Phase separation of poly(ether sulfone imide) modified epoxy resin

Poly(ether sulfone imide)s (PEI) with molecular weight M_n ∼ 10⁴ were synthesized from 3,3′,4,4′-benzophenone tetracarboxylic dianhydride and amine terminated poly(ether sulfone) having molecular weights ranging from M_n ∼ 400 to M_n ∼ 4000. Thus, the PEIs had the same molecular weight but various imide and ether sulfone contents. The PEIs were mixed with a stoichiometric mixture of diglycidyl ether bis-phenol-A (DGEBA)/diamino diphenyl sulfone (DDS). The effect of PEI on the curing reaction of DGEBA/DDS and the morphology of the polymer blend were studied by differential scanning calorimetry (DSC) and optical microscopy. In the DGEBA/DDS/PEI blend with a fixed PEI molecular weight and PEI concentration but with various imide content, the experimental data revealed the PEI with a higher content of ether sulfone had a lower T_g and a better compatibility with solvents and epoxy resins; the curing reaction rate of DGEBA/DDS/PEI was faster for PEI with a higher imide content; the DSC data of cured DGEBA/DDS/PEI showed two T_gs, indicating phase separation between PEI and cured epoxy resins; and the data of optical microscopy showed that the compatibility of PEI with epoxy resins increased with the content of ether sulfone in PEI. © 1996 John Wiley & Sons, Inc.     

Phase Separation of Poly(ether sulfone imide) Modified Epoxy Resins

Amine terminated poly(ether sulfone imide) (PESI) with various imide and ethersulfone contents but similar polymer molecular weights were blended with diglycidyletherbisphenol-A (DGEBA) and cured with diaminodiphenylsulfone (DDS). The imide group, a tertiary amine, is a catalyst of the curing reaction of DGEBA with DDS, but it is poorly compatible with uncured epoxy resin. The ethersulfone group is not a catalyst of the curing reaction of DGEBA with DDS, but it has a similar chemical structure as DDS and is compatible with epoxy resin while it is at a low degree of curing. Since PESIs used in this study had similar molecular weights, increasing imide content of PESI would reduce ethersulfone content. The influence of imide and ethersulfone contents of PESI on the phase separation and curing reaction of DGEBA/DDS/PESI blend was investigated using differential scanning calorimetry (DSC), time-resolved light scattering (TRLS), and polarized optical microscopy (POM). Though the imide group has a catalysis effect on the curing reaction of DGEBA with DDS, however, its poor compatibility with epoxy resin retards the curing reaction. Our experimental results revealed the morphology of the cured blends and the curing behavior was a compromise result of catalysis and compatibility of PESI with epoxy resin.     

Mechanical and morphological properties of epoxy resins modified by poly(phthalazinone ether sulfone ketone)

A series of blends have been prepared by adding a novel thermoplastic poly(phthalazinone ether sulfone ketone) (PPESK) in varying proportions to diglycidyl ether of bisphenol A epoxy resin (DGEBA) cured with p‐diaminodiphenylsulfone (DDS). All the blends showed two‐phase structures characterized by differential scanning calorimetry (DSC) and scanning electron microscopy (SEM). Addition of the PPESK resulted in great enhancement of glass transition temperatures (T_g) both in the epoxy‐rich phase and in the PPESK‐rich phase by reason of the special structure of PPESK. There was moderate increase in the fracture toughness as estimated by impact strength. Fracture mechanisms such as crack deflection and branches, ductile microcracks, ductile tearing of the thermoplastic, and local plastic deformation of the matrix were responsible for the increase in the fracture toughness of the blends. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Thermal,mechanical, and dielectric studies on the DGEBA epoxy blends by using liquid oxidized poly(1,2‐butadiene) as a reactive component

Liquid oxidized poly(1,2‐butadiene) (LOPB) with multi epoxy groups is synthesized to modify diglycidyl end‐caped poly(bisphenol A‐co‐epichlorohydrin) (DGEBA) cured by 4,4′‐diaminodiphenyl sulfone (DDS). FTIR spectra shows that DGEBA and LOPB can be effectively cured by DDS, and the epoxide rubber particles are evenly distributed in the composites till their addition up to 20 wt % of DGEBA as seen from the scanning electron microscope (SEM). Their decomposition temperatures (Td) increase with the increase in LOPB addition at around 10 wt % of DGEBA while the Td for the composite containing 20 wt % LOPB of DGEBA is lower than that of the neat epoxy. The addition of LOPB improves their storage moduli and especially these values at temperatures higher above 150 °C; all the composites exhibit higher glass transition temperature (T_g) than that of the neat epoxy, and the maximum T_g reaches up to 255 °C for the composite containing 15 wt % LOPB of DGEBA. The incorporation of LOPB effectively decreases their dielectric constants and the composite with 10 wt % LOPB of DGEBA possesses the lowest one. The synergic improvements in their various properties are attributed to the networks formation via covalent linkage between the two phases in these reactive blends. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 44689.     

Cure kinetics and morphology of blends of epoxy resin with poly (ether ether ketone) containing pendant tertiary butyl groups

The cure kinetics and morphology of diglycidyl ether of bisphenol-A (DGEBA) epoxy resin modified with a poly (ether ether ketone) based on tertiary butyl hydroquinone (PEEK-T) cured with diamino diphenyl sulphone (DDS) were investigated using differential scanning calorimetry (DSC), scanning electron microscopy (SEM) and dynamic mechanical thermal analysis (DMTA). The results obtained from DSC were applied to autocatalytic and diffusion controlled kinetic models. The reaction mechanism broadly showed autocatalytic behaviour regardless of the presence of PEEK-T. At higher PEEK-T concentration, more diffusion controlled mechanism was observed. The rate of curing reaction decreased with increase in thermoplastic content and also with the lowering of curing temperature. The activation energies of the blends are higher than that of the neat resin. The blends showed a phase separated morphology. The dispersed phase showed a homogeneous particle size distribution. The T_g of the neat resin decreased with the decrease in cure temperature. Two T_g's corresponding to the epoxy rich and thermoplastic rich phases were observed in the dynamic mechanical spectrum. The storage modulus of 10 and 20 phr PEEK-T blends are found to be greater than the neat resin.     

High‐performance thermosetting films based on an amino‐functionalized poly(ether sulfone)

We have developed a sequence‐dependent synthesis of the amino‐functionalized poly(ether sulfone) P2 . The amino groups of P2 act as reactive sites toward epoxy resins. After curing P2 with diglycidyl ether of bisphenol A (DGEBA) and cresol novolac epoxy (CNE), we obtained the flexible, light‐yellow, transparent, epoxy thermosetting films P2 /DGEBA, and P2 /CNE, respectively, having glass transition temperatures (T_g) of 258 and 274°C, respectively. In addition, we also prepared a flexible film after condensation of the amino groups of P2 with the anhydride groups of 4,4′‐oxydiphthalic anhydride (ODPA); after imidization at 300°C for 1 h, the resulting P2 /ODPA thermosetting film possessed a value of T_g of 340°C. These three thermosetting films also exhibited flame retardancy with a UL‐94 VTM‐0 grade. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 40980.     

Epoxy resin containing the poly(sily ether): Preparation,morphology, and mechanical properties

The poly(sily ether) with pendant chloromethyl groups (PSE) was synthesized by the polyaddition of dichloromethylsilane (DCM) and diglycidylether of bisphenol A (DGEBA) with tetrabutylammonium chloride (TBAC) as a catalyst. This polymer was miscible with diglycidyl ether of bisphenol A (DGEBA), the precursor of epoxy resin. The miscibility is considered to be due mainly to entropy contribution because the molecular weight of DGEBA is quite low. The blends of epoxy resin with PSE were prepared through in situ curing reaction of diglycidyl ether of bisphenol A (DGEBA) and 4,4′‐diaminodiphenylmethane (DDM) in the presence of PSE. The DDM‐cured epoxy resin/PSE blends with PSE content up to 40 wt % were obtained. The reaction started from the initial homogeneous ternary mixture of DGEBA/DDM/PSE. With curing proceeding, phase separation induced by polymerization occurred. PSE was immiscible with the 4,4′‐diaminodiphenylmethane‐cured epoxy resin (ER) because the blends exhibited two separate glass transition temperatures (T_gs) as revealed by the means of differential scanning calorimetry (DSC) and dynamic mechanical analysis (DMA). SEM showed that all the ER/PSE blends are heterogeneous. Depending on blend composition, the blends can display PSE‐ or epoxy‐dispersed morphologies, respectively. The mechanical test showed that the DDM‐cured ER/PSE blend containing 25 wt % PSE displayed a substantial improvement in Izod impact strength, i.e., epoxy resin was significantly toughened. The improvement in impact toughness corresponded to the formation of PSE‐dispersed phase structure. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 89: 505–512, 2003     

Phase and crystallization behavior of solution-blended poly(ether ether ketone) and poly(ether imide)

Results on solution-blended poly(ether ether ketone) (PEEK) and poly(ether imide) (PEI) blends are reported. Dichloroacetic acid was used as the cosolvent for blending. PEEK and PEI are confirmed to be miscible in the melt. The glass transition, T_g, behavior obeys the simple Fox equation or the Gordon-Taylor equation with the adjustable coefficient k = 0.86. This agrees with prior data on melt-blended PEEK/PEI blends. The T_g width of the amorphous PEEK/PEI blends was found to be broader than that of the pure components. The maximum broadening is about 10°C. The specific volume of the amorphous PEEK/PEI blends shows a slight negative deviation from linearity, indicating favorable interaction between PEEK and PEI. The spherulitic growth and resultant blend morphology at 270°C were studied by a cross-polarized optical microscope. The radial growth rate of PEEK spherulites formed from the miscible melt at 270°C decreases from 3.04 μm/min for PEEK/PEI 90/10 blend to 0.77 μm/min for PEEK/PEI 70/30 blend. The decrease in crystalization rate of PEEK from PEEK/PEI blends is attributable to the increase in blend T_g. A linear growth was observed for PEEK spherulites formed from miscible melt at 270°C in the early growth stage. The spherulitic growth deviated from linearity in the late stage of growth. PEEK spherulites formed from the miscible PEEK/PEI melt at 270°C are essentially volume-filling. The branches of the spherulites become more clear for PEEK spherulites formed from the blend than that formed from pure PEEK melt.     

Fluorinated poly(arylene ether sulfone)s for polymeric optical waveguide devices

Pentafluorophenyl sulfone was prepared by oxidation of pentafluorophenyl sulfide. Ethynyl terminated fluorinated poly(arylene ether sulfone) (EFPAESO) was synthesized via nucleophilic aromatic substitution from 4,4′-(hexafluoroisopropylidene) diphenol or 4,4′-(trifluoromethylphenylisopropylidene) diphenol with an excess of pentafluorophenyl sulfone, followed by reaction with 3-ethylnylphenol. The molecular weights (M_ns) of the polymers determined by GPC with polystyrene standard were in the range of 6,400-17,200 and polydispersities (M_w/M_ns) were in the range of 2.25-3.19. This EFPAESO showed very high thermal stability up to 479 °C for 5% weight loss in TGA in air. T_g of the polymer was changed from 148 to 196 °C after curing. The cured films showed good chemical resistance and high thermal-stability. At 1550 nm wavelength, the refractive indices of the copolymer films were in the range of 1.5037-1.5504 and birefringences were in the range of 0.0021-0.0025. The optical loss for EFPAESO was less than 0.37 dB/cm at 1550 nm wavelength.     

Preparation and characterization of maleimide-terminated poly(arylene ether sulfone) oligomers of various molecular weights

A new variation in the bismaleimide (BMI) resin family, maleimide-terminated poly(oxy-1,4-phenylene sulfonyl-1,4-phenylene) oligomers, has been synthesized. The preparation of oligomers (n = 1–12) is described in this study. The structure of these oligomers is characterized by FT-IR and NMR spectroscopy. These oligomers are light yellow to light gray powders that can be melted or dissolved in solvents. Their terminating group bismaleimide has relatively high reactivity. Therefore, these BMI resins can be cured at 250°C to form a crosslinked product. Since the backbone chain is poly(arylene ether sulfone), the cured polymers have high T_g's, which increased from 220°C to higher than 340°C as the number of repeating units n of the corresponding oligomers decreases.     

A nonlinear regression approach to model the physical aging of poly(ether imide)

Differential scanning calorimetry (DSC) was used to measure the relaxation enthalpy of glassy amorphous poly(ether imide) (PEI) at three high isothermal aging temperatures between 190 and 200°C. A three-parameter model based on the Williams-Watts relaxation function was utilized to describe the aging process of PEI, and nonlinear regression approach was used to estimate the model parameters. The prediction according to this model was found to be more accurate in comparison with the two-parameter model based on the same Williams-Watts relaxation function. Furthermore, the peculiar aging behavior at the highest aging temperature of 200°C was explained from the molecular view point of transition from sub-T_g β-relaxation to α-relaxation near T_g.     

Segmental dynamics of functional graphene‐filled poly(ether sulfone ether ketone ketone) nanocomposites

The segmental dynamics of functional graphene (fGR)/poly(ether sulfone ether ketone ketone) (PESEKK) nanocomposites were investigated via differential scanning calorimetry and dynamic mechanical analysis (DMA) measurements. First, fGR was prepared using graphene oxide and sodium dodecylbenzene sulfonate. Subsequently, a series of fGR/PESEKK nanocomposites were prepared through solution blend. When the sulfone groups were introduced into the segments of PESEKK polymers, the glass transition temperature (T_g) of PESEKK was higher than that of free sulfone functionalized poly(ether ketone ketone). The fGR/PESEKK nanocomposites displayed a uniform nanostructure because of the strong interfacial interaction between fGR and PESEKK. With the increase in the fGR contents, the T_g values of fGR/PESEKK nanocomposites decreased. Two loss factor peaks were noted in the fGR/PESEKK nanocomposites, which were characterized via DMA. The α′‐relaxation of the nanocomposites at low temperature was assigned to polymer chains close to the polymer/filler interface with mobility higher than that in the bulk unfilled PESEKK (α‐relaxation). © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 44391.     

Modification of aromatic diamine-cured epoxy resins by poly(oxymethylene) or hybrid modifiers containing poly(oxymethylene)

A copolymer comprising poly(oxymethylene) (POM, polyacetal) was used to improve the fracture toughness of a resin based on diglycidyl ether of bisphenol A (DGEBA) cured with 3,3′-dimethyl-5,5′-diethyl-4,4′-diaminodiphenyl methane. POM was a less effective modifier for epoxies and a third component was used as a toughener or a compatibilizer for POM. The third component includes polypropylene glycol-type urethane prepolymer (PU) and aromatic polyesters. The hybrid modifiers composed of POM and PU were more effective as modifiers for toughening epoxies than POM alone. In the ternary DGEBA/POM/PU (90/10/10wt ratio) blend, the fracture toughness, K_IC, for the modified resin increased 50% with retention of flexural properties and a slight decrease in glass transition temperature (T_g) compared with those of the unmodified epoxy resin. The aromatic polyesters include poly(ethylene phthalate) (PEP), the related copolyesters and poly(butylene phthalate). PEP was most effective of them as a third component in the hybrid modifier. In the ternary DGEBA/POM/PEP (85/15/10) blend, K_IC for the modified resin increased 70% with medium loss of flexural strength and retention of T_g. The toughening mechanism is discussed in terms of morphological and dynamic viscoelastic behaviour of the modified epoxy resin systems. ©1997 SCI     

Isotactic poly(1-butene)/hydrogenated oligo(cyclopentadiene) blends: Miscibility,morphology, and thermal and mechanical properties

The article discusses the influence of the oligomeric resin, hydrogenated oligo(cyclopentadiene) (HOCP), on the morphology and properties of its blends with isotactic poly(1-butene) (PB-1). PB-1 and HOCP are found to be partially miscible in the melt state. Solidified PB-1/HOCP blends contain three phases: (1) a crystalline phase formed by PB-1 crystals; (2) an amorphous PB-1-rich phase; and (3) an amorphous HOCP-rich phase. The optical micrographs of the solidified blends show a morphology constituted by microspherulites and domains of the HOCP-rich phase homogeneously distributed in the intraspherulitic region. DSC and DMTA results show two glass transition temperatures (T_g), different from the T_g values of the plain components. The lower T_g is attributed to the PB-1-rich phase, and the higher T_g, to the HOCP-rich phase. The tensile properties were investigated at 25 and 80°C. At 25°C, the PB-1-rich phase is rubbery and the HOCP-rich phase is glassy, so the addition of HOCP to PB-1 arouses a noteworthy hardening of the samples and this brings an increase of the Young's modulus, E′ (although the blend crystallinity lessens), and decreases of stresses at yielding point (σ_y) and at rupture (σ_r). The 90/10 and 80/20 blends show high values of elongation at rupture (ε_r). At 80°C, the blends show decreases of E′ and σ_r values with the HOCP content. These decreases are attributed to the rubbery state of the phases and reduction of the blend's crystallinity. At 80°C, all the blends show a high value of ε_r. This phenomenon is attributed to the fine-size domain dispersion of the phases and to sufficient densities of tie molecules and entanglements. Finally, the partial miscibility behavior proposed in this article is compared with the miscibility hypothesis reported elsewhere. © 1998 John Wiley & Sons, Inc. J Appl Polym Sci 67:1369–1381, 1998     

Synthesis and properties of poly(ether ether ketone ketone)–poly(ether sulfone) block copolymers

Poly(ether ether ketone ketone)-poly(ether sulfone) (PEEKK/PES) block copolymers were prepared from the corresponding oligomers via a nucleophilic aromatic substitution reaction, and the M _n of the PEEKK segment was fixed at 12,000, while the M _n's of the PES segment ranged from 250 to 12,680. The different properties of the copolymers were investigated by differential scanning calorimetry (DSC), wide-angle X-ray diffraction (WAXD), thermogravimetric analysis (TGA), and dynamic mechanical analysis (DMA). The results showed that the relationship between T_g and compositions of copolymers approximately followed the formula 1/T_g = W₂/T_g2. The PES content and the segment length of the copolymers had a significant influence on their melting points and crystallization behavior. The thermal properties and dynamic mechanical behavior of the copolymers were also studied. In the study of isothermal crystallization, the copolymers have the same nucleation mechanism and crystal growth as that of pure PEEKK. Owing to the introduction of the PES segment into the PEEKK main chain, it increases the free energy which forms the critical crystal nucleus and produces a resistant action to the whole crystallization process of the PEEKK segment. © 1996 John Wiley & Sons, Inc.     

Physical aging in poly(methyl methacrylate)poly(styrene-co-acrylonitrile) blends. Part II: Enthalpy relaxation

An investigation of the effect of physical aging on excess enthalpy of compatible polymer blends was carried out. Poly(methyl methacrylate) (PMMA) and poly(styrene-co-acrylonitrile) (SAN) were chosen for this study. Blends of different ratios of PMMA and SAN were physically aged at different times and temperatures below their glass transition (T_g) and then subjected to enthalpy relaxation measurement in a differential scanning calorimeter (DSC). An improved procedure was developed and, employed to analyze the data. The error associated with the calculation of the normalized deviation in enthalpy, known as the “Φ” function, was below 4%. The relaxation was observed to proceed faster at higher aging temperature. It was also found that at higher aging temperatures of T_g – 20 and T_g– 35°C, enthalpy relaxation in SAN-rich blends proceeds faster than in PMMA rich blends, while at the low aging temperature of T_g– 50°C the rate of relaxation becomes independent of the composition.     

Observations of physical aging in a polycarbonate and acrylonitrile–butadiene–styrene blend

The effects of physical aging of a 75 : 25 PC/ABS blend have been studied using differential scanning calorimetry (DSC) and Fourier transform infrared spectroscopy (FTIR). From DSC, two distinct peak endotherms at about 90°C and 110°C, which are associated with the glass transition of ABS (T_g,ABS) and PC (T_g,PC) components, respectively, were observed. When progressive aging was monitored at 80°C for over 1000 h, the changes in enthalpic relaxation, glass and fictive temperatures for the blend followed similar trends to those already seen in the literature for PC aged between 125 and 130°C. The rate of enthalpy relaxation was also comparable. The plot of peak endotherm against logarithmic aging time for the PC blend constituent, however, behaved quite differently from the linear relationship known for highly aged PC. The ABS peak component also appeared to be insensitive to aging. Both observations were confirmed to be statistically significant using analysis of variance methods. Using temperature modulated‐DSC, there is evidence that aging increases the blend miscibility as the T_g,PC shifts toward the stationary T_g,ABS during aging. Parallel FTIR investigations found oxidation of butadiene during aging to be even at this relatively low temperature, forming hydroxyl and carbonyl degradation products. The presence of ABS in the blend also appeared to have prevented the shifting from the trans‐cis to trans‐trans arrangement of the carbonate linkage, which is a well‐known phenomenon during elevated temperature aging of PC alone. Moreover, the carbonate linkage appears to have been at the lower energy, trans‐trans, arrangement prior to the aging process. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

A study of sub-Tg heat flow transition of cured epoxy resin

The physical aging behavior of fully and partially cured epoxy resins based on diglycidyl ether of bisphenol A(DGEBA) has been investigated by differential scanning calorimetry (DSC). A sub-T_g heat flow transition (T_g1) could not be attributed to the phase separation or dynamic mechanical relaxation, as reported in the literature. In both fully and partially cured epoxy resins, it occurs only when the cooling rate is higher than that having the lowest T_g in the DSC scan. Therefore, it could be attributed to the motion of the internal stress-relaxed molecular chain.     

Comparison of microwave and thermal cure of epoxy resins

Stoichiometric mixtures of DGEBA (diglycidyl ether of bisphenol A)/DDS (diaminodiphenyl sulfone) and DGEBA/mPDA (meta phenylene diamine) have been isothermally cured by electromagnetic radiation and conventional heating using thin film sample configurations. Fourier transform infrared spectroscopy (FTIR) was used to measure the extent of cure. Thermal mechanical analysis (TMA) was used to determine the glass transition temperatures directly from the cured thin film samples. Well-defined glass transitions were observed in the TMA thermograph for both thermal and microwave cured samples. Significant increases in the reaction rates have been observed in the microwave cured DGEBA/DDS samples. Only slight increases in the reaction rates have been observed in the microwave cured DGEBA/mPDA samples. Higher glass transition temperatures were obtained in microwave cured samples compared to those of thermally cured ones after gelation. The magnitude of increases of glass transition temperature is much larger for the DGEBA/DDS system than DGEBA/mPDA system. The microwave radiation effect was much more significant in DGEBA/DDS system than in DGEBA/mPDA system. DiBenedetto's model was used to fit the experimental T_g data of both thermal and microwave cured epoxy resins.