用电子束掺杂形成浅结

本文介绍用电子束掺杂形成浅结的方法和实验结果,给出了结深在0.1～0.2μm的掺磷、掺硼、掺砷的掺杂层的载流子沿深度方向的分布曲线,以及用此法作的平面二极管的伏安特性曲线。在5伏下,反向漏电流<1×10~(-8)A。     

ITO玻璃衬底上PLZT铁电薄膜的制备与电性能

用sol-gel法在掺Sn的In2O3导电透明膜(ITO)衬底上,制备了La掺杂的PbZr0.5Ti0.5O3(PLZT)铁电薄膜。研究了La掺杂量对薄膜的铁电、介电和漏电性质的影响。结果表明,x(La)为5%的PLZT薄膜经650℃退火,有优良的铁电特性,外加15V电压下,剩余极化强度为35.4×10–6C/cm2,矫顽场强为111×103V/cm。100kHz时的εr和tgδ分别为984和0.13。在外加电场小于9V时,薄膜的漏电流密度不超过10–8A/cm2。     

GaN紫外探测器的Ti/Al接触的电学特性

在非故意掺杂的和掺Si的GaN薄膜上蒸镀Ti(24nm)/Al(nm)薄膜,氮气环境下400～800℃范围内进行退火。实验结果表明,在非故意掺杂的样品上,随退火温度的升高,肖特基势垒高度下降,理想因子升高,表面状况逐渐变差,600℃退火形成较低接触电阻的欧姆接触,比接触电阻率为3.03×10-4Ωcm2,而载流子浓度为5.88×1018cm-3的掺Si的样品未退火就形成欧姆接触,比接触电阻可达到4.03×10-4Ωcm2。     

超薄高介电Er2O3栅介质薄膜的漏电机理

采用激光分子束外延设备在不同温度下制备了不同厚度的超薄晶态、非晶态高介电Er2O3栅介质薄膜,用X射线衍射和高分辨透射电镜分析了薄膜结构,用HP4142B半导体参数分析仪测试了Al/Er2O3/Si/Al结构MOS电容器的漏电流。XRD谱和HRTEM图像显示400℃以下制备的Er2O3薄膜呈非晶态,400℃到840℃制备的Er2O3薄膜是(111)方向高度择优取向的。电学测试表明：晶态Er2O3薄膜厚度由5.7 nm 减小到3.8 nm,漏电流密度从6.20×10-5 A/cm2突增到6.56×10-4 A/cm2,增加了一个数量级。而厚度3.8 nm的非晶Er2O3薄膜漏电流密度仅为1.73×10-5 A/cm2。漏电流数据分析显示高场下超薄Er2O3薄膜的漏电流主要来自于Fowler-Nordheim隧穿。低场下超薄晶态Er2O3薄膜较大的漏电流是由晶粒边界产生的杂质缺陷引起。     

La掺杂对BLT薄膜微观结构与性能的影响

采用sol-gel工艺低温制备了Si基Bi4–xLaxTi3O12(BLT)铁电薄膜。研究了La掺杂量对薄膜微观结构、介电和铁电性能的影响。结果表明,600～650℃退火处理的BLT薄膜表面平整无裂纹,晶粒均匀,无焦绿石相或其它杂相,薄膜为多晶生长;La掺杂量x在0.5～0.85的BLT薄膜介电与铁电性能优良,其εr和tanδ分别介于284～289和(1.57～1.63)×10–2,4V偏压下薄膜的漏电流密度低于10–8A/cm2,Pr可达(13.0～17.5)×10–6C/cm2,Ec低至(102.5～127.8)×103V/cm。     

溅射法制备BST纳米薄膜电学性能的研究

采用射频磁控溅射与微细加工技术,制得Cu/BST/Pt/Ti/SiO2/Si的MIM(金属-绝缘体-金属)微电容结构。研究了不同退火时间、薄膜厚度对钛酸锶钡(BST)纳米薄膜介电常数和漏电流密度的影响,结果表明,随着退火时间的延长,BST纳米薄膜结晶度提高,介电常数增加,退火30 min的纳米薄膜具有最高的介电常数和较小的漏电流密度。同时还得出介电常数随薄膜厚度的减少而减少,在0.1 MV/cm下,90 nm和50 nm薄膜的漏电流密度分别为5.35×10-8A/cm2和6×10-6A/cm2。     

活性炭-聚吡咯混合电容器的电化学性能

低温下(0℃)化学氧化合成了盐酸掺杂聚吡咯。分别以聚吡咯和活性炭为电极材料组装成电化学电容器。采用扫描电镜、恒流充放电、循环伏安和交流阻抗测试仪研究了混合电容器的电化学性能。结果表明:低温下合成的聚吡咯呈颗粒状堆积,粒径为100～300nm;电流密度为6×10–3A/cm2时,混合电容器在1mol/LNa2SO4电解液中比电容高达178.6F/g,100次循环后比电容为初始容量的88.4%,漏电流仅为0.16×10–3A/cm2。     

重掺碳GaAs层的MOCVD生长及特性研究

采用 CCl4 作为碳掺杂源 ,进行了重掺碳 Ga As层的 L P- MOCVD生长 ,并且对掺杂特性进行了研究 ,研究了各生长参数对掺杂的影响。CCl4 流量是决定掺杂浓度的主要因素。减小生长温度、减小 / 比、降低生长压力 ,都能较大的提高掺杂浓度。通过改变 CCl4 流量 ,在生长温度为5 5 0～ 6 5 0℃、 / 比为 15～ 4 0 ,生长压力在 1× 10 4 ～ 4× 10 4 Pa的范围内 ,均能得到高于 2× 10 19/cm3 的掺碳 Ga As外延层 ,最高掺杂浓度为 8× 10 19/ cm3     

Gd掺杂BiFeO3薄膜的溶胶-凝胶法制备和电性能研究

利用溶胶-凝胶工艺在ITO/玻璃衬底上制备了Bi1-xGdxFeO3(x=0.00、0.05、0.10和0.15)薄膜.研究了Gd掺杂对薄膜的结构、形貌、漏电流性能和介电性能的影响.结果显示,未掺Gd和Gd掺杂为5％的样品为菱方结构,当Gd掺杂量达到10％和15％时,样品变为四方结构.掺10％Gd的薄膜样品表面光滑、平整,晶粒大小均匀.Gd的掺入大大降低了BiFeO3(BFO)薄膜的漏电流,其中掺Gd量为10％和15％的薄膜的漏电流几乎为零.在整个测试频率范围内,掺10％Gd的样品的介电常数较大且能保持恒定,同时其介电损耗最小.     

掺磷低压化学汽相沉淀的硅薄膜

本文对于低压化学汽相沉淀方法沉积的多晶硅薄膜的电导性能进行了研究,并与大气压下沉积的薄膜的导电性能作了比较。低压薄膜在580℃和620℃下沉积成,然后用离子注入法掺入磷。在620℃下沉积的薄膜是多晶膜,而在580℃下沉积的薄膜最初是无定形膜,但经过热处理后,它就变成结晶膜。对于两种不同掺磷剂量的低压膜,研究了退火温度对电阻率的影响,发现电阻率随退火温度的升高而减小。580℃下沉淀的薄膜经退火后,它的电阻率总是比620℃下沉淀的薄膜的电阻率低,而且在退火温度较低的情况下,两者的差别最为显著。在第二组实验中,注入的磷量范围很宽,相当于平均掺杂浓度在2×10~(15)—2×10~(20)cm~(-3)之间。只有在浓度低于2×101~(15)cm~(-3)和高于2×10~(20)cm~(-3)的情况下,电阻率才是掺杂浓度的一个慢变化函数(Slowfunction);而浓度在2×10~(15)cm~(-3)和2×10~(20)cm~(-3)之间时,掺杂浓度稍有改变就会使电阻率发生很大的变化。如上所述,在580℃沉淀的薄膜,其电阻率总是最低,在掺杂浓度居于中间的情况下,这尤其显著。测量了霍尔迁移率,发现它在掺杂浓度近于6×10~(18)cm~(-3)时有一最大值,而且随掺杂浓度降低急速减小。可以预料,所观察到的霍尔迁移率的这种变化特性与薄膜是由含有大量载流子陷阱的晶粒间界环绕的微晶构成这一解释相一致。     

高纯Ta溅射靶材微观组织与织构的EBSD研究

高纯Ta溅射靶材广泛应用于电子信息产品制造业中,其微观组织均匀性、晶粒尺寸大小及晶粒取向分布对溅射性能有着直接的影响。本文采用EBSD技术对高纯Ta溅射靶材不同区域的组织和织构进行了分析,并对高纯Ta溅射靶材的微观组织、织构组分和晶界取向差进行了研究。     

Nb和Co掺杂对PZT铁电薄膜电性能的影响

用sol-gel法在ITO玻璃衬底上制备了不同比例Nb和Co掺杂的PZT铁电薄膜,薄膜呈以(101)为首要方向的多晶结构。结果表明,Co掺杂的PZT薄膜的剩余极化强度、矫顽场强、相对介电常数和漏电流密度均大于PZT薄膜的相应值,但在掺杂x(Nb)为1%~10%内漏电流密度随着Nb掺杂比例的增加而减小,薄膜的剩余极化强度和相对介电常数也有所减小。     

Correlating discrete orientation and grain size to the sputter deposition properties of tantalum

Recent findings indicate that the erosion behavior of tantalum sputtering targets varies across regions of different discrete crystal orientation. Specifically, bands of sharp, localized (100) texture amid the microstructure and aligned parallel to the sputtering surface of planar tantalum targets have been shown to resist erosion. Referencing theoretical models and characterization studies of wrought tantalum, this paper explores the relationship between discrete crystallographic texture and grain size of tantalum with respect to the physical erosion behavior of tantalum sputtering targets. The findings demonstrate that both grain size and preferred orientation contribute to the deposition behavior of tantalum. Also, controlling both the microstructural and textural homogeneity are key to assuring the reliability of Ta targets and the subsequent integrity of the sputter-deposited thin films.     

Oxygen Surface Exchange at Grain Boundaries of Oxide Ion Conductors

The role of grain boundaries on oxygen surface exchange in an oxide ion conductor is reported. Atomic‐scale characterization of the microstructure and chemical composition near the grain boundaries of gadolinia‐doped ceria (GDC) thin films show the segregation of dopants and oxygen vacancies along the grain boundaries using the energy dispersive spectroscopy in scanning transmission electron microscopy (STEM‐EDS). Kelvin probe microscopy is employed to verify the charge distribution near grain boundaries and shows that the grain boundary is positively charged, indicating a high concentration of oxygen vacancies. AC impedance spectroscopy on polycrystalline GDC membranes with thin interfacial layers with different grain boundary densities at the cathodes demonstrated that the cells with higher grain boundary density result in lower electrode impedance and higher exchange current density. These experimental evidences clearly show that grain boundaries on the surface provide preferential reaction sites for facilitated oxygen incorporation into the GDC electrolyte.     

激光送丝堆焊工艺参数对堆焊层组织性能的影响

在45#钢基体上,选用不同的激光功率、扫描速度、送丝速度,用专用焊丝进行堆焊试验。结果表明:当速度不变 时,激光功率增加,其热影响区变大,FeNi基体上析出V8C7组织,由细变粗,硬度增加;当其它条件不变时,随着扫描速度的 增加,堆焊层的稀释率下降,硬度增加,随着送丝速度的增加,堆焊层的组织均匀分布,硬度增加。由此达到优化工艺目的。     

Interface microstructure effects in Au thermosonic ball bonding contacts by high reliability wire materials

Palladium-doped and (Cu, Pt)-doped high reliability gold wires were used to form wire bond interconnects on aluminum IC metallization. By isothermal annealing of wire bond samples the formation of intermetallic Au–Al phases was stimulated. SEM/EBSD investigations of the phase regions exhibited significantly slower isothermal growth rates compared to a reference gold wire. Correlated TEM, STEM–EDXS and nanobeam diffraction analyses revealed that Pd is preferentially incorporated into the Au₈Al₃ intermetallic forming a new stable phase but additionally can obviously form a new Pd-rich ternary intermetallic. In comparison, Cu dopants are also accumulated into a new Al–Au–Cu phase while Pt is rather found agglomerating within grain boundaries and interfaces. These results suggest a diffusion barrier model that allows discussing how wire doping can affect the bond contact microstructure, thus increasing the lifetime of bond contacts.     

纳米ZnO掺杂对压敏阀片电性能和组织的影响

研究了纳米级ZnO粉料对压敏阀片的压敏电压、漏电流和压比的影响,并对其微观结构进行了分析研究,从理论上探讨了纳米ZnO影响压敏阀片电性能与微观结构的机理。研究结果表明,氧化锌压敏阀片中加入纳米ZnO后,其压敏电压显著提高。在质量分数为0~30%的范围内,随着纳米ZnO含量的增加,压敏阀片的压敏电压明显提高,其压比也呈升高趋势。当纳米ZnO含量为30%时,压敏电压约达547.54 V/mm,压比为1.149。在0~10%的范围内,随着纳米ZnO含量的增加,压敏阀片的漏电流呈下降趋势,而在10%~30%的时,漏电流又随纳米ZnO的含量的增加而升高。当纳米ZnO的含量为10%时,漏电流最小,为0.6 mA。     

Effects of annealing in O2 and N2 on the electrical properties of tantalum oxide thin films prepared by electron cyclotron resonance plasma enhanced chemical vapor deposition

The tantalum oxide thin films with a thickness of 14 nm were deposited at 95°C by electron cyclotron resonance plasma enhanced chemical vapor deposition (ECRPECVD), and annealed at various temperatures (700∼850°C) in O₂ and N₂ ambients. The microstructure and composition of the tantalum oxide thin films and the growth of interfacial silicon oxide layer were investigated and were related to the electrical characteristics of the film. Annealing in an O₂ ambient led to a high dielectric constant (ε_r(Ta₂O₅) = 24) as well as a small leakage current (E_bd = 2.3 MV/cm), which were due to the improved stoichiometry and the decreased impurity carbon content. Annealing in an N₂ ambient resulted in poor and nonuniform leakage current characteristics. The as-deposited tantalum oxide films were crystallized into δ-Ta₂O₅ after annealing at above 750°C regardless of the ambient. The leakage current of the film abruptly increased after annealing at 850°C probably because of the stress caused by thermal expansion or contraction.     

CuO和V_2O_5对MnZn功率铁氧体性能的影响

采用氧化物陶瓷工艺制备了分子组成为Mn0.69Zn0.24Fe2.07O4的MnZn功率铁氧体,研究了不同CuO和V2O5含量对MnZn功率铁氧体晶相、显微形貌和磁性能的影响。结果表明,添加CuO和V2O5可促进晶粒生长,增大晶格常数,适量添加可降低气孔率,提高起始磁导率和电阻率,降低损耗;而加入过多的CuO和V2O5会导致晶粒异常长大,气孔率增加,起始磁导率和电阻率降低,损耗增大。当w(V2O5)=2.76×10-2%,w(CuO)=1.2×10-2%时,烧结样品的晶粒最均匀致密,气孔率最低,起始磁导率和电阻率最大,损耗最低。     

影响电解电容器漏电流的因素

以铝和钽电解电容器为例,特别强调了原材料对漏电流值的影响;分析了工作温度的影响作用,除了一般的离子电导随着温度上升而成指数式增加的规律外,还指出了由于各类电容器有各自的特点,因此所受的影响也各不相同,具有一定的参考价值.