Implementation of a compact, four-stage, scalable optical interconnect for photonic backplane applications

We report on the implementation of a dense 512-beam free-space optical interconnect linking four optoelectronic VLSI chips at the backplane level. The system presented maximizes the positioning tolerances of the components by use of slow f-number (f/16) Gaussian beams and oversized apertures. A beam-clustering scheme whereby a 4 x 4 array of beams is transmitted by each minilens is used to provide a high channel density. A modular approach is used to decrease the number of degrees of freedom in the system and achieve passive alignment of the modules in the final integration phase. A design overview as well as assembly and experimental results are presented.     

Design, implementation, and characterization of a hybrid optical interconnect for a four-stage free-space optical backplane demonstrator

A four-stage unidirectional ring free-space optical interconnect system was designed, analyzed, implemented, and characterized. The optical system was used within a complementary metal-oxide semiconductor-self-electro-optic-effect-device-based optical backplane demonstrator that was designed to fit into a standard VME chassis. This optical interconnect was a hybrid microlens-macrolens system, in which the microlens relays were arranged in a maximum lens-to-waist configuration to route the optical beams from the optical power supply to the transceiver arrays, while the macrolens optical relays were arranged in a telecentric configuration to route optical signal beams from stage to stage. The following aspects of the optical system design are discussed: the optical parameters for the hybrid optical system, the image mapping of the two-dimensional array of optical beams from stage to stage, the alignment tolerance of the hybrid relay system, and the power budget of the overall optical interconnect. The implementation of the optical system, including the characterization of optical components, subsystem prealignment, and final system assembly, is presented. The two-dimensional array of beams for the stage-to-stage interconnect was adjusted with a rotational error of <0.05 degrees and a lateral offset error of <3.5 mum. The measured throughput is in good agreement with the lower-bound predictions obtained in the theoretical results, with an optical power throughput of -20.2 dB from the fiber input of the optical power supply to the modulator array and -25.5 dB from the fiber input to the detector plane.     

Multimode polymeric Y junctions for star couplers in backplane optical interconnect

Three different multimode polymeric Y junctions with 50:50 splitting ratios were designed and their performance analyzed with ray tracing and measurements. There is agreement between measurements and modeling. The best performance is found for a Y junction in which the waveguide is split to S bends with 50% widths.     

Design and implementation of a modulator-based free-space optical backplane for multiprocessor applications

Design and implementation of a free-space optical backplane for multiprocessor applications is presented. The system is designed to interconnect four multiprocessor nodes that communicate by using multiplexed 32-bit packets. Each multiprocessor node is electrically connected to an optoelectronic VLSI chip which implements the hyperplane interconnection architecture. The chips each contain 256 optical transmitters (implemented as dual-rail multiple quantum-well modulators) and 256 optical receivers. A rigid free-space microoptical interconnection system that interconnects the transceiver chips in a 512-channel unidirectional ring is implemented. Full design, implementation, and operational details are provided.     

Design and characterization of a microchannel optical interconnect for optical backplanes

The design, modeling, and experimental characterization of a microchannel-based free-space optical interconnect is described. The microchannel interconnect was used to implement a representative portion of an optical backplane that was based on field-effect transistor, self-electro-optic device smart-pixel transceivers. Telecentric relays were used to form the optical interconnect, and two modes based on two different optical window clusterings were implemented. The optical system design, including the optical geometry for different degrees of clustering of windows supported by a lenslet relay and the image mapping associated with a free-space optical system, is described. A comparison of the optical beam properties at the device planes, including the spot size and power uniformity of the spot array, as well as the effects of clipping and misalignment for the different operating modes, is presented. In addition, the effects of beam clipping and misalignment for the different operating modes is presented. We show that microchannel free-space optical interconnects based on a window-clustering scheme significantly increase the connection density. A connection density of 2222 connections/cm(2) was achieved for this prototype system with 2 x 2 window clustering.     

Design, implementation, and characterization of an optical power supply spot-array generator for a four-stage free-space optical backplane

The design and implementation of a robust, scalable, and modular optical power supply spot-array generator for a modulator-based free-space optical backplane demonstrator is presented. Four arrays of 8 x 4 spots with 6.47-mum radii (at 1/e(2) points) pitched at 125 mum in the vertical direction and 250 mum in the horizontal were required to provide the light for the optical interconnect. Tight system tolerances demanded careful optical design, robust optomechanics, and effective alignment techniques. Issues such as spot-array generation, polarization, power efficiency, and power uniformity are discussed. Characterization results are presented.     

Gradient-index lens optical backplane

An optical backplane design based on gradient-index lenses is described. This design is based on a tapped bus architecture and offers an affordable and efficient card-to-card communication method. It was found that the use of gradient-index lenses reduced the alignment tolerances by a factor of 10 over an equivalent free-space model. Results from simulation and from the construction of a five-node, proof-of-concept demonstration unit are presented. The excess loss measured for the 25 different combinations varied from a low of 0.7 dB to a high of 4.0 dB.     

Azobenzenes for photonic network applications: Third-order nonlinear optical properties

We review the third-order nonlinear performance of pseudo-stilbene type azobenzenes with an eye to application in ultrafast optical signal processing. We discuss mechanisms responsible for the nonlinear response of the azobenzenes. By aggregating experimental data and theoretical trends reported in the literature, we identify five characteristic regions of optical nonlinear response. Analyzed with respect to Stegeman figures of merit, pseudo-stilbene type azobenzenes show promise for ultrafast optical signal processing in two spectral regions, one lying between the main and two-photon absorption resonances, and the other for wavelengths longer than the two-photon absorption resonance. © 2001 Kluwer Academic Publishers     

Design of an integrated optical magic T for astronomy applications

A new integrated optical component is introduced that performs the function of the well-known microwave magic T, i.e., that produces the sum and the difference of the two input optical signals. Two structures are proposed and tested theoretically for this purpose. The first is based on the symmetric Y junction, and the second is based on interference phenomena in a multimode waveguide. The theoretical design is tested with a beam-propagation method simulation, and good performance is obtained. The effects of the geometrical design parameters on the structures' performance (bandwidth, cross talk, and losses) are also investigated.     

Optomechanics for a four-stage hybrid-self-electro-optic-device-based free-space optical backplane

We present the design, fabrication, and testing of optomechanics for a free-space optical backplane mounted in a standard 6U VME backplane chassis. The optomechanics implement an optical interconnect consisting of lenslet-to-lenslet, as well as conventional lens-to-lens, links. Mechanical, optical, electrical, thermal, material, and fabrication constraints are studied. Design trade-offs that affect system scalability and ease of assembly are put forward and analyzed. Novel mounting techniques such as a thermal-loaded interference-fitted lens-mounting technique are presented and discussed. Diagnostic tools are developed to quantify the performance of the optomechanics, and experimental results are given and analyzed.     

Transverse holographic optical interconnect design

The design of A new type of planar optical interconnect, the transverse holographic waveguide, is described. With this type of interconnect a one-dimensional input light distribution is converted into a one-dimensional output light distribution by holographic patterning along the direction of the optical wave propagation.     

Two-sided through-wafer interconnect for optical spiral delay line

True-time-delay devices could significantly contribute to improving the performance of many optical systems in applications such as sensing, ranging, communication and signal processing. Delay devices based on spiral optical waveguides are of special interest due to their small size and relatively low power attenuation. In this paper, we propose to fabricate spirals on both sides of a wafer, where the coupling between them is through a vertical interconnect. The novel through-wafer interconnect has a level of attenuation that compares competitively with that obtained with a conventional s-shaped interconnect between two interleaved spirals and considerably simplifies the waveguide design and fabrication.     

Aberration correction in an adaptive free-space optical interconnect with an error diffusion algorithm

Aberration correction within a free-space optical interconnect based on a spatial light modulator for beam steering and holographic wavefront correction is presented. The wavefront sensing technique is based on an extension of a modal wavefront sensor described by Neil et al. [J. Opt. Soc. Am. A 17, 1098 (2000)], which uses a diffractive element. In this analysis such a wavefront sensor is adapted with an error diffusion algorithm that yields a low reconstruction error and fast reconfigurability. Improvement of the beam propagation quality (Strehl ratio) for different channels across the input plane is achieved. However, due to the space invariancy of the system, a trade-off among the beam propagation quality for channels is obtained. Experimental results are presented and discussed.     

Design and analysis of an adaptive board-to-board dynamic holographic interconnect

We describe the design and analysis of an adaptive free-space optical interconnect between two circuit boards in a standard electronic backplane. An array of vertical-cavity surface-emitting lasers is used as the transmitter, and this communicates with a detector array on the receiver circuit board. Routing is achieved with a holographic crossbar that has a ferroelectric liquid-crystal spatial light modulator to display binary phase computer-generated holograms. A detailed analysis of a 48-channel interconnect designed to operate at 1 (Gbytes/s)/channel indicates that such a switch will operate successfully given typical components and card misalignments.     

Off-axis refractive mass-transported gallium-phosphide microlens array for the reduction of distortion in an optical interconnect system

Mass-transport smoothing has been used to fabricate an array of off-axis gallium-phosphide microlenses for use in an optical interconnection system employing a single macroscopic lens to image an array of vertical-cavity surface-emitting lasers (VCSEL's) onto a detector array. Steering the individual VCSEL beams through the center of the relay lens creates an optical system with low distortion.     

Active optical interconnect based on liquid-crystal grating

We propose a transparent plate of a liquid-crystal grating to be used as a light guide for optical interconnection. To this end, we are empowering the connection itself with active functions, such as switching, wavelength division, power adjustment, etc. In experiments, we built a grating based on in-plane switching. It contains vertically-aligned nematic liquid-crystal molecules between a glass plate with a high refractive index (light guide) and another glass plate with a pair of interdigitated electrodes. Entering a TM wave from an edge of the light guide, we have demonstrated that the activation of diffraction and intensity adjustment for the guided light are both possible. Because a TE wave is barely diffracted, the device also exhibits polarization division capability.     

Design, implementation, and characterization of a folded spot-array generator for a modulator-based free-space optical interconnect

A folded structured light generator is presented. This spot generator is to be used in a modulator-based free-space optical interconnect. Three cascaded diffractive optical elements produce 4 x 8 clusters on an 800 microm x 1600 microm pitch, in which each cluster is a 4 x 4 array of 13.1-microm-radius spots on a 90-microm pitch. The folded configuration is more compact than an existing linear spot-array generator and replaces 14 optical surfaces with eight surfaces. Details of the optical design, sensitivity analysis, alignment techniques, assembly, and test results are presented.     

Design considerations of stacked multilayers of diffractive optical elements for optical network units in optical subscriber-network applications

The detailed design process and experimental results of stacked multilayer diffractive optical elements are reported for an optical network unit used in optical subscriber-network applications. The optical network unit accepts two incoming light beams of 1.3- and 1.55-mum wavelengths through a single-mode optical fiber. A laser diode is also placed for bidirectional communications. The optical network unit consists of five diffractive optical elements that perform the following functions: collimation of incoming beams, focusing of the outgoing 1.55-mum beam, 3-dB splitting of the 1.3-mum beam, focusing of the 1.3-mum beam onto the photodiode, and collimation of the light emitted from a laser diode. Possible cost reductions as a result of mass production and the ease of alignment of the stacked diffractive optical elements could be ideal for constructing low-cost optical network units.     

Conventional and microwave-assisted processing of Cu-loaded ICAs for electronic interconnect applications

Isotropically conductive adhesives (ICAs) and inks are widely used for interconnecting components and for printed circuits. Silver (Ag)-filled ICAs and inks are the most popular due to their high conductivity and good reliability. However, the price of Ag is a significant issue for the wider exploitation of these materials in low cost, high volume applications such as printed electronics. In addition, there is a need to develop systems compatible with temperature-sensitive substrates through the use of alternative materials and heating methods. Copper (Cu) is considered as a more cost-effective filler for ICAs and in this work, Cu powders were treated to remove the oxide layer and then protected with a self-assembled monolayer. The treated Cu powder was combined with one of two different adhesive resins to form ICAs that were stencil printed onto glass substrates before curing. The use of conventional and microwave-assisted heating methods under an inert atmosphere for the curing of the Cu-loaded ICAs was investigated in detail. The samples were characterised for electrical performance, microstructure and shrinkage as a function of curing temperature (80–150 °C) and time. Tracks with electrical conductivity comparable to Ag-filled adhesives were obtained for both curing methods and with both resins. It was found that curing could be accelerated and/or carried out at lower temperature with the addition of microwave radiation for one adhesive resin, but the other showed almost no absorption indicating a difference in mechanism for the two formulations.