一种低噪声高线性度射频前端电路设计

介绍了超高频接收系统射频前端电路的芯片设计。从噪声匹配、线性度、阻抗匹配以及增益等方面详细讨论了集成低噪声放大器和下变频混频器的设计。电路采用硅基0.8μm B iCM O S工艺实现,经过测试,射频前端的增益约为18 dB,双边带噪声系数2.5 dB,IIP 3为+5 dBm,5 V工作电压下的消耗电流仅为3.4 mA。     

用于IEEE802．11b／g WLAN直接下变频接收机的射频前端设计

介绍了一种应用于IEEE802．11b／g无线局域网接收机射频前端的设计。基于直接下变频的系统架构。接收机集成了低噪声放大器、I／Q下变频器、去直流偏移滤波器、基带放大器和信道选择滤波器。电路采用TSMC0．18μm CMOS工艺设计,工作在2．4GHz ISM（工业、科学和医疗）频段,实现的低噪声放大器噪声系数为0．84dB,增益为16dB,S11低于-15dB,功耗为13mW;I／Q下变频器电压增益为2dB,输入1dB压缩点为-1 dBm,噪声系数为13dB,功耗低于10mw。整个接收机射频前端仿真得到的噪声系数为3．5dB,IIP3为-8dBm,IP2大于30dBm,电压增益为31dB,功耗为32mW。     

一种高线性度CMOS有源混频器的设计

设计了一个用于数字电视ZERO-IF结构接收机射频前端的CMOS下变频混频器。基于对有源混频器的噪声机制及线性度的物理理解,对传统的有源混频器电路采用电流注入技术,实现了增益,噪声和线性度折中。电路采用UMC0.18RFCMOS工艺实现,SSB噪声系数为18dB,1/f噪声拐角频率100kHz。电压转换增益为5dB和8dB两档增益,输入1dB压缩点为0dBm,IIP3为15dBm（5dB增益）,7dBm（8dB增益）。全差分电路在1.8V供电电压下的功耗不到7mW,可以满足数字电视零中频结构射频前端对高线性度、低闪烁噪声和可变增益的要求。     

一种应用于LTE直接变频无声表滤波器接收机的1.2-V CMOS前端设计

本文提出了一种应用于LTE直接变频接收机的CMOS射频前端电路。电路由低噪声跨导放大器（LNA）,电流型无源混频器和跨阻运算放大器（TIA）组成,该结构对于LTE多频带应用具有高集成,高线性,并实现简单的频率配置。电路采用多个电流舵跨导级实现了大的可变增益控制范围。电流型无源混频器采用25%占空比本振改善了电路增益、噪声和线性性能。为了抑制带外干扰,采用直接耦合电流输入滤波器。该射频前端电路采用0.13-μm CMOS工艺设计制造。测试结果表明电路在2.3GHz到2.7GHz工作频率范围,具有45dB电压转换增益,噪声系数为2.7dB,IIP3为-7dBm以及校准后的IIP2为 60dBm。电路采用1.2V单电压供电,整个电路工作电流为40mA。     

2.4GHz带片上非平衡变压器射频前端的设计与优化

本文介绍了一种工作在2.4GHz频段的低功耗、低噪声、高线性射频接收机前端电路,该接收前端电路使用新型的带三种增益模式的LNA,并提出一种新的片上非平衡变压器优化技术。前端电路采用了直接变频结构,使用片上非平衡变压器实现低噪声放大器与下变频混频器之间的单端-差分转换,优化设计以提高前端电路的噪声性能。本文使用锗硅0.35um BiCMOS工艺,所采用的技术同样适用于CMOS工艺。前端电路总的最大转换增益为36dB;在高增益模式下的双边带噪声系数为3.8dB;低增益模式下,输入三阶交调点位12.5dBm。为了获得最大的输入动态范围,低噪声放大器采用三种可调增益模式,低增益模式使用by-pass结构,大大提高了大信号输入下接收前端的线性度。下变频混频器在输出端使用可调R-C tank,滤除带外高频杂波。混频器输出使用射极跟随器作为输出极驱动片外50ohm负载。该接收前端在2.85-V电源供电下,功耗为33mW,芯片面积为0.66mm2。     

一种混合信号传输的低场核磁共振读出电路

提出了一种应用于低场核磁共振的采用混合信号传输的读出电路。该读出电路系统主要由前端放大器、接收机与后端模数转换器组成。提出的混合信号传输技术的本质在于利用相位域与电压域的混合模式检测,以及放大器与模数转换器之间的增益分配来增强线性度。采用0.18 μm CMOS工艺设计,仿真结果表明,在1.2 V的电源电压下,整体电路的功耗为0.5 mW,前端放大器的输入1 dB压缩点与IIP3分别为-9.31 dBm和-5.98 dBm,接收机的等效输入噪声仅为2 nV·Hz-1/2。     

UHF RFID接收机中混频器的IP2/IP3性能改进

根据UHF射频识别的应用、结合提出的接收前端结构,对所需的射频前端中混频器线性度要求做出分析,给出了决定IP2、IP3值的因素。在不影响系统噪声性能的条件下,提出了基于共模信号反馈、复用补偿电流路径的IP2改进办法;源极负反馈,低输出阻抗的IP3改进办法。混频器采用UMC0.18μm RF CMOS工艺实现,在3.3 V供电、抽取8.7 mA电流条件下,采用带外线性度的测试办法,测得23个样品的IP3平均值为15 dBm;采用FIB断开校正电路的试验表明,混频器的IP2有明显的提升(从37 dBm到52 dBm)。     

基于WCDMA接收机系统的低噪声放大器设计

介绍了低噪声放大器的基本工作原理,并对噪声源进行了分析。提出了采用先进的TSMC90 nm工艺,设计了一种基于WCDMA接收机系统的全差分拓扑共源共栅型低噪声放大器。该放大器片内集成了电感、电容,片外配置匹配网络。芯片测试结果表明:电路在2 GHz工作频率下,电压增益达到20 dB、噪声系数NF为1.4 dB、IIP3为-3.43 dBm。综合各项数据表明,该低噪声放大器具备良好的性能,可广泛适用于通讯系统之中。     

一种2.4 GHz CMOS射频前端电路

基于0.18 μm CMOS工艺,设计了一种面向低速率低功耗应用的2.4 GHz射频前端电路,包含2个单刀双掷开关、1个功率放大器和1个低噪声放大器。采用栅衬浮动电压偏置技术对传统单刀双掷开关进行了改进,以提高其线性度;功率放大器采用两级放大结构,对全集成的低噪声放大器进行了噪声优化;集成了输入输出匹配网络,采用了到地电感,以提高输入输出端的ESD性能。在接收模式时,电路的静态电流为10.7 mA,增益为11.7 dB,IIP3为2.1 dBm,噪声系数为3.4 dB。在发射模式时,电路的静态电流为17.4 mA,功率增益为17.7 dB,输出P1dB为20 dBm,饱和功率为21.4 dBm,最大PAE为23.8%,在输出功率为20 dBm时的频谱满足802.15.4协议要求。     

一种应用于DRM/DAB/DVB-H的噪声抵消和IP3改进的CMOS射频前端设计

本文给出了一种应用于数字广播标准的CMOS射频前端电路芯片,其包括宽带低噪声放大器、正交混频器和可变增益放大器,该前端能够支持200kHz-2GHz频率范围内的多种无线通信标准,该电路在没有牺牲其他电路性能包括电压增益和功耗的情况下,改善了NF和IP3。通过噪声抵消技术降低前端的NF,通过差分多栅晶体管结构（DMGTR）提高前端的IP3。dB线性可变增益放大器的增益控制通过采用工作在线性区的PMOS晶体管来实现。芯片采用0.18um CMOS工艺实现。测试结果表明在200kHz-2GHz范围内S11小于-11.4,增益变化范围在250MHz为12-42dB,在2GHz为4-36dB。单边带NF为3.1-6.1 dB。在中等增益情况下IIP3为-4.7-2.0dBm。整个前端在1.8V电源电压情况下功耗仅仅为36mW。     

A dual-band RF front-end for WCDMA and GSM applications

An RF front-end for dual-band dual-mode operation is presented. The front-end consumes 22.5 mW from a 1.8-V supply and is designed to be used in a direct-conversion WCDMA and GSM receiver. The front-end has been fabricated in a 0.35-μm BiCMOS process and, in both modes, can use the same devices in the signal path except the LNA input transistors. The front-end has a 27-dB gain control range, which is divided between the LNA and quadrature mixers. The measured double-sideband noise figure and voltage gain are 2.3 dB, 39.5 dB, for the GSM and 4.3 dB, 33 dB for the WCDMA, respectively. The linearity parameters IIP3 and IIP2 are -19 dBm, +35 dBm for the GSM and -14.5 dBm and +34 dBm for the WCDMA, respectively     

RF front-end of direct conversion receiver RFIC for cdma-2000

We report on the front-end of a highly integrated dual-band direct-conversion receiver IC for cdma-2000 mobile handset applications. The RF front-end included a CELL-band low-noise amplifier (LNA), dual-band direct-conversion quadrature I/Q down-converters, and a local-oscillator (LO) signal generation circuit. At 2.7 V, the LNA had a noise figure of 1.2 dB and input third-order intermodulation product (IIP3) of 9 dBm. I/Q down-converters had a noise figure of 4-5 dB and IIP3 of 4-5 dBm and IIP2 of 55 dBm. An on-chip phase-locked loop and external voltage-controlled oscillator generated the LO signal. The receiver RFIC was implemented in a 0.35-/spl mu/m SiGe BiCMOS process and meets or exceeds all cdma-2000 requirements when tested individually or on a handset.     

一个双频带可重构的直接变频接收机射频前端

A dual-band reconfigurable wireless receiver RF front-end is presented, which is based on the directconversion principle and consists of a low noise amplifer （LNA） and a down-converter. By utilizing a compact switchable on-chip symmetrical inductor, the RF front-end could be switched between two operation frequency bands without extra die area cost. This RF front-end has been implemented in the 180 nm CMOS process and the measured results show that the front-end could provide a gain of 25 dB and IIP3 of 6 dBm at 2.2 GHz, and a gain of 18.8 dB and IIP3 of 7.3 dBm at 4.5 GHz. The whole front-end consumes 12 mA current at 1.2 V voltage supply for the LNA and 2.1 mA current at 1.8 V for the mixer, with a die area of 1.2 × 1 mm^2.     

A low power direct conversion receiver RF front-end with high in-band IIP2/IIP3 and low 1/f noise

A low power direct-conversion receiver RF front-end with high in-band IIP2/IIP3 and low 1/f noise is presented. The front-end includes the differential low noise amplifier, the down-conversion mixer, the LO buffer, the IF buffer and the bandgap reference. A modified common source topology is used as the input stages of the down-conversion mixer (and the LNA) to improve IIP2 of the receiver RF front-end while maintaining high IIP3. A shunt LC network is inserted into the common-source node of the switching pairs in the down-conversion mixer to absorb the parasitic capacitance and thus improve IIP2 and lower down the 1/f noise of the down-conversion mixer. The direct-conversion receiver RF front-end has been implemented in 0.18 μm CMOS process. The measured results show that the 2 GHz receiver RF front-end achieves +33 dBm in-band IIP2, 21 dB power gain, 6.2 dB NF and −2.3 dBm in-band IIP3 while only drawing 6.7 mA current from a 1.8 V power supply.     

A low power 3-5 GHz CMOS UWB receiver front-end

A novel low power RF receiver front-end for 3-5 GHz UWB is presented. Designed in the 0.13μm CMOS process, the direct conversion receiver features a wideband balun-coupled noise cancelling transconductance input stage, followed by quadrature passive mixers and transimpedance loading amplifiers. Measurement results show that the receiver achieves an input return loss below-8.5 dB across the 3.1-4.7 GHz frequency range, max-imum voltage conversion gain of 27 dB, minimum noise figure of 4 dB, IIP3 of-11.5 dBm, and IIP2 of 33 dBm. Working under 1.2 V supply voltage, the receiver consumes total current of 18 mA including 10 mA by on-chip quadrature LO signal generation and buffer circuits. The chip area with pads is 1.1 × 1.5 mm2.     

A low voltage CMOS RF front-end for IEEE 802.11b WLAN transceiver

A low voltage CMOS RF front-end for IEEE 802.11b WLAN transceiver is presented. The problems to implement the low voltage design and the on-chip input/output impedance matching are considered, and some improved circuits are presented to overcome the problems. Especially, a single-end input, differential output double balanced mixer with an on-chip bias loop is analyzed in detail to show its advantages over other mixers. The transceiver RF front-end has been implemented in 0.18 um CMOS process, the measured results show that the Rx front-end achieves 5.23 dB noise figure, 12.7 dB power gain (50 ohm load), −18 dBm input 1 dB compression point (ICP) and −7 dBm IIP3, and the Tx front-end could output +2.1 dBm power into 50 ohm load with 23.8 dB power gain. The transceiver RF front-end draws 13.6 mA current from a supply voltage of 1.8 V in receive mode and 27.6 mA current in transmit mode. The transceiver RF front-end could satisfy the performance requirements of IEEE802.11b WLAN standard. Supported by the National Natural Science Foundation of China, No. 90407006 and No. 60475018.     

A 5-GHz highly integrated receiver front-end

In this paper a radio front-end for a IEEE 802.11a and HIPERLAN2 sliding-IF receiver is presented. The circuit, implemented in a low-cost 46-GHz-f _T silicon bipolar process, includes a variable-gain low noise amplifier and a double-balanced mixer. Thanks to monolithic LC filters and on-chip single-ended-to-differential conversion of the RF signal, the proposed solution does not require the expensive image rejection filter and an external input balun. The receiver front-end exhibits a 4.3-dB noise figure and a power gain of 21 dB, providing an image rejection ratio higher than 50 dB. By using a 1-bit gain control, it achieves an input 1-dB compression point of −11 dBm, while drawing only 22 mA from a 3-V supply voltage.     

应用于GSM/EDGE零中频接收机的CMOS射频前端

介绍了一个零中频接收机CMOS射频前端,适用于双带(900MHz/1800 MHz)GSM/EDGE;E系统.射频前端由两个独立的低噪声放大器和正交混频器组成,并且为了降低闪烁噪声采用了电流模式无源混频器.该电路采用0.13 μm CMOS工艺流片,芯片面积为0.9 mm×1.0 mm.芯片测试结果表明:射频前端在90...     

A 1.9-GHz silicon receiver with monolithic image filtering

A 1.9-GHz fully monolithic silicon superheterodyne receiver front-end is presented; it consists of a low noise amplifier (LNA), a tunable image reject filter, and a Gilbert cell mixer integrated in one die. The receiver was designed to operate with a 1.9-GHz RF and a 2.2-GHz local oscillator (LO) for a 300-MHz IF. Two chip versions were fabricated on two different fabrication runs using a 0.5-μm bipolar technology with 25 GHz transit frequency (f_T). Measured performance for the receiver front-end version 1, packaged and without input matching, was: conversion gain 33.5 dB, noise figure 4.9 dB, input IP3 -28 dBm, image rejection 53 dB (tuned to reject a 2.5-GHz image frequency), and 15.9 mA current consumption at +3 V. The image rejection was tunable from 2.4-2.63 GHz by means of an on-chip varactor. Version 2 had increased mixer degeneration for improved linearity. Its measured performance for the packaged receiver with its input matched to 50 Ω was: conversion gain 24 dB, noise figure 4.8 dB, input IP3 -19 dBm, and 65 dB image rejection for a 2.5-GHz image with an image tuning range from 2.34-2.55 GHz     

A 1.5-V 45-mW direct-conversion WCDMA receiver IC in 0.13-/spl mu/m CMOS

A 2-GHz direct-conversion receiver for wide-band code division multiple access (WCDMA) is presented. It includes two low-noise amplifiers (LNAs), an I/Q demodulator, and two sixth-order baseband channel select filters with programmable gain. Quadrature local oscillator (LO) signals are generated on chip in a frequency divider flip-flop. An external interstage filter between the LNAs rejects transmitter leakage to relax demodulator linearity requirements. A low-voltage demodulator topology improves linearity as well as demodulator output pole accuracy. The active-RC baseband filter uses a programmable servo loop for offset compensation and provides an adjacent channel rejection of 39 dB. Programmable gain over 71-dB range in 1-dB steps is merged with the filter to maximize dynamic range. An automatic on-chip frequency calibration scheme provides better than 1.5% corner frequency accuracy. The receiver is integrated in a 0.13-/spl mu/m CMOS process with metal-insulator-metal (MIM) capacitors. Measured receiver performance includes a 6.5-dB noise figure, IIP2 of +27 dBm, and IIP3 of -8.6 dBm. Power consumption is 45 mW.