共查询到20条相似文献,搜索用时 15 毫秒
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Svetlana Tatic-Lucic John Ames Bill Boardman David McIntyre Paul Jaramillo Larry Starr Myoungho Lim 《Sensors and actuators. A, Physical》1997,60(1-3):223-227
A simple testing method is presented that allows the comparison of the bond quality for anodically bonded wafers. An array of parallel metal lines of predetermined thickness is formed on a glass wafer. The estimation of the bond quality can be performed by visual inspection after the bonding. This method enables comparison of the anodic-bonding process performance for different glasses, for intermediate layers and various bonding conditions. The optimization of silicon-glass anodic bonding with an intermediate phosphosilicate glass (PSG) layer is shown using this technique. 相似文献
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两电极多层阳极键合实验研究 总被引:1,自引:0,他引:1
介绍了用2个电极通过一次电极反接的方式实现多层样片之间阳极键合的操作工艺和键合机理,并以玻璃-硅-玻璃三层结构为例对其进行了实验研究。结果显示:多余的玻璃对第一次键合过程的电流特性影响不大,而第一次键合的玻璃对第二次键合电流产生显著的影响,电流出现不规则的突变。而且,在第二次键合过程中,第一次键合的玻璃在键合面上会出现由于钠元素积聚而产生的黄褐色斑点。拉伸强度实验的结果表明:第二次键合过程中在第一次键合面形成的反向电压会减弱键合的强度;通过合理选择键合参数可以得到满足MEMS封装要求的键合强度。 相似文献
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This paper proposes a new explanation to account for the anodic passivation of single-crystalline silicon in aqueous KOH. The effects of experimental results. 相似文献
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Steady-state measurement of wafer bonding cracking resistance 总被引:1,自引:0,他引:1
A steady-state wedge-opening test has been developed in order to measure the fracture toughness of bonded silicon wafers. Comparison between non-steady-state and steady-state tests is performed. The importance of allowing the rotation of the testing stage is discussed and appears to be essential in order to have the wedge perfectly aligned with the sample. Significant influence of (1) surface treatment; (2) thermal annealing; and (3) crack velocity on the toughness is observed for Si/Si wafer bonding and related to the interface chemistry. 相似文献
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Other than temperature and voltage, load plays a key role in anodic bonding process. In this paper we present a new design of top electrode (cathode) for anodic bonding machine by which the bonding time has been reduced up to 30 % in case of bare silicon wafer at ?400 V and approximate 52 % in case of oxidized silicon wafer with Pyrex glass bonding at ?800 V. Experimentally it has been observed there was no bonding in oxidized silicon wafer with Pyrex glass up to ?600 V by using standard design while it has been successfully bonded at same voltage (?600 V) by using new design. 相似文献
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通过对静电封接结构的受力分析,建立了静电封接后弹性膜片的热失配应力数学模型。并分析了改善微压传感器性能的技术途径。 相似文献
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Low temperature silicon direct bonding for application in micromechanics: bonding energies for different combinations of oxides 总被引:3,自引:0,他引:3
Gertrud Kräuter Andreas Schumacher Ulrich Gösele 《Sensors and actuators. A, Physical》1998,70(3):100-275
Plain or structured hydrophillic silicon wafers covered with native oxide or with thermally grown oxide layers have been directly bonded at room temperature; afterwards, the samples were annealed at 100°C to 400°C. There is a significant difference in the observed bonding energy depending on the wafer pairing chosen. If one or both wafers are covered with a native oxide layer, high bonding strengths are reached even at low temperatures. This can be explained by the different diffusion behaviour of water molecules through a thick thermal oxide layer on one hand, and through a thin native oxide layer on the other hand. Two different methods for the activation of the wafer surfaces just prior to bonding are described. 相似文献
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近些年随着动车组运行功能的不断提升和优化,车辆内部分布的电线电缆数量大量增加,接线测试点在校线、耐压试验环节人工测试付出的时间成本更多。为了避免人工失误影响产品质量,提高测试准确率,提高生产效率,使用自动化测试系统来替代人工试验。本文研制了动车组单车自动校线及耐压试验方法,测试可靠性高并能在不同动车组项目产品之间完成灵活转换,可缩短试验周期,提高测试效率,保障动车组生产的质量。 相似文献
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Alexandra Desmoulin César Viho 《International Journal on Software Tools for Technology Transfer (STTT)》2009,11(3):261-267
This study deals with interoperability testing of protocol implementations. The objective is to define a method for automatic
test derivation based on formal definitions. First, the notion of interoperability criteria is introduced. They formally describes the conditions that two implementations must verify in order to be considered interoperable.
Then, based on the equivalence of two of the defined interoperability criteria, we propose a method to derive automatically
interoperability test cases that avoids the state-space explosion problem. 相似文献
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《Information and Software Technology》2014,56(10):1360-1376
ContextFunction Block Diagram (FBD) is increasingly used in safety-critical applications. Test coverage issues for FBDs are frequently raised by regulators and users. However, there is little work at this aspect on testing FBD at model level. Our previous study has designed a new data-flow test coverage criterion, FB-Path Complete Condition Test Coverage (FPCC), that can directly test FBD structures and effectively detect function mutation errors. Nevertheless, because FPCC scheme involves several data-flow concepts and thus it is somewhat complicated to comprehend and to generate FPCC-complied test cases. An automatic test suite generator for FPCC is highly desirable.ObjectiveThis study designs an automatic test case generator, FPCCTestGen, for FPCC so as to enhance the practicability and acceptance of the FPCC approach.MethodFirst, a supporting infrastructure for performing automatic FBD-to-UPPAAL-for-FPCC transformation is designed. The supporting infrastructure includes templates, declarations, and functions as building blocks for transformation. Then, for each input FBD, represented in PLCopen XML format, FPCCTestGen performs parsing and converts FBD components into corresponding UPPAAL model components using aforementioned building blocks. After that, queries related to FPCC characteristics are submitted to UPPAAL model checker for verification. Finally, the verification traces are analyzed to obtain a FPCC-complied test suite.ResultsA safety injection system is used as a case study. Preliminary results show that the generated test suite achieves the highest FPCC percentage with a near optimal number of test cases.ConclusionThis automatic test case generation tool is effective and thus, can promote the use of the new test coverage criterion. Methodology used in FPCCTestGen is generic and can be applied to test suite generation for other test criteria on data-flow programs. 相似文献
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In this work, we investigate the low temperature (<200 °C) wafer bonding using wet chemical surface activation and we demonstrate high bonding strength sufficient to achieve the transfer of a thin silicon film of thickness less than 400 nm on top of another silicon wafer using spin-on-glass (SOG) film as an intermediate layer. The process developed is the first critical step that can enable three-dimensional (3D) integration and wafer level packaging of MEMS with electronic circuits. 相似文献
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Alexandre M. AmoryAuthor Vitae Cristiano LazzariAuthor Vitae 《Journal of Parallel and Distributed Computing》2011,71(5):675-686
Networks-on-Chip (NoCs) can be used for test data transportation during manufacturing tests. On one hand, NoC can avoid dedicated Test Access Mechanisms (TAMs), reducing long global wires, and potentially simplifying the layout. On the other hand, (a) it is not known how much wiring is saved by reusing NoCs as TAMs, (b) the impact of reuse-based approaches on test time is not clear, and (c) a computer aided test tool must be able to support different types of NoC designs. This paper presents a test environment where the designer can quickly evaluate wiring and test time for different test architectures. Moreover, this paper presents a new test scheduling algorithm for NoC TAMs which does not require any NoC timing detail and it can easily model NoCs of different topologies. The experimental results evaluate the proposed algorithm for NoC TAMs with an exiting algorithm for dedicated TAMs. The results demonstrate that, on average, 24% (up to 58%) of the total global wires can be eliminated if dedicated TAMs are not used. Considering the reduced amount of dedicated test resources with NoC TAM, the test time of NoC TAM is only, on average, 3.88% longer compared to dedicated TAMs. 相似文献