Cure kinetics of biphenyl epoxy resin system using latent catalysts

The investigation of the cure kinetics of a biphenyl epoxy–phenol resin system with different kinds of latent catalysts was performed by differential scanning calorimetry using an isothermal approach. All kinetic parameters of the curing reaction including the reaction order, activation energy, and rate constant were calculated and reported. The results indicated that the curing reaction of the biphenyl epoxy resin system in this experiment proceeded through an autocatalytic kinetic mechanism, irrespective of the kind of catalyst. The epoxy resin system with acid/diazabicycloundecene (DBU) salt as the latent catalyst showed a second overall reaction order; however, a third reaction order was represented for microencapsulated triphenylphosphine (TPP). The storage stability tests for these systems were performed, and a good shelf life was observed in the epoxy resin system with pyromellitic acid/DBU salt, trimellitic acid/DBU salt, and microencapsulated TPP as the latent catalyst. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 81: 2711–2720, 2001     

Curing characteristics of epoxy resin systems that include a biphenyl moiety

The curing characteristics of epoxy resin systems that include a biphenyl moiety were investigated according to the change of curing agents. Their curing kinetics mainly depend on the type of hardener. An autocatalytic kinetic reaction occurs in epoxy resin systems with phenol novolac hardener, regardless of the kinds of epoxy resin and the epoxy resin systems using Xylok and DCPDP (dicyclopentadiene‐type phenol resin) curing agents following an nth‐order kinetic mechanism. The kinetic parameters of all epoxy resin systems were reported in terms of a generalized kinetic equation that considered the diffusion term. The fastest reaction conversion rate among the epoxy resin systems with a phenol novolac curing agent was obtained in the EOCN‐C epoxy resin system, and for systems with Xylok and DCPDP hardeners, the highest reaction rate values were obtained in NC‐3000P and EOCN‐C epoxy resin systems, respectively. The system constants in DiBenedetto's equation of each epoxy resin system with different curing agents were obtained, and their curing characteristics can be interpreted by the curing model using a curing agent as a spacer. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 86: 1942–1952, 2002     

联苯酚醛环氧树脂固化动力学及热性能研究

以4,4'-二氨基二苯砜(DDS)为固化剂,采用非等温示差扫描量热法(DSC)研究了联苯酚醛环氧树脂(BPNE)的固化动力学。通过外推法确定了体系的固化工艺。采用Kissinger、Ozawa法计算出固化体系的表观活化能,根据Crane理论计算得到该体系的固化反应级数。采用DSC,热重分析(TGA)研究了固化物的耐热性。结果表明:BPNE的固化工艺为160℃/2h+200℃/2h+230℃/2h;固化反应的活化能约为61.86kJ/mol,指前因子为5.27×105min-1,反应级数为1.1;玻璃化转变温度(Tg)为167℃,其10%热失重温度为398.1℃,800℃残炭率为29.37%,与双酚A环氧树脂/DDS固化物相比,分别提高了22℃,11.71%。     

脂环族环氧树脂/酸酐体系固化促进剂的研究

利用示差扫描量热仪研究了乙酰丙酮铝、三苯基膦、2-乙基-4-甲基咪唑(2E4MZ)等3种促进剂在脂环族环氧树脂(UVR-6103)/甲基六氢邻苯二甲酸酐(MHHPA)体系中的固化行为,通过Ellerstien方程计算得到了UVR-6103/MHHPA体系在3种促进剂作用下的固化动力学参数,其表观活化能分别为48.6,69.2,90.2kJ/mol,反应级数分别为0.96,2.09和1.60。     

聚乙二醇接枝改性纳米炭黑对环氧树脂固化过程的影响

采用差示扫描量热法研究了以聚乙二醇(PEG)接枝改性的纳米炭黑(NC)(NC-PEG)为填料对环氧树脂/4,4-二氨基二苯砜非等温固化反应的影响,通过Flynn-Wall-Ozawa法和Malek法确定了固化反应的动力学参数.结果表明:两参数的自催化模型能够很好地描述环氧树脂及其复合材料的固化反应过程,各试样的模型拟合结果与实验数据相吻合.NC-PEG能够促进环氧树脂的固化,使固化活化能降低,其中,NC-PEG用量为3 phr时,活化能最低.     

桐马酸酐与环氧树脂的非等温固化反应动力学

采用Málek法对桐马酸酐与双酚A环氧树脂E-51体系(含有1%质量分数的DMP-30)的非等温固化反应动力学进行了研究。通过机理函数esták-Berggren方程很好地模拟了真实的固化反应过程。等转化率法求得反应活化能为69.78 kJ/mol。指前因子A的值为4.567×108 min-1,n和m的值分别为1.082和0.456。根据得到的固化动力学方程计算可知,在固化温度为137.05℃时达到98%固化度的固化时间为115 min。     

新型环氧树脂胶粘剂的固化动力学研究

在不同升温速率下采用非等温差示扫描量热（DSC）技术对一种新型改性环氧树脂胶粘剂的固化反应过程进行了跟踪,并利用Kissinger、crane方程以及Arrhenius方程对该固化反应进行了动力学分析。结果表明,该固化反应的活化能为59.18kJ／mol,反应级数为0．89;结合Dsc谱图确定其固化工艺为130℃／1h＋150℃／2h＋175℃／3h。     

Effect of amino-polycarbonate on the curing kinetics and morphology of epoxy resin

The curing kinetics and the glass transition behavior of amino-polycarbonate with diglycidyl ether of bisphenol-A epoxy resin systems were studied by differential scanning calorimetry (DSC). The ASTM E-698 method was chosen to determine the kinetics parameters of the curing reaction, including the activation energy, preexponential factor, rate constant, and 60-min half-life temperature. The amino-polycarbonate was able to accelerate the curing reaction, reduce the apparent active energy, and decrease T_g of the systems. A homogeneous amino-polycarbonate/epoxy resin network was observed in scanning electron microscopy (SEM) pictures. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 82: 833–838, 2001     

Differential scanning calorimetric study of curing of acrylated epoxy resin with benzoyl peroxide

The curing reaction of the acrylated diglycidyl ether of bisphenol-A (DGEBA) with benzoyl peroxide has been investigated by differential scanning calorimetry at three different heating rates. The overall cure kinetics were found to be first-order, with Arrhenius parameters E=83 kJ mol^?1 and In A = 16.5 min^?1, independent of the scan rate, up to at least 90% conversion.     

New tetrafunctional epoxy resin system with increased shelf life

Chlorine‐ and methyl‐substituted aromatic diamines based on diaminodiphenylmethane were epoxidized and characterized. The effect of different substituents on epoxidation was studied. The cure studies of the two new tetrafunctional resins in comparison with unsubstituted resin N,N,N′,N′‐tetraglycidyl‐4,4′‐diaminodiphenylmethane (TGDDM) was carried out by DSC with 3,3′‐dichloro‐4,4′diaminodiphenylmethane (o‐DCDDM; 30% w/w) as a common curing agent. The mechanical properties such as flexural, Izod impact, heat distortion temperature (HDT), of such cured neat resins were also studied. The results of the cure studies indicate that the substitution of the α‐hydrogen of the resin by chlorine or methyl group decreases the reactivity of the resin leading to an increase in the shelf life. This study also indicates that the functionality of the resin plays a pivotal role in the reactivity and thus the shelf life of an epoxy resin system. The results of the mechanical properties of the neat resin casts obtained by subjecting to a common cure schedule when compared with the unsubstituted resin showed a decrease in impact strength, which is obvious because of the presence of a bulky pendant group but the impact strength was higher than that of the TGOS30 resin system. Results of flexural strength of the different substituted neat resin casts did not show much of a deviation from that of the unsubstituted resin system. The HDT results indicate no significant difference in the values of the unsubstituted resin vis‐a‐vis with substituted resin systems. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 93: 2790–2801, 2004     

Kinetics of 4,4′-diaminodiphenylmethane curing of bisphenol-S epoxy resin

The kinetics of the cure reaction for a system of bisphenol-S epoxy resin (BPSER), with 4,4′-diaminodiphenylmethane (DDM) as a curing agent, were studied by means of differential scanning calorimetry (DSC). Analysis of DSC data indicated that an autocatalytic behavior showed in the first stages of the cure, with the model proposed by Kamal, which includes two rate constants, k₁ and k₂, and two reaction orders, m and n. Rate constants k₁ and k₂ were observed to be greater when curing temperature increased. The over-all reaction order, m + n, is in the range of 2.5 ∼ 3. The activation energies for k₁ and k₂ were 55 kJ/mol and 57 kJ/mol, respectively. Diffusion control is incorporated to describe the cure in the latter stages. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 73: 1799–1803, 1999     

环氧树脂固化反应动力学研究及其活性增韧

采用动态DSC法跟踪环氧树脂E-51／固化剂5784体系的反应历程,确定固化温度,利用Kissinger方程和Crane方程对固化反应动力学进行分析,通过红外分析确定聚硫橡胶的增韧方式,研究不同聚硫橡胶用量列固化产物力学性能的影响,采用扫描电镜分析试样断口形貌。研究结果表明：该固化体系的动力学参数为表观活化能△E=63．946kJ／mol,指前因子Ak=1．90×10^5,反应能级n=0．91,聚硫橡胶增韧环氧树脂通过化学键合来实现,并且效果明显。     

2-甲基咪唑/环氧树脂体系的固化动力学研究

利用等温DSC法对E-51环氧树脂/2-甲基咪唑(2-MI)体系的固化动力学进行了研究,拟合得到n级固化模型、自催化模型及Kamal复合模型方程中的各个参数值,以确定固化模型。研究表明:E-51/2-MI体系的固化过程分为2个阶段,即诱发阶段和加成反应,其固化反应兼具n级固化与自催化的特征,符合Kamal复合模型。     

腰果酚缩醛胺与环氧树脂的固化反应动力学的研究

在不同升温速率下,用差示扫描量热分析(DSC)研究了腰果酚缩醛胺固化剂(PCD)与环氧树脂的固化反应动力学。通过Kissinger、Crane方程和等转化率的方法求得了其表观活化能E=39.89kJ/mol,固化反应级数n=0.906。     

聚双胍/环氧树脂体系潜伏性固化过程

用己二胺与双氰胺熔融缩聚, 合成了一种新型潜伏性环氧树脂固化剂, 并研究了其与环氧树脂的固化过程。用FTIR、XPS、¹H NMR分析了固化剂的结构;用DSC分析得到了固化剂与环氧树脂的适宜配比、固化体系的适宜固化温度及固化动力学参数;通过XRD分析了固化物的相结构;通过TG分析了固化物的热稳定性。结果表明, 与双氰胺环氧树脂固化体系相比, 固化温度降低近70℃, 同时潜伏性能良好, 30 d内固化度少于10%, 热稳定性能良好, 热分解温度超过300℃。     

催化剂对环氧树脂/酚类固化剂体系反应性的影响

采用三氟甲磺酸铒和三氟甲磺酸镱作为环氧树脂/酚类固化剂的催化剂,筛选了固化剂的最佳用量,采用胶化时间研究了催化剂的催化活性,并采用差热分析法对环氧树脂/酚类固化剂/三氟甲磺酸铒动力学参数进行了研究。结果表明,酚类固化剂的最佳质量分数为9%(以环氧树脂计),三氟甲磺酸铒的催化活性最强,环氧树脂/酚类固化剂/三氟甲磺酸铒体系的活化能为79.53 kJ/mol,反应级数为0.95。     

风电叶片用环氧树脂固化体系动力学研究

以三乙醇胺、BH-1、2-乙基-4-甲基咪唑(2,4-EMI)和2,4,6-三(二甲氨基甲基)苯酚(DMP-30)为促进剂,采用非等温DSC(差示扫描量热)法研究了四种不同环氧树脂(EP)/酸酐体系的固化反应动力学和固化工艺,并采用Ozawa法、Kissinger法和Crane法计算出不同固化体系的动力学参数。结果表明:四种固化体系的活化能分别为25.75、20.93、29.29、33.59 kJ/mol,反应级数均小于0.9(近似于1级反应);固化工艺为"80℃/2 h→100℃/2 h→120℃/2 h";DMP-30/EP/酸酐固化体系的黏度特性和反应特性完全满足风电叶片用复合材料对树脂基体的要求。     

环氧树脂改性双马来酰亚胺/氰酸酯树脂固化工艺研究

采用差示扫描量热(DSC)法和红外光谱(FT-IR)法对缩水甘油胺型环氧树脂(AG-80)与脂环族缩水甘油酯型环氧树脂(TDE-85)共同改性双马来酰亚胺(BMI)/氰酸酯树脂(CE)的固化反应历程进行了研究,并按照Kissinger和Crane法计算出该改性树脂体系固化反应的动力学参数。结果表明:改性树脂体系的固化反应表观活化能为68.11 kJ/mol,固化反应级数为0.860(接近于1级反应);环氧树脂(EP)可促进CE固化,当固化工艺条件为"150℃/3 h→180℃/2 h"时,改性树脂体系可以固化完全。     

Etherification versus amine addition during epoxy resin/amine cure: An in situ study using near-infrared spectroscopy

The reactions between a multifunctional epoxy resin, tetraglycidyl 4,4′-diaminodiphenylmethane (TGDDM) and a monofunctional amine, methylaniline (mAnil) are studied. Due to the existence of a tertiary amine catalytic center within the TGDDM molecule, the etherification reaction during cure of TGDDM is usually more significant than in other epoxide systems. The importance of this reaction relative to the amine addition reactions is investigated. In situ near-infrared spectroscopy is used to obtain kinetic data during the cure reactions. The reaction rate constants are calculated from linear regression analysis for both amine addition and etherification reactions based on the reaction mechanisms proposed. Arrhenius relationships are observed for all the reaction rate constants involved. © 1998 John Wiley & Sons, Inc. J Appl Polym Sci 67:895–901, 1998     

含有联萘基团的环氧树脂的合成与固化

合成了一种具有联萘结构的环氧树脂(BEBN)。通过红外光谱、核磁共振氢谱以及元素分析对其结构进行了表征。以双酚A型环氧树脂(E-51)作为参照,采用二氨基二苯基甲烷为固化剂,通过差示扫描量热法(DSC)研究了BEBN,E-51的固化反应性;采用DSC,热重分析对固化物的热学性能进行测试,比较了固化物的力学性能、热性能以及吸水率;探讨了BEBN的结构与性能之间的关系。结果表明,同E-51相比,BEBN的固化反应平缓：BEBN固化物的玻璃化转变温度升高29℃,吸水率降低0．31％,热失重5％和50％的温度分别升高15℃和13℃。