LTCF/LTCC 异质材料共烧EMI滤波器设计与制作

采用低温共烧陶瓷(LTCC)/低温共烧铁氧体(LTCF)相结合异质材料共烧工艺制作 EMI 滤波器,介绍了器件的设计、仿真方法、制作工艺与性能测试结果.通过介质材料掺杂改性和优化流延工艺,解决了异质材料低温共烧匹配技术难点,实现了LTCC/LTCF异质材料良好的共烧兼容特性.EMI滤波器性能分析和测试结果表明,器件具有高的插入损耗,可在宽频率范围内防止EMI噪声.     

低温共烧陶瓷技术发展及行业现状分析

低温共烧陶瓷技术是近年来发展起来的一种技术。该技术已经成为无源集成中的主流实现方案。本文主要对低温共烧陶瓷技术的发展现状以及行业现状进行分析,为该行业的进一步发展提供借鉴。     

叠层片式低通滤波器的设计与制作

利用LTCC<CF(低温共烧陶瓷和低温共烧铁氧体)技术设计和制作了具有标准封装型号0805型叠层片式低通滤波器,给出了一个完整而有效的设计流程.并采用介电常数为14、流延厚度为30μm的陶瓷膜片成功制作了截止频率在220MHz的三阶低通叠层片式滤波器,其外形尺寸为2.0mm×1.2mm×0.9mm.     

LTCC铁氧体叠层片式器件及材料的国内外发展动态

根据最近(2008.10.10)举行的第十届国际磁铁氧体会议(ICF10)和第十三届全国磁学会议(2008.10.31)资料,以及近两年有关专业会议文献,综合介绍了近期国内外制作叠层片式电感、滤波器和变压器的LTCF(低温共烧铁氧体)工艺、低温烧结NiCuZn、MnZn、Co_2Z、Co_2Y、BaM等铁氧体技术以及LTCC(低温共烧陶瓷)叠层片式电感的研发进展,展望了LTCC和叠层片式电感的发展趋势.     

低温共烧陶瓷埋置电感的设计与仿真

讨论了低温共烧陶瓷(Low Temperature Co-Fired Ceramic LTCC),埋置电感的几何结构模型,并进行仿真,分析了结构变化对电感各参数的影响.     

低温共烧陶瓷射频无源集成基础技术研究进展

低温共烧陶瓷(LTCC)技术是当今世界射频无源集成的关键技术,嵌入式无源元件设计与模型化是LTCC重要基础技术。本文介绍了LTCC射频无源集成的关键技术,并着重介绍了射频无源元件(如电感、电容)的等效电路模型的发展过程。     

多层小型化抗EMI滤波器的仿真与设计

采用低温共烧陶瓷(low temperature co-fired ceramics,LTCC)先进集成技术及异质材料的共烧匹配技术,并借助于三维电磁场仿真软件对滤波器进行建模和仿真,实现低截止频率多层抗EMI滤波器的小型化设计,得到截止频率为12MHz(3dB),带外抑制≥30dB(200～2500MHz),尺寸为2.00mm×1.25mm×0.85mm的抗EMI滤波器样品。     

基于LTCC技术的耦合电感

耦合电感已被广泛应用于负载点电源(Point of Load,POL),以提高其稳态和动态性能。为了进一步提高系统的集成度和功率密度,耦合电感的封装集成技术近年来引起了广泛的关注。在这样的研究背景下,本文对基于低温共烧陶瓷工艺(Low Temperature Co-fired Ceramic,LTCC)的耦合电感的封装集成技术进行了研究。首先,针对低温高烧陶瓷工艺的特点,本文提出了四种不同的耦合电感结构并对它们进行了分析、仿真;其次推导出估算电感值的简单有效的数学模型,并通过仿真表明模型的准确性;然后,为了更好的测试低温共烧陶瓷耦合电感的特性,本文制作了一个超薄的易于三维集成的耦合电感样品,并给出了其电感值特性的测量结果;最后,耦合电感样品被应用于一台1MHz、12V输入、1.2V/45A输出的两相交错并联降压斩波电路中,测试其在功率电路中的性能。     

片式电感器的技术发展趋势

片式电感器是电感领域重点开发的产品,文章综述了电感器的发展,片式电感器的分类,介绍了绕线型片式电感器、叠层片式电感器、编织型片式电感器、激光刻线型片式电感器的制造工艺,给出了片式电感器的技术发展方向,并介绍了低温共烧陶瓷技术和薄膜平面电感器。     

叠层片式电感及低温烧结铁氧体的研发进展

介绍了叠层片式电感的现状及其低温共烧技术,特别就低温烧结NiCuZn、MgCuZn和Co2Z铁氧体粉料的研发进展作了详细报道.最后,展望了低温烧结铁氧体的发展趋势,指出缩小差距的研究方向.     

低温共烧结陶瓷(LTCC):特点、应用及问题

与传统的封装技术相比，LTCC技术因其具有优良的高频特性、小线宽和低阻抗而倍受瞩目，现已迅速发展并应用于各领域。LTCC技术是将四大无源器件(电感L、电阻R、变压器T、电容C)和有源器件(晶体管、IC电路模块、功率MOS)集成在一起的混合集成技术。LTCC技术的应用可以取代目前的PCB板，使系统趋于小型化和稳定化。本文介绍LTCC技术的发展历史、研究现状、应用前景等，并着重介绍LTCC技术的分类、市场情况，也分析了LTCC技术的局限性。     

基于LTCC技术的高频开关电源变压器设计原理和方法

通过对高频开关变压器磁芯工作时能量储存、损耗、传递及工作曲线的分析,应用磁性材料的B-H回线和Q值并结合LTCC工艺特点提出一种LTCC高频开关电源变压器完整的设计思路和方法.文中以反激式高频开关变压器为例阐述了设计过程中的主要要点.用低频电磁场仿真工具Maxwell 2D/3D对计算结果进行仿真验证,在此基础上调整绕组结构和优化磁芯结构参数,得出高频变压器的合理设计方案.     

The application of thick-film technology in C-MEMS

Laminated 3D structures made using low-temperature co-fired ceramic (LTCC) technology are practical for ceramic micro-electro-mechanical systems (C-MEMS). The sensors for mechanical quantities, and/or actuators, are fundamental parts of MEMS. Thick-film resistors can be used to sense the mechanical deformations, and thick-film piezoelectric materials can be used as electro-mechanical transducers in a C-MEMS structure. The integration of these thick-film materials on LTCC substrates is in some cases difficult to realise due to interactions with the rather glassy LTCC substrates. The subject of our work is an investigation of thick-film materials for electro-mechanical transducers (sensors and actuators) and their compatibility with LTCC substrates. Resistors made with commercial thick-film resistor materials for use as sensors on LTCC substrates have been investigated and evaluated. Ferroelectric ceramic materials based on solid solutions of lead zirconate titanate (PZT) with low firing temperatures around 850°C were developed for thick-film technology and evaluated on LTCC substrates.     

The co-fired behaviors between Ag and glass–ceramics materials in LTCC

The paper studied the interfacial co-fired behavior between silver and Ba–Ti–B–Si–O glass–ceramics composites for LTCC application. The dielectric properties of this LTCC glass–ceramic materials were as follows: ??≈?8–10, tanδ?≤?2?×?10^?3 (at 1 GHz), and its sintering temperature was lower than 900 °C. The Ag elemental distribution near the interface between glass–ceramics and Ag was investigated by scanning electronic microscopy and energy spectrum analysis. No de-lamination, camber and cracking were found between LTCC/Ag systems after firing at 810–900 °C for 2 h. The experimental results showed that the diffusion of silver was mainly decided by sintering temperature and microstructure of LTCC. Promoting densification of the LTCC can prevent Ag diffusion from co-fired interface.     

An investigation of thick PZT films for sensor applications: A case study with different electrode materials

Lead zirconate titanate (PZT) is a piezoelectric material that can sense or respond to mechanical deformations and can be used in ceramic micro-electro-mechanical systems (C-MEMS). A thick-film paste was prepared from a pre-reacted PZT powder (PbZr_0.53Ti_0.47O₃) and thick-film technology (screen-printing and firing) was used to deposit the PZT layers on LTCC tapes and on alumina substrates. The microstructural, electrical and piezoelectric characteristics of the thick PZT films on relatively inert alumina substrates and on LTCC tapes were studied. Preliminary experiments indicated that due to the interaction between the printed PZT layers and the LTCC substrates during firing the electrical characteristics deteriorate significantly. To minimise the influence of substrate-film interactions different electrode materials and the use of additional intermediate layers as a barrier were evaluated. The dielectric permittivities, dielectric losses, and piezoelectric coefficients (d ₃₃) were measured. The dielectric permittivities of the thick films fired on LTCC substrates were lower (210 with gold electrodes and 430 with silver electrodes) than those measured on alumina substrates (500). The piezoelectric coefficients d₃₃ were measured with a Berlincourt piezometer. The d ₃₃ values measured on the LTCC substrates were relatively low (60–80 pC/N) compared with the values obtained for the alumina substrates (around 140 pC/N). The lower dielectric constants and piezoelectric coefficients d ₃₃ of the films on LTCC substrates are attributed to the formation of phases with a lower permittivity. This was a result of the diffusion of SiO₂ from the LTCC into the active PZT layer. The diffusion of silica was confirmed by the SEM and EDS analyses.     

OFDM技术的特点及其在通信系统中的应用

OFDM(正交频分复用)是一种无线环境下的高速传输技术.在简述其基本原理的基础上,介绍了它的应用情况,分析了OFDM技术的主要特点.     

基于LTCC/LTCF的数控YIG调谐激励器设计与实现

基于LTCC/LTCF复合集成技术,对包含DC-DC电源变换电路的YIG调谐数字激励器进行集成化设计。电路基板由LTCC和LTCF两种材料复合层叠而成。通过Maxwell 3D软件进行仿真设计,利用LTCF材料的磁特性,在基板内集成了DC-DC电源所需的电感器,取代了高度较高的表贴式电感。将电感仿真结果导入Durst Graffy软件,与其它电路元件一起进行布局布线,实现了YIG激励器的平面化设计。最后,通过多次烧结工艺试验,成功实现了YIG激励器电路基板样品的制作。预计组装完成后,激励器高度将缩减到约原先PCB电路的44%。