不流动半固化片特性的探讨

随着刚挠板、阶梯板与金属基散热板需求量的增大，作为连接材料的不流动半固化的使用量增多。不流动半固化片与普通FR-4半固化片、纯胶片有很大的差别，苓丈结合实验验证，详细分析了不流动半固化片的测试指标、流动性等特性，为不流动半固化片的加工提供了若干建议。     

不流动（低流动度）半固化片及其在刚挠性板和冷板中的应用

介绍了什么是不流动(低流动度)半固化片,以及在PCB行业中的主要应用,特别介绍了在加工挠性板和冷板的工艺注意事项。并通过丰富的图示,介绍了其测试方法,通过玻璃转化温度,导热特性等多方面介绍了不流动(低流动度)半固化片的选择方法。     

Semi-flex印制板制作工艺研究

使用半固化片(PP)开窗法制作Semi-flex印制电路板时,半固化片开窗的尺寸及品质直接影响压合时树脂向Semi-flex印制板挠性区域的流动情况,进而影响其挠曲性能。本文使用开窗法制作挠性层为L5/L6层的10层Semi-flex印制板,研究了铣刀转速、叠合张数等加工参数对半固化片开窗品质的影响,以及半固化片开窗放大尺寸与压合时刚挠结合处PP溢胶长度的关系。为了验证产品其可靠性,对其进行了漂锡测试、回流焊测试和冷热冲击测试。     

低流动度半固化片的压合技术研究及其产品应用开发

随刚挠板、阶梯板与金属基散热板需求量的增大,相对于纯胶片更为便宜的低流动度半固化片的使用量增多,但由于此类半固化片的流胶量较低而往往容易导致压合白斑。本文对比试验了图形分布、半固化片数量、层压辅助材料、拼板工艺边设计及层压工艺参数等的影响,提出了低流动度半固化片的压合模型,此法有效避免了必须采用低流动度半固化片与FR-4半固化片混压或必需采用额外压合辅材的业界做法;试验并成功采用陪板填充阶梯槽的独特的简单工艺,避免了业界报道的操作相对复杂的叠板方式,可成功避免板凹和板件局部变形的质量问题,希望能对PCB制造业同行有所帮助。     

认识基材性能之所以然

覆铜板（CCL）和半固化片（PP）是印制电路板（PCB）的基础材料,由其决定了PCB的基本特性。然而,CCL和PP之性能也是由其材料与结构决定。CCL构成主体是导体铜箔、粘合树脂和增强物,此外还有固化促进剂、阻燃剂和填料等成分,都会影响到CCL和PP之性能,并延伸至PCB的性能。本期主题基材,所载文章内容突出的是基材的材料及构成,帮助我们对基材的认识从知其然到知其所以然。     

半固化片激光分条工艺研究

半固化片激光分条,是一种可以彻底解决长期以来困扰线路板行业的PP粉污染问题的新工艺。该工艺采用激光等光、机、电一体化控制技术,实现卷状PP（Prepreg,或者半固化片）料的分条。该工艺不产生PP粉,自动封边,同时,解决PP粉在压合制程中带来的凹陷问题,满足PCB行业的生产需求。     

盲槽孔板的设计及加工方法探讨

文章主要针对盲槽产品的制作流程及加工方法的控制作探讨,盲槽孔主要是利用已经钻好槽孔板和半固化片与另一张板进行压合形成。压合盲槽板时半固化片上所钻的槽孔大小设计/品质及半固化片本身流胶量严重影响成品盲槽的品质,本次主要以影响盲槽孔品质的几个因素作实验层别:半固化片槽孔大小分别比成品槽孔单边大0.4mm、0.6mm、0.8mm;PP厚度0.0375mm×3张;PP铣槽孔时叠板数为6、9、12。结论:半固化片槽孔单边大0.8mm最优,1.5mil厚的PP铣板叠板数9张时铣出的PP压合后槽孔品质符合要求,叠板数越少铣槽的效果越好;介层总厚度相同时,PP选用的张数越少压合时流胶越少,盲槽孔孔形越好。     

HDI板盲埋孔填胶量化分析及模型探索

文章定量分析了半固化片对盲埋孔填胶的影响因素,在此基础上,正交分析确定了盲埋孔填胶的主要控制因素（填胶深度和PP片数量）,为前端工程设计和控制提供依据。最后,建立盲埋孔填胶的胶体流动模型,即在层流状态下的渗流模型,服从达西定律。     

多层板半固化片防错方法谈

<正>0引言印制电路板（printed circuit board,PCB）生产中用到半固化片（prepreg,PP）,因其树脂处于半固化状态,固称其为PP。多层PCB压合过程中PP多放、少放、错放等造成损失成本越来越高,因此PCB工厂对PP规格、数量等管理的系统化、     

半固化片浸渍加工技术的新进展

高密度互连印制电路板制造需要高性能可靠性的覆铜板及半固化片基材。为满足这一需求，在覆铜板及半固化片生产中，就要在半固化片（prepreg，简称为PP，或称：预浸粘结片）的加工设备水平上获得提高。当前，在提高环氧-玻纤布基覆铜板及半固化片加工质量和水平的重点之一，是要克服在浸渍加工中出现的半固化片中含有微小气泡、树脂胶浸透性差、漏浸、胶含量不均匀等问题。这些质量问题的存在，会严重影响此工序以后所制出的覆铜板、多层板的可靠性。     

RCC与不同FR-4基板多次积层的性能研究

通过DOE应用试验,考察对比涂树脂铜箔（RCC）与不同FR-4半固化片制作高密度互连（HDI）板的多次层压性能,评估RCC相对FR-4半固化片的性能水平,为我们掌握不同材料多次层压制作HDI的表现、RCC与不同产品的组合使用及RCC产品配套开发提供参考依据。     

不流动性半固化片压合白斑的思考

介绍了利用不流动性半固化片在制作刚挠板压合过程中产生白斑的原因,通过对不同条件下（不同敷形材料、表面不同线路图形分布、不同压合压力、不同半固化片张劐不流动性半固化片的压合实验发现,不流动性半固化片的压合与普通半固化片无论是从压合辅材、压合压力及压合模型上来说者研艮大不同。最后通过之前的实验分析,提出了不流动性半固化片的压舍模型。     

混合PCB的微带线的性能

综述了采用低成本的常规FR-4层压板芯材和低介电常数高性能的半固化片形成的混合结构印制板,它具有较低的信号串扰和较低的成本。     

Surface graft copolymerization enhanced adhesion of an epoxy-basedprinted circuit board substrate (FR-4) to copper

The lamination of surface modified printed circuit board (PCB) substrate, FR-4(R), from argon plasma pretreatment and UV-induced graft copolymerization with glycidyl methacrylate (GMA), to copper foil was carried out at elevated temperature and in the presence of an epoxy adhesive. The structure and chemical composition of the graft copolymerized surfaces and interfaces of the glass fiber-reinforced and epoxy-based FR-4 substrates were studied by X-ray photoelectron spectroscopy (XPS). The effects of the plasma pretreatment time, the UV illumination time, as well as the curing temperature, on the adhesion strength between the FR-4 substrate and copper were investigated. The assemblies involving GMA graft copolymerized FR-4, or the FR-4-GMA/epoxy resin/Cu assemblies, exhibited a significantly higher interfacial adhesion strength and reliability, in comparison to those assemblies in which only epoxy adhesive alone was used. The enhanced adhesion in the assemblies involving GMA graft copolymerized substrate arises from the fact that the covalently tethered GMA graft chains on the FR-4 surface can become covalently incorporated into the epoxy resin, resulting in the toughening of the epoxy matrix and increased interaction with copper     

200-mm wafer-scale transfer of 0.18-/spl mu/m dual-damascene Cu/SiO/sub 2/ interconnection system to plastic substrates

We report a low-temperature (<200/spl deg/C) 200-mm wafer-scale transfer of a 0.18-/spl mu/m dual-damascene Cu/SiO/sub 2/ interconnection system to FR-4 plastic substrates using adhesive bonding. We demonstrate removal of the silicon bulk layer to leave behind a flexible 3-/spl mu/m-thick Si back-end-of-line (BEOL) circuit on a 0.1-mm-thick FR-4 wafer. The mechanical and electrical integrity of the thin Si BEOL circuit on FR-4 are confirmed by focused ion beam scanning electron microscope microscopy and current-voltage characterization on a variety of test structures, which include serpentine, via chain and Kelvin test structures on different locations on the wafer. This process will pave the path to allow integration of high-performance submicrometer Si electronics on plastic substrates.     

Corrosion protection of anisotropically conductive adhesive joined flip chips

Corrosion is a common cause of failure in electronic devices. Conformal coatings may be used to prevent corrosion of electronics packages. Water and contaminants are thus not in direct contact with the package surface, which may improve resistance to corrosion. However, it is important to study the effects of corrosion on both coating materials and on the electronics itself. The protection method and the level of protection can then be selected.This study presents a salt spray test of anisotropically conductive adhesive joined flip chip components on FR-4 substrate, where half of the test samples were parylene C coated. A dramatic difference was seen between these two test lots. Parylene C proved to be an excellent barrier against salt spray. The test lots without conformal coating suffered severe corrosion, and were thus considerably less reliable. Scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS) revealed the reasons for the failures in the non-coated test samples. The main reason was found to be severe corrosion of the nickel layer. There were no failures among the parylene C coated test samples during the 3000 h test. Moisture absorption of the FR-4 substrate material is also studied in this paper. Both plain FR-4 and parylene C coated FR-4 materials were studied. These tests were performed both at room temperature and in boiling water.     

厚铜PCB用高填充性半固化片的研制

一般地,106半固化片的树脂含量（简称RC）只能达到75％左右。因厚铜（铜厚达到105μm及以上）印制电路板的线路间需要更多的树脂来填充,故普通工艺制造的半固化片就很难满足厚铜印制线路板的填胶性。因此,本文研究了提高半固化片RC的新工艺方法,从而改善半固化片对厚铜印制线路板的填胶性能。     

不流动半固化片的研制及应用研究

通过对高性能环氧树脂进行降低流动性等特殊改性研究，开发出一种综合性能优良的不流动半固化片（No-Fl0w Prepreg），并成功通过了刚挠结合印制板厂家的试用及一系列严格考察评估。该产品从2007年下半年开始向市场推广，经多个厂家的批量生产使用，结果显示No-Flow Prepreg产品综合性能优良，使用质量稳定，达到国外同类产品的水平。     

不流动半固化片厚铜层压技术探讨

随刚挠板、阶梯板与金属基散热板需求量的增大,相对于纯胶片更为便宜的低流动度半固化片的使用量增多,但由于此类半固化片的溢胶量较低而往往容易导致压合白斑、白点、填胶不足等缺陷。本文通过分析对厚铜层压参数的调整,分析其影响因素,总结出NO-FLOW半固化片的压合技术点,希望能对PCB制造业同行有所帮助。