Influence of alloy composition on fillet-lifting phenomenon in tin binary alloys

The influence of alloy composition on the fillet-lifting phenomenon was investigated for Sn−Bi, Sn−Pb, and Sn−In binary alloys. Fillet-lifting occurs in Sn-(1–30%)Bi, Sn-(1–5%)Pb, Sn-(2–15%)In, but does not occur in pure Sn, Sn-(40–62%)Bi, Sn-(10–45%)Pb, and Sn-43 In. Fillet-lifting does not correlate with the formation of a Bi-concentrated layer at the solder/Cu land interface, previously thought to cause fillet-lifting. The solidification temperature range also does not necessarily correlate with fillet-lifting. Fillet-lifting was found to be related to the retention time (t_r) for which solidus temperature (the final solidification temperature) remains by latent heat released during eutectic solidification in the cooling curve. The released latent heat contributes to the alleviation of the temperature gradient causing fillet-fifting in the solder joint. A fillet-fifting resistant index (FRI) is proposed as a new index for fillet-lifting, and correlates well with fillet-lifting occurrence rate in each of the studied tin binary alloys.     

Effect of reflow and thermal aging on the microstructure and microhardness of Sn-3.7Ag-xBi solder alloys

This work investigates the effect of reflow and the thermal aging process on the microstructural evolution and microhardness of five types of Sn-Ag based lead-free solder alloys: Sn-3.7Ag, Sn-3.7Ag-1Bi, Sn-3.7Ag-2Bi, Sn-3.7Ag-3Bi, and Sn-3.7Ag-4Bi. The microhardness and microstructure of the solders for different cooling rates after reflow at 250°C and different thermal aging durations at 150°C for air-cooled samples have been studied. The effect of Bi is discussed based on the experimental results. It was found that the microhardness increases with increasing Bi addition to Sn-3.7Ag solder regardless of reflow or thermal aging process. Scanning electron microscopy images show the formation of Ag₃Sn particles, Sn-rich phases, and precipitation of Bi-rich phases in different solders. The increase of microhardness with Bi addition is due to the solution strengthening and precipitation strengthening provided by Bi in the solder. The trend of decrease in microhardness with increasing duration of thermal aging was observed.     

Microstructural effect on the creep strength of a Sn-3.5%Ag solder alloy

The effect of microstructure obtained by rapid or slow solidification and cooling of a Sn-3.5%Ag lead-free solder alloy on the creep strength has been investigated. The rapidly cooled alloy showed that the microstructure consisted of the primarily crystallized Sn phase and the quasi-eutectic phase, where fine Ag₃Sn particles dispersed in the Sn matrix. In the slowly cooled alloy, large platelets of Ag₃Sn were formed sparsely in the Sn matrix. A difference of about 2.5 orders of magnitude in the cooling rate translates to about 1.5 orders of magnitude in the creep-rupture time. Accordingly, fine particle dispersion of Ag₃Sn is considered to be very beneficial for the restraining of creep deformation, that is, for the decreasing of creep rate of the Sn-3.5%Ag alloy, compared with the effect of large platelets of Ag₃Sn sparsely formed in the Sn matrix.     

Comparative study of microstructures and properties of three valuable SnAgCuRE lead-free solder alloys

Lead-free solders with excellent material properties and low cost are essential for the electronics industry. It has been proved that mechanical properties of SnAgCu alloys can be remarkably improved with a minute addition of rare earth (RE) elements. For comparison and optimization, three valuable solder candidates, Sn3.8Ag0.7Cu0.05RE, Sn3Ag0.5Cu0.05RE, and Sn2.9Ag1.2Cu0.05RE, were chosen due to the excellent properties of their own SnAgCu basic alloys. Wetting properties, melting temperature, bulk tensile properties, and joint tensile and shear properties were investigated. In addition, the microstructures of solder joints were observed and the effects of microstructure on mechanical properties were analyzed. Experimental results indicated that the tensile and shear strengths of solder joints were decreased from Sn3.8Ag0.7Cu0.05RE, Sn2.9Ag1.2Cu0.05RE, to Sn3Ag0.5Cu0.05RE, in order. Such difference in mechanical properties could be attributed to the influence of slightly coarse or strong Cu₆Sn₅ scallops in the reaction layer as well as superior eutectic network and large volume percentage of large primary intermetallic compounds (IMCs) inside the solder joints. It is also suggested that the size and volume percentage of large primary IMCs inside the solder be controlled. In addition, serration morphology was observed at the edge of large primary and eutectic IMCs in the three solder joints, which could be related to the content of Ag, Cu, and RE. The serration morphology was proved to be beneficial to mechanical properties theoretically. Furthermore, the three alloys investigated possessed similar wetting properties, melting temperatures, and bulk tensile properties.     

Effects of Cu, Ag and Sb on the creep-rupture strength of lead-free solder alloys

The materials used in the present research are pure Sn metal and Sn-0.5% Cu, Sn-3.5%Ag, Sn-0.3%Sb, and Sn-3.5%Ag-0.5%Cu alloys. Effects of Cu, Ag and Sb on the creep-rupture strength of lead-free solder alloys have been investigated. Creep tests are performed at the stress and temperature range of 3 to 12 MPa and 378 to 403 K, respectively. A 3.5% addition of Ag had the largest contribution to the creep-rupture strength of Sn metal among the single addition of 0.5%Cu, 3.5%Ag, and 0.3%Sb. The combined addition of 3.5%Ag and 0.5%Cu makes the largest creep-rupture strength. The effects of these elements on the microstructure of the lead-free alloys are also investigated with optical microscope (OM) and transmission electron microscope (TEM) observations.     

Effect of Lanthanum Doping on the Microstructure of Tin-Silver Solder Alloys

In this study, quantitative microstructure studies were performed on multiple length scales to investigate the effect of lanthanum (La) doping on Sn-Ag lead-free solder materials. Factors considered in this paper include doping amount, aging temperature, and aging time. It was found that La doping reduces the grain size significantly, and the reduced grain size remains stable during thermal aging. The size of the Ag₃Sn particles is also greatly reduced by La doping, and the particles coarsen during thermal aging, albeit at a much reduced rate than in the undoped alloy. The rate of particle coarsening can be described by a cubic-root law. Another observation is that the interparticle spacing remains unaffected by the doping. Therefore, higher La doping level leads to higher volume fraction of the eutectic region due to the increased total number of Ag₃Sn particles.     

Study of Solidification Cracks in Sn-Ag-Cu Lead-Free Solder Joints

In the present work, solidification cracks in Sn-Ag-Cu solder joints were investigated. Experimental results indicate that solidification cracks existed in significant numbers in the miniature Sn-Ag-Cu solder joints. In order to create solidification cracks in the miniature solder joints during solidification and evaluate the susceptibility of Sn-Ag-Cu alloys to solidification cracking, a copper self-restraint specimen was designed, which can simulate the process of solidification crack formation. The solidification crack susceptibility of the Sn-Ag-Cu solder alloy was evaluated using the total crack length of the solder joint. In addition, the effect of trace amounts of elemental additions on solidification cracking of Sn-Ag-Cu solder joints was studied. It was found that adding trace amounts of Ni or Ce could depress the solidification cracks in Sn-3.0Ag-0.5Cu solder joints. However, P additions aggravated the formation of solidification cracks.     

激光冲击次数对镁合金电化学特性的影响

为了研究激光冲击对镁合金表面抗腐蚀性能的影响,利用钕玻璃脉冲激光对AZ31镁合金表面进行不同次数的激光冲击处理,用透射电子显微镜观察镁合金表层的微观组织,并采用电化学测量技术在氯化钠溶液(质量分数为0.035)中测试其极化曲线和电化学交流阻抗谱的影响。结果表明,激光冲击波导致镁合金表面层产生超高应变速率的塑性变形;晶粒内部存在与孪晶相互交叉、相互缠结的高密度位错而导致晶粒细化;极化曲线和交流阻抗谱表明1次激光冲击后AZ31的自腐蚀电位提高约267mV;腐蚀电流稍有增大,反应电阻增大,抗腐蚀性明显提高;随着冲击次数的增多,腐蚀抗力未明显提高。其相应的交流阻抗谱也得出与极化曲线相同的结论。该研究对于激光冲击处理镁合金提高耐腐蚀性具有一定的参考价值。     

扫描速度对激光熔覆NiAlBSi高温合金涂层组织和性能的影响

采用激光熔覆技术在45#钢表面制备NiAlBSi高温合金涂层。利用X射线衍射仪、扫描电镜、电子探针、显微硬度计、摩擦磨损试验机和热重分析仪,对不同激光扫描速度下合金涂层的相组成、微观组织、成分、显微硬度、耐磨性和高温抗氧化性进行了分析。研究结果表明,不同激光扫描速度下合金涂层皆是由树枝状NiAl金属间化合物构成。随着扫描速度的增加,由于树枝晶逐渐细化,合金涂层的硬度增加,但耐磨性能和抗高温氧化性则呈现出先增后降的变化趋势,在激光扫描速度为4 mm/s时,合金涂层具有最好的耐磨性能和抗高温氧化性能。     

红外探测器降温时间的影响因素分析

为了提高武器系统的战术指标,需要实现红外探测器的快速降温。通过分析探测器结构列出了影响探测器降温时间的相关因素。然后分别进行了降低杜瓦冷台热容、降低热耗、提升冷台部分粘接剂的导热系数以及调整制冷器喷液口到杜瓦冷台距离等方面的降温时间对比试验。通过分析试验结果得出以下结论:对于锥形金属杜瓦来说,影响最大的因素是冷台部分的热容,降温时间缩短与热容降低的比例接近;其次是制冷器与杜瓦之间的热交换效率;改善其它因素也能缩短探测器的降温时间,但效果不明显。该结论为红外探测器降温时间研究的改进方向提供了更为直观的参考。     

激光冲击强化对TC17微观组织和表面硬度的影响

为了研究激光冲击次数和冲击能量对TC17钛合金微观组织和表面硬度的影响,采用不同的工艺参量对TC17钛合金进行了激光冲击强化处理。TC17钛合金在激光冲击后,表面形成了剧烈塑性变形和高密度位错,冲击过程中位错发生增殖、塞积、缠结等现象,单脉冲冲击形成的微凹坑的深度最大可达21.4μm;脉冲能量为5J、搭接冲击次数从1次增加到4次时,材料的表面硬度相比母材的增幅分别为8.3%,17.2%,24.3%和24.5%;5J和7J冲击1次时,表面硬度相比母材增幅分别达8.3%和14.2%。结果表明,随着冲击次数和脉冲能量的增加,TC17材料表面硬度随之增加,激光冲击强化使材料表面产生高密度位错,这是其表面硬度增加的关键原因。     

In-situ control of temperature and alloy composition of Cd1−xZnxTe grown by molecular beam epitaxy

In this work in-situ spectroscopic ellipsometry (SE) has been applied for the simultaneous determination of the growth temperature and alloy composition for the epitaxial Cd_1−xZn_xTe(211)/Si(211) structure. The optical dielectric functions of CdTe and Cd_0.96Zn_0.04Te (CZT) epilayers were studied as a function of temperature both ex-situ and in-situ in the range from 1.6 eV to 4.5 eV. We employed parametric models for the simulation of the optical properties of CZT at and between the critical points (CP) E₀, E₀ + Δ₀, E₁, E₁ + Δ₁, E₂(Σ) and E₂(Σ). Critical point energies and line widths for Cd_1−xZn_xTe were obtained through the fitting process, which included both zero order and higher order derivatives of the SE pseudo dielectric function. The dependence of the different critical points on Zn concentration x is discussed. It has been demonstrated that the energy of the weak E₀ + Δ₀ transition can be used to measure composition, while the E₁ energy can be used as a real-time temperature measure. The model parameters were optimized through the simultaneous analysis of multiple data sets, and the temperature dependent model was developed for in-situ application. Our analysis is estimated to produce uncertainties of only ±0.5°C in measuring the temperature and ±0.5% in measuring the composition of only the zero order dielectric function is being fitted. The effects of a surface overlayer, of reflected beam deflections, and of other experimental problems on the overall accuracy, are discussed as well as ways to improve the in-situ SE data quality.     

铝合金表面激光熔覆铜基合金涂层研究

为了提高铝合金的表面强度,根据铜合金的液相分离性质,采用CO2激光熔覆方法,在铝合金表面成功制备了铜基合金涂层。结果表明,涂层的基体相为铜基固溶体,强化相主要为呈弥散分布的laves相。涂层中的强化相表现出了"富Mo核心"+"包围相"的复合结构特征,这主要是由于富Mo核心的析出为液相分离提供了异质形核条件所造成的。硬度测试表明,所获涂层的硬度约为270HV0.05,比ZL104铝合金提高了约2倍。     

双温热处理TiAl基合金显微组织和相结构分析

采用透射电子显微镜较详细地研究了双温热自理试样的显微组织结构特征。试验发现，由于多相ＴｉＡｌ基合金相界面间存在一定的位向关系，以及相析出和相转变在一定的惯习面和方向上发生，导致了相奕特征呈现多样性，从而得到复杂结构的显微组织。     

镁合金激光表面熔凝技术分析

为了研究不同激光工艺参量对镁合金熔凝层组织和性能的影响,采用高功率快速扫描(13J/mm2～33J/mm2)和低功率慢速扫描(100J/mm2～250J/mm2)两套能量密度相差较大的激光熔凝技术对镁合金表面进行真空激光熔凝处理.结果表明,两套激光工艺处理下熔凝层均由?Mg和?Mg17Al12相所组成,但?Mg17Al12所占的比例在低功率慢速扫描下较高,约为16%;熔凝层组织均为典型的树枝晶,高功率快速扫描熔凝层枝晶尺寸远远小于低功率慢速扫描熔凝层的枝晶尺寸;在高功率快速扫描处理工艺下,熔凝层的硬度、耐磨性分别是低功率慢速扫描处理下熔凝层的1.5倍和3倍;高功率快速扫描处理下熔凝层的耐蚀性也较低功率慢速扫描处理下熔凝层的耐蚀性显著提高.     

6061铝合金表面激光合金化Al-Fe-Mn-Zn-Si合金涂层的组织与性能研究

采用激光合金化工艺在6061铝合金表面制备Al-Fe-Mn-Zn-Si合金化层,以期望提高铝合金表面性能。用扫描电镜(SEM)、X射线衍射仪(XRD)、电子显微硬度计、HSR-2M磨损试验机等材料表征手段分析了合金化层的组织结构与性能,研究结果表明:合金化层的晶相组织由结合区附近的柱状晶向表面的等轴晶过渡,且晶粒大小较基体明显细化,含有金属间化合物AlFe4Si、Al9Si、Mn5Si2以及面心立方的α-Al;激光合金化使铝合金表面硬度由104HV左右提高到了390HV左右;磨损试验结果表明,合金化层提高了铝合金表面的耐磨性。     

EBSD技术在形变Zr合金组织与织构研究中的应用

本文采用配备在扫描电镜中的EBSD系统及相应的取向分析和组织重构技术,对形变状态和退火状态下Zr合金的微观组织及织构演变规律进行了初步研究。结果表明,形变样品中晶粒细碎且不均匀,具有较为明显的形变带特征;织构主要为基面平行于轧面（（0002）／／Z）取向织构,同时还存在较多的{0001}（1010）和{0001}（1150）织构及{1104}（1102）织构。退火样品中晶粒均匀,基本为等轴晶,几种主要基面织构变化不大,但{1104}（1102）织构含量与形变样品相比提高了一倍以上。     

Isothermal aging of near-eutectic Sn-Ag-Cu solder alloys and its effect on electrical resistivity

Solder joints were prepared from seven eutectic and near-eutectic Sn-based compositions and characterized for electrical resistivity after 100 h and 1,000 h of isothermal aging at 423 K. The solder joint samples were prepared by hand soldering to copper substrates, and the post-heat treatment resistivity was measured at room temperature in a specially designed, four-point probe fixture. Compositions tested included Sn-3.5Ag, Sn-3.7Ag-0.9Cu, Sn-3.0Ag-0.5Cu, Sn-3.6Ag-1.0Cu, and Sn-3.9Ag-0.6Cu. In addition, the effect of a minor addition of a fourth element, designed to improve high-temperature shear strength, was also evaluated in the compositions Sn-3.7Ag-0.6Cu-0.3Co and Sn-3.7Ag-0.7Cu-0.2Fe. The observed changes in electrical resistivity are discussed in terms of microstructural coarsening, diffusional transport from the substrate, and nucleation of precipitate phases.     

Effect of heat treatment on the electrical resistivity of near-eutectic Sn-Ag-Cu Pb-Free solder alloys

The electrical resistivity of solder joints prepared from Sn-Ag, Sn-Ag-Cu, and Sn-Ag-Cu-X alloys (where X = Co, Fe, or Bi) was characterized by a four-point probe technique and interpreted in terms of microstructure and composition. The resistivity is also reported of drawn solid wires of these alloys. The solder-joint samples were prepared by hand soldering to copper substrates and were electrically characterized over a temperature range from 293–423 K, covering the anticipated range of elevated-temperature operation for Pb-free solders. Selected joint specimens were measured before and after a 72-h heat treatment at 423 K. Metallographic inspection of the solder joints was performed to characterize coarsening effects and to determine the degree to which these changes affected electrical conduction.     

模拟研究离焦量对7050铝合金Al/Ti熔覆过程的影响

针对7050铝合金表面激光熔覆Al/Ti复合粉体,建立了三维瞬态温度场有限元模型,模拟了不同离焦量条件下的熔池大小、温度梯度、冷却速度及形状控制因子.结果表明,熔池宽度与深度尺寸随着离焦量数值的增大先增大后减小,在离焦量为20 mm时熔池宽度与深度都出现了最大值.沿熔池深度方向(即Z向)的温度梯度数值最大,散热条件最好,表明熔覆凝固过程中的晶粒生长方向主要集中在Z向.离焦量为40 mm时的冷却速度最大、晶粒细小,离焦量为80 mm时的冷却速度最小、晶粒粗大,且得到实验验证.离焦量为60 mm时的形状控制因子最大,金相组织出现柱状晶;离焦量为80 mm时的形状控制因子最小,金相组织主要为胞状晶,并有相应的实验验证.