基于纳米多晶硅薄膜晶体管分裂漏MAGFET制作和特性

A split-drain magnetic field-effect transistor （MAGFET） based on a nano-polysilicon thin film transistor （TFT） is proposed, which contains one source, two drains and one gate. The sensor chips were fabricated on （100） high resistivity silicon substrate by CMOS technology. When drain-source voltage equals 5.0 V and length and width ratio of the TFT channel is 80 μm/160 μm, the current and voltage magnetic sensitivities of the split-drain MAGFET based on the TFT are 0.018 mA/T and 55 mV/T, respectively. Through adopting nano-polysilicon thin films and nano-polysilicon thin films/high resistivity silicon heterojunction interfaces as the magnetic sensing layers, it is possible to realize detection of the external magnetic field. The test results show that magnetic sensitivity of the split-drain MAGFET can be improved significantly.     

SOI谐振式微型电场传感器的新型制作工艺研究

This paper presents a new fabrication process for the SOI-based novel miniature electric field sensor. This new process uses polyimide film to release the SiO₂ layer.Compared with the CO₂ critical point release method,it significantly improves the device surface cleanliness and shortens the process flow.The impurity on the base layer is analyzed.The problem of peak and butterfly-type contamination occurring on the base layer of the SOI wafer during the DRIE process is discussed and solved by thickening the photoresist layer and coating with polyimide film twice.This new process could fabricate MEMS sensors and actuators such as SOI-based electric field sensors,gyroscopes,and micro mirrors and can be an alternative fabrication process compared to commercial SOIMUMPS fabrication processes.     

纳米多晶硅薄膜压力传感器制作及特性

给出一种纳米多晶硅薄膜压力传感器,采用LPCVD法在衬底温度620℃时制备纳米多晶硅薄膜,基于MEMS技术在方形硅膜不同位置制作由4个薄膜厚度为63.0nm的掺硼纳米多晶硅薄膜电阻构成惠斯通电桥结构,实现对外加压力的检测. 实验结果表明,当硅膜厚度75μm时,纳米多晶硅薄膜压力传感器在恒压源5.0V供电时,满量程（160kPa）输出为24.235mV,灵敏度为0.151mV/kPa,精度为0.59%F.S,零点温度系数和灵敏度温度系数分别为-0.124%/℃和-0.108%/℃.     

纳米多晶硅薄膜压力传感器制作及特性

给出一种纳米多品硅薄膜压力传感器,采用LPCVD法在衬底温度620℃时制备纳米多晶硅薄膜,基于MEMS技术在方形硅膜不同位置制作由4个薄膜厚度为63.0nm的掺硼纳米多晶硅薄膜电阻构成惠斯通电桥结构,实现对外加压力的检测.实验结果表明.当硅膜厚度75μm时,纳米多晶硅薄膜压力传感器在恒压源5.0V供电时,满量程(160kPa)输出为24.235mV,灵敏度为0.151mV/kPa,精度为0.59%F.S,零点温度系数和灵敏度温度系数分别为-0.124%/℃和-0.108%/℃.     

基于溶液法的金属诱导碟型晶畴多晶硅薄膜和薄膜晶体管的研究

以非晶硅为晶化前驱物,采用镍盐溶液浸沾的方法可以得到超大尺寸碟型晶畴结构的低温多晶硅薄膜.所得多晶硅薄膜的平均晶畴尺寸大约为50 μm,空穴的最高霍尔迁移率为30.8 cm~2/V·s,电子的最高霍尔迁移率为45.6 cm~2/V·s.用这种多晶硅薄膜为有源层,所得多晶硅TFT的场效应迁移率典型值为70～80 cm~2 /V·s,亚阈值斜摆幅为1.5 V/decade,开关电流比为1.01×10~7,开启电压为-8.3 V.另外,P型的TFT在高栅偏压和热载流子偏压下具有良好的器件稳定性.     

CMOS有源像素传感器特性分析与优化设计

设计了一个三管有源像素和其用开关电容放大器实现的双采样读出电路.该电路被嵌入一64×64像素阵列CMOS图像传感器,在Chartered公司0.35μm工艺线上成功流片.在8μm×8μm像素尺寸下实现了57%的填充因子.测得可见光响应灵敏度为0.8V/(lux·s),动态范围为50dB.理论分析和实验结果表明随着工艺尺寸缩小,像素尺寸减小会使光响应灵敏度降低.在深亚微米工艺条件下,较深的n阱/p衬底结光电二极管可以提供合理的填充因子和光响应灵敏度.     

Fabrication and characteristics of the nc-Si/c-Si heterojunction MAGFET

A MAGFET using an nc-Si/c-Si heterojunction as source and drain was fabricated by CMOS technology, using two ohm-contact electrodes as Hall outputs on double sides of the channel situated 0.7L from the source. The experimental results show that when V_(DS) = -7.0 V, the magnetic sensitivity of the single nc-Si/c-Si heterojunction magnetic metal oxide semiconductor field effect transistor (MAGFET) with an L : W ratio of 2 : 1 is 21.26 mV/T,and that with an L : W ratio of 4 : 1 is 13.88 mV/T. When the outputs of double nc-Si/c-Si heterojunction MAGFETs with an L : W ratio of 4 : 1 are in series, their magnetic sensitivity is 22.74 mV/T, which is an improvement of about 64% compared with that of a single nc-Si/c-Si heterojunction MAGFET.     

纳米硅/单晶硅异质结MAGFET制作及特性

A MAGFET using an nc-Si/c-Si heterojunction as source and drain was fabricated by CMOS technology, using two ohm-contact electrodes as Hall outputs on double sides of the channel situated 0.7L from the source. The experimental results show that when VDS = -7.0 V, the magnetic sensitivity of the single nc-Si/c-Si heterojunction magnetic metal oxide semiconductor field effect transistor （MAGFET） with an L ： W ratio of 2 ： 1 is 21.26 mV/T, and that with an L ： W ratio of 4 ： 1 is 13.88 mV/T. When the outputs of double nc-Si/c-Si heterojunction MAGFETs with an L ： W ratio of 4 ： 1 are in series, their magnetic sensitivity is 22.74 mV/T, which is an improvement of about 64% compared with that of a single nc-Si/c-Si heterojunction MAGFET.     

关于光纤传感器测弱磁场的最高分辨率问题

本文根据实测的数据,采用较严格的分析方法,详细讨论了光纤传感器测弱磁场可达到的最高分辨率问题。     

基于磁流体的一维光子晶体磁场传感器的研究

基于磁流体的折射率对外加变化磁场的敏感特性,提出将磁流体作为缺陷层引入到一维光子晶体中实现磁场传感。由于缺陷的存在,使得光子晶体的透射谱中产生缺陷峰。该传感器可通过测量磁场变化时光子晶体缺陷模波长的移动对相应的磁场进行测量。利用传输矩阵法对不同结构参数下,缺陷模波长随在外加磁场的变化进行了模拟计算,为实际磁场传感器的设计提供了理论参考。     

基于硅桥结构的MEMS磁场传感器

提出了一种基于硅桥结构的MEMS磁场传感器结构。其结构由制作在硅桥敏感膜表面的惠斯通电桥和在膜中间沾上铁磁体制成。当传感器处于磁场中时,铁磁体在外磁场中磁化产生磁力,磁力会使硅敏感膜弯曲从而引起压阻改变进而使惠斯通电桥产生电压输出以达到测量磁场的目的。文章通过有限元软件仿真对铁磁体的尺寸进行了优化。实验结果和理论结果较接近。实验测得该传感器最大灵敏度为48mV/T,分辨率为160μT,该传感器可以用来进行强磁场的测量。实验结果结果表明:传感器的重复性和动态响应时间分别约为0.66%和150ms。     

MEMS magnetic field sensor based on silicon bridge structure

A MEMS piezoresistive magnetic field sensor based on a silicon bridge structure has been simulated and tested.The sensor consists of a silicon sensitivity diaphragm embedded with a piezoresistive Wheatstone bridge,and a ferromagnetic magnet adhered to the sensitivity diaphragm.When the sensor is subjected to an external magnetic field, the magnetic force bends the silicon sensitivity diaphragm,producing stress and resistors change of the Wheatstone bridge and the output voltage of the sensor.Good agreeme...     

基于磁流体的LPFG磁场传感器的温度特性

对基于磁流体的长周期光纤光栅磁场传感方案的温度特性进行了理论研究和数值模拟。仿真结果表明,外界温度的变化会使长周期光纤光栅耦合的谐振波长发生漂移,同时改变磁流体的折射率,进而影响磁场测量的精度,对基于磁流体的长周期光纤光栅磁场传感器的实际应用方面有一定的意义。     

感应式频率域磁场传感器设计

为解决长期制约我国电磁法勘探技术发展的感应式频率域磁传感器研制问题,以法拉第电磁感应定律为基础,通过对磁芯材料研制、感应线圈绕制、输出信号的开环补偿以及电场干扰信号的梳状屏蔽技术的研究,总结出传感器研制调试方法,并成功研制感应式频率域磁传感器。测试与试验结果表明,该传感器具有在3～10 000 Hz的工作频带内幅频特性曲线平坦的特点,实测结果与进口传感器相当。满足物探电磁法测量需要。