共查询到16条相似文献,搜索用时 203 毫秒
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基于热电分离式设计理念,首先将表面经金属化处理且具备高导热率的AlN陶瓷片局部嵌入导热率较低的FR4材料中,利用压合工艺将二者复合制备成用于LED散热管理的嵌埋陶瓷基板;然后借助SMT工艺将LED灯珠与上述散热基板组装成LED模组;最后利用结温测试仪以及恒温控制系统对不同AlN尺寸及不同功率LED的上述模组进行了结温测试,并依据结温测试结果对上述嵌埋陶瓷基板的散热能力进行了对比研究。结果表明,当LED功率一定时,随着AlN陶瓷片尺寸不断加大,嵌埋陶瓷的扩散热阻及一维热阻均随之减小,从而致使基板总热阻呈现出下降趋势,LED的结温也因此而随之降低。而随着LED功率不断增加,嵌埋同一尺寸AlN陶瓷片的散热基板因一维热阻保持不变,扩散热阻不断增加,从而导致基板的总热阻也不断增加。 相似文献
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填料型导热复合材料是LED等半导体在封装及使用过程中一种常见的散热材料,它利用高导热填料填充具有密度小、可加工性能好、成本低廉等优点的高分子聚合物制备而成,对降低半导体器件的结温、增强其综合特性大有裨益。简要概述了近年来填料型导热复合材料的研究现状,并对其发展趋势进行了预测,以期为LED的实际散热需要提供技术参考,进而推动LED产业的发展。 相似文献
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《功能材料》2017,(6)
自支撑硅氧碳纳米镶嵌复合薄膜具有细小等轴β-SiC纳米晶弥散分布在非晶态相SiO_xC_y和游离碳基体的复合结构。利用电子顺磁共振谱(EPR)仪对900~1 200℃终烧薄膜复合结构中的氧空位形成进行分析;采用丝网印刷法在薄膜表面获得两条平行高温银浆电路层,并以其为散热基板进行LED器件板上芯片封装(COB)。通过扫描电镜(SEM)与光学显微镜对薄膜微观形貌及封装结构进行观察,并通过LED热光参数测试仪对其结温进行探究。结果表明,终烧温度升高,薄膜氧空位浓度增大,g因子接近自由电子值2.0023。高温银浆导电层均匀致密保证良好电导效果。1 200℃终烧薄膜作为散热基板具有较好热传导与绝缘特性,其封装LED结温约为33.7℃,低于120℃限制,有望规模应用于大功率LED器件领域。 相似文献
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LED绝缘铝基板的制备与散热性能研究 总被引:1,自引:0,他引:1
采用硬质阳极氧化工艺制备LED封装用铝基板绝缘层,通过实验分析了制备铝基板过程中氧化时间、草酸浓度、硫酸浓度和电流密度等因素对其氧化膜厚度、击穿电压的影响,得到了制备低热阻铝基板的最佳工艺参数:电流密度3A/dm2,草酸浓度为10g/L,H2SO4浓度150g/L,氧化时间45min。利用原子力显微镜(AFM)观察热冲击后裂纹萌生的情况,结果表明铝基板有微小裂纹,但仍满足绝缘要求,通过对氧化铝膜热阻的测试发现,铝基板与氧化膜的复合热阻在1~3℃/W之间。结果表明用阳极氧化法制备的铝氧化膜满足LED基板对散热及绝缘性的要求。 相似文献
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在LED散热领域,铝基板居很大市场份额.介绍了金属渗透梯度层陶瓷基片,这种陶瓷基片由陶瓷与金属材料相互扩散形成的,导热性、绝缘性、抗剥离强度及抗震动性好,可解决大功率LED的散热问题.这种基板已用于制作大功率LED灯,并取得了明显的社会经济效益. 相似文献
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Jiao Enxiang Wu Kun Liu Yingchun Zhang Hangzhen Zheng Haoting Xu Chang-an Shi Jun Lu Mangeng 《Journal of Materials Science》2022,57(4):2584-2596
Journal of Materials Science - The development of materials with efficient heat dissipation capabilities and remarkable mechanical properties is essential for high-power integrated electronic... 相似文献
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Haina Ci Hongliang Chang Ruoyu Wang Tongbo Wei Yunyu Wang Zhaolong Chen Yuanwei Sun Zhipeng Dou Zhiqiang Liu Jinmin Li Peng Gao Zhongfan Liu 《Advanced materials (Deerfield Beach, Fla.)》2019,31(29)
For III‐nitride‐based devices, such as high‐brightness light‐emitting diodes (LEDs), the poor heat dissipation of the sapphire substrate is deleterious to the energy efficiency and restricts many of their applications. Herein, the role of vertically oriented graphene (VG) nanowalls as a buffer layer for improving the heat dissipation in AlN films on sapphire substrates is studied. It is found that VG nanowalls can effectively enhance the heat dissipation between an AlN film and a sapphire substrate in the longitudinal direction because of their unique vertical structure and good thermal conductivity. Thus, an LED fabricated on a VG‐sapphire substrate shows a 37% improved light output power under a high injection current (350 mA) with an effective 3.8% temperature reduction. Moreover, the introduction of VG nanowalls does not degrade the quality of the AlN film, but instead promotes AlN nucleation and significantly reduces the epilayer strain that is generated during the cooling process. These findings suggest that the VG nanowalls can be a good buffer layer candidate in III‐nitride semiconductor devices, especially for improving the heat dissipation in high‐brightness LEDs. 相似文献
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Light emitting diodes (LEDs) are already familiar for use as lighting sources in various electronic devices and displays. LEDs have many advantages such as long life, low power consumption, and high reliability. In the future, as an alternative to fluorescent lighting, LEDs are certain to receive much attention. However, in components related to advanced LED packages or modules there has been an issue regarding the heat from the LED chip. The LED chip is still being developed for use in high-power devices which generate more heat. In this study, we investigate the variation of thermal resistance in LED modules embedded with thermal vias. Through the analysis of thermal resistance with various test vehicles, we obtained the concrete relationship between thermal resistance and the thermal via structure. 相似文献
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一种计算大功率LED光源模块器件结温的方法 总被引:1,自引:0,他引:1
研究了大功率LED光源模块各器件之间热传导的相互影响,建立了一种基于热阻矩阵的LED光源模块器件结温计算公式,然后以一个由5只1W大功率器件组成的光源模块为例,演示如何通过测量器件的正向工作电压计算热阻矩阵,进而计算各器件的结温,并与现有方法计算值以及红外测温仪实际测量值进行了比较,结果表明:本方法比现有计算方法更为准确,可以用来预测LED光源的使用寿命和系统可靠性。 相似文献