Properties of Epon 828 resin cured by cyclic phosphine oxide tetra acid

A new phosphorylated epoxy polymer was obtained using Epon 828 resin cured with a phosphorus-containing curing agent, 10-phenylphenoxaphosphine-2,3,7,8-tetracarboxylic acid-10-oxide (PDAC). In addition, compositions of Epon 828 with common curing agents, for example, 4,4′-diaminodiphenylmethane (DDM) and 4,4′-diaminodiphenylsulfone (DDS), were used for making a comparison of its curing reactivity, heat, and flame retardation with that of PDAC. The reactivites of the three curing agents toward Epon 828, as measured by differential scanning calorimetry (DSC), was in the following order: DDM > PDAC > DDS. Through thermal gravimetric analysis evaluation (TGA), the thermal and flame resistance of epoxy polymers were confirmed in this study as capable of being improved through introduction of the cyclic phosphine oxide group into the carboxyl curing agent structure. © 1998 John Wiley & Sons, Inc. J Appl Polym Sci 70: 1877–1885, 1998     

The synthesis and properties of new epoxy resin containing phosphorus and nitrogen groups for flame retardancy

A new type of epoxy resin, which contained phosphorus oxide and nitrogen groups in the main chain, was synthesized. The structure of the new type of epoxy resin was confirmed by infrared (IR) spectroscopy, ¹H nuclear magnetic resonance (¹H‐NMR), and ¹³C‐NMR spectroscopic techniques. In addition, compositions of the new synthesized epoxy resin (TGDMO) with three curing agents, for example, bis(3‐aminophenyl) methylphosphine oxide (BAMP), 4,4′‐diaminodiphenylmethane (DDM), and 4,4′‐diaminodiphenylsulfone (DDS), were used for making a comparison of its curing reactivity, heat, and flame retardancy with that of Epon 828 and DEN 438. The reactivities were measured by differential scanning calorimetry (DSC). Through the evaluation of thermal gravimetric analysis (TGA), those polymers which were obtained through the curing reactions between the new epoxy resin and three curing agents (BAMP, DDM, and DDS) also demonstrated excellent thermal properties as well as a high char yield. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 74: 413–421, 1999     

The properties of epoxy–imide resin cured by cyclic phosphine oxide diacid

A new phosphorylated epoxyimide polymer synthesized was obtained using diimide-diepoxide (DIDE) resin cured with the new curing agent, 10-phenylphenoxa-phosphine-3,8-dicarboxylic acid-10-oxide (PCAO). In addition, compositions of the synthesized diimide-diepoxide (DIDE), Epon 828, with common curing agents, e.g., 4,4′-diaminodiphenylether (DDE) and 4,4′-diaminodiphenylsulfone (DDS), were used for making a comparison of its curing reactivity and heat, and flame retardation with that of (PCAO). The reactivities of those curing agents toward the two kinds of epoxy resins, as measured by differential scanning calorimetry (DSC), were in the following order: DDE> PCAO> DDS. Through evaluation of thermal gravimetric analysis (TGA), the thermal and flame resistances of epoxy polymers were confirmed in this study as capable of being significantly improved through introduction of imide and cyclic phosphine oxide group into the epoxide and curing agent structures. © 1996 John Wiley & Sons, Inc.     

Syntheses,structure, reactivity,and thermal properties of epoxy–imide resin cured by phosphorylated triamine

A new phosphorylated epoxy–imide polymer was obtained using diimide–diepoxide (DIDE) cured with tris(3-aminophenyl)phosphine oxide (TAPO). In addition, compositions of the synthesized diimide diepoxide (DIDE), Epon 828, and DEN 438 with common curing agents, e.g., 4,4′-diaminodiphenyl ether (DDE) and 4,4′-diaminodiphenylsulfone (DDS), were compared as to curing reactivity and heat and flame retardation with that of tris(3-aminophenyl)phosphine oxide. The reactivities of those curing agent toward the three kinds of epoxy resins, as measured by differential scanning calorimetry (DSC), were in the order DDE > TAPO > DDS. Through thermal gravimetric analysis (TGA), the thermal and flame resistances of epoxy were confirmed in this study as capable of being significantly improved through introduction of imide and phosphorus groups into the epoxide structure. © 1996 John Wiley & Sons, Inc.     

Properties of cyclic phosphine oxide epoxy cured by diacids and anhydride

New phosphorylated epoxy polymers were obtained with a cyclic phosphine oxide epoxy, 10‐phenylphenoxaphosphine‐3,8‐diglycidylester‐10‐oxide (EPCAO), cured with three types of curing agents: N,N′‐(4,4′‐diphenylsulfone)bis(trimellitimide) (DIDA), 10‐phenylphenoxaphosphine‐3,8‐dicarboxylic acid‐10‐oxide (PACO), and phthalic anhydride (PA). In addition, compositions of the new EPCAO synthesized with these three curing agents (DIDA, PACO, and PA) were used to make a comparison of EPCAO's curing reactivities and heat and flame retardancy with those of Epon828 and DEN438. The reactivities were measured by differential scanning calorimetry. Through the evaluation of thermogravimetric analysis, those polymers that were obtained through the curing reactions between the cyclic phosphine oxide epoxy resin and the three curing agents mentioned also demonstrated excellent thermal properties and a high char yield. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 84: 950–961, 2002; DOI 10.1002/app.10146     

A simple imide compound as a curing agent for epoxy resin. I. Synthesis and properties

A simple imide compound, 4‐amino‐phthalimide (APH), was synthesized as a curing agent for epoxy resin. APH was prepared from the hydration of 4‐nitro‐phthalimide, which was prepared from the nitration of phthalimide. The chemical structure of APH was verified by IR and ¹H‐NMR spectra. The thermal properties and dielectric constant (ε) of a phosphorus‐containing novolac epoxy resin cured by APH were determined and compared with those of epoxy resins cured by either 4,4′‐diamino diphenyl methane (DDM) or 4,4′‐diamino diphenyl sulfone (DDS). The results indicate that the epoxy resin cured by APH showed better thermal stability and a lower ε than the polymer cured by either DDM or DDS. This was due to the introduction of the imide group of APH into the polymer structure. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Novel flame retardant epoxy resins I: Synthesis, characterization, and properties of aryl phosphinate epoxy ether cured with diamine

Summary A novel aryl phosphinate epoxy ether, 10-(2',5'-bis(glycidyloxy)phenyl)-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DHQEP), was synthesized. The structures of the obtained compounds were confirmed by mass, FTIR, ¹H, ¹³C, ³¹P-NMR spectroscopies, elemental analysis, and X-ray single crystal analysis. In addition, compositions of DHQEP with common curing agents, e.g., 4,4'-diaminodiphenylmethane (DDM), 4,4'-diaminodiphenyl sulfone (DDS), and dicyanodiamide (DICY), were studied to compare their thermal and flame resistance with that of commercial epoxy resins. The aryl phosphinate epoxy-resin composites exhibited excellent thermal properties and a quite high limiting oxygen index (LOI) value as well as high char yield. Aryl phosphinate epoxy ether is shown to be an effective flame retardant and thermal stabilizer for epoxy resins. Received: 13 April 1998/Revised version: 8 May 1998/Accepted: 11 May 1998     

Multifunctional epoxy resins

The curing behavior of epoxy resins prepared by reacting epichlorohydrin with 4,4′-diaminodiphenyl methane (DADPM)/4,4′-diaminodiphenyl ether (DADPE) or 4,4′-diaminodiphenyl sulfone (DDS) was investigated using DDS and tris-(m-aminophenyl)phosphine oxide (TAP) as curing agents. A broad exothermic transition with two maxima were observed in the temperature range of 100–315°C when TAP was used as the curing agent. The effect of varying DDS concentration on curing behavior of epoxy resin was also investigated. Peak exotherm temperature (T_exo) decreased with increasing concentration of DDS, whereas heat of curing (ΔH) increased with an increase in amine concentration up to an optimum value and then decreased. Thermal stability of the resins, cured isothermally at 200°C for 3 h, was investigated using thermogravimetric analysis in a nitrogen atmosphere. Glass fiber-reinforced multifunctional epoxy resin laminates were fabricated and the mechanical properties were evaluated. © 1993 John Wiley & Sons, Inc.     

Reaction kinetics and thermal properties of epoxidised cresol novolac/4,4′‐diglycidyl (3,3′,5,5′‐tetramethylbiphenyl) epoxy resin composite cured with aromatic diamine

A series of novel composites based on different ratios of epoxidised cresol novolac (ECN) and 4,4′‐diglycidyl(3,3′,5,5′‐tetramethylbiphenyl) epoxy resin (TMBP) have been prepared with the curing agent 4,4′‐methylenediamine (DDM) and 4,4′‐diaminodiphenylsulfone (DDS), respectively. The investigation of cure kinetics was performed by differential scanning calorimetry using an isoconversional method. The high thermal stabilities of the cured samples were also studied by thermogravimetric analysis. In addition, no phase separation was observed for cured ECN/DDM and ECN/DDS blending with different amounts of TMBP by dynamic mechanical analysis and scanning electron microscopy. Moreover, the cured systems also exhibited excellent impact properties and low moisture absorption. All the results indicate that the ECN/TMBP/DDM and ECN/TMBP/DDS systems are promising materials in electronic packaging. Copyright © 2011 Society of Chemical Industry     

Phosphorus-containing epoxy for flame retardant. III: Using phosphorylated diamines as curing agents

Two phosphorus-containing diamine compounds, bis(4-aminophenoxy)-phenyl phosphine oxide and bis(3-aminophenyl)phenyl phosphine oxide, were synthesized for use as curing agents of epoxy resins. Phosphorylated epoxy resins were obtained by curing Epon 828 and Eponex 1510 with these two diamine agents. For raising the phosphorus contents of the resulting epoxy resins, the phosphorus-containing epoxy, bis(glycidyloxy)phenyl phosphine oxide (BGPPO), was also used. These two diamine agents showed similar reactivity toward epoxies. Their reactivities were higher than DDS and lower than DDM. High char yields in TGA evaluation were found for all the phosphorylated epoxy resins, implying their high flame retardancy. The excellent flame-retardant properties of these phosphorylated epoxy resins were also demonstrated by the high limiting oxygen index (LOI) values of 33 to 51. © 1997 John Wiley & Sons, Inc. J Appl Polym Sci 63: 895–901, 1997     

Biphenyl liquid crystal epoxy containing flexible chain: Synthesis and thermal properties

A biphenyl type liquid crystal epoxy (LCE) monomer 4,4′-di(2,3-epoxyhexyloxy)biphenyl (LCBP4) containing flexible chain was synthesized and the curing behavior was investigated using 4,4′-diaminodiphenylmethane (DDM) as the curing agent. The effect of curing condition on the formation of the liquid crystalline phase was examined. The cured samples show good mechanical properties and thermal stabilities. Moreover, the relationship between thermal conductivity and structure of liquid crystalline domain was also discussed. The samples show high thermal conductivity up to 0.28–0.31 W/(m*K), which is 1.5 times as high as that of conventional epoxy systems. In addition, thermal conductive filler, Al₂O₃, was introduced into LCBP4/DDM to obtain higher thermal conductive composites. When the content of Al₂O₃ was 80 wt%, the thermal conductivity of the composite reached to 1.86 W/(m*K), while that of diglycidyl ether of bisphenol A (Bis-A) epoxy resin/DDM/Al₂O₃ was 1.15 W/(m*K). Compared with Bis-A epoxy resin, the formation of liquid crystal domains in the cured LCE resin enhanced the thermal conductivity synergistically with the presence of Al₂O₃. Furthermore, the introduction of Al₂O₃ also slightly increased the thermal stabilities of the cured LCE.     

Development and characterization of phosphorus-containing siliconized epoxy resin coatings

The objective of the present work is the development and characterization of siliconized epoxy-phosphorus based bismaleimide coating systems using diglycidylether terminated poly (dimethylsiloxane) (DGTPDMS) and phosphorus-containing bismaleimide (PBMI) as chemical modifiers for epoxy resin. Phosphorus-containing diamine (DOPO-NH₂) was synthesized from 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO) and 4,4′-diaminobenzophenone (DABP), which was utilized in the preparation of phosphorus-containing bismaleimide (PBMI) with maleic anhydride. Siliconized epoxy prepolymer was prepared using epoxy resin and functionally terminated polydimethylsiloxane. The purity and structural conformation of these materials were ascertained from FTIR and NMR spectral studies. The prepared siliconized epoxy prepolymer was blended with varying percentages of PBMI using diaminodiphenylsulfone (DDS) and diaminodiphenylmethane (DDM) as curing agents. The siliconized epoxy and bismaleimide modified epoxy and siliconized epoxy coating materials were characterized by dynamic mechanical thermal analysis (DMTA), differential scanning calorimetry (DSC), thermo gravimetric analysis (TGA), heat distortion temperature (HDT) and Limiting oxygen index (LOI).     

Improvement of Elastic Modulus and Thermal Stability of Epoxy Resin Using New Curing Agents

New curing agents 2,5-diamino-1,3,4-thiadiazole (DATD) and N-(4-hydroxybenzal) N'(4′-hydroxyphenyl) thiourea (HHPT) were synthesised and characterized using FT-IR, 1H-NMR and 13C-NMR analysis. The curing reactions were studied for the epoxy resin diglycidyl ether of bisphenol-A (DGEBA) using new curing agents along with the conventional aromatic diamine 4,4′-diamino diphenyl methane (DDM) for comparison purpose. The curing profiles of DDM, DATD and DATD/HHPT towards DGEBA were examined by Differential Scanning Calorimetry (DSC). Elastic modulus and thermal stability of the cured resins were evaluated using DMA and TGA analysis. When compared with DDM and DATD, the DATD/HHPT curing system accelerated the curing rate due to the presence of phenol molecules in the HHPT. Furthermore, the DATD/HHPT-cured epoxy resin demonstrated higher elastic modulus along with better thermal stability.     

Epoxy resin based on 4,4′-dihydroxydiphenysulfone. I. Synthesis and reaction kinetics with 4,4′-diaminodiphenylmethane and 4,4′-diaminodiphenylsulfone

Epoxy resins based on 4,4′-dihydroxydiphenylsulfone (DGEBS) and diglycidyl ether of bisphenol A (DGEBA) were prepared by alkaline condensation of 4,4′-dihydroxydiphenylsulfone (bisphenol S) with epichlorohydrin and by recrystallization of liquid, commercial bisphenol A-type epoxy resin, respectively. Curing kinetics of the two epoxy compounds with 4,4′-diaminodiphenylmethane (DDM) and with 4,4′-diaminodiphenylsulfone (DDS) as well as T_g values of the cured materials were determined by the DSC method. It was found that the ? SO₂? group both in the epoxy resin and in the harener increases T_g values of the cured materials. DGEBS reacts with the used hardeners faster than does DGEBA and the curing reaction of DGEBS begins at lower temperature than does the curing reaction of DGEBA when the same amine is used. © 1994 John Wiley & Sons, Inc.     

Development and characterization of novel DOPO based phosphorus tetraglycidyl epoxy nanocomposites for aerospace applications

A study was made in the present investigation on the development and characterization of 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO) based phosphorus tetraglycidyl epoxy nanocomposites and to find its suitability for use in aerospace and high performance applications. Phosphorus-containing diamine (DOPO-NH₂) was synthesized from 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO) and 4,4′-diaminobenzophenone (DABP), and this is utilized for the preparation of DOPO based phosphorus containing tetraglycidyl epoxy denoted as ‘D’. The synthesized resin was characterized by Fourier transform infrared spectra (FT-IR) and ¹H, ¹³C nuclear magnetic resonance (NMR) spectra. Nanoclay and polyhedral oligomeric silsesquioxane (POSS)-amine nano-reinforcements denoted as N1 and N2 were incorporated into the synthesized epoxy resin. Curing was done with diaminodiphenylmethane (DDM) and bis(3-aminophenyl) phenylphosphine oxide (BAPPO) curing agents denoted as X and Y respectively. Mechanical, thermal, flame retardant, water absorption behaviour and electrical properties of the epoxy nanocomposites were studied and the results are discussed.     

Low-temperature fast curable behavior and properties of bio-based carbon fiber composites based on resveratrol

Environmentally friendly materials are an integral part of sustainable chemistry, and bio-based polymer composites are an important class of materials. The manufacture of composites is expected to reduce or even eliminate the use of adjuvants, considering the importance of reducing energy consumption and avoiding health and environmental risks. In this study, a phenyl-containing, polyfunctional, bio-based epoxy resin (TGER) was synthesized, and carbon fiber-reinforced, bio-based epoxy resin composites were fabricated by vacuum-assisted resin infusion using two aromatic amine curing agents, 4,4′-diaminodiphenylmethane (DDM) and 3,3′-diethyl-4,4′-diaminodiphenylmethane (DEDDM). Curing reactions and rheological behavior studies showed that TGER had higher curing reactivity toward DDM and DEDDM than to diglycidyl ether of bisphenol A (DGEBA) and possessed good processability. The results indicated that the resveratrol-based epoxy resin displayed low-temperature fast curing properties. The evaluation of the mechanical properties of the carbon fiber composites showed that the flexural strengths of CF/TGER/DDM and CF/TGER/DEDDM were 520 and 628 MPa, respectively. The initial decomposition temperature of CF/TGER composites is above 200°C. Furthermore, the carbon fiber–reinforced biopolymers possess excellent heat resistance. Therefore, carbon fiber-reinforced, resveratrol-based epoxy resin composites are promising candidates as alternatives to petroleum-based high-performance carbon fiber composites.     

Studies on the curing kinetics and thermal stability of the novel tetrafunctional epoxy resin N,N,N′N′-tetrakis(2,3-epoxypropyl)-4,4′-(1,4-phenylenedioxy)dianiline

A novel tetrafunctional epoxy resin, namely N,N,N′N′-tetrakis(2,3-epoxypropyl)-4,4′-(1,4-phenylenedioxy)dianiline, has been synthesized. The curing kinetics has been studied by differential scanning calorimetry (DSC) using various amine curing agents. Thermal stabilities of the cured products have been investigated by thermogravimetric (TG) analyses. The overall activation energies for the curing reactions are observed to be in the range 63.6–196.7 kJ·mol^–1. The cured products have good thermal stability.     

Torsional braid analysis of the aromatic amine cure of epoxy resins

The cure behavior of diglycidyl ether of bisphenol A (DGEBA) type of epoxy resins with three aromatic diamines, 4,4′-diaminodiphenyl methane (DDM), 4,4′-diaminodiphenyl sulfone (44DDS), and 3,3′-diaminodiphenyl sulfone (33DDS) was studied by torsional braid analysis. For each curing agent the stoichiometry of the resin mixtures was varied from a two to one excess of amino hydrogens per epoxy group to a two to one excess of epoxy groups per amino hydrogen. Isothermal cures of the resin mixtures were carried out from 70 to 210°C (range depending on epoxy—amine mixture), followed by a temperature scan to determine the glass transition temperature (T_g). The times to the isothermal liquid-to-rubber transition were shortest for the DDM mixtures and longest for the 44DDS mixtures. The liquid-to-rubber transition times were also shortest for the amine excess mixtures when stoichiometry was varied. A relatively rapid reaction to the liquid-to-rubber transition was observed for the epoxy excess mixtures, followed by an exceedingly slow reaction process at cure temperatures well above the T_g. This slow process was only observed for epoxy excess mixtures and eventually led to significant increases in T_g. Using time—temperature shifts of the glass transition temperature vs. logarithm of time, activation energies approximately 50% higher were derived for this process compared to those derived from the liquid-to-rubber transition. The rate of this reaction was virtually independent of curing agent and was attributed to etherification taking place in the epoxy excess mixtures. © 1994 John Wiley & Sons, Inc.     

Cure kinetics and catalyzed effect of hydroxyl group of LC diglycidyl ether of bisphenol‐S with aromatic diamines

The curing reactions of liquid crystalline 4,4′‐bis‐(2,3‐epoxypropyloxy)‐sulfonyl‐bis(1,4‐phenylene) (p‐BEPSBP) with 4,4′‐diaminodiphenylmethane (DDM) and 4,4′‐diaminodiphenylsulfone (DDS) were investigated by nonisothermal differential scanning calorimeter (DSC). The relationships of E_a with the conversion α in the curing process were determined. The catalyzed activation of hydroxyl group for curing reaction of epoxy resins with amine in DSC experiment was discussed. The results show that these curing reactions can be described by the autocatalytic ?esták‐Berggren model. The curing technical temperature and parameters were obtained, and the even reaction orders m, n, and ΔS for p‐BEPSBP/DDM and p‐BEPSBP/DDS are 0.35, 0.92, ?81.94 and 0.13, 1.32, ?24.45, respectively. The hydroxyl group has catalyzed activation for the epoxy–amine curing system in the DSC experiment. The average E_a of p‐BEPSBP/DDM is 67.19 kJ mol^?1 and is 105.55 kJ mol^?1 for the p‐BEPSBP/DDS system, but it is different for the two systems; when benzalcohol as hydroxyl group was added to the curing system, the average E_a of p‐BEPSBP/DDM decreases and increases for p‐BEPSBP/DDS. The crystalline phase had formed in the curing process and was fixed in the system. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Amine-terminated oligoimides for epoxy curing

Oligoimides of N,N′,-4,4′-bismaleimidodiphenyl ether (DDEBM) and 4,4′-diaminodiphenylmethane (DDM) were prepared by the Michael addition reaction. The synthesized oligoimides (DDEBM–DDM) were characterized for their molecular structure by elemental analysis and IR spectroscopy. The number-average molecular weight (M _n) was determined by nonaqueous conductometric titration. Thermal characteristics were studied by thermogravimetry. Use of DDEBM–DDM oligomers as a curing agent for epoxy resin was studied by differential scanning calorimetry (DSC). The resin curing of the epoxy was monitored by the change in oxirane spectral band in the IR spectrum. Glass fiber reinforced composites of DDEBM–DDM-epoxy were prepared and evaluated for their physical and chemical properties. © 1996 John Wiley & Sons, Inc.