ZChSnSb11-6在镀锡合金钢表面扩散连接分析

在原子扩散理论分析基础上,通过热浸镀锡作为扩散过渡层的方法制备了高强界面的ZChSnSb11-6/30CrMnSi复合材料.采用扫描电子显微镜（SEM）,能谱仪（EDS）表征了ZChSnSb11-6在热浸镀锌30CrMnSi钢表面形成的界面过渡区形貌及其元素分布,并对界面硬度和结合强度进行了表征.结果表明,通过热浸镀锡作为中间层的方法可以制备出巴氏合金/钢双金属复合材料;30CrMnSi钢基体与中间层金属锡形成一层互相扩散的过渡区,厚度随镀锡温度的升高而显著增加;过渡区硬度明显高于两侧基体;界面结合强度随镀锡温度的升高逐渐上升,在900℃时结合强度达到60.6 MPa.     

Effect of immersion Ni plating on interface microstructure and mechanical properties of Al/Cu bimetal

A nickel-based coating was deposited on the pure Al substrate by immersion plating, and the Al/Cu bimetals were prepared by diffusion bonding in the temperature range of 450–550 °C. The interface microstructure and fracture surface of Al/Cu joints were studied by scanning electron microscopy (SEM) and X-ray diffraction (XRD). The mechanical properties of the Al/Cu bimetals were measured by tensile shear and microhardness tests. The results show that the Ni interlayer can effectively eliminate the formation of Al-Cu intermetallic compounds. The Al/Ni interface consists of the Al₃Ni and Al₃Ni₂ phases, while it is Ni-Cu solid solution at the Ni/Cu interface. The tensile shear strength of the joints is improved by the addition of Ni interlayer. The joint with Ni interlayer annealed at 500 °C exhibits a maximum value of tensile shear strength of 34.7 MPa.     

铝/镀银层/钢的扩散钎焊及界面化合物的生长行为

采用扩散钎焊方法对6063铝合金/镀银层/1Cr18Ni9Ti不锈钢进行焊接,探讨焊接界面金属间化合物的生长行为。结果表明:钎缝中靠近不锈钢一侧为Fe-Al金属间化合物层,靠近铝合金一侧主要是Ag(Al)固溶体,中心区域由Ag-Al化合物和Ag(Al)固溶体混合而成;随着低温扩散保温时间的延长,化合物层厚度随之增加,Ag在铝合金一侧富集出现晶界渗透现象;钎缝中首先产生Ag-Al金属间化合物,之后共晶液相中的Al原子穿越Ag-Al金属间化合物层和残余镀银层扩散至不锈钢一侧,与Fe原子生成Fe-Al金属间化合物;在任意给定的扩散钎焊低条件下,可以对化合物层厚度进行初步估算。