Thermal Stability of Thermoelectric Zn<Subscript>4</Subscript>Sb<Subscript>3</Subscript>

The thermal stability of the thermoelectric Zn₄Sb₃ has been investigated by synchrotron power diffraction measurements in the temperature range of 300 K to 625 K in a capillary sealed under Ar. Data were also collected in air on a 1% Cd-doped sample. Rietveld refinements of the data indicate that a variety of impurity phases are formed. After heat treatment, more than 85% of the Zn₄Sb₃ phase remains in the 1% Cd-doped sample heated in air, and 97% remains in the undoped Zn₄Sb₃ heated in Ar. These stabilities are better than those previously observed in pure samples heated in air. This suggests that doping, as well as oxygen or oxidation impurities, play important roles in the thermal stability of this compound.     

Preparation and properties of Zn<Subscript>4</Subscript>Sb<Subscript>3</Subscript>-based thermoelectric material

The effect of synthesis conditions on the structure and thermoelectric properties of zinc-antimonide- based materials is investigated. The effects of Zn excess, the modes of spark plasma sintering, and In doping on the phase composition and the thermal stability of the properties of the obtained material are considered. The material is prepared by the method of the direct alloying of components and spark plasma sintering. It is shown that, at certain modes of spark plasma sintering, the introduction of an excess amount of Zn and In doping make it possible to obtain β-Zn₄Sb₃ with the thermoelectric efficiency ZT ≈ 1.47 at a temperature of 720 K, which shows the stability of characteristics under the performed tests.     

Molecular Dynamics Study of the Mechanical Behavior of Zn<Subscript>4</Subscript>Sb<Subscript>3</Subscript> Nanofilms

This paper reports molecular dynamics simulations performed to study the mechanical properties of Zn₄Sb₃ nanofilms. In the simulations, interatomic interactions are represented by an enhanced atomic potential, and the crystal structure is based on the core structure of β-Zn₄Sb₃. For tensile loading along the [0 1 0] direction, the stability of the crystal structure of the Zn₄Sb₃ nanofilms is analyzed by the radial distribution function method, and the stress–strain relation of the nanofilms is obtained at room temperature. Our present work indicates that the mechanical properties of Zn₄Sb₃ nanofilms are quite different from those of bulk Zn₄Sb₃ due to the impact of surface atoms of the nanostructure. From the atomic configuration, Zn₄Sb₃ nanofilms exhibit typical brittleness. The size effect and the strain-rate effect on the extension of Zn₄Sb₃ nanofilms are discussed in detail. Lastly, the mechanical properties of nanofilms based on different Zn₄Sb₃ crystal structure models are examined.     

Thermoelectric Properties of Mo<Subscript>3</Subscript>Sb<Subscript>5.4</Subscript>Te<Subscript>1.6</Subscript> and Ni<Subscript>0.06</Subscript>Mo<Subscript>3</Subscript>Sb<Subscript>5.4</Subscript>Te<Subscript>1.6</Subscript>

Mo₃Sb₇, crystallizing in the Ir₃Ge₇ type structure, has poor thermoelectric (TE) properties due to its metallic behavior. However, by a partial Sb-Te exchange, it becomes semiconducting without noticeable structure changes and so achieves a significant enhancement in the thermopower with the composition of Mo₃Sb₅Te₂. Meanwhile, large cubic voids in the Mo₃Sb₅Te₂ crystal structure provide the possibility of filling the voids with small cations to decrease the thermal conductivity by the so-called rattling effect. As part of the effort to verify this idea, we report herein the growth as well as measurements of the thermal and electrical transport properties of Mo₃Sb_5.4Te_1.6 and Ni_0.06Mo₃Sb_5.4Te_1.6.     

Thermoelectric power of Bi<Subscript>92</Subscript>Sb<Subscript>8</Subscript> and Bi<Subscript>85</Subscript>Sb<Subscript>15</Subscript> thin films

The results of studying the galvanomagnetic and thermoelectric properties of thin block Bi₉₂Sb₈ and Bi₈₅Sb₁₅ films on mica and polyimide substrates are presented. The method used for measuring the thermoelectric power allowed us to study the temperature dependence the thermoelectric power, without introducing additional deformations into the substrate–film system. A significant difference in the temperature dependences of the galvanomagnetic and thermoelectric properties of films on mica and polyimide is found. The free charge-carrier concentrations and mobilities in the films on mica and polyimide and levels of the chemical potential for electrons and holes are calculated within the two-band approximation. The difference in the charge-carrier parameters for films on mica and polyimide is associated with strains in the film–substrate system.     

Thermoelectric properties of Bi<Subscript>0.5</Subscript>Sb<Subscript>1.5</Subscript>Te<Subscript>3</Subscript> ribbons prepared by melt spinning

The results of studying the thermoelectric properties of p-type Bi_0.5Sb_1.5Te₃ alloy samples prepared by melt spinning quenching are presented. The material after melt spinning is shaped as thin ribbons and has a quasi-amorphous structure. The thermoelectric properties (thermoelectric power and electrical resistance) and crystallization processes of as-prepared melt-spun ribbons are studied at 300–800 K for the first time. The stability range of the initial state, the crystallization-onset temperature, and the effect of thermal annealing on the thermoelectric-power factor of the alloy are determined.     

Thermoelectric Properties of Cu-doped Bi<Subscript>0.4</Subscript>Sb<Subscript>1.6</Subscript>Te<Subscript>3</Subscript> Prepared by Hot Extrusion

Cu_0.003Bi_0.4Sb_1.6Te₃ alloys were prepared by using encapsulated melting and hot extrusion (HE). The hot-extruded specimens had the relative average density of 98%. The (00l) planes were preferentially oriented parallel to the extrusion direction, but the specimens showed low crystallographic anisotropy with low orientation factors. The specimens were hot-extruded at 698 K, and they showed excellent mechanical properties with a Vickers hardness of 76 Hv and a bending strength of 59 MPa. However, as the HE temperature increased, the mechanical properties degraded due to grain growth. The hot-extruded specimens showed positive Seebeck coefficients, indicating that the specimens have p-type conduction. These specimens exhibited negative temperature dependences of electrical conductivity, and thus behaved as degenerate semiconductors. The Seebeck coefficient reached the maximum value at 373 K and then decreased with increasing temperature due to intrinsic conduction. Cu-doped specimens exhibited high power factors due to relatively higher electrical conductivities and Seebeck coefficients than those of undoped specimens. A thermal conductivity of 1.00 Wm^?1 K^?1 was obtained at 373 K for Cu_0.003Bi_0.4Sb_1.6Te₃ hot-extruded at 723 K. A maximum dimensionless figure of merit, ZT _max = 1.05, and an average dimensionless figure of merit, ZT _ave = 0.98, were achieved at 373 K.     

Thermoelectric Properties of Mn-Doped Ca<Subscript>5</Subscript>Al<Subscript>2</Subscript>Sb<Subscript>6</Subscript>

Ca₅Al₂Sb₆ is a relatively inexpensive Zintl compound exhibiting promising thermoelectric efficiency at temperatures suitable for waste heat recovery. Motivated by our previous studies of Ca₅Al₂Sb₆ doped with Na and Zn, this study focuses on doping with Mn²⁺ at the Al³⁺ site. While Mn is a successful p-type dopant in Ca₅Al₂Sb₆, we find that incomplete dopant activation yields lower hole concentrations than obtained with either previously investigated dopant. High-temperature Hall effect and Seebeck coefficient measurements show a transition from nondegenerate to degenerate semiconducting behavior in Ca₅Al_2−x Mn _x Sb₆ samples (x = 0.05, 0.1, 0.2, 0.3, 0.4) with increasing Mn content. Ultimately, no improvement in zT is achieved via Mn doping, due in part to the limited carrier concentration range achieved.     

Electrodeposition and Thermoelectric Characteristics of Bi<Subscript>2</Subscript>Te<Subscript>3</Subscript> and Sb<Subscript>2</Subscript>Te<Subscript>3</Subscript> Films for Thermopile Sensor Applications

A thermopile sensor was processed on a glass substrate by electrodeposition of n-type bismuth telluride (Bi-Te) and p-type antimony telluride (Sb-Te) films. The n-type Bi-Te film electrodeposited at −50 mV in a 50 mM electrolyte with a Bi/(Bi + Te) mole ratio of 0.5 exhibited a Seebeck coefficient of −51.6 μV/K and a power factor of 7.1 × 10⁻⁴ W/K² · m. The p-type Sb-Te film electroplated at 20 mV in a 70 mM solution with an Sb/(Sb + Te) mole ratio of 0.9 exhibited a Seebeck coefficient of 52.1 μV/K and a power factor of 1.7 × 10⁻⁴ W/K² · m. A thermopile sensor composed of 196 pairs of the p-type Sb-Te and the n-type Bi-Te thin-film legs exhibited sensitivity of 7.3 mV/K.     

Special features of Sb<Subscript>2</Subscript> and Sb<Subscript>4</Subscript> incorporation in MBE-grown AlGaAsSb alloys

AlGaAsSb and GaAsSb alloys of different composition were grown by molecular-beam epitaxy (MBE) on GaSb, InAs, and GaAs substrates, using both conventional and cracker antimony effusion cells. The incorporation coefficients of dimer and tetramer antimony molecules, which totally describe the kinetic processes on the growth surface, were calculated. The differences in the incorporation of Sb₂ and Sb₄ molecules in MBE-grown GaAsSb alloys are shown. The effect of the MBE-growth parameters (substrate temperature and incident fluxes of group-V and group-III elements) on the composition of (Al,Ga)AsSb alloys and the incorporation coefficient of Sb was studied in detail. The incorporation coefficients of tetramer and dimer antimony molecules were found to vary over a wide range, depending on the substrate temperature and the ratio between the arrival rates of the group-III and the group-V elements.     

Thermoelectric Properties of Spark Plasma-Sintered In<Subscript>4</Subscript>Se<Subscript>3</Subscript>-In<Subscript>4</Subscript>Te<Subscript>3</Subscript>

We report the thermoelectric properties of spark plasma-sintered In₄Se₃-In₄Te₃ materials. For comparison, pure In₄Se₃ and In₄Se₃ (80 wt.%)/In₄Te₃ (20 wt.%) mixture samples were prepared. In₄Se₃ and In₄Te₃ powders were synthesized by a conventional melting process in evacuated quartz ampoules, and a spark plasma method was used for the sintering of the pure In₄Se₃ and mixture samples. Thermoelectric and structural characterizations were carried out, and the mixing effect of In₄Se₃ and In₄Te₃ on the thermoelectric properties was investigated.     

Low-Temperature Thermoelectric Properties of Co<Subscript>0.9</Subscript>Fe<Subscript>0.1</Subscript>Sb<Subscript>3</Subscript>-Based Skutterudite Nanocomposites with FeSb<Subscript>2</Subscript> Nanoinclusions

Bulk thermoelectric nanocomposite materials have great potential to exhibit higher ZT due to effects arising from their nanostructure. Herein, we report low-temperature thermoelectric properties of Co_0.9Fe_0.1Sb₃-based skutterudite nanocomposites containing FeSb₂ nanoinclusions. These nanocomposites can be easily synthesized by melting and rapid water quenching. The nanoscale FeSb₂ precipitates are well dispersed in the skutterudite matrix and reduce the lattice thermal conductivity due to additional phonon scattering from nanoscopic interfaces. Moreover, the nanocomposite samples also exhibit enhanced Seebeck coefficients relative to regular iron-substituted skutterudite samples. As a result, our best nanocomposite sample boasts a ZT = 0.041 at 300 K, which is nearly three times as large as that for Co_0.9Fe_0.1Sb₃ previously reported.     

Thermoelectric Properties of Co<Subscript>4</Subscript>Sb<Subscript>12</Subscript> Skutterudite Materials with Partial In Filling and Excess In Additions

The properties of Co₄Sb₁₂ with various In additions were studied. X-ray diffraction revealed the presence of the pure δ-phase of In_0.16Co₄Sb₁₂, whereas impurity phases (γ-CoSb₂ and InSb) appeared for x = 0.25, 0.40, 0.80, and 1.20. The homogeneity and morphology of the samples were observed by Seebeck microprobe and scanning electron microscopy, respectively. All the quenched ingots from which the studied samples were cut were inhomogeneous in the axial direction. The temperature dependence of the Seebeck coefficient (S), electrical conductivity (σ), and thermal conductivity (κ) was measured from room temperature up to 673 K. The Seebeck coefficient of all In-added Co₄Sb₁₂ materials was negative. When the filler concentration increases, the Seebeck coefficient decreases. The samples with In additions above the filling limit (x = 0.22) show an even lower Seebeck coefficient due to the formation of secondary phases: InSb and CoSb₂. The temperature variation of the electrical conductivity is semiconductor-like. The thermal conductivity of all the samples decreases with temperature. The central region of the In_0.4Co₄Sb₁₂ ingot shows the lowest thermal conductivity, probably due to the combined effect of (a) rattling due to maximum filling and (b) the presence of a small amount of fine-dispersed secondary phases at the grain boundaries. Thus, regardless of the non-single-phase morphology, a promising ZT (S ² σT/κ) value of 0.96 at 673 K has been obtained with an In addition above the filling limit.     

Preparation and Thermoelectric Characterization of SiC-B<Subscript>4</Subscript>C Composites

SiC-B₄C composites with various values of SiC-to-B₄C ratio and grain size were fabricated by pressureless sintering. This paper presents the results of current investigations of this composite material. This includes the parameters of manufacture (shrinkage, density, and open porosity), thermoelectric properties (electrical and thermal conductivity, and thermopower), and material characterization (x-ray diffraction, scanning electron microscopy, oxidation resistance, and thermal expansion). The results indicate high potential of this composite as an alternative material for thermoelectric applications at high temperatures. The Seebeck coefficient of the composite was higher than that of the single-component materials B₄C and SiC and reached 400 μV/K at 500°C.     

Comparative studies of p-type InP layers formed by Zn<Subscript>3</Subscript>As<Subscript>2</Subscript> and Zn<Subscript>3</Subscript>P<Subscript>2</Subscript> diffusion

The Zn₃As₂ and Zn₃P₂ were used as Zn-diffusion sources to form a p-region in undoped-InP wafers. The p-type InP formed by Zn diffusion from a Zn₃P₂ source has higher transmittance over the testing-spectrum range 1,000–1,700 nm versus Zn diffusion from a Zn₃As₂ source. In the case of a p-type region formed from a Zn₃As₂ source, x-ray photoelectron spectroscopy (XPS) showed As atoms were reduced from the oxide state and formed an InAs composition, which introduces more absorption loss.     

Effect of Deformation Temperature on Texture and Thermoelectric Properties of Bi<Subscript>0.5</Subscript>Sb<Subscript>1.5</Subscript>Te<Subscript>3</Subscript> Prepared by Hot-Press Deformation

The effects of deformation temperature on texture and thermoelectric properties of p-type Bi_0.5Sb_1.5Te₃ sintered materials were investigated. The sintered materials were prepared by mechanical alloying and hot-press sintering. The hot-press deformation was performed at 723 K and 823 K by applying mechanical pressure in a graphite die. Then, the materials were extruded in the direction opposite to the direction of applied pressure. X-ray diffraction and electron backscattered diffraction patterns showed that the hexagonal c-plane tended to align along the extruded direction when the samples were deformed at high temperatures. The thermoelectric power factor was increased by high-temperature hot-press deformation because of the low electrical resistivity that originated from the c-plane orientation.     

Improvement of Thermoelectric Power Factor of Hydrothermally Prepared Bi<Subscript>0.5</Subscript>Sb<Subscript>1.5</Subscript>Te<Subscript>3</Subscript> Compared with its Solvothermally Prepared Counterpart

We report on the successful hydrothermal synthesis of Bi_0.5Sb_1.5Te₃, using water as the solvent. The products of the hydrothermally prepared Bi_0.5 Sb_1.5Te₃ were hexagonal platelets with edges of 200–1500 nm and thicknesses of 30–50 nm. Both the Seebeck coefficient and electrical conductivity of the hydrothermally prepared Bi_0.5Sb_1.5Te₃ were larger than those of the solvothermally prepared counterpart. Hall measurements of Bi_0.5Sb_1.5Te₃ at room temperature indicated that the charge carrier was p-type, with a carrier concentration of 9.47 × 10¹⁸ cm⁻³ and 1.42 × 10¹⁹ cm⁻³ for the hydrothermally prepared Bi_0.5Sb_1.5Te₃ and solvothermally prepared sample, respectively. The thermoelectric power factor at 290 K was 10.4 μW/cm K² and 2.9 μW/cm K² for the hydrothermally prepared Bi_0.5Sb_1.5Te₃ and solvothermally prepared sample, respectively.     

Electrical and Structural Real-Time Changes in Thin Thermoelectric (Bi<Subscript>0.15</Subscript>Sb<Subscript>0.85</Subscript>)<Subscript>2</Subscript>Te<Subscript>3</Subscript> Films by Dynamic Thermal Treatment

A recent trend in thermoelectrics is miniaturization of generators or Peltier coolers using the broad spectrum of thin-film and nanotechnologies. Power supplies for energy self-sufficient micro and sensor systems are a wide application field for such generators. It is well known that thermal treatment of as-deposited p-type (Bi_0.15Sb_0.85)₂Te₃ films leads to enhancement of their power factors. Whereas up to now only the start (as-deposited) and the end (after annealing) film stages were investigated, herein for the first time, the dynamical changes of sputter-deposited film properties have been observed by real-time measurements. The electrical conductivity shows a distinct, irreversible increase during a thermal cycle of heating to about 320°C followed by cooling to room temperature. The interpretation of the Seebeck and Hall coefficients points to an enhancement in Hall mobility after annealing. In situ x-ray diffractometry shows the generation of an additional Te phase depending on temperature. This is also confirmed by energy-dispersive x-ray microanalysis and the corresponding mapping by scanning electron microscopy. It is presumed that the Te enrichment in a separate, locally well-defined phase is the reason for the improvement in the integral film transport properties.     

Characterization of Ge<Subscript>22</Subscript>Sb<Subscript>22</Subscript>Te<Subscript>56</Subscript> and Sb-Excess Ge<Subscript>15</Subscript>Sb<Subscript>47</Subscript>Te<Subscript>38</Subscript> Chalcogenide Thin Films for Phase-Change Memory Applications

A phase-change memory device that utilizes an antimony (Sb)-excess Ge₁₅Sb₄₇Te₃₈ chalcogenide thin film was fabricated and its electrical properties were measured and compared with a similar device that uses Ge₂₂Sb₂₂Te₅₆. The resulting electrical characteristics exhibited I _reset values of 14 mA for Ge₂₂Sb₂₂Te₅₆ and 10.6 mA for Ge₁₅Sb₄₇Te₃₈. Also, the set operation time (t _set) for the device using Ge₁₅Sb₄₇Te₃₈ films was 140 ns, which was more than twice as fast as the Ge₂₂Sb₂₂Te₅₆ device. The relationship between the microstructure and the improved electrical performance of the device was examined by means of transmission electron microscopy (TEM).     

Thermoelectric Properties of Zr<Subscript>3</Subscript>Mn<Subscript>4</Subscript>Si<Subscript>6</Subscript> and TiMnSi<Subscript>2</Subscript>

The Seebeck coefficient, electrical resistivity, and thermal conductivity of Zr₃Mn₄Si₆ and TiMnSi₂ were studied. The crystal lattices of these compounds contain relatively large open spaces, and, therefore, they have fairly low thermal conductivities (8.26 Wm⁻¹ K⁻¹ and 6.63 Wm⁻¹ K⁻¹, respectively) at room temperature. Their dimensionless figures of merit ZT were found to be 1.92 × 10⁻³ (at 1200 K) and 2.76 × 10⁻³ (at 900 K), respectively. The good electrical conductivities and low Seebeck coefficients might possibly be due to the fact that the distance between silicon atoms in these compounds is shorter than that in pure semiconductive silicon.