不同择优取向的ZnO薄膜的制备

采用射频磁控溅射法在载玻片上制备了不同择优取向的ZnO薄膜。结果表明,溅射功率在100~380 W范围内制备的ZnO薄膜呈(101)择优取向性,当功率上升至550 W时,薄膜则为(100)取向;基片温度升高有利于(002)面的生长,当基片温度为250℃时,在溅射功率为200 W时即可制得(002)面择优取向的薄膜。热处理温度的提高有助于(100)和(101)面的择优取向,而对(002)面的取向不利。同时,该文对ZnO薄膜不同择优取向生长的机制进行了探讨。     

溅射功率对AlN/ZnO薄膜结构形貌的影响

采用直流反应磁控溅射法以ZnO为缓冲层在Si衬底上制备了AlN/ZnO薄膜。利用台阶仪、X线衍射(XRD)仪和原子力显微镜(AFM)对不同溅射功率下制备的AlN/ZnO薄膜的厚度、结构及表面形貌进行测试表征。结果表明,不同溅射功率下生长的AlN薄膜都沿(002)择优生长,且随着功率的增大,薄膜的沉积速率增加,晶粒长大,AlN薄膜的(002)取向性变好。同时还利用扫描电子显微镜(SEM)对在优化工艺下制得AlN/ZnO薄膜断面的形貌进行表征,结果显示AlN薄膜呈柱状生长。     

适用于FBAR的ZnO薄膜制备及压电特性分析

采用射频磁控溅射法在Al电极层上制备了适用于 薄膜体声波谐振器(FBAR)的ZnO薄膜, 研究了溅射功率对ZnO薄膜择优取向、压电响应和极化分布的影响。X射线衍射(XRD)测试结 果 表明,在一定范围内,随着溅射功率的增大,ZnO薄膜的择优取向和结晶质量得到提高;但 溅射功率过大,ZnO薄膜的择优取向变差。压电响应力显微镜(PFM)测量表明,溅射功率对薄 膜的压电性能和极化取向也有很大影响, 在所制备的薄膜中,多数晶粒的自发极化方向均垂直向上,表明所制备ZnO薄膜的表面主要 为O 截止;压电响应的振幅与薄膜的结晶质量和择优取向相关,在溅射功率为150W条件下制备的ZnO 在垂直于表面方向上表现出最大压电响应振幅,同时薄膜极化取向分布的一致性最好。     

高RF功率制备的ZnO:Li薄膜性能研究

实验采用射频(RF)磁控溅射法在高射频功率(550 W)下制备了Zn0.9Li0.1O薄膜,探讨了薄膜的光学性能,并与低溅射功率制备的薄膜性能进行了比较。结果表明,高功率下溅射的薄膜晶粒均匀细小,表面平整致密,在可见光波长范围内,透过率达80%。该薄膜的光学带隙约3.29 eV,明显低于低功率溅射的薄膜(3.44 eV)。其室温光致发光(PL)谱结果显示,最强峰是由Li杂质能级引起的399 nm峰,热处理后,370 nm的带间发光峰增强,而低功率制备的薄膜其PL谱与纯ZnO材料的特征谱相似。     

溅射功率对PET衬底上ZnO:Zr薄膜性能的影响

采用直流磁控溅射法在室温下柔性PET衬底上制备出了高质量的掺锆氧化锌(ZnO:Zr)透明导电薄膜。研究了溅射功率对ZnO:Zr薄膜表面形貌、结构、电学和光学性能的影响。溅射功率对ZnO:Zr薄膜的电阻率影响显著:当溅射功率从60W增加到90W时,薄膜的电阻率先减小后增大,在最佳功率80W时,电阻率具有最小值3.67×10-3Ω·cm。所制备的ZnO:Zr薄膜具有良好的附着性能,在可见光区平均透射率高达90%。     

AZO透明导电薄膜的制备

采用射频磁控溅射法在玻璃衬底上制备了ZnO:Al(AZO)透明导电薄膜,并借助XRD、SEM等表征方法,研究了溅射功率和衬底温度对薄膜结构、表面形貌及光电特性的影响。结果表明,制备薄膜的最佳溅射功率和衬底温度分别为180 W、200℃,在此条件下制备的AZO薄膜具有明显的c轴(002)择优取向,其最低方块电阻为18/□,在可见光范围内的平均透光率超过91%,且透明导电性能优于目前平板显示器的要求,有望取代现在市场上的主流氧化铟锡(ITO)薄膜。     

射频溅射法生长ZnO薄膜的参数研究

以ZnO陶瓷为溅射靶材,通入纯氩气,使用射频溅射法在玻璃基片上制备ZnO薄膜,研究了气体压强、基片温度、溅射功率等对薄膜性质的影响。通过XRD及原子力显微镜(AFM)等检测得出制备C轴(002)ZAO薄膜的最佳工艺条件为:溅射压强0.4Pa;溅射功率200W;基片温度300℃。     

掺锆氧化锌透明导电薄膜的制备及特性研究

利用射频磁控溅射法在室温水冷玻璃衬底上成功地制备出了掺锆氧化锌(ZnO:Zr)透明导电薄膜.研究了溅射功率对ZnO:Zr薄膜结构、形貌和光电性能的影响.研究结果表明,溅射功率对ZnO:Zr薄膜的结构和电阻率有显著影响.X射线衍射(XRD)表明,ZnO:Zr薄膜为六角纤锌矿结构的多晶薄膜,且具有C轴择优取向.在溅射功率为150 W时,实验获得的ZnO:Zr薄膜电阻率具有最小值3.8×10-3Ω·cm.实验制备的ZnO:Zr薄膜具有良好的附着性能,可见光区平均透过率超过92%.ZnO:Zr薄膜可以用作薄膜太阳能电池和液晶显示器的透明电极.     

Au薄膜溅射功率对ZnO/Au复合薄膜质量的影响

在ZnO薄膜上采用不同溅射功率制作了Au薄膜,研究不同溅射功率对Au膜成膜速率、结晶质量和结合力的影响,表明在本实验中100 W功率下Au膜的成膜质量比较好。同时对ZnO薄膜电阻的影响进行了研究,结果表明溅射功率越高,ZnO导通的可能性越大,通过实验,溅射工艺在100 W下制备的Au薄膜对ZnO电阻影响最小。     

Al薄膜对(002)ZnO/Al/Si结构基片中ZnO薄膜特性影响的实验研究

采用射频磁控溅射法沉积制备了(002)ZnO/A l/Si复合结构。研究了Al薄膜对(002) ZnO/Al/Si复合结构的声表面波器件(SAWD)基片性能影响以及当ZnO 薄膜厚度一定时的Al膜最佳厚度。采用X射线衍射(XRD)对Al和ZnO薄膜进行了结构表征 ,采用 扫描电镜(SEM)对ZnO薄膜进行表面形貌表征,并从薄膜生长机理角度进行了分析。结果 表明,加Al薄膜有利于ZnO薄膜按(002)择优取向生长,并且ZnO 薄膜的结晶性能提高;与(002)ZnO/Si结构基片相比,当Al薄膜 厚为100nm时,(002)ZnO/Al/Si结构中ZnO薄 膜的机电耦合系数提高 了65%。     

N/Al共掺ZnO透明导电薄膜的制备及光电性能研究

采用射频磁控溅射和退火处理方法在普通玻璃基底上制备了N、Al共掺的ZnO薄膜。利用扫描电子显微镜(SEM)、X射线衍射仪(XRD)、四探针电阻测试仪和紫外-可见光光谱及X射线光电子能谱(XPS)等测试手段,分析了溅射功率对薄膜表面形貌结构及光电性能的影响。研究结果表明:不同溅射功率下所制备的薄膜均为具有c轴择优取向的六角纤锌矿结构,在可见光范围内,平均透过率都超过了85%;在溅射功率为140W条件下,N、Al共掺的ZnO薄膜显示出p型导电特性。     

RF溅射ZnO薄膜工艺与结构研究

通过RF磁控溅射在Si(100)基片上制备了ZnO薄膜,并研究了磁控溅射中各生长参数,如衬底温度、氧分压及后处理工艺等因素对ZnO薄膜微结构、表面形貌与结晶取向的影响。结果表明:溅射温度和氧分压对薄膜的微结构与择优取向有很大的影响,并对不同的溅射工艺进行了分析比较,从而确定了最佳溅射及后处理条件:RF溅射温度小于300℃,功率为50W,ψ(Ar:O2)为20:5,退火温度550~600℃,并获得了c轴择优取向的ZnO薄膜。     

Structural,surface morphology and optical properties of sputter-coated CaCu3Ti4O12 thin film: Influence of RF magnetron sputtering power

This study focusses on the investigation of RF power variations (100–300 W) effects on structural, morphological and optical properties of CaCu₃Ti₄O₁₂ thin film deposited on ITO/glass substrate in a non-reactive atmosphere (Ar). The increase of RF power from 100 W to 300 W led to evolution of (112), (022), (033), and (224) of CCTO XRD peaks. The results indicated that all the films were polycrystalline nature with cubic structure. The crystallite size increased from 20 nm to 25 nm with increasing RF power. FESEM revealed that the films deposited were uniform, porous with granular form, while the grain size increased from 30 to 50 nm. AFM analysis confirmed the increment in surface roughness from 1.6 to 2.3 nm with increasing film grain size. Besides, optical transmittance values decreased to minimum 70% with increasing RF power while optical energy bandgap increased from 3.20 eV to 3.44 eV. Therefore, favorable CCTO thin film properties can be possibly obtained for certain application by controlling RF magnetron sputtering power.     

Optical Constants and Structure of ZnO Films by Radio Frequency Magnetron Sputtering

ZnO films are deposited on glass slides by radio frequency（RF） magnetron sputtering under different powers. The polycrystal structures and surface morphologies of the film are investigated. The optical transmission spectra for the ZnO films are measured within the range from 300 nm to 800 nm. The optical constants and thickness of the films are determined using a nonlinear programming method suggested by Birgin et al. The band gap of the film increases with reducing the nano-size of the film grains. The packing density of the films can be improved by reducing the RF power.     

PECVD制备非晶硅薄膜的研究

实验采用等离子体增强化学气相沉积(PECVD)法在Si衬底上制备了非晶硅薄膜。研究了射频功率、PH3掺杂浓度等因素对薄膜电阻率以及应力的影响。实验结果表明,对于非掺杂非晶硅薄膜,当射频功率从15W增加到45W时,薄膜应力从张应力变化到压应力,在射频功率为35W时,应力几乎为零,应力绝对值先降低后增加,淀积速率随着射频功率的增加而增加;对于掺杂非晶硅薄膜,电阻率随着PH3掺杂浓度的增加而降低,当PH3流量从0cm3/min增加到12cm3/min时,薄膜掺杂效果明显,电阻率降低3个数量级,继续增加PH3流量,电阻率变化较小,而应力随着PH3掺杂浓度的增加而降低,当PH3流量超过12cm3/min时,应力有增加的趋势。     

Microstructure and corrosion resistance of room-temperature RF sputtered Ta2O5 thin films

The connection between the chemical corrosion resistance and the microstructure of the Ta₂O₅ thin films prepared at room temperature by a RF magnetron sputtering technique on Si substrates has been investigated. We find that the microstructure of the films changes with different RF sputtering power, and is responsible for the degradation of the corrosion resistance in HF solutions. The deposited films are amorphous and porous when the RF power is low. A preferred orientation toward (200) β-Ta₂O₅ can be observed when the RF power is increased to 150 W. In addition, the films deposited under this condition are dense and are consequently more resistant to the attack of chemicals. AT an RF power of 300 W the corrosion resistance of the films declines due to an increase of the exposed pore surface to the HF solution.     

Silicon Nitride Films Deposited by RF Sputtering for Microstructure Fabrication in MEMS

In the present work, we report silicon nitride films deposited by a radio- frequency (RF) sputtering process at relatively low temperatures (<260°C) for microelectromechanical system (MEMS) applications. The films were prepared by RF diode sputtering using a 3-inch-diameter Si₃N₄ target in an argon ambient at 5 mTorr to 20 mTorr pressure and an RF power of 100 W to 300 W. The influence of the film deposition parameters, such as RF power and sputtering pressure, on deposition rate, Si-N bonding, surface roughness, etch rate, and stress in the films was investigated. The films were deposited on single/double-side polished silicon wafers and transparent fused-quartz substrates. To explore the RF-sputtered silicon nitride film as a structural material in MEMS, microcantilever beams of silicon nitride were fabricated by bulk, surface, and surface-bulk micromachining technology. An RF-sputtered phosphosilicate glass film was used as a sacrificial layer with RF-sputtered silicon nitride. Other applications of sputtered silicon nitride films, such as in the local oxidation of silicon (LOCOS) process, were also investigated.     

Effect of RF power and substrate temperature on the properties of boron and gallium co-doped ZnO films

Boron and gallium co-doped ZnO (BGZO) films were prepared by radio-frequency (RF) magnetron sputtering under different RF powers (50–250 W) at room temperature and 200 °C, respectively. The influence of sputtering power and substrate temperature on the structural, morphological, electrical and optical properties of BGZO films was investigated. The results indicated that all the films showed preferentially c-axis orientation and structure of hexagonal wurtzite. The grain size decreased at higher sputtering power above 150 W. The carrier concentration and optical band gap (E_g) increased with the increasing of RF sputtering power. At RF power of 150 W, the films showed higher mobility and lower resistivity. Average optical transmittance of all the BGZO films is greater than 85% in the visible wavelength and did not change obviously with the sputtering power or substrate temperature.     

基片温度对基于Bi1.5Zn1.0Nb1.5O7栅绝缘层的ZnO基TFT性能的影响

在不同基片温度(RT、300、400、500和600℃)下,采用射频磁控溅射法制备了ZnO薄膜和BZN薄膜.研究表明,所制备的BZN薄膜拥有非晶态结构,ZnO薄膜具有c轴择优取向,在基片温度为500℃时,获得低的漏电流(10-7 A/cm2),比RT时的漏电流(10-4 A/cm2)低三个数量级.将所制备的ZnO薄膜和BZN薄膜分别作为ZnO-TFT的有源层和栅绝缘层,研究表明,在基片温度为500℃时,提高了器件性能,所取得的亚阈值摆幅(470 mV/dec.)是RT时的亚阈值摆幅(1 271 mV/dec.)的三分之一;界面态密度(3.21×1012 cm-2)是RT时的界面态密度(1.48×1013 cm-2)的五分之一.