CdS薄层对有机电致发光器件性能的影响

将光电材料硫化镉(CdS)薄层插入到结构为ITO/NPB/Rubrene/NPB/DPVBi/Alq3/LiF/Al的白光有机发光器件(OLED)的Alq3和LiF之间,研究了CdS对OLED性能的影响。结果表明,0.1nm厚的CdS插入Alq3和LiF之间的器件性能最好。器件电压从7 V变化到14 V时,色度均在白光的中心区域;当电压为7V时,器件的最大电流效率为9.09cd/A;当电压为14V时,器件的最大亮度为16 370cd/m2。不加CdS时,当电压为8V时,器件的最大效率为5.16cd/A;当电压为14V时,最大亮度为6 669cd/m2。加CdS的器件比不加CdS的器件最大效率提高了1.76倍,最大亮度提高了2.42倍。     

1200V大容量SiC MOSFET器件研制

采用平面栅MOSFET器件结构,结合优化终端场限环设计、栅极bus-bar设计、JFET注入设计以及栅氧工艺技术,基于自主碳化硅工艺加工平台,研制了1200V大容量SiC MOSFET器件.测试结果表明,器件栅极击穿电压大于55V,并且实现了较低的栅氧界面态密度.室温下,器件阈值电压为2.7V,单芯片电流输出能力达到50A,器件最大击穿电压达到1600V.在175℃下,器件阈值电压漂移量小于0.8V;栅极偏置20V下,泄漏电流小于45nA.研制器件显示出优良的电学特性,具备高温大电流SiC芯片领域的应用潜力.     

高耐压Si基GaN功率电子器件

基于Si基GaN HEMT材料制作了击穿电压530V、无场板的功率电子器件。器件制作工艺与现有GaN微波功率器件工艺兼容。研究了器件栅漏间距与击穿电压的关系。器件栅宽为100μm,栅漏间距为15μm时,得到的GaN HEMT器件击穿电压530V,最大电流密度536mA/mm。器件的特征通态电阻为1.54mΩ·cm2,是相同击穿电压Si MOSFET器件特征通态电阻的二十五分之一。所制作的6mm栅宽器件击穿电压400V,输出电流2A。该器件的研制为制作低成本GaN HEMT功率器件奠定了基础。     

1200V大容量SiC MOSFET器件研制

采用平面栅MOSFET器件结构,结合优化终端场限环设计、栅极bus-bar设计、JFET注入设计以及栅氧工艺技术,基于自主碳化硅工艺加工平台,研制了1200V大容量SiC MOSFET器件.测试结果表明,器件栅极击穿电压大于55V,并且实现了较低的栅氧界面态密度.室温下,器件阈值电压为2.7V,单芯片电流输出能力达到50A,器件最大击穿电压达到1600V.在175℃下,器件阈值电压漂移量小于0.8V;栅极偏置20V下,泄漏电流小于45nA.研制器件显示出优良的电学特性,具备高温大电流SiC芯片领域的应用潜力.     

基于硅衬底静电感应晶体管器件仿真与研究

针对静电感应晶体管理论研究迟滞于实践过程,文中利用软件Silvaco Tcad,从器件仿真入手,对影响硅基表面栅静电感应晶体管器件电学性能进行了理论研究。仿真得到了反偏栅压约为0 V、漏电压＜20 V时,器件表现类五极管饱和特性曲线,器件电流约为10-5 A,此时沟道状态为预夹断。当反偏栅压为-1.5 V、漏电压逐渐增大到300 V时,器件表现为类三极管不饱和特性曲线,器件电流约为10-6 A,此时沟道状态为完全夹断,研究结果静电感应晶体管工艺实践提供了参考。     

一款100V的GaN HEMT功率器件及其温度特性

功率器件应用于航空航天等领域,可以起到功率转换、开关控制等作用。以GaN为代表的宽禁带半导体材料器件已逐渐地成为新型功率器件的不二选择。介绍了一款p型GaN栅的100 V GaN HEMT功率器件,给出了该器件各项参数的仿真情况、常态测试参数和三温实验数据,并给出了仿真结果与器件实测结果的对比情况。相较于25℃,在125℃环境温度下,器件阈值电压漂移-0.1 V;在-55℃环境温度下,阈值电压漂移+0.1 V;在-55～125℃全温范围内,器件击穿电压没有明显的变化,均为108 V。说明该GaN HEMT器件有较强的全温范围适应能力。     

4H-SiC TSOB结势垒肖特基二极管静态特性

为增强器件的反向耐压能力,降低器件的漏电功耗,采用Silvaco TCAD对沟槽底部具有SiO₂间隔的结势垒肖特基二极管(TSOB)的器件特性进行了仿真研究。通过优化参数来改善导通压降(V_F)-反向漏电流(I_R)和击穿电压的折衷关系。室温下,沟槽深度为2.2 μm时,器件的击穿电压达到1 610 V。正向导通压降为2.1 V,在V_F=3 V时正向电流密度为199 A/cm²。为进一步改善器件的反向阻断特性,在P型多晶硅掺杂的有源区生成一层SiO₂来优化漂移区电场分布,此时改善的器件结构在维持正向导通压降2.1 V的前提下,击穿电压达到1 821 V,增加了13%。在1 000 V反向偏置电压下,反向漏电流密度比普通结构降低了87%,有效降低了器件的漏电功耗。普通器件结构的开/关电流比为2.6×10³(1 V/-500 V),而改善的结构为1.3×10⁴(1 V/-500 V)。     

氟处理增强型InAlN/GaN HEMT直流和射频特性分析

报道了使用氟处理的方法制备的InAlN/GaN 增强型器件。 器件的阈值电压为0.86V。 在VGS=0 V ,VDS=5 V下得到器件跨导为0mS, 表现出了完全的关态特性。氟处理之后器件的栅漏电得到了降低。0.3μm栅长器件的电流截至频率（fT）与最大振荡频率(fMAX)分别为29.4GHz和36.7GHz。建立了器件的小信号模型用来描述器件本征与寄生参量。     

基于0.18μm CMOS高压工艺的低压器件优化设计

产品设计时,是否能灵活应用低压器件与高压器件对一款成功的设计而言至关重要。设计一款多电源芯片,器件电压种类繁多,最高电源为±15 V,基于SMIC 0.18μm 40 V HV-LDMOS工艺,5 V低压器件版图采用优化设计,在±15 V电源下,在同一芯片上实现了电路的高低压转换,没有发生击穿漏电现象,并满足了各种器件的电特性指标,产品工作稳定、性能可靠,并且整体性能良好。     

与常规CMOS工艺兼容的高压PMOS器件设计与应用

采用常规P阱CMOS工艺,实现了与CMOS工艺兼容的高压PMOS器件。制作的器件,其击穿电压为55 V,阈值电压0.92 V,驱动电流25 mA。对所设计的CMOS兼容高压PMOS器件的制造工艺、器件结构和测试等方面进行了阐述。该器件已成功应用于VFD平板显示系列电路。     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Development of the readout system for waveguide multilayer optical card

Waveguide multilayer optical card （WMOC） is a novel storage device of three-dimensional optical information. An advanced readout system fitting for the WMOC is introduced in this paper. The hardware mainly consists of the light source for reading, WMOC, motorized stages addressing unit, microscope imaging unit, CCD detecting unit and PC controlling ＆ processing unit. The movement of the precision motorized stage is controlled by the computer through Visual Basic （VB） language in software. A control panel is also designed to get the layer address and the page address through which the position of the motorized stages can be changed. The WMOC readout system is easy to manage and the readout result is directly displayed on computer monitor.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Collinear phase-matching study of terahertz-wave generation via difference frequency mixed in GaAs and Inp

The collinearly phase-matching condition of terahertz-wave generation via difference frequency mixed in GaAs and InP is theoretically studied. In collinear phase-matching, the optimum phase-matching wave hands of these two crystals are calculated. The optimum phase-matching wave bands in GaAs and lnP are 0.95-1.38μm and 0.7-0.96μm respectively. The influence of the wavelength choice of the pump wave on the coherent length in THz-wave tuning is also discussed. The influence of the temperature alteration on the phase-matching and the temperature tuning properties in GaAs crystal are calculated and analyzed. It can serve for the following experiments as a theoretical evidence and a reference as well.     

Effects of the alloy compositions on the phonon-polaritons in ternary mixed crystals

Composition dependence of bulk and surface phonon-polaritons in ternary mixed crystals are studied in the framework of the modified random-element-isodisplacement model and the Bom-Huang approximation. The numerical results for Several Ⅱ - Ⅵ and Ⅲ- Ⅴ compound systems are performed, and the polariton frequencies as functions of the compositions for ternary mixed crystals AlxGa1-xAs, GaPxAS1-x, ZnSxSe1-x, GaAsxSb1-x, GaxIn1-xP, and ZnxCd1-xS as examples are given and discussed. The results show that the dependence of the energies of two branches of bulk phonon-polaritons which have phonon-like characteristics, and surface phonon-polaritons on the compositions of ternary mixed crystals are nonlinear and different from those of the corresponding binary systems.     

New insert layer structure OLEDs

An insert layer structure organic electroluminescent device（OLED） based on a new luminescent material （Zn（salen）） is fabricated. The configuration of the device is ITO/CuPc/NPD/Zn（salen）/Liq/LiF/A1/CuPc/NPD/Zn（salen）/Liq/LiF/A1. Effective insert electrode layers comprising LiF（1nm）/Al（5 nm） are used as a single semitransparent mirror, and bilayer cathode LiF（1 nm）/A1（100 nm） is used as a reflecting mirror. The two mirrors form a Fabry-Perot microcavity and two emissive units. The maximum brightness and luminous efficiency reach 674 cd/m^2 and 2.652 cd/A, respectively, which are 2.1 and 3.7 times higher than the conventional device, respectively. The superior brightness and luminous efficiency over conventional single-unit devices are attributed to microcavity effect.