处理;利用电铸工艺对其进行电铸。实验结果表明:电铸的微模具具有与样品对称的纹理,实现了微细结构镜像转移。     

过程参数对悬浮微珠摩擦辅助脉冲电铸铜表面形貌的影响

为了改善传统酸性硫酸盐电铸铜的表面质量,提出了空心悬浮微珠摩擦辅助的脉冲电铸铜工艺。使空心微珠悬浮于卧式放置阴极上部,不断摩擦和撞击阴极表面,并结合脉冲电铸,提高电铸层表面质量。研究了脉冲频率、占空比、平均电流密度和阴极转速对摩擦辅助电铸铜表面形貌的影响。结果发现:在空心悬浮微珠的影响下,使用低脉冲频率、高占空比、较大的平均电流密度及较低的转速范围,更能发挥悬浮微珠的摩擦作用,细化晶粒。     

模芯钴含量对仿荷叶PDMS制件表面疏水性的影响

目的在采用电铸镍钴合金提高模芯硬度的基础上,研究模芯钴含量对仿荷叶PDMS制件表面质量与疏水性的影响,探明镍钴合金模芯用于模板法制备仿荷叶超疏水表面的可行性。方法采用电铸-聚二甲基硅氧烷(PDMS)二次复制模板法先后制备荷叶母模、镍钴合金电铸模芯与仿荷叶疏水表面PDMS制件。采用数字式显微硬度仪、超景深三维显微镜、Image-Pro Plus图像处理软件、激光共聚焦显微镜等分析模芯钴含量对模芯硬度与PDMS制件表面微结构、粗糙度及疏水性的影响。最后采用接触角测量仪进一步测量与分析PDMS制件表面的疏水性能。结果当镍钴合金模芯钴含量(质量分数计)达到22.4%以上时,模芯硬度较纯镍模芯由244.1HV提升至450HV以上。当模芯钴含量从0增加到51.5%时,仿荷叶PDMS制件表面微结构深宽比先从2.12减小至1.72,再增加至2.38;微结构面积占比从19.15%减小至15.03%;表面粗糙度Ra值从59.01μm增加至74.93μm;静态接触角从166.22°线性减小至149°左右,疏水性降低。结论相比微结构深宽比与面积占比,表面粗糙度对PDMS制件疏水性的影响占主导作用。镍钴合金模芯硬度显著提高的同时,随钴含量的增大,仿荷叶PDMS制件的静态接触角从166.22°减小至149°左右,但仍具有良好的疏水性。     

飞秒激光与电沉积复合工艺制备不锈钢超疏水表面及减阻性能EI北大核心CSCD

在远程管道运输过程中,固液间摩擦阻力是一个不容忽视的问题,类鲨鱼结构减阻效率低且制备困难。基于荷叶表面仿生思想,构筑微结构制备超疏水表面,减小摩擦阻力。采用飞秒激光刻蚀与电沉积复合工艺,在不锈钢表面构筑框-锥多级结构,经自组装氟硅烷制备超疏水表面,讨论复合工艺参数对微结构形貌及润湿性能的影响,探究框-锥多级结构超疏水表面减阻。结果表明,利用飞秒激光可获得周期性分布的框结构,随着激光功率的增加,微米框结构内部形成不规则沟壑金属堆积物,且关光延时的增长会产生单侧分布微孔结构,损伤基体整体强度;通过电沉积工艺制备亚微米尖锥结构镍镀层,随着电流密度的增加,镀层微结构形态发生变化,形成亚微米尖锥石结构,表面由疏水转变为超疏水。与激光刻蚀10次自组装氟硅烷涂层试样相比,激光刻蚀与电沉积复合工艺自组装氟硅烷涂层的试样表面接触角由138.6°提高到156.7°,对水和30wt.%甘油的减阻率分别由8.17%、14.38%提高到27.74%、23.69%。将激光刻蚀与电沉积相结合,构筑微纳结构经自组装制备超疏水表面,可为降低管道输运中固液间摩擦阻力提供新的技术途径。     

仿生表面减阻的研究现状与进展

仿生表面减阻是众多减阻方法中非常有前景的减阻方式。目前研究最多的是仿生鲨鱼皮减阻和仿生超疏水表面减阻,其中仿生鲨鱼皮表面减阻又分为直接复刻鲨鱼皮表面的盾鳞结构和仿鲨鱼皮沟槽减阻。文中介绍了国内外关于仿生减阻的最新研究进展及成果,综述了仿生鲨鱼皮表面减阻和仿生超疏水表面减阻的研究现状,探讨了仿生表面减阻未来的发展方向和研究重点。虽然仿生超疏水表面一般都具有粗糙的表面微纳结构以及较低的表面能,但不是所有的超疏水表面都具有减阻效果,因此超疏水表面的减阻效果还需要一个度量标准。     

超疏水表面微结构的设计及其注射成型

目的 从超疏水表面的功能设计出发,主动设计三种深宽比的微结构阵列并洞察其在不同润湿接触状态下的疏水性能。方法 首先,采用热力学分析方法,建立三种深宽比微结构的系统自由能与其接触角、结构几何参数之间的函数关系,探明自主设计微结构表面的润湿性能。继而,在热力学分析的基础上,采用紫外光刻、电铸和注射成型技术相结合的方法实现三种深宽比微结构聚丙烯（PP）超疏水表面的制备。最后,进一步测量与分析聚丙烯（PP）微结构表面的润湿性能。结果 三种深宽比微结构表面的静态接触角测量值均大于150?,滚动角分别为12?、14?和15?,基本达到设计目标;同时,微结构表面的表观接触角测量值与理论计算值基本符合。表面的接触角滞后分别为15?、21?、22?,且接触角滞后随着深宽比的增加而变大,使液滴在PP表面的流动性也变差。结论 在设计微结构超疏水表面的过程中,可以适当降低微结构的深宽比,以获取更好的超疏水特性。自主设计的微结构表面基本实现超疏水性,为高聚物超疏水表面的功能设计与高效制备提供了理论依据与技术支撑。     

电铸沉积层性能的试验研究

进行了直流和脉冲电流铜沉积实验,分析了沉积层微结构和电铸层性能,并安排了放电工试验,结果表明有机用脉冲电流可以使电沉积层的某些性能得到改善,当电铸层作为电火花加工电极时,脉冲电流电铸可以降低电极损耗率。     

柱状微结构超疏水表面制备及其结霜性能研究

目的研究表面结构与化学成分对结霜性能的影响。方法以具有不同结构参数的多孔阳极氧化铝表面为模板,以高密度聚乙烯为压印热塑材料,采用模板热压法在常压下制备柱状微结构表面。分析表面形貌,测试接触角,通过结霜实验研究其结霜性能。结果柱状微结构表面经化学修饰后,获得超疏水效果。结霜过程实验显示,制备的超疏水表面初始结霜时间更晚,结霜速率更慢。结论通过改变表面结构与表面化学成分均能对表面结霜性能产生直接影响,修饰后的柱状结构表面具有较好的抑霜效果。     

基于微铣削的微结构尺寸与形状对PMMA表面疏水性的影响

目的 研究不同微结构尺寸参数和阵列形状对PMMA表面疏水性的影响.方法 使用精密微铣削方式,在光滑PMMA表面加工微沟槽、方柱、圆形及椭圆形阵列,并将测量的水滴的接触角和形状作为表面疏水性的表征指标.结果当微沟槽阵列的微槽宽度B、凸台宽度C及微槽深度H分别在84.86～208.77μm、36.22～133.94μm、6...     

Effects of pulse reverse electroforming parameters on the thickness uniformity of electroformed copper foil

The non-uniformity of electroformed layers directly affects the mechanical properties and application requirements of micro devices. Therefore, uniformity of electroformed copper foil is significant in ensuring or improving the mechanical properties of micro devices. The influences of duty cycle, current density, power source, and electroforming time on the thickness uniformity of electroformed copper layers were studied, and these parameters were optimised by using the orthogonal experiment method. The thickness distribution rule of electroformed copper foil was also determined. Duty cycle had the largest influence on the uniformity; the uniformity of electroformed layers prepared with pulse reverse current power source was superior to those prepared with direct current power source and pulse current power source. Increasing current density enhanced uniformity. The optimal technical process suggested by this orthogonal experiment adopts pulse reverse current power, 30% of positive duty cycle, 10% of negative duty cycle, 2?A?dm^?2 of current density, and 92?minutes of electroforming time. The minimum coefficient of variation reached 1.54%. The thickness of electroformed copper foil varied directionally.     

Cathode Characterization with Steel and Copper Collector Bars in an Electrolytic Cell

This article presents finite-element method simulation results of current distribution in an aluminum electrolytic cell. The model uses one quarter of the cell as a computational domain assuming longitudinal (along the length of the cell) and transverse axes of symmetries. The purpose of this work is to closely examine the impact of steel and copper collector bars on the cell current distribution. The findings indicated that an inclined steel collector bar (φ = 1°) can save up to 10–12 mV from the cathode lining in comparison to a horizontal 100 mm × 150-mm steel collector bar. It is predicted that a copper collector bar has a much higher potential of saving cathode voltage drop (CVD) and has a greater impact on the overall current distribution in the cell. A copper collector bar with 72% of cathode length and size of 100 mm × 150 mm is predicted to have more than 150 mV savings in cathode lining. In addition, a significant improvement in current distribution over the entire cathode surface is achieved when compared with a similar size of steel collector bar. There is a reduction of more than 70% in peak current density value due to the higher conductivity of copper. Comparisons between steel and copper collector bars with different sizes are discussed in terms CVD and current density distribution. The most important aspect of the findings is to recognize the influence of copper collector bars on the current distribution in molten metal. Lorentz fields are evaluated at different sizes of steel and copper collector bars. The simulation predicts that there is 50% decrease in Lorentz force due to the improvement in current distribution in the molten metal.     

UV-LIGA技术制备微细金结构试验研究

利用基于SU-8光刻胶的UV-LIGA技术加工微细金结构.针对所沉积的微结构出现凹形的现象,建立了加工过程的电场数学模型,利用有限元方法对这种现象进行仿真研究,发现当光刻胶厚度大于微结构厚度时,可以明显改善这种情况.另外,试验还研究了阴阳极距离、电流密度对沉积层表面平整度的影响.优化参数组合,最终制备出厚度0.2 mm...     

Fabrication of complex shape electrodes by localized electrochemical deposition

Localized electrochemical deposition (LECD) is a promising technology for fabrication of high-aspect ratio electrode of various materials. This technology is found to be one of the simple and inexpensive ways to fabricate electrodes for micro-EDM. This study presents a novel method to manufacture electrodes with complex cross-section using mask of non-conductive material. In this study, the mask is placed between the anode and cathode, which is immersed in mixed electrolyte of copper sulfate, 1.0 M sulfuric acid and as an additive agent 0.04 g/l of thiourea. The deposition of copper is localized on the cathode surface using a mask and applying ultra short voltage pulses between the anode and cathode. In this setup the cathode is placed above the anode and mask, so that the deposited electrode can be used directly for EDM or any application without changing tool orientation. The deposition characteristics such as size, shape, surface, and structural density according to gap between the anode and mask, applied voltage, pulse frequency and duty ratio have been investigated in this study. Finally, appropriate conditions have been found out for effective fabrication of smooth and fine-grained deposited electrodes based on the findings of the various experiments.     

Current density limitation and diffusion boundary layer calculation using CFD method

The knowledge of limiting current density and thickness of diffusion boundary layer is particularly important in improving space-time-yield of electrolysis and especially of high current-density electrolysis. Both natural and forced convection of electrolyte flow are considered in the presented computational fluid dynamics model for calculation of these values. Natural convection is modeled by implementation of a source term at the cathode surface for copper concentration according to Faraday’s law, which allows calculation of electrolyte density for each volume cell of the grid. Forced convection is considered as flow of electrolyte through the cell generated by electrolyte inlet and outlet. By variation of current density, the limiting current density can be calculated with a copperion concentration of zero at the cathode surface after reaching the steady-state conditions in electrolyte. Time dependency of diffusion boundary layer thickness is shown for a chosen cell geometry. Literature data and measured and calculated values of both quantities are in good agreement.     

The effect of additives on the pulsed electrodeposition of copper

Abstract

The pulsed electrodepostion of copper has been systematically investigated from a copper sulphate bath. Pulse duty cycles of 5–80%, at frequencies from 10 to 100 Hz with current densities ranging from 2·5 to 7·5 A dm^?2 were employed. The influences of pulsed current duty cycle, peak current density and frequency on the thickness and hardness of the copper deposit, current efficiency and throwing power of the plating process were studied. The effect of additives, polyethylene glycol and di-sodium EDTA on the properties of deposit were investigated.     

Effects of pulse parameters on macro-particle production in pulsed cathodic vacuum arc deposition

The effects of the pulse parameters on the production of macro-particles in vacuum arc deposition are studied. A power supply that can provide either direct current or pulsed power is used and the influence of the current and duty cycle are independently investigated. Copper is used as the cathode and glass is used as the substrate. Optical microscopy and scanning electron microscopy with image processing software are used to analyze the macro-particles deposited on the substrate. Our results show the general trend that the density of macro-particles increases with the direct current but there is no obvious correlation with the duty cycles. The lowest degree of macro-particle contamination is observed at a duty cycle of about 40.5%.     

Microstructure and crystallographic characteristics of nanocrystalline copper prepared from acetate solutions by electrodeposition technique

Methane sulphonic acid is an alternative electrolyte for conventional sulphuric acid for copper deposition. The electrodeposition of copper from eco-friendly acetate-based electrolytes consisting of copper acetate, sodium acetate and methane sulphonic acid was dealt. Thamine hydrochloride (THC), saccharin and 4-amino-3-hydroxynaphthalene 1-suphonic acid were used as additives in depositing electrolytes. The cathode current efficiency was calculated using the Faraday's law. Metal distrbution ratio of the solutions was determined using Haring–Blum cell. These additives impact the surface morphology of deposited copper films by downgrading, the grain size was analyzed by scanning electron microscopy (SEM) and X-ray diffiraction technique. XRD pattern acquired for electrodeposited copper film shows polycrystalline and face centered cubic structure (FCC). The crystal size of the copper film was calculated using the Debye–Scherrer's equation. The crystal size revealed that deposits produced from additive containing electrolytes exhibited the lowest grain size. Texture coefficient analysis studies revealed that all copper film deposits are polycrystalline and the crystals are preferentially oriented and parallel to the surface. A uniform and pin-hole free surface morphology and grain refining were brought about by the additives.