Synthesis and properties of vinyl siloxane modified cresol novolac epoxy for electronic encapsulation

Vinyl siloxane (VS) modified cresol novolac epoxy (CNE) and cresol novolac hardener (CNH) resins are synthesized and both components are capable of further crosslinking. The reaction kinetics for both components are studied so that they can crosslink simultaneously in a designed synthesis procedure. Through careful adjustment of a triphenylphosphine dosage, the glass‐transition temperature (T_g) of CNE/CNH resins can be effectively controlled. Phenomena characteristic of the existence of a diffusion‐controlled reaction are also observed. The relationships between the T_g and crosslinking density for the CNE/CNH resin are explicitly revealed through gel content and swell ratio experiments. CNE/CNH resins with a higher T_g have lower equilibrium moisture uptake because of the higher fraction of free volume. The coefficient of diffusion also shows a similar but less apparent trend. The incorporation of VS incurs a 35% reduction in the equilibrium moisture uptake and a 20% reduction in the coefficient of diffusion for the modified resin. The VS‐modified CNE/CNH resin possesses a lower Young's modulus and a higher strain at break than its unmodified counterpart does. This modified resin can help to alleviate the popcorning problems in integrated circuit packages, which results from hygrothermal stresses. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 79: 652–661, 2001     

Subtle variations in the structure of crosslinked epoxy networks and the impact upon mechanical and thermal properties

Presented here is an investigation of the structure–property relationships of crosslinked networks using three bi-functional glycidyl ether aromatic epoxy resins, two bi-aryl and one tri-aryl, cured with bi- and tri-aryl amines. Subtle changes to the monomer chemistry including changing aromatic substitution patterns from meta to para, methylene to isopropyl and isopropyl to ether were explored. Changing an epoxy resin backbone from methylene to isopropyl enhances backbone rigidity thus increasing glass transition temperature (T_g), yield strength, and strain despite reducing modulus. Changing meta-substitution to para increases T_g and yield strain while leaving strength unaffected and reducing modulus. Changing isopropyl linkages to ether reduces modulus, strength, T_g, and yield strain reflecting increased molecular flexibility. Using three instead of two aromatic rings increases the molecular weight between crosslinks thereby decreasing T_g and yield strain while increasing modulus and strength. Despite the complexities of multiple systems for varying epoxy resins and amine hardeners, the effect upon network properties is explained in terms of short- and long-range molecular and segmental mobility, crosslink density, and equilibrium packing density. © 2020 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2020 , 137, 48874.     

Bisphenol-A bimodal epoxy resins. Part I: The dynamic mechanical characterization of a 6300 (340/22,500) weight average molecular weight system

By using an advanced epoxy resin of 22,500 weight average molecular weight two bimodal systems of 6300 weight average molecular weights were prepared. By altering the curing procedure normally used to cure epoxy resins and high molecular weight resins we have succeeded in minimizing the difficulty associated with preparing bimodal epoxy resin systems. The ultimate T_g of these bimodal systems is associated with the phase morphology and controlled by the curing conditions employed. For the completely phase separated bimodal system a T_g of 473 K is reported and for the partially phase separated system a T_g of 466 K is reported. Equations were developed for predicting the equilibrium shear modulus of these bimodal systems. Theoretical predictions based on these equations were found to be consistent with experimental results.     

Cure modeling and monitoring of epoxy/amine resin systems. II. Network formation and chemoviscosity modeling

The glass transition temperature (T_g) advancement and the chemoviscosity development under isothermal conditions have been investigated for four epoxy/amine systems, including commercial RTM6 and F934 resins. Differential scanning calorimetry (DSC) was the thermoanalytical technique used to determine the T_g advancement and rheometry the technique for the determination of the chemoviscosity profiles of these resin systems. The complex cure kinetics were correlated to the T_g advancement via an one‐to‐one relationship using Di Benedetto's formula. It was revealed that the three‐dimensional network formation follows a single activated mechanism independent of whether the cure kinetics follow a single or several activation mechanisms. The viscosity profiles showed the typical characteristics of epoxy/amine cure. A modified version of the Williams‐Landel‐Ferry equation (WLF) was adequate to model the viscosity profiles of all the resin systems, in the temperature range 130 to 170°C, with a very good degree of accuracy. The parameters of the WLF equation were found to vary in a systematic manner with cure temperature. Further correlation between T_g and viscosity showed that gelation, defined as the point where viscosity reaches 10⁴ Pas, occurs at a unique T_g value for each resin system, which is independent of the cure conditions. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 77: 2178–2188, 2000     

A Study of the Interphase Region in Carbon Fibre/Epoxy Composites using Dynamic Mechanical Thermal Analysis

We have examined the effect of fibre addition on the glass transition temperature (T _g ) of two epoxy resin systems (an amine cured and an anhydride cured epoxy system) using dynamic mechanical thermal analysis (DMTA) and differential scanning calorimetry (DSC). The presence of fibres changes the glass transition temperature (T _g ) of an anhydride cured epoxy resin but does not affect that of an amine cured epoxy. The data suggest that two counteracting mechanisms are responsible for these changes: firstly, the presence of fibres causes a restriction of the molecular motion in the resin system, and secondly, the presence of carboxyi and keto-enol groups on the fibre surface inhibit curing of the resin close to the fibre, i.e. in the interphase region. The former increases the T _g and is a long range effect whereas the latter decreases the T _g and is a localised phenomenon. Changes in the dynamic properties of the interphase region are only detected when the samples are loaded in the longitudinal direction and not in the transverse direction where bulk matrix properties dominate. Sizing the fibres before their incorporation into the epoxy resin eliminates the variation in interfacial properties arising from differences in fibre surface chemistry.     

Influence of the network structure and void content on hygrothermal stability of resol resin modified with epoxy–amine

Epoxy–amine was blended with two resol resins to study the influence of the final network and void content on the water absorption of these systems. To characterize the network structure of the blends, infrared analyses were performed. It was observed that a diminution in the crosslink density of the network and the reaction between the epoxy and resol have been occurred. From dynamic–mechanical analyses, a diminution in the T_g value and an increment in the height of the tan δ peak with the epoxy–amine content added to the resol were observed. Thermogravimetric analysis showed that the thermal stability of the resol was reduced by the addition of epoxy–amine as well as a lesser crosslink network for the blends with higher epoxy–amine content. The maximum water uptake and the diffusion coefficient were related with the chemical structure and void content of the specimens. On one hand, the maximum water uptake was observed to depend on the void content of the blends. On the other hand, the diffusion coefficient appears to be related with the local motions of the polymeric chains and with the hydrophilic character of the materials. This behavior was observed for the two resols studied. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 102: 588–597, 2006     

Synthesis and properties of urethane elastomer-modified epoxy resin having hydroxymethyl group

Synthesis and properties of urethane elastomer-modified epoxy resins were studied. The urethane elastomer-modified epoxy resins were synthesized by the reaction of a 4-cresol type epoxy compound having hydroxymethyl groups (EPCDA) with isocyanate prepolymer. The structure was identified by IR, ¹H NMR and GPC. These epoxy resins (EPCDATDI) were mixed with a commercial epoxy resin (DGEBA) in various ratios. The mixed epoxy resins were cured with a mixture of 4,4′-diaminodiphenylmethane and 3-phenylenediamine (molar ratio 6:4) as a hardener. The curing behaviour of these epoxy resins was studied by DSC. The higher the concentration of EPCDATDI, the higher the onset temperature and the smaller the rate constant (k) of the exothermic cure reaction were. It was considered that the ratio of hydroxymethyl group to epoxide group was very small and the molecular weight of EPCDATDI was large. Therefore, the accelerating effect of the hydroxymethyl group on the epoxide–amine reaction was cancelled by the retardant effect of increased molecular weight and viscosity, and decreased molecular motion. Toughness was estimated by Izod impact strength and fracture toughness (K_1C). On addition of 10 wt% EPCDATDI with low molecular weight (M?_n 6710, estimated by GPC using polystyrene standard samples), Izod impact strength and K_1C increased by 70% and 60%, respectively, compared with unmodified epoxy resin. Glass transition temperatures (T_g) for the cured epoxy resins mixed with EPCDATDI measured by dynamic mechanical spectrometry were the same as those of unmodified epoxy resin. The storage modulus (E′) at room temperature decreased with increasing concentration of EPCDATDI. Toughness and dynamic mechnical behaviour of cured epoxy resin systems were studied based on the morphology.     

Time-temperature–transformation (TTT) diagrams of high Tg epoxy systems: Competition between cure and thermal degradation

The cure behavior and thermal degradation of high T_g epoxy systems have been investigated by comparing their isothermal time-temperature-transformation (TTT) diagrams. The formulations were prepared from di- and trifunctional epoxy resins, and their mixtures, with stoichiometric amounts of a tetrafunctional aromatic diamine. The maximum glass transition temperatures (T_g∞) were 229°C and > 324°C for the fully cured di- and trifunctional epoxy materials, respectively. Increasing functionality of the reactants decreases the times to gelation and to vitrification, and increases the difference between T_g after prolonged isothermal cure and the temperature of cure. At high temperatures, there is competition between cure and thermal degradation. The latter was characterized by two main processes which involved devitrification (decrease of modulus and T_g) and revitrification (char formation). The experimentally inaccessible T_g∞ (352°C) for the trifunctional epoxy material was obtained by extrapolation from the values of T_g∞ of the less highly crosslinked systems using a relationship between the glass transition temperature, crosslink density, and chemical structure.     

Synthesis of tetrafunctional epoxy resins and their modification with polydimethylsiloxane for electronic application

High-performance tetrafunctional epoxy resins were synthesized by reacting a suitable tetraphenols which were obtained by the condensation of appropriate dialdehyde with phenol followed by epoxidation with a halohydrin. The structure of the synthesized tetraphenols was confirmed by infrared (IR), mass spectra (MS), and nuclear magnetic resonance (NMR) spectroscopy. Dispersed silicone rubbers were used to reduce the stress of the synthesized tetrafunctional epoxy resin cured with phenolic novolac resin for electronic encapsulation application. The dynamic viscoelastic properties and morphologies of neat rubber-modified epoxy networks were investigated. The thermal mechanical properties and moisture absorption of encapsulants formulated from the synthesized tetrafunctional epoxy resins were also studied. The results indicate that a low-stress, high glass transition temperature (T_g), and low-moisture-absorbing epoxy resin system was obtained for semiconductor encapsulation application. © 1996 John Wiley & Sons, Inc.     

Tertiary-amine-terminated polybutadiene and butadiene acrylonitrile: Synthesis and application in the modification of epoxy resins

Two tertiary-amine-terminated liquid rubbers (TATPB and TATBN) containing polybutadiene and butadiene acrylonitrile are successfully synthesized and used in the modification of epoxy networks. By taking advantage of the flexibility of rubbers, the toughness of epoxy resin has been significantly improved. The addition of 60 phr TATPB and TATBN increased the impact strength of epoxy resins from 12.2 to 59.8 and 92.0 KJ/m², respectively. Meanwhile, due to the dual role of tertiary amine of TATPB and TATBN in catalysis and curing for epoxies, their T_g values shifted from 87.7 to 102.0 and 95.7°C, respectively. TATPB with a smaller polarity improves the toughness of the epoxy resin slightly less than TATBN with a larger polarity, but the former is more effective in increasing the T_g values. This study demonstrates a novel strategy to enhance the toughness of epoxy composites as well as improve the high temperature resistance by designing the end-structure of toughening agents.     

Synthesis and properties of trifluoromethyl groups containing epoxy resins cured with amine for low Dk materials

The study synthesized a trifluoromethyl (CF₃) groups with a modified epoxy resin, diglycidyl ether of bisphenol F (DGEBF), using environmental friendly methods. The epoxy resin was cured with 4,4′‐diaminodiphenyl‐methane (DDM). For comparison, this study also investigated curing of commercially available diglycidyl ether of bisphenol A (DGEBA) with the same curing agent by varying the ratios of DGEBF. The structure and physical properties of the epoxy resins were characterized to investigate the effect of injecting fluorinated groups into epoxy resin structures. Regarding the thermal behaviors of the specimens, the glass transition temperatures (T_g) of 50–160°C and the thermal decomposition temperatures of 200–350 °C at 5% weight loss (T_d5%) in nitrogen decreased as amount of DGEBF increased. The different ratios of cured epoxy resins showed reduced dielectric constants (D_k) (2.03–3.80 at 1 MHz) that were lower than those of pure DGEBA epoxy resins. Reduced dielectric constant is related to high electrronegativity and large free volume of fluorine atoms. In the presence of hydrophobic CF₃ groups, the epoxy resins exhibited low moisture absorption and higher contact angles. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2012     

Epoxy resin based on 4,4′-dihydroxydiphenysulfone. I. Synthesis and reaction kinetics with 4,4′-diaminodiphenylmethane and 4,4′-diaminodiphenylsulfone

Epoxy resins based on 4,4′-dihydroxydiphenylsulfone (DGEBS) and diglycidyl ether of bisphenol A (DGEBA) were prepared by alkaline condensation of 4,4′-dihydroxydiphenylsulfone (bisphenol S) with epichlorohydrin and by recrystallization of liquid, commercial bisphenol A-type epoxy resin, respectively. Curing kinetics of the two epoxy compounds with 4,4′-diaminodiphenylmethane (DDM) and with 4,4′-diaminodiphenylsulfone (DDS) as well as T_g values of the cured materials were determined by the DSC method. It was found that the ? SO₂? group both in the epoxy resin and in the harener increases T_g values of the cured materials. DGEBS reacts with the used hardeners faster than does DGEBA and the curing reaction of DGEBS begins at lower temperature than does the curing reaction of DGEBA when the same amine is used. © 1994 John Wiley & Sons, Inc.     

Role of core‐shell rubber particle cavitation resistance on toughenability of epoxy resins

The role of rubber particle cavitation resistance on toughening of epoxy resins is still unresolved. In this research, the role of rubber particle cavitation resistance was exclusively studied. Two types of core‐shell rubber (CSR) particles with different cavitation resistances were utilized for modifying epoxy resin. Matrix crosslink density (XLD) was varied by using nonstoichiometric amounts of hardener. Fracture toughness values of neat and CSR‐modified epoxy samples decreased with lowering of XLD via deviation from stoichiometric point. It was resulted by higher modulus and lower elongation at break of the nonstoichiometric samples, and also antiplasticization of epoxy networks resulted from suppression of β‐transition relaxation motions. In all XLDs, the CSR particles with higher core T_g and modulus yielded higher fracture energy. Results showed that core properties such as T_g and modulus of CSR particles had a significant effect on toughening of the epoxy networks. POLYM. ENG. SCI., 2008. © 2008 Society of Plastics Engineers     

Toughening of epoxy resin systems using low‐viscosity additives

This study has evaluated three low‐viscosity epoxy additives as potential tougheners for two epoxy resin systems. The systems used were a lower‐reactive resin based upon the diglycidyl ether of bisphenol A (DGEBA) and the amine hardener diethyltoluene diamine, while the second epoxy resin was based upon tetraglycidyl methylene dianiline (TGDDM) and a cycloaliphatic diamine hardener. The additives evaluated as potential tougheners were an epoxy‐terminated aliphatic polyester hyperbranched polymer, a carboxy‐terminated butadiene rubber and an aminopropyl‐terminated siloxane. This work has shown that epoxy‐terminated hyperbranched polyesters can be used effectively to toughen the lower cross‐linked epoxy resins, i.e. the DGEBA‐based systems, with the main advantage being that they have minimal effect upon processing parameters such as viscosity and the gel time, while improving the fracture properties by about 54 % at a level of 15 wt% of additive and little effect upon the T_g. This result was attributed to the phase‐separation process producing a multi‐phase particulate morphology able to initiate particle cavitation with little residual epoxy resin dissolved in the continuous epoxy matrix remaining after cure. The rubber additive was found to impart similar levels of toughness improvement but was achieved with a 10–20 °C decrease in the T_g and a 30 % increase in initial viscosity. The siloxane additive was found not to improve toughness at all for the DGEBA‐based resin system due to the poor dispersion within the epoxy matrix. The TGDDM‐based resin systems were found not to be toughened by any of the additives due to the lack of plastic deformation of the highly cross‐linked epoxy network Copyright © 2003 Society of Chemical Industry     

Synthesis,characterization, and properties of multifunctional naphthalene-containing epoxy resins cured with cyanate ester

Multifunctional naphthalene-containing epoxy resins derived from 2,7-dihydroxylnaphthalene were synthesized and the intermediates were characterized by Fourier transform infrared spectroscopy, elemental analysis, and mass spectrometry. The cured products from naphthalene-containing epoxy resin and the dicyanate ester of bisphenol A (DCBA) exhibited a better T_g and a lower coefficient of thermal expansion than those of the commercial epoxy system. The glass transition temperature, thermal stability, and moisture absorption were found to increase with the epoxy functionality when naphthalene-containing epoxy resins were cured with DCBA. Thermogravimetric analyses revealed that the DCBA-cured system had a better thermal stability than that of the 4,4′-diaminodiphenylsulfone (DDS)-cured system. The addition of a metallic catalyst into the epoxy resin/cyanate ester system not only facilitated the cyclotrimerization of the cyanate ester but also the polyetherification of the epoxy resin. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 73: 1611–1622, 1999     

Torsional braid analysis of the aromatic amine cure of epoxy resins

The cure behavior of diglycidyl ether of bisphenol A (DGEBA) type of epoxy resins with three aromatic diamines, 4,4′-diaminodiphenyl methane (DDM), 4,4′-diaminodiphenyl sulfone (44DDS), and 3,3′-diaminodiphenyl sulfone (33DDS) was studied by torsional braid analysis. For each curing agent the stoichiometry of the resin mixtures was varied from a two to one excess of amino hydrogens per epoxy group to a two to one excess of epoxy groups per amino hydrogen. Isothermal cures of the resin mixtures were carried out from 70 to 210°C (range depending on epoxy—amine mixture), followed by a temperature scan to determine the glass transition temperature (T_g). The times to the isothermal liquid-to-rubber transition were shortest for the DDM mixtures and longest for the 44DDS mixtures. The liquid-to-rubber transition times were also shortest for the amine excess mixtures when stoichiometry was varied. A relatively rapid reaction to the liquid-to-rubber transition was observed for the epoxy excess mixtures, followed by an exceedingly slow reaction process at cure temperatures well above the T_g. This slow process was only observed for epoxy excess mixtures and eventually led to significant increases in T_g. Using time—temperature shifts of the glass transition temperature vs. logarithm of time, activation energies approximately 50% higher were derived for this process compared to those derived from the liquid-to-rubber transition. The rate of this reaction was virtually independent of curing agent and was attributed to etherification taking place in the epoxy excess mixtures. © 1994 John Wiley & Sons, Inc.     

Multifunctional formaldehyde resins as curing agent for epoxy resins

Formaldehyde resins (FR) at 1/1/2 molar ratios of monomers (Cl‐phenol/amino monomers/p‐formaldehyde) were synthesized under acid catalysis. The obtained resins were characterized using elemental analysis, FTIR and RMN spectroscopic methods, being used as crosslinking agents for epoxy resin formulations. The curing of epoxy resins with FR were investigated. The glass transition temperature (T_g) and decomposition behavior of crosslinked resins were studied by differential scanning calorimetry (DSC) and thermogravimetric (TGA) techniques. All DSC scans show two exothermic peaks, which implied the occurrence of cure reactions between epoxy ring and amine or carboxylic protons, in function of chemical structures of FR. The crosslinked products showed good thermal properties, high glass transitions, and low water absorption. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

Studies on the conductivity properties of a family of cyanoethylated amine cured epoxy resin matrices

A group of epoxy matrices having a varied amount of crosslink densities have been prepared by curing diglycidyl ether of bisphenol A (DGEBA)–epoxy resin with the help of a family of cyanoethylated amine hardeners based on the adducts of 1 mole of triethylenetetramine and x moles of acrylonitrile, where x = 1, 2, and 3, to effect increasing level of cyanoethylation of triethylenetetramine. The electrical conductivities of such epoxy matrices having increasing crosslink densities were evaluated by a two‐probe a.c. technique in the frequency range of 100 Hz to 13 MHz using an impedance analyzer in the temperature range from 299 to 495 K. It was observed that the conductivity increased with an increased level of cyanoethyl (? CH₂CH₂CN) moiety in the matrix resin, while the activation energy (E_c) of conductivity in the elastomeric region above T_e generally showed a reversed trend with respect to E_v from 1.11 to 0.83 eV, where T_e is defined by T_e = (T_g + ΔT), the 〈ΔT 〉 for this family of matrix resin being 44.83°C. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 88: 1627–1631, 2003     

The Effects of Pre-Bond Moisture on the Fracture Behaviour of Adhesively-Bonded Composite Joints

The results of an investigation into the effects of pre-bond moisture absorbed by fibre-composite substrates prior to bonding with various structural epoxy adhesives are presented. Substrates were bonded in the as-received condition (where substrates had been exposed to atmospheric moisture for periods of greater than three months) and were also bonded in the fully-dried condition (after drying under vacuum at 105°C for 28 days). Additionally, substrates were conditioned by water submersion for various durations prior to bonding. Double cantilever beam tests were performed on the resulting joints to determine the adhesive fracture energy, G _IC. The effect of pre-bond moisture on the glass transition temperature of the adhesive was also determined. One adhesive was shown to exhibit an extreme sensitivity to pre-bond moisture. A severe reduction in fracture energy accompanied a change in the fracture morphology and T_g. Other adhesives were shown to be relatively insensitive to the levels of pre-bond moisture introduced.     

Dynamic mechanical characterization of a soy based epoxy resin system

Epoxidized allyl soyate (EAS), a novel soy based epoxy resin, has been prepared by the process of transesterfication and epoxidation of regular food grade soybean oil. Two types of crosslinking agents were employed in this study. The effects of the concentration of EAS and the type of crosslinking agent on the dynamic mechanical behavior of the soy based resin system have been investigated. The room temperature storage moduli (E′) and the glass transition temperatures (T_g) increased for the anhydride cured and decreased for the amine cured resins. The loss tangent maximum (tan δ)_max decreased for anhydride cured resins and increased for amine cured resins. The effect of frequency on the storage modulus was also studied. Master curves were constructed by the time‐temperature superpositioning technique (TTS) to predict the storage modulus at times and temperatures that are not experimentally feasible. The results indicate that soy based epoxy resins with appropriate concentrations hold great potential as a replacement for petroleum based materials in noise and vibration attenuation applications. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 98: 1772–1780, 2005