Mechanical behavior of nanoscale Cu/PdSi multilayers

Berkovich nanoindentation and uniaxial microcompression tests have been performed on sputter-deposited crystalline Cu/amorphous Pd_0.77Si_0.23 multilayered films with individual layer thicknesses ranging from 10 to 120 nm. Elastic moduli, strengths and deformation morphologies have been compared for all samples to identify trends with layer thicknesses and volume fractions. The multilayer films have strengths on the order of 2 GPa, from which Cu layer strengths on the order of 2 GPa can be inferred. The high strength is attributed to extraordinarily high strain hardening in the polycrystalline Cu layers through the inhibition of dislocation annihilation or transmission at the crystalline/amorphous interfaces. Cross-sectional microscopy shows uniform deformation within the layers, the absence of delamination at the interfaces, and folding and rotation of layers to form interlayer shear bands. Shear bands form where shear stresses are present parallel to the interfaces and involve tensile plastic strains as large as 85% without rupture of the layers. The homogeneous deformation and high strains to failure are attributed to load sharing between the amorphous and polycrystalline layers and the inhibition of strain localization within the layers.     

Cu/Nb纳米多层膜延性及其断裂行为

通过单轴拉伸试验研究恒定调制周期的聚酰亚胺基体Cu/Nb纳米金属多层膜的延性对调制比的依赖性,并采用聚焦离子束／扫描电子显微镜(FIB/SEM)截面定量表征技术深入分析多层膜的异质约束效应对断裂行为的影响.结果表明随着调制比的增加,多层膜的延性单调减小,出现由剪切型向张开型断裂模式的转变.当调制比小于某一临界值时,调制周期越小,多层膜延性越高;反之,则多层膜延性越差.这是由于软相Cu层对脆相Nb层中萌生的微裂纹扩展的约束作用.     

Electrodeposition of Cu/Ni compositionally modulated multilayers by the dual-plating bath technique

Electrodeposition of Cu/Ni Compositionally Modulated Multilayers (CMM) has been attempted by the dual-plating bath technique. In a very simple set-up using a manual transfer of the substrate from one bath to another, multilayers with sublayer thicknesses of 100, 25 and 5 nm have been deposited. Cross-sectional scanning, transmission electron microscopy and X-ray texture measurements have been used to characterize the samples. A number of problems encountered in the deposition of a good quality CMM have been identified. The possibility of improving the quality of the layered structure through the selection of appropriate plating parameters has been demonstrated. It has been shown how the electrocrystallization of thin copper layers differs quite markedly from that of thin nickel layers.     

铜铝复合板的拉深变形行为

对轧制态及退火态铜铝复合板进行了室温拉伸试验,得到了其不同变形速度下的强度和塑性性能数据,计算了其不同变形速度下的应变硬化指数n值,以得到其优化的拉深速度.分别在无润滑、20号机油润滑以及聚丙烯薄膜润滑3种条件下对两种状态的铜铝复合板进行拉深试验,测量变形后的极限拱顶高度日,观察分析缺陷位置以及界面层演变规律.结果 表...     

Length scale-dependent deformation behavior of nanolayered Cu/Zr micropillars

The mechanical behavior of incoherent Cu/Zr multilayers was studied in uniaxial compression experiments using micropillars with individual layer thicknesses (h) ranging from 5 to 100 nm. The deformation behavior of these micropillars are size dependent, transiting from dislocation dominated symmetrical slip at large h to shear localization induced by asymmetric slip and grain boundary mediated deformation at small h. During compression studies the multilayer micropillars exhibit a transition from strain hardening to shear softening at small h, and work softening at greater h. A maximum strain hardening rate is observed at a critical h of 20 nm, which was explained in terms of a transition from dislocation interactions to cross-slip of dislocations. The mechanical strength of the micropillars is also dependent on h, which was quantitatively analyzed using the confined layer slip model. In addition, the influence of pillar diameter on the mechanical behavior is also investigated. The effect of extrinsic size on the deformation mechanisms is discussed with respect to the intrinsic size effect with variation in h.     

Y12Cr18Ni9Cu奥氏体易切削钢的高温塑性变形行为

为了研究Y12Cr18Ni9Cu奥氏体易切削钢的高温力学性能,利用Gleeble-3500热模拟机对Y12Cr18Ni9Cu钢进行了不同温度的高温拉伸试验,并对断口形貌、抗拉强度以及断面收缩率进行了分析。结果表明,随着温度升高试验钢的高温抗拉强度逐渐降低,断面收缩率逐渐增加。试验钢的低温脆性区为800～900℃,未出现高温脆性区。低温脆性区的出现是由于材料在热变形过程中没有发生动态再结晶,并且由于硫化物与基体所能承受的变形能力不同,裂纹在硫化物与基体界面产生,最终导致脆性断裂。在1150～1250℃温度范围内,试验钢发生了动态再结晶并表现出良好的高温热塑性,Y12Cr18Ni9Cu奥氏体易切削钢的热加工温度应选择在1150～1250℃之间。     

基于大变形理论的塑性变形量线性递减矫直理论研究

由于H型钢具有诸多优点而在多个领域得到越来越广泛的应用,但其在生产过程中必须经过矫直工序。对基于大变形压弯矫直理论的塑性变形量线性递减矫直理论进行了研究,讨论了传统方法的局限性,并对九辊型钢矫直机矫直HW300×300 H型钢的矫直规程进行了实例计算,得到了更为精确的矫直规程制定方法。     

Microstructure and strengthening mechanisms in Cu/Fe multilayers

Nanostructured Cu/Fe multilayers on Si (1 1 0) and Si (1 0 0) substrates were prepared by magnetron sputtering, with individual layer thicknesses h varying from 0.75 to 200 nm. The growth orientation relationships between Cu and Fe at the interfaces were determined to be of the Kurdjumov–Sachs and Nishiyama–Wasserman type. Nanoscale columnar grains in Fe, with an average grain size of 11–23 nm, played a dominant role in the strengthening mechanism when h ? 50 nm. At smaller h the hardness of Cu/Fe multilayers with (1 0 0) texture approached a peak value, followed by softening due to the formation of fully coherent interfaces. However, abundant twins were observed in Cu/Fe films with (1 1 1) texture when h = 0.75 nm, which led to the retention of high hardness in the multilayers.     

Length-scale-dependent deformation and fracture behavior of Cu/X (X = Nb, Zr) multilayers: The constraining effects of the ductile phase on the brittle phase

The plastic deformation and fracture behavior of two different types of Cu/X (X = Nb, Zr) nanostructured multilayered films (NMFs) were systematically investigated over wide ranges of modulation period (λ) and modulation ratio (η, the ratio of X layer thickness to Cu layer thickness). It was found that both the ductility and fracture mode of the NMFs were predominantly related to the constraining effect of ductile Cu layers on microcrack-initiating X layers, which showed a significant length-scale dependence on λ and η. Experimental observations and theoretical analyses also revealed a transition in strengthening mechanism, from single dislocation slip in confined layers to a load-bearing effect, when the Cu layer thickness was reduced to below ∼15 nm by either decreasing λ or increasing η. This is due to the intense suppression of dislocation activities in the thin Cu layers, which causes a remarkable reduction in the deformability of the Cu layers. Concomitantly, the constraining effect of Cu layers on microcrack propagation is weakened, which can be used to explain the experimentally observed λ and η-dependent fracture mode transition from shear mode to an opening mode. Furthermore, the fracture toughness of the NMFs is also found to be sensitive to both λ and η. A fracture mechanism-based micromechanical model is developed to quantitatively assess the length-scale-dependent fracture toughness, and these calculations are in good agreement with experimental findings.     

Anisothermal solid-state reactions of Ni/Al nanometric multilayers

The structural evolution of Ni/Al multilayer thin films with temperature was studied by differential scanning calorimetry (DSC), scanning electron microscopy (SEM), transmission electron microscopy (TEM), scanning transmission electron microscopy (STEM) and X-ray diffraction (XRD). Thin films with nanometric Ni and Al alternated layers were deposited by d.c. magnetron sputtering. In our experiments, we used a bilayer thickness of 5, 14 and 30 nm and a total film thickness ranging from 2 to 2.7 μm. The XRD patterns of the as-deposited sample revealed only peaks of Al and Ni. DSC experiments were performed on freestanding films, from room temperature to 700 °C at 10 and 40 °C/min. Two exothermic reactions were detected in the DSC curves of the film with a 30 nm bilayer thickness, with peak temperatures at 230 and 330 °C. The films with 5 and 14 nm bilayer thickness presented only one exothermic peak at 190 and 250 °C, respectively. To identify the intermetallic reaction products, DSC samples were examined by XRD. NiAl formation corresponds to one single DSC peak, for films with short bilayer thicknesses (5 and 14 nm). The films with 30 nm bilayer thickness were heated at 250 °C (T = T_{1st peak}), 300 °C (T_{1st peak} < T < T_{2nd peak}), 450 °C (T > T_{2nd peak}) and 700 °C. The XRD results indicated that at 250 °C the phase formed was NiAl₃, whilst NiAl₃ and Ni₂Al₃ phases were identified at 300 °C. For the 450 °C sample, only NiAl was detected. Further heating to 700 °C promotes the growth of NiAl grains.     

A new single bath for the electrodeposition of NiFe/Cu multilayers exhibiting giant magnetoresistance behavior

A new single bath for the electrodeposition of ultrathin NiFe/Cu multilayers was developed and magnetoresistance measurements were conducted. Complementary methods such as scanning electron microscopy (SEM), x-ray diffraction (XRD) and transmission electron microscopy (TEM) were used to characterize the multilayers. Magnetoresistance measurements indicated that the multilayers grown from this new bath exhibited a giant magnetoresistance (GMR) behavior.     

低Ni/Cu比钢中铜的富集行为

采用热重分析仪和扫描电镜研究了不同加热温度和升温速率下Ni/Cu比为0.39的低Ni/Cu比含铜钢铜富集行为。研究结果表明:在1050～1300℃加热温度范围内,富集相以富Cu-Ni相和富Ni相为主,且以颗粒形式弥散分布于氧化皮内部或氧化皮与钢基体界面;除1250℃外,随加热温度升高,富集相中Ni/Cu比值逐渐增加,在1200℃和1300℃时,富集相仅为富Ni相。加热温度为1250℃时,升温速率不同,富集相的Ni/Cu比值和氧化皮与钢基体界面形态不同:采用5℃/min低速升温和15℃/min高速升温均有利于增加Ni/Cu比值,而采用10℃/min中速升温导致Ni/Cu比值偏低;增加升温速率,缩短加热时间,使氧化皮与钢基体界面更加平滑,有利于除鳞以改善钢材表面质量。对生产高表面质量低Ni/Cu比含铜钢而言,可采取低温加热或高温加热,将加热温度分别控制在1180～1220℃或者1280～1320℃;也可采用1220～1280℃中温加热,将弱氧化性气氛下分阶段步进梁加热炉的第三阶段升温速率控制在15℃/min左右。     

Giant magnetoresistance and super-paramagnetism in electrodeposited NiFe/Cu multilayers

The giant magnetoresistance of electrodeposited NiFe/Cu multilayers from a single bath under potentiostatic control is studied. The observed nonsaturating behavior urged us to investigate the probability of the occurrence of superparamagnetic regions in these multilayers. In this research, for the first time, the presence of super-paramagnetic regions in electrodeposited NiFe/Cu multilayers is shown and proved via high resolution transmission electron microscopy. The reason was found to be the existence of a very large anodic transient at the beginning of the copper deposition pulse, which could be eliminated by choosing a more negative potential.     

基于分子动力学的Cu3Sn/Cu界面元素扩散行为数值模拟

文中采用修正的嵌入原子势函数(modified embedded atomic method, MEAM)的分子动力学模拟,研究了无铅焊点中Cu3Sn/Cu界面元素的扩散过程,对界面元素的扩散行为进行了分析计算,获得了界面各元素的扩散激活能,根据元素扩散的经验公式得出界面过渡区的厚度表达式. 结果表明, 扩散过程中主要是铜晶格中Cu原子向Cu3Sn晶格中扩散. 其中,铜晶格内原子以较慢的速率扩散,但可以深入Cu3Sn晶格内部,Cu3Sn中原子以较快的速率扩散,但难以进入铜晶格内部. 结合阿伦尼乌斯关系和爱因斯坦扩散定律,计算得到界面处铜晶格原子的扩散激活能为172.76 kJ/mol,界面处Cu3Sn晶格中Cu原子扩散激活能为52.48 kJ/mol,Sn原子扩散激活能为77.86 kJ/mol.     

Sputter-deposited Cu/Cu(O) multilayers exhibiting enhanced strength and tunable modulus

By means of brief pauses in radiofrequency (RF) sputter deposition between individual layers, ultrathin copper oxide layers were formed through adsorption in the Cu/Cu multilayers. Their mechanical properties were compared with the Cu/Cu(O) multilayers whose oxide layers were deliberately deposited between copper layers. The mechanical hardness value of the Cu/Cu(O) multilayers approached that of nanostructured copper thin films. The Young’s modulus of the multilayers was tunable, in accordance with the elasticity theories of composites. In addition, the Hall–Petch slope of the RF sputter-deposited Cu monolayers indicated that their theoretical strength approached the shear modulus of copper.     

Ti-50.1Ni形状记忆合金相变与形变行为

用热重分析仪、X射线衍射仪和拉伸试验研究了退火温度、变形温度对Ti-50.1Ni形状记忆(SME)合金丝的相变、形变的影响.Ti-50.1Ni合金加热氧化过程中温度超过600℃后氧化加剧,故退火温度不宜超过600℃.该合金奥氏体相变开始温度(As)高于室温,室温相为马氏体,呈SME特性.350～600℃退火态Ti-50.1Ni合金在室温下均呈SME.     

Thermal stability of microstructure and mechanical properties of Ni/Ru multilayers

The microstructure, hardness and thermal stability of Ni/Ru multilayers prepared by evaporation deposition were investigated by X-ray diffraction, transmission electron microscopy, vacuum annealing and nanoindenation. The hardness values of as deposited multilayers increase, while their elastic modulus values decrease, with decreasing periodicity. After annealing at low temperature (below 450 °C), the decrease in hardness of multilayers with larger periodicity is more remarkable than that of multilayers with smaller periodicity due to coarsening of the in-plane grain size. The higher temperature (600 °C) annealing results in the breakdown of the periodical structure and a significant drop in hardness for multilayers with smaller periodicity. The results were discussed according to Orowan-type single dislocation bowing mechanism.     

Electrodeposition of NiFe/Cu multilayers from a single bath

NiFe/Cu multilayers were deposited from a single bath in the potentiostatic mode using two different solutions. In solution A, the ionic concentration ratios were Fe²⁺: Ni²⁺: Cu²⁺ 9: 60: 10 and in solution B they were 1: 103: 1. To characterize the layers, scanning electron microscopy (SEM), high resolution transmission electron microscopy (HRTEM), X-ray diffraction (XRD) and atomic force microscopy (AFM) were used. SEM results revealed the layered structure of the deposits for relatively thick bilayers. While HRTEM provided direct evidence for the composition modulation across successive layers in the NiFe/Cu nanometer-multilayered structure prepared from solution B. Therefore, the layers prepared from solution B seemed to be more appropriate for giant magnetoresistance (GMR) applications. The effect of stirring during the electrodeposition process of the multilayers was also investigated.