A Short Range, Low Data Rate, 7.2 GHz-7.7 GHz FM-UWB Receiver Front-End

A 9 mW FM-UWB receiver front-end for low data rate ( $≪$$ hbox{50~kbps}$), short range ( $≪$$hbox{10~m}$) applications operating in the ultra-wideband (UWB) band centered at 7.45 GHz is described in this paper. A single-ended-to-differential preamplifier with 30 dB voltage gain, a 1 GHz bandwidth FM demodulator, and a combined (preamp/demodulator) receiver front-end were fabricated in 0.25 $muhbox{m}$ SiGe:C BiCMOS and characterized. Measured receiver sensitivity is $-hbox{85.8~dBm}$ while consuming 9 mW from a 1.8 V supply, and $-hbox{83~dBm}$ consuming 6 mW at 1.5 V. 15-20 m range line-of-sight in an indoor environment is realized, justifying FM-UWB as a robust radio technology for short range, low data rate applications. Multi-user and interference capabilities are also evaluated.      

$hbox{HfO}_{x}$ Bipolar Resistive Memory With Robust Endurance Using AlCu as Buffer Electrode

A novel method of fabricating $hbox{HfO}_{x}$-based resistive memory device with excellent nonvolatile characteristics is proposed. By using a thin AlCu layer as the reactive buffer layer into the anodic side of a capacitor-like memory cell, excellent memory performances, which include reliable programming/erasing endurance $(≫ hbox{10}^{5} hbox{cycles})$, robust data retention at high temperature, and fast operation speed ( $≪$ 50 ns), have been demonstrated. The resistive memory based on AlCu/$hbox{HfO}_{x}$ stacked layer in this letter shows promising application in the next generation of nonvolatile memory.      

Positive Bias Temperature Instability (PBTI) Characteristics of Contact-Etch-Stop-Layer-Induced Local-Tensile-Strained $hbox{HfO}_{2}$ nMOSFET

The positive bias temperature instability (PBTI) characteristics of contact-etch-stop-layer (CESL)-strained $hbox{HfO}_{2}$ nMOSFET are thoroughly investigated. For the first time, the effects of CESL on an $hbox{HfO}_{2}$ dielectric are investigated for PBTI characteristics. A roughly 50% reduction of $V_{rm TH}$ shift can be achieved for the 300-nm CESL $hbox{HfO}_{2}$ nMOSFET after 1000-s PBTI stressing without obvious $ hbox{HfO}_{2}/hbox{Si}$ interface degradation, as demonstrated by the negligible charge pumping current increase ($≪$ 4%). In addition, the $hbox{HfO}_{2}$ film of CESL devices has a deeper trapping level (0.83 eV), indicating that most of the shallow traps (0.75 eV) in as-deposited $ hbox{HfO}_{2}$ film can be eliminated for CESL devices.      

Integrated Hydrogen-Sensing Amplifier With GaAs Schottky-Type Diode and InGaP–GaAs Heterojunction Bipolar Transistor

New hydrogen-sensing amplifiers are fabricated by integrating a GaAs Schottky-type hydrogen sensor and an InGaP–GaAs heterojunction bipolar transistor. Sensing collector currents ( $I_{rm CN}$ and $I_{rm CH}$) reflecting to $hbox{N}_{2}$ and hydrogen-containing gases are employed as output signals in common-emitter characteristics. Gummel-plot sensing characteristics with testing gases as inputs show a high sensing-collector-current gain $(I_{rm CH}/I_{rm CN})$ of $≫hbox{3000}$. When operating in standby mode for in situ long-term detection, power consumption is smaller than 0.4 $muhbox{W}$. Furthermore, the room-temperature response time is 85 s for the integrated hydrogen-sensing amplifier fabricated with a bipolar-type structure.      

Novel NiGe MSM Photodetector Featuring Asymmetrical Schottky Barriers Using Sulfur Co-Implantation and Segregation

We report the first demonstration of a novel germanium (Ge) metal–semiconductor–metal (MSM) photodetector featuring asymmetrical Schottky-barrier height for low dark current and high-speed photodetection applications. Through co-implantation and segregation of valence-mending adsorbate such as sulfur at the NiGe/Ge interface, the germanide Fermi level can be pinned close to the conduction band edge. This results in an effective modulation of hole Schottky-barrier height, leading to a significant dark current suppression by $≫$3 orders of magnitude over a conventional MSM photodetector. When operated at a bias voltage $V_{A}$ of 1.0 V, a detector with an area of 804 $muhbox{m}^{2}$ shows a spectrum response of $sim$0.36 A/W or a corresponding quantum efficiency of $sim$34%. In addition, a frequency response measurement reveals the achievement of a $-$3-dB bandwidth of $sim!$15 GHz at an illumination photon wavelength of 1550 nm.      

A 2.4–2.5 GHz WLAN Direct-Conversion Receiver Front-End With Low-Distortion Baseband Filters

Low-distortion I/Q baseband filters interface with a 2.5 GHz RF receiver front-end configured as a Gm-cell in a direct-conversion architecture targeted towards WLAN 802.11b application. The active I/Q current-mode filters use AC current to carry the large swing of both desired and blocker signals, relaxing the voltage headroom requirement to a 1.2 V supply. An on chip master–slave automatic tuner is used to lock the filter bandwidth to a precision 20 MHz reference crystal oscillator, resulting in a $≪ ,$3% tuning accuracy and $≪, $ 0.5% I/Q bandwidth matching. The receiver achieves a 3.2 dB DSB NF, ${-}$14 dBm out-of-band IIP3, and ${+}$ 27 dBm worst case IIP2, all referred to the LNA input, while drawing 30mA from a 2.7 V supply. The chip is fabricated in a 0.5 $mu$m 46 GHz $f_{T}$ SiGe BiCMOS process. The active area is 2.54 mm$^{2}$ .      

A Silicon-Germanium Receiver for X-Band Transmit/Receive Radar Modules

This work investigates the potential of commercially-available silicon-germanium (SiGe) BiCMOS technology for X-band transmit/receive (T/R) radar modules, focusing on the receiver section of the module. A 5-bit receiver operating from 8 to 10.7 GHz is presented, demonstrating a gain of 11 dB, and average noise figure of 4.1 dB, and an input-referred third-order intercept point $({hbox{IIP}}_{3})$ of $-$13 dBm, while only dissipating 33 mW of power. The receiver is capable of providing 32 distinct phase states from 0 to 360$^{circ}$ , with an rms phase error $≪ !{hbox{9}}^{circ}$ and an rms gain error $≪ ,$0.6 dB. This level of circuit performance and integration capability demonstrates the benefits of SiGe BiCMOS technology for emerging radar applications, making it an excellent candidate for integrated X-band phased-array radar transmit/receive modules.      

Resistive Switching Properties of $hbox{Au}/ hbox{ZrO}_{2}/hbox{Ag}$ Structure for Low-Voltage Nonvolatile Memory Applications

The reliable resistive switching properties of $hbox{Au}/hbox{ZrO}_{2}/ hbox{Ag}$ structure fabricated with full room temperature process are demonstrated in this letter. The tested devices show low operation voltages ($≪hbox{1}$ V), high resistance ratio (about $hbox{10}^{4}$), fast switching speed (50 ns), and reliable data retention (ten years extrapolation at both RT and 85 $^{circ}hbox{C}$). Moreover, the benefits of high yield and multilevel storage possibility make them promising in the next generation nonvolatile memory applications.      

Effect of Hole-Trap Distribution on the Power-Law Time Exponent of NBTI

This letter presents a phenomenological relationship between the energy distribution of stress-induced hole traps and the power-law time exponent of NBTI. Experimental results show that increased generation of deep-level hole traps (DLHTs), i.e., trap-energy levels are near and/or above the Si conduction-band edge, yields a small exponent ($≪hbox{0.2}$). Annealing the DLHTs results in the exponent increasing to $sim$0.3. Measurement on the n-MOSFET (in which the effect of DLHTs is suppressed) shows an exponent of $sim$ 0.4–0.5 for interface-state generation. This implies that the relatively small exponent ( $sim$0.3) of the p-MOSFET is due to remnant DLHTs which charge-up positively again when subjected to negative gate biasing during measurement. This new insight calls for a reexamination of the notion that as-measured exponents of $sim$ 0.14–0.17 are experimental proof of $hbox{H}_{2}$ -diffusion-driven interface-state generation.      

Erase and Retention Improvements in Charge Trap Flash Through Engineered Charge Storage Layer

The simultaneous improvement in the erase and retention characteristics in a TANOS $(hbox{TaN}{-}hbox{Al}_{2}hbox{O}_{3}{-}hbox{Si}_{3}hbox{N}_{4}{-}break hbox{SiO}_{2}{-}hbox{Si})$ Flash memory transistor by utilizing the band-engineered and compositionally graded $hbox{SiN}_{x}$ trap layer is demonstrated. With the process optimizations, a $≫ hbox{4}$ V memory window and excellent 150 $^{circ}hbox{C}$ 24-h retention (0.1–0.5 V charge loss) for a programmed $Delta V_{t} = hbox{4} hbox{V}$ with respect to the initial state are obtained. The band-engineered $hbox{SiN}_{x}$ charge storage layer enables Flash scaling beyond the floating-gate technology with a promise for improved erase speed, retention, lower supply voltages, and multilevel cell applications.      

Separate Absorption-Charge Multiplication Heterojunction Phototransistors With the Bandwidth-Enhancement Effect and Ultrahigh Gain-Bandwidth Product Under Near Avalanche Operation

We demonstrate a high-performance heterojunction phototransistor (HPT): separate absorption-charge multiplication HPT. The incorporation of an $hbox{In}_{0.52}hbox{Al}_{0.48} hbox{As}$-based multiplication layer in the $hbox{In}_{0.53} hbox{Ga}_{0.47}hbox{As}$-based collector layer of our HPT allows for a great shortening of the trapping time ($sim$ns to $ sim$30 ps) of electrons at the base–emitter junction under near avalanche operation, without sacrificing the gain performance. The interaction between the photoconductive gain and avalanche gain means that it is not necessary to use high bias voltages ($≫ hbox{30} hbox{V}$ ) in our device to attain high-gain $(≫ hbox{1} times hbox{10}^{4})$ performance. With this device design, we can achieve an extremely high (90 THz) gain-bandwidth product (1.6 GHz, $hbox{5.5} times hbox{10}^{4}$ ) under a 6-V bias.      

Sub-Minute Response Time of a Hollow-Core Photonic Bandgap Fiber Gas Sensor

A hollow-core photonic bandgap (PBG) fiber sensing configuration for optical absorption spectroscopy of multiple-component gas samples absent of a vacuum environment is presented. Pressure-driven sensor response times that are shorter in duration compared to diffusion-limited filling times for fiber lengths ${>}1$ m are reported. Reduced filling times that approach the sub-minute regime are possible for a ${sim} {hbox {2}}$ meter length of commercially available PBG fiber with a 12.5 micron core diameter at a pressure ${≪}15$ Psi. The spectroscopy measurements were limited to the near-IR region for sample gases that include acetylene and carbon dioxide. Using the techniques presented, the detection of concentrations ${≪}100$ ppm for acetylene gas at pressures ${≪}15$ Psi is possible.      

$hbox{TiN/ZrO}_{2}$/Ti/Al Metal–Insulator–Metal Capacitors With Subnanometer CET Using ALD-Deposited $hbox{ZrO}_{2}$ for DRAM Applications

We provide the first report of the structural and electrical properties of $hbox{TiN/ZrO}_{2}$/Ti/Al metal–insulator–metal capacitor structures, where the $hbox{ZrO}_{2}$ thin film (7–8 nm) is deposited by ALD using the new zirconium precursor ZrD-04, also known as Bis(methylcyclopentadienyl) methoxymethyl. Measured capacitance–voltage ($C$– $V$) and current–voltage ( $I$–$V$) characteristics are reported for premetallization rapid thermal annealing (RTP) in $hbox{N}_{2}$ for 60 s at 400 $^{circ}hbox{C}$, 500 $^{circ}hbox{C}$, or 600 $^{ circ}hbox{C}$. For the RTP at 400 $^{circ}hbox{C}$ , we find very low leakage current densities on the order of nanoamperes per square centimeter at a gate voltage of 1 V and low capacitance equivalent thickness values of $sim$ 0.9 nm at a gate voltage of 0 V. The dielectric constant of $ hbox{ZrO}_{2}$ is 31 $pm$ 2 after RTP treatment at 400 $^{circ}hbox{C}$.      

10-GHz and 20-GHz Channel Spacing High-Resolution AWGs on InP

This letter reports on 10-GHz and 20-GHz channel-spacing arrayed waveguide gratings (AWGs) based on InP technology. The dimensions of the AWGs are 6.8$,times,$8.2 mm$^{2}$ and 5.0$,times,$6.0 mm$^{2}$, respectively, and the devices show crosstalk levels of $-$12 dB for the 10-GHz and $-$17 dB for the 20-GHz AWG without any compensation for the phase errors in the arrayed waveguides. The root-mean-square phase errors for the center arrayed waveguides were characterized by using an optical vector network analyzer, and are 18 $^{circ}$ for the 10-GHz AWG and 28$^{circ}$ for the 10-GHz AWG.      

An Analytical Method to Extract the Physical Parameters of a Solar Cell From Four Points on the Illuminated $J{-}V$ Curve

For a variety of solar cells, it is shown that the single exponential $J{-}V$ model parameters, namely—ideality factor $eta$ , parasitic series resistance $R_{s}$, parasitic shunt resistance $R_{rm sh}$, dark current $J_{0}$, and photogenerated current $J_{rm ph}$ can be extracted simultaneously from just four simple measurements of the bias points corresponding to $V_{rm oc}$, $sim!hbox{0.6}V_{rm oc}$, $J_{rm sc}$, and $sim! hbox{0.6}J_{rm sc}$ on the illuminated $J{-}V$ curve, using closed-form expressions. The extraction method avoids the measurements of the peak power point and any $dJ/dV$ (i.e., slope). The method is based on the power law $J{-}V$ model proposed recently by us.      

1580-V–40-$hbox{m}Omegacdot hbox{cm}^{2}$ Double-RESURF MOSFETs on 4H-SiC $(hbox{000}bar{hbox{1}})$

Double-reduced-surface-field (RESURF) MOSFETs with $hbox{N}_{2}hbox{O}$ -grown oxides have been fabricated on the 4H-SiC $(hbox{000} bar{hbox{1}})$ face. The double-RESURF structure is effective in reducing the drift resistance, as well as in increasing the breakdown voltage. In addition, by utilizing the 4H-SiC $(hbox{000}bar{hbox{1}})$ face, the channel mobility can be increased to over 30 $hbox{cm}^{2}/hbox{V}cdothbox{s}$, and hence, the channel resistance is decreased. As a result, the fabricated MOSFETs on 4H-SiC $( hbox{000}bar{hbox{1}})$ have demonstrated a high breakdown voltage $(V_{B})$ of 1580 V and a low on-resistance $(R_{rm ON})$ of 40 $hbox{m}Omega cdothbox{cm}^{2}$. The figure-of-merit $(V_{B}^{2}/R_{rm ON})$ of the fabricated device has reached 62 $hbox{MW/cm}^{2}$, which is the highest value among any lateral MOSFETs and is more than ten times higher than the “Si limit.”      

High Microwave-Noise Performance of AlGaN/GaN MISHEMTs on Silicon With Gate Insulator Grown by ALD

High microwave-noise performance is realized in AlGaN/GaN metal–insulator semiconductor high-electron mobility transistors (MISHEMTs) on high-resistivity silicon substrate using atomic-layer-deposited (ALD) $hbox{Al}_{2}hbox{O}_{3}$ as gate insulator. The ALD $hbox{Al}_{2}hbox{O}_{3}/hbox{AlGaN/GaN}$ MISHEMT with a 0.25- $muhbox{m}$ gate length shows excellent microwave small signal and noise performance. A high current-gain cutoff frequency $f_{T}$ of 40 GHz and maximum oscillation frequency $f_{max}$ of 76 GHz were achieved. At 10 GHz, the device exhibits low minimum-noise figure $(hbox{NF}_{min})$ of 1.0 dB together with high associate gain $(G_{a})$ of 10.5 dB and low equivalent noise resistance $(R_{n})$ of 29.2 $Omega$. This is believed to be the first report of a 0.25-$muhbox{m}$ gate-length GaN MISHEMT on silicon with such microwave-noise performance. These results indicate that the AlGaN/GaN MISHEMT with ALD $hbox{Al}_{2}hbox{O}_{3}$ gate insulator on high-resistivity Si substrate is suitable for microwave low-noise applications.      

Comparison of the Mean Time Between Failures for Two Systems Under Short Tests

A Sequential Probability Ratio Test (SPRT) is discussed, for comparison of two systems, one “basic” $(b)$, and the other “new” $(n)$, with exponentially distributed times between failures (TBF). The hypothesis that the mean $TBF_{n}/MTBF_{b}geq 1$ is checked, versus one that it is $≪$ 1. The paper deals with tests with a low Average Sample Number (ASN), having the advantage of economy in time requirement, and cost; and it is shown that the points of possible solutions in them are sparse. Criteria are proposed for assessment of the test quality, with a view to optimization of its parameters. We present a search algorithm for the truncation apex (TA), with dependences for the search domain, and for the position of the oblique test boundaries, serving jointly as the basis for our development of the test planning algorithm.      

Characterization and Modeling of RF-Performance $(f_{T})$ Fluctuation in MOSFETs

The fluctuation of RF performance (particularly for $f_{T}$ : cutoff frequency) in the transistors fabricated by 90-nm CMOS technology has been investigated. The modeling for $f_{T}$ fluctuation is well fitted with the measurement data within approximately 1% error. Low-$V_{t}$ transistors (fabricated by lower doping concentration in the channel) show higher $f_{T}$ fluctuation than normal transistors. Such a higher $f_{T}$ fluctuation results from $C_{rm gg}$ (total gate capacitance) variation rather than $g_{m}$ variation. More detailed analysis shows that $C_{rm gs} + C_{rm gb}$ (charges in the channel and the bulk) are predominant factors over $C_{rm gd}$ (charges in LDD/halo region) to determine $C_{rm gg}$ fluctuation.      

180$^{circ}$ and 90$^{circ}$ Phase Shifting Networks With an Octave Bandwidth and Small Phase Errors

A new phase shifting network for both 180 $^{circ}$ and 90 $^{circ}$ phase shift with small phase errors over an octave bandwidth is presented. The theoretical bandwidth is 67% for the 180$^{circ}$ phase bit and 86% for the 90$^{circ}$ phase bit when phase errors are $pm 2^{circ}$. The proposed topology consists of a bandpass filter (BPF) branch, consisting of a LC resonator and two shunt quarter-wavelength transmission lines (TLs), and a reference TL. A theoretical analysis is provided and scalable parameters are listed for both phase bits. To test the theory, phase shifting networks from 1 GHz to 3 GHz were designed. The measured phase errors of the 180$^{circ}$ and the 90$^{circ}$ phase bit are $pm 3.5^{circ}$ and $pm 2.5^{circ}$ over a bandwidth of 73% and 102% while the return losses are better than 18 dB and 12 dB, respectively.