10-Gb/s limiting amplifier and laser/modulator driver in 0.18-/spl mu/m CMOS technology

A limiting amplifier incorporates active feedback, inductive peaking, and negative Miller capacitance to achieve a voltage gain of 50 dB, a bandwidth of 9.4 GHz, and a sensitivity of 4.6 mV/sub pp/ for a bit-error rate of 10/sup -12/ while consuming 150 mW. A driver employs T-coil peaking and negative impedance conversion to achieve operation at 10 Gb/s while delivering a current of 100 mA to 25-/spl Omega/ lasers or a voltage swing of 2 V/sub pp/ to 50-/spl Omega/ modulators with a power dissipation of 675 mW. Fabricated in 0.18-/spl mu/m CMOS technology, both prototypes operate with a 1.8-V supply.     

A fully integrated 5.8 GHz U-NII band 0.18-/spl mu/m CMOS VCO

A fully integrated 5.8 GHz CMOS L-C tank voltage-controlled oscillator (VCO) using a 0.18-/spl mu/m 1P6M standard CMOS process for 5 GHz U-NII band WLAN application is presented. The VCO core circuit uses only PMOS to pursue a better phase noise performance since it has less 1/f noise than NMOS. The measurement is performed by using a FR-4 PCB test fixture. The output frequency of the VCO is from 5860 to 6026 MHz with a 166 MHz tuning range and the phase noise is -96.9 dBc/Hz at 300 kHz (or -110 dBc/Hz at 1 MHz) with V ctrl = 0 V. The power consumption of the VCO excluding buffer amplifiers is 8.1 mW at V/sub DD/ = 1.8 V and the output power is -4 dBm.     

A 40-Gb/s clock and data recovery circuit in 0.18-/spl mu/m CMOS technology

A phase-locked clock and data recovery circuit incorporates a multiphase LC oscillator and a quarter-rate bang-bang phase detector. The oscillator is based on differential excitation of a closed-loop transmission line at evenly spaced points, providing half-quadrature phases. The phase detector employs eight flip-flops to sample the input every 12.5 ps, detecting data transitions while retiming and demultiplexing the data into four 10-Gb/s outputs. Fabricated in 0.18-/spl mu/m CMOS technology, the circuit produces a clock jitter of 0.9 ps/sub rms/ and 9.67 ps/sub pp/ with a PRBS of 2/sup 31/-1 while consuming 144 mW from a 2-V supply.     

A Bluetooth radio in 0.18-/spl mu/m CMOS

This paper describes the results of an implementation of a Bluetooth radio in a 0.18-/spl mu/m CMOS process. A low-IF image-reject conversion architecture is used for the receiver. The transmitter uses direct IQ-upconversion. The VCO runs at 4.8-5.0 GHz, thus facilitating the generation of 0/spl deg/ and 90/spl deg/ signals for both the receiver and transmitter. By using an inductor-less LNA and the extensive use of mismatch simulations, the smallest silicon area for a Bluetooth radio implementation so far can be reached: 5.5 mm/sup 2/. The transceiver consumes 30 mA in receive mode and 35 mA in transmit mode from a 2.5 to 3.0-V power supply. As the radio operates on the same die as baseband and SW, the crosstalk-on-silicon is an important issue. This crosstalk problem was taken into consideration from the start of the project. Sensitivity was measured at -82 dBm.     

A 0.18-/spl mu/m CMOS bioluminescence detection lab-on-chip

The paper describes a bioluminescence detection lab-on-chip consisting of a fiber-optic faceplate with immobilized luminescent reporters/probes that is directly coupled to an optical detection and processing CMOS system-on-chip (SoC) fabricated in a 0.18-/spl mu/m process. The lab-on-chip is customized for such applications as determining gene expression using reporter gene assays, determining intracellular ATP, and sequencing DNA. The CMOS detection SoC integrates an 8 /spl times/ 16 pixel array having the same pitch as the assay site array, a 128-channel 13-bit ADC, and column-level DSP, and is fabricated in a 0.18-/spl mu/m image sensor process. The chip is capable of detecting emission rates below 10/sup -6/ lux over 30 s of integration time at room temperature. In addition to directly coupling and matching the assay site array to the photodetector array, this low light detection is achieved by a number of techniques, including the use of very low dark current photodetectors, low-noise differential circuits, high-resolution analog-to-digital conversion, background subtraction, correlated multiple sampling, and multiple digitizations and averaging to reduce read noise. Electrical and optical characterization results as well as preliminary biological testing results are reported.     

A low-voltage folded-switching mixer in 0.18-/spl mu/m CMOS

Scaling of CMOS technologies has a great impact on analog design. The most severe consequence is the reduction of the voltage supply. In this paper, a low voltage, low power, AC-coupled folded-switching mixer with current-reuse is presented. The main advantages of the introduced mixer topology are: high voltage gain, moderate noise figure, moderate linearity, and operation at low supply voltages. Insight into the mixer operation is given by analyzing voltage gain, noise figure (NF), linearity (IIP3), and DC stability. The mixer is designed and implemented in 0.18-/spl mu/m CMOS technology with metal-insulator-metal (MIM) capacitors as an option. The active chip area is 160 /spl mu/m/spl times/200 /spl mu/m. At 2.4 GHz a single side band (SSB) noise figure of 13.9 dB, a voltage gain of 11.9 dB and an IIP3 of -3 dBm are measured at a supply voltage of 1 V and with a power consumption of only 3.2 mW. At a supply voltage of 1.8 V, an SSB noise figure of 12.9 dB, a voltage gain of 16 dB and an IIP3 of 1 dBm are measured at a power consumption of 8.1 mW.     

A matrix amplifier in 0.18-/spl mu/m SOI CMOS

A fully integrated matrix amplifier with two rows and four columns (2-by-4) fabricated in a three-layer metal 0.18-/spl mu/m silicon-on-insulator (SOI) CMOS process is presented. It exhibits an average pass-band gain of 15 dB and a unity-gain bandwidth of 12.5 GHz. The input and output ports are matched to 50 /spl Omega/ using m-derived half sections; the measured S/sub 11/ and S/sub 22/ values exceed -7 and -12 dB, respectively. Integrated in 2.0/spl times/2.9mm/sup 2/, it dissipates 233.4 mW total from 2.4- and 1.8-V power supplies.     

A 43-Gb/s full-rate clock transmitter in 0.18-/spl mu/m SiGe BiCMOS technology

A 43-Gb/s full-rate clock transmitter chip for SONET OC-768 transmission systems is reported. The IC is implemented in a 0.18-/spl mu/m SiGe BiCMOS technology featuring 120 GHz f/sub T/ and 100 GHz f/sub max/ HBTs. It consists of a 4:1 multiplexer, a clock multiplier unit, and a frequency lock detector. The IC features clock jitter generation of 260 fs rms and dissipates 2.3 W from a -3.6-V supply voltage. Measurement results are compared to a previously reported half-rate clock transmitter designed using the same technology.     

A 10-Gb/s receiver with series equalizer and on-chip ISI monitor in 0.11-/spl mu/m CMOS

A 10-Gb/s receiver is presented that consists of an equalizer, an intersymbol interference (ISI) monitor, and a clock and data recovery (CDR) unit. The equalizer uses the Cherry-Hooper topology to achieve high-bandwidth with small area and low power consumption, without using on-chip inductors. The ISI monitor measures the channel response including the wire and the equalizer on the fly by calculating the correlation between the error in the input signal and the past decision data. A switched capacitor correlator enables a compact and low power implementation of the ISI monitor. The receiver test chip was fabricated by using a standard 0.11-/spl mu/m CMOS technology. The receiver active area is 0.8 mm/sup 2/ and it consumes 133 mW with a 1.2-V power supply. The equalizer compensates for high-frequency losses ranging from 0 dB to 20 dB with a bit error rate of less than 10/sup -12/. The areas and power consumptions are 47 /spl mu/m /spl times/ 85 /spl mu/m and 13.2 mW for the equalizer, and 145 /spl mu/m /spl times/ 80 /spl mu/m and 10 mW for the ISI monitor.     

A low-power oscillator mixer in 0.18-/spl mu/m CMOS technology

A downconversion double-balanced oscillator mixer using 0.18-/spl mu/m CMOS technology is proposed in this paper. This oscillator mixer consists of an individual mixer stacked on a voltage-controlled oscillator (VCO). The stacked structure allows entire mixer current to be reused by the VCO cross-coupled pair to reduce the total current consumption of the individual VCO and mixer. Using individual supply voltages and eliminating the tail current source, the stacked topology requires 1.0-V low supply voltage. The oscillator mixer achieves a voltage conversion gain of 10.9 dB at 4.2-GHz RF frequency. The oscillator mixer exhibits a tuning range of 11.5% and a single-sideband noise figure of 14.5 dB. The dc power consumption is 0.2 mW for the mixer and 2.94 mW for the VCO. This oscillator mixer requires a lower supply voltage and achieves a higher operating frequency among recently reported Si-based self-oscillating mixers and mixer oscillators. The mixer in this oscillator mixer also achieves a low power consumption compared with recently reported low-power mixers.     

Low-power fully integrated 10-Gb/s SONET/SDH transceiver in 0.13-/spl mu/m CMOS

Here, we present a low-power fully integrated 10-Gb/s transceiver in 0.13-/spl mu/m CMOS. This transceiver comprises full transmit and receive functions, including 1:16 multiplex and demultiplex functions, high-sensitivity limiting amplifier, on-chip 10-GHz clock synthesizer, clock-data recovery, 10-GHz data and clock drivers, and an SFI-4 compliant 16-bit LVDS interface. The transceiver exceeds all SONET/SDH (OC-192/STM-64) jitter requirements with significant margin: receiver high-frequency jitter tolerance exceeds 0.3 UI/sub pp/ and transmitter jitter generation is 30 mUI/sub pp/. All functionality and specifications (core and I/O) are achieved with power dissipation of less than 1 W.     

A 10-Gb/s CMOS CDR and DEMUX IC With a Quarter-Rate Linear Phase Detector

This paper presents a 10-Gb/s clock and data recovery (CDR) and demultiplexer IC in a 0.13-mum CMOS process. The CDR uses a new quarter-rate linear phase detector, a new data recovery circuit, and a four-phase 2.5-GHz LC quadrature voltage-controlled oscillator for both wide phase error pulses and low power consumption. The chip consumes 100 mA from a 1.2-V core supply and 205 mA from a 2.5-V I/O supply including 18 preamplifiers and low voltage differential signal (LVDS) drivers. When 9.95328-Gb/s 2³¹-1 pseudorandom binary sequence is used, the measured bit-error rate is better than 10^-15 and the jitter tolerance is 0.5UIpp, which exceeds the SONET OC-192 standard. The jitter of the recovered clock is 2.1 psrms at a 155.52MHz monitoring clock pin. Multiple bit rates are supported from 9.4 Gb/s to 11.3 Gb/s     

A 15-gb/s 2:1 multiplexer in 0.18-/spl mu/m CMOS

By employing the inductive peaking technique and the super-dynamic flip-flops, a 2:1 multiplexer (MUX) is presented for high-speed operations. The proposed circuit is realized in a 0.18-/spl mu/m CMOS process. With a power consumption of 110mW from a 2-V supply voltage, the fully integrated MUX can operate at an output rate up to 15Gb/s. From the measured eye-diagrams, the 15-Gb/s half-rate MUX exhibits an output voltage swing of 225mV and a root-mean-square jitter of 2.7ps.     

A 5.9-GHz voltage-controlled ring oscillator in 0.18-/spl mu/m CMOS

This paper presents the design of three- and nine-stage voltage-controlled ring oscillators that were fabricated in TSMC 0.18-/spl mu/m CMOS technology with oscillation frequencies up to 5.9 GHz. The circuits use a multiple-pass loop architecture and delay stages with cross-coupled FETs to aid in the switching speed and to improve the noise parameters. Measurements show that the oscillators have linear frequency-voltage characteristics over a wide tuning range, with the three- and nine-stage rings resulting in frequency ranges of 5.16-5.93 GHz and 1.1-1.86 GHz, respectively. The measured phase noise of the nine-stage ring oscillator was -105.5 dBc/Hz at a 1-MHz offset from a 1.81-GHz center frequency, whereas the value for the three-stage ring oscillator was simulated to be -99.5 dBc/Hz at a 1-MHz offset from a 5.79-GHz center frequency.     

G/sub m/-boosted common-gate LNA and differential colpitts VCO/QVCO in 0.18-/spl mu/m CMOS

The demand for radio frequency (RF) integrated circuits with reduced power consumption is growing owing to the trend toward system-on-a-chip (SoC) implementations in deep-sub-micron CMOS technologies. The concomitant need for high performance imposes additional challenges for circuit designers. In this paper, a g/sub m/-boosted common-gate low-noise amplifier (CGLNA), differential Colpitts voltage-controlled oscillators (VCO), and a quadrature Colpitts voltage-controlled oscillator (QVCO) are presented as alternatives to the conventional common-source LNA and cross-coupled VCO/QVCO topologies. Specifically, a g/sub m/-boosted common-gate LNA loosens the link between noise factor (i.e., noise match) and input matching (i.e., power match ); consequently, both noise factor and bias current are simultaneously reduced. A transformer-coupled CGLNA is described. Suggested by the functional and topological similarities between amplifiers and oscillators, differential Colpitts VCO and QVCO circuits are presented that relax the start-up requirements and improve both close-in and far-out phase noise compared to conventional Colpitts configurations. Experimental results from a 0.18-/spl mu/m CMOS process validate the g/sub m/-boosting design principle.     

A 0.35-/spl mu/m CMOS 2-GHz VCO in wafer-level package

This letter presents a complementary metal oxide semiconductor (CMOS) voltage-controlled oscillator (VCO) with a high-Q inductor in a wafer-level package for the LC-resonator. The on-chip inductor is implemented using the redistribution metal layer of the wafer-level package (WLP), and therefore it is called a WLP inductor. Using the thick passivation and copper metallization, the WLP inductor has high quality-factor (Q-factor). A 2-nH inductor exhibits a Q-factor of 8 at 2 GHz. The center frequency of the VCO is 2.16 GHz with a tuning range of 385 MHz (18%). The minimum phase noise is measured to be -120.2 dBc/Hz at an offset frequency of 600 kHz. The dc power consumed by the VCO-core is 1.87 mW with a supply voltage of 1.7 V and a current of 1.1 mA. The output power with a 50-/spl Omega/ load is -12.5/spl plusmn/1.3 dBm throughout the whole tuning range. From the best of our knowledge, compared with recently published 2-GHz-band 0.35 /spl mu/m CMOS VCOs in the literature, the VCO in this work shows the lowest power consumption and the best figure-of-merit.     

A 40-GHz frequency divider in 0.18-/spl mu/m CMOS technology

An analysis of regenerative dividers predicts the required phase shift or selectivity for proper operation. A divider topology is introduced that employs resonance techniques by means of on-chip spiral inductors to tune out the device capacitances. Configured as two cascaded /spl divide/2 stages, the circuit achieves a frequency range of 2.3 GHz at 40 GHz while consuming 31 mW from a 2.5-V supply.     

A 285-MHz pipelined MAP decoder in 0.18-/spl mu/m CMOS

Presented in this paper is a pipelined 285-MHz maximum a posteriori probability (MAP) decoder IC. The 8.7-mm/sup 2/ IC is implemented in a 1.8-V 0.18-/spl mu/m CMOS technology and consumes 330 mW at maximum frequency. The MAP decoder chip features a block-interleaved pipelined architecture, which enables the pipelining of the add-compare-select kernels. Measured results indicate that a turbo decoder based on the presented MAP decoder core can achieve: 1) a decoding throughput of 27.6 Mb/s with an energy-efficiency of 2.36 nJ/b/iter; 2) the highest clock frequency compared to existing 0.18-/spl mu/m designs with the smallest area; and 3) comparable throughput with an area reduction of 3-4.3/spl times/ with reference to a look-ahead based high-speed design (Radix-4 design), and a parallel architecture.     

A 32-GHz non-uniform distributed amplifier in 0.18-/spl mu/m CMOS

This letter presents a fully integrated distributed amplifier in a standard 0.18-/spl mu/m CMOS technology. By employing a nonuniform architecture for the synthetic transmission lines, the proposed distributed amplifier exhibits enhanced performance in terms of gain and bandwidth. Drawing a dc current of 45mA from a 2.2-V supply voltage, the fabricated circuit exhibits 9.5-dB pass-band gain with a bandwidth of 32GHz while maintaining good input and output return losses over the entire frequency band. With a compact layout technique, the chip size of the distributed amplifier including the testing pads is 940/spl times/860/spl mu/m/sup 2/.     

A 0.13-/spl mu/m CMOS 5-Gb/s 10-m 28AWG cable transceiver with no-feedback-loop continuous-time post-equalizer

The frequency-dependent attenuation of the transmission lines between chips and printed circuit boards, for example, is an obstacle to improving the performance of a system enhanced with LSI technology scaling. This is because large frequency-dependent attenuation results in poor eye-opening performance and a high bit-error rate in data transmission. This paper presents a 5-Gb/s 10-m 28AWG cable transceiver fabricated by using 0.13-/spl mu/m CMOS technology. In this transceiver, a continuous-time post-equalizer, with recently developed no-feedback-loop high-speed analog amplifiers, can handle up to 9dB of frequency-dependent attenuation in cables and also achieve an 18-dB improvement in the attenuation (27dB total improvement) by using pre- and post-equalization techniques in combination.