裸眼3D电视的优势与未来发展

在简要介绍裸眼3D的优势之后,分享了该技术在香港教学领域的应用研究,发现该技术在提高学生注意力,增强教学效果方面有较好的成效。随后,分析了3D与超高清技术结合发展的可能性。最后,对裸眼3D电视的未来进行了展望。     

AV资讯速递

目前电视产业将沿着显示技术与应用服务两条主线发展,4K×2K超高清、裸眼3D、OLED是未来显示技术发展的主趋势。智能电视为电视产业带来了更多的发展空间,其核心是人机交互,用户体验是产品的核心竞争力。     

可切换光栅式裸眼3D电视系统的设计

提出一种可切换光栅式裸眼3D电视系统的设计,详细阐述了系统的原理、硬件及关键技术的实现.系统通过TV模块将电视信号处理成1 080p@120 Hz的图像信号,由裸眼3D模块生成多个视点图像并交织为3 840 ×2 160@30 Hz的合成图像,经过帧频转换后驱动裸眼3D屏幕实现高清晰度裸眼3D显示,以及采用独立的Barrier panel来形成可切换屏障光栅,能够兼容超高清晰度2D显示.     

一种裸眼3D电视系统的设计方案

本文提出一种裸眼3D电视系统的设计方案,详细阐述了方案的原理及关键技术的实现.方案系统先将电视信号处理成单视点或双视点图像,然后将单视点或双视点图像转换成N个视点图像,并将N个视点图像交织成一幅合成图像来驱动裸眼3D屏发出图像光实现裸眼3D显示.该方案可快速应用于柱状透镜式和光栅屏障式裸眼3D电视产品,具有广泛的应用价值.     

液晶材料与3D显示

介绍了3D显示的基本原理,重点介绍了目前3D显示的主流技术类型,包含了眼镜式3D技术以及裸眼式3D技术,其中眼镜式3D技术包含色差式3D技术、偏光式3D技术和主动快门式3D技术;裸眼式3D技术包含视差屏障式3D技术、柱状透镜式3D技术、指向光源式3D技术和多层显示式3D技术。阐述了各种3D显示技术的基本实现原理和应用领域、并对涉及液晶显示的几种3D技术的优缺点进行了对比。结合液晶材料的特点与3D液晶显示的实际要求,阐述了3D液晶面板对液晶材料快速响应方面的要求,以及液晶透镜对液晶材料光学各向异性参数的要求。     

3D显示技术的现状及发展

文章介绍了3D显示技术的显示特点及发展趋势,重点介绍了目前3D显示的主要技术类型,包含眼镜式3D技术以及裸眼式3D技术。详细阐述了3D显示技术的基本原理,眼镜式和裸眼式3D技术的基本原理及对比,分析了各类3D显示技术的基本结构组成、原理和各自的优缺点,最后展望了3D显示技术的发展和应用前景。     

裸眼3D—3D电视技术发展的必然归宿

2010年,3D潮流可谓锐不可挡,以主动快门式3D技术为代表的眼镜式3D电视大规模登陆市场,市场销售呈现开门红,预计全年全球销量将突破300万台,因此2010年可以称得上真正的"3D电视发展的开元之年"。眼镜的束缚似乎没有阻挡消费者对3D电视的欣赏热情,但冷静之余,我们却不得不面对眼镜式3D电视可能会对视力造成的不良影响,以及长时间观看所带来的头晕、恶心等不良感受,而且对近视眼患者因佩戴"双重"眼镜所带来的痛苦更是不可言状,因此,我们不得不承认,目前的眼镜式3D电视只能作为3D电视技术发展的过渡产品,而最终必然被成熟的裸眼3D电视技术所取代,裸眼3D显示将是未来3D电视技术发展的必然归宿。     

联发科技推出全球首款支持120Hz偏光／快门式3D技术的单芯片解决方案

1月5日,全球无线通信及数字媒体IC设计领导厂商联发科技股份有限公司（MediaTek Inc．）宣布于2011消费电子展（CES）推出完整一系列的3D电视解决方案,包含可支持120Hz与240Hz偏光,快门式3D电视解决方案。其全球首款支持120Hz偏光／快门式3D技术的单芯片,不但支持多视角视频影像压缩技术（MVC）,亦支持多种3D媒体格式,     

4月行业趣评

正京东方裸眼3D液晶面板已正式量产近期京东方表示,旗下的裸眼3D液晶面板已经正式量产。该面板尺寸为55英寸,分辨率方面达到了4K超高清标准,也就是大家熟知的3640×9600,不仅支持裸眼3D回放,传统的2D显示同样支持。除此之外,这款面板还采用了京东方独有的ADSDS宽视角技术,其分辨率、亮度、视角等特性均得到极大提升。据     

LG84英寸超高清智能电视

在三星发布75英寸的智能电视之后,LG电子不甘人后,在韩国本地发布了84英寸超高清智能电视。LG这款型号为84LM9600的巨型“魔兽”,采用LG Display的3DIPS面板,自带FPR Cinema不闪式3D技术,分辨率达到超高清的4K2K标准,为3840×2160。随着超高清技术在伦敦奥运会上展示,相对应的超高清智能电视将迎来井喷。不过,这款产品售价不菲,超过1万美元,对家庭而言,仍是奢侈品。     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Teleportation of an arbitrary unknown N-qubit entangled state under the controlling of M controllers

A new quantum protocol to teleport an arbitrary unknown N-qubit entangled state from a sender to a fixed receiver under M controllers(M < N) is proposed. The quantum resources required are M non-maximally entangled Greenberger-Home-Zeilinger (GHZ) state and N-M non-maximally entangled Einstein-Podolsky-Rosen (EPR) pairs. The sender performs N generalized Bell-state measurements on the 2N particles. Controllers take M single-particle measurement along x-axis, and the receiver needs to introduce one auxiliary two-level particle to extract quantum information probabilistically with the fidelity unit if controllers cooperate with it.     

A rigorous proof of MIMO channel capacity’s increase with antenna number

It is well known that adding more antennas at the transmitter or at the receiver may offer larger channel capacity in the multiple-input multiple-output（MIMO） communication systems. In this letter, a simple proof is presented for the fact that the channel capacity increases with an increase in the number of receiving antennas. The proof is based on the famous capacity formula of Foschini and Gans with matrix theory.     

Diode-end-pumped Nd:YVO4/LBO lasers with 4.2W continuous-wave output at 457 nm

A continuous-wave (CW) 457 nm blue laser operating at the power of 4.2 W is demonstrated by using a fiber coupled laser diode module pumped Nd: YVO4 and using LBO as the intra-cavity SHG crystal With the optimization of laser cavity and crystal parameters, the laser operates at a very high efficiency. When the pumping power is about 31 W, the output at 457nm reaches 4.2 W, and the optical to optical conversion efficiency is about 13.5% accordingly. The stability of the out putpower is better than 1.2% for 8 h continuously working.     

Call for Papers

正Wireless Body-area Networks The last decade has witnessed the convergence of three giant worlds:electronics,computer science and telecommunications.The next decade should follow this convergence in most of our activities with the generalization of sensor networks.In particular with the progress in medicine,people live longer and the aging of population will push the development of wireless personal networks