共查询到19条相似文献,搜索用时 78 毫秒
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MEMS器件自动引线键合系统 总被引:1,自引:0,他引:1
引线键合是MEMS传感器最常用的封装形式之一,传统IC引线键合设备的批量制造特点限制了MEMS制造的灵活性.本文将连续变倍显微镜作为视觉传感器建立柔性显微视觉系统,并与改造后的手动引线键合机相结合,建立了面向MEMS的自动引线键合系统.通过分析变倍显微镜的成像模型提出了一种适用于变倍显微镜的自动调焦方法,以获取不同倍数下的清晰图像.利用变倍显微镜可以连续变倍的特点,在低放大倍数下进行大范围粗定位,高放大倍数下进行精定位,从而实现大范围高精度定位.最后通过实验验证了该系统的实用性. 相似文献
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集成化MEMS工艺设计技术的研究 总被引:3,自引:0,他引:3
针对目前MEMS研究领域中普遍存在的器件设计与加工工艺脱节的问题,提出了一种集成化的MEMS工艺设计技术。即在器件设计的过程中充分考虑加工工艺的特点和制约,提高器件的工艺设计能力和效率.这种工艺设计方法以结构材料、反应材料、工艺设备和环境限制的数据库为基础,从工艺过程为结构材料和反应物之间的物理或化学反应的角度出发,提炼出了工艺设计规则;在设计过程中,结合版图尺寸和具体的工艺参数,对工艺过程中器件结构二维断面上的所有结构材料的状态和图形进行计算和记录,并以此信息为依据结合设计规则判断工艺流程的合理性,并把相应的工艺信息、材料信息等代入器件的结构分析中去,实现MEMS器件的集成化工艺和结构设计.最后三维可视化设计工具IMEE1.0实现了集成化的设计技术,并通过对一个结构比较复杂的气体传感器进行设计和制作。验证了这种集成化工艺设计技术的可行性和实用性. 相似文献
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压缩机与空调器的自动匹配技术研究 总被引:1,自引:0,他引:1
研究了利用计算机仿真手段进行压缩机与空调器的自动匹配技术。首先,建立了压缩机与空调器自动匹配的系统流程。以系统冷媒的质量流量保持不变为联系纽带,将整个空调系统分为蒸发器、冷凝器、压缩机、毛细管等几部分分别进行模拟计算。其次,给出了相应的数学模型。对换热器进行模拟时,将系统的过冷度、过热度转化为焓差进行处理。对压缩机进行模拟时,考虑了冷冻油中溶解的冷媒量。最后,使用VBA语言在Excel软件上实现了压缩机与空调器自动匹配的模拟程序。与实际空调匹配实验的对比结果表明该方法是有效的,其Excel宏文件的编制使其更易于推广应用。 相似文献
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本文主要对射孔作业施工方案设计自动生成系统进行了分析及研究,对射孔作业施工方案设计自动生成的过程,系统总体方案论证、详细方案设计等方面进行了论述。该系统的建立将在满足减轻设计人员工作强度,降低方案设计错误率方面发挥重要的作用。 相似文献
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采用CMOS标准工艺,同时采用三种典型MEMS后处理关键工艺,重点通过对牺牲层释放工艺进行研究,制作实现了一种新型CMOS兼容的电容式气压传感器.在该传感器结构中,作为牺牲层的是在CMOS工艺中形成的掺硼氧化硅.通过释放使电容上电极悬空从而感应气压变化.释放过程采用氢氟酸HF、氯化铵、甘油和水的混合溶液.由于释放孔大小和释放孔间距的设计十分关键,通过实验验证优化了4μm×4μm的释放孔更适用于此传感器结构,并对此结构进行了性能分析与实验测试.结果表明,该气压传感器结构合理,工艺成功,重点解决了MEMS后处理中的牺牲层释放工艺与CMOS标准工艺的兼容问题,为利用CMOS标准工艺进行MEMS传感器的研制做出了有益的尝试. 相似文献
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To achieve efficient facility design, the problem of finding an initial slicing tree of a complete graph may influence the layout solutions in many ways. We introduce a maximum weight-matching algorithm to generate the slicing tree, which is used as an initial solution. This initial solution produces modifications to generate alternative layouts for further selection. The system employs a genetic algorithm (GA) as the search engine with a relationship weight function to obtain good solutions. The model is proposed to solve a fixed-shape layout problem. The research has made contributions to two areas. First, it defines a quality function for the clustering technique to generate an initial slicing tree. Second, it designs a process for generating layout alternatives that can take predetermined location constraints and weights based on relationships among facilities into consideration. We compare our initial slicing tree GA with other approaches in the literature. In addition, computational results to demonstrate the performance characteristics of our algorithm are also evaluated. 相似文献
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Abstract Recent research in knowledge‐based expert systems of VLSI design tools has concentrated on placement, routing, and cell generation. This paper presents an alternative application for artificial intelligence (AI) techniques on compaction design for a VLSI mask layout‐expert compactor. In order to overcome the shortcomings of iterative search through a large problem space within a working memory, and therefore, to speed‐up the runtime of compaction, a set of rule‐based region query operations and knowledge‐based techniques for the plane sweep method are proposed in this system. Experimental results have explored the possibility of using expert system technology (EST) to automate the compaction process by “reasoning” out the layout design and applying sophisticated expert rules to its knowledge base. 相似文献
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在研究了虚拟现实建模语言(VRML)模型特点以及协同装配工艺规划过程的基础上,将以VRML三维模型为设计信息载体的协同装配工艺规划仿真分为无约束的规划仿真和基于约束的规划仿真,并提出了相应的实现方法.所提方法使网络化的同步协同装配规划操作成为可能,通过实时交流,使产品装配工艺规划能够在集合多方设计经验的基础上方便快捷地实现.应用实例的应用结果表明,所提方法可快速发现设计缺陷并显著地缩短产品工艺规划周期. 相似文献
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以提高MEMS惯性测量装置(MIMU)的测量精度为目的,本文设计了一套温度控制系统和控制算法;通过对MIMU进行精密温控,改善了惯性器件的热环境,抑制了外界温度变化对MIMU的干扰,提高了MIMU的综合性能;测试结果验证了方案的有效性。 相似文献
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T. F. Marinis 《Strain》2009,45(3):208-220
Abstract: MEMS-based products produced in 2005 had a value of $8bn, 40% of which was sensors. The balance was for products that included micromachined features, such as ink jet print heads, catheters and RF IC chips with embedded inductors. Growth projections follow a hockey stick curve, with the value of products rising to $40bn in 2015 and $200bn in 2025! Growth to date has come from a combination of technology displacement, as exemplified by automotive pressure sensors and airbag accelerometers and new products, such as miniaturised guidance systems for military applications and wireless tire pressure sensors. Much of the growth in MEMS business is expected to come from products that are in the early stages of development or yet to be invented. Some of these devices include disposable chips for performing assays on blood and tissue samples, which are now performed in hospital laboratories, integrated optical switching and processing chips, and various RF communication and remote sensing products.The key to enabling the projected 25-fold growth in MEMS products is development of appropriate technologies for integrating multiple devices with electronics on a single chip. At present, there are two approaches to integrating MEMS devices with electronics. Either the MEMS device is fabricated in polysilicon, as part of the CMOS wafer fabrication sequence or a discrete MEMS device is packaged with a separate ASIC chip. Neither of these approaches is entirely satisfactory, though, for building the high-value, system-on-chip products that are envisioned. It is this author's opinion that a combination of self-assembly techniques in conjunction with wafer stacking, offer a viable path to realizing ubiquitous, complex MEMS systems. 相似文献