超细陶瓷粉及铁粉的表面化学包覆改性的研究

本语文根据化学电镀原理,采用的化学镀液,分别研究了超细铁氧体粉末和陶次 粉的表面化学镀层工艺。并采用电镀、能谱分析和俄歇能谱对粉体包覆层的结构均匀性、厚度及化学元素变化进行了详细的分析。通过表面处理,可降低粉体的红外发射率,所获得的粉体同时具有雷达吸波性和红外隐身性,可用于宽波段隐身材料。     

金属镀层中元素含量的测试计算方法

测定金属表面镀层中特定元素的含量时,因易受基材的影响,单纯的通过物理或化学的方法很难得到最终的正确结果。文章通过建立数学模型推导出计算公式,并结合物理或化学的检测结果,从而实现对镀层中特定元素的准确定量计算。     

Spezielle Korrosionsschutz-Maßnahmen im Chemie-Apparatebau

Special corrosion protection measures in fabrication of chemical equipment. An essential pre-condition for uninterrupted and safe operation of equipment is a proper selection of materials with regard to service conditions, design, and fabrication. In case of difficulties with the application of unprotected metallic materials suitable additional measures must be applied to ensure proper performance of the equipment. Basically, there are four types of measures. The material can be improved by modification of the composition or fabrication (e. g. powder metallurgical, remelt techniques, accurate welding); the material can be protected by the application of a duplex-system (lining, cladding, plating); the electrochemical performance of the metal can be influenced by superimposed currents (cathodic/ anodic protection); and last but not least a change in service conditions can meet the requirements for materials performance. To ensure satisfactory performance of protective measures, supervision of application, installation, and in-service behaviour is a must.     

Preparation and characterization of core‐shell PS/Ni composite microspheres

PS/Ni microspheres were prepared by electroless nickel plating on PS microspheres. Several parameters for plating were optimized in order to obtain integrated and uniform nickel coatings. The properties of obtained composite microspheres, such as chemical composition and crystal texture of the coating, mechanical property, density, and magnetism, were characterized by SEM, EDS, XRD, and VSM. It was revealed that several parameters, such as thiourea dosage, reaction temperature, and load, had significant influence on fabrication of integrated and homogeneous nickel shell. It was also demonstrated that the properties of the PS/Ni microspheres, such as nickel weight ratio, density, and magnetism, can be tuned by adjusting the load. POLYM. COMPOS., 2009. © 2008 Society of Plastics Engineers     

Electroless plating of moisture‐curable polyurethane undercoating films

The compatibility of using moisture‐curable polyurethane (MCPU) system as a thin undercoating layer with electroless plating process was evaluated. The characteristics of the MCPU before and after chemical etching treatment were analyzed using atomic force microscope (AFM), scanning electrode microscope (SEM), contact‐angle measurements, and (Fourier‐Transform Infrared) FTIR spectroscopy. We found that surface morphology and roughness of the MCPU is affected by curing period and etching times. A proper combination of curing period and etching times are critical for obtaining a fully metallized surface. All MCPU samples that were etched for 15 min show poor plating performance due to surface damage caused by mild etching treatment. A standard pull‐off testing method (ASTM 4541) was used to evaluate the adhesion strength of nickel–MCPU. Only samples that were postcured for 4 days show influence of surface roughness on adhesion strength. On average, samples that were postcured for 7 days before electroless plating showed better adhesion of nickel–MCPU compared with samples that were postcured for 2 or 4 days. The results show that MCPU system can be used as a thin undercoating layer for electroless plating. It also offers smooth metal–polymer interface and therefore has the potential to be exploited for use in many electroless plating applications including in the decorative such as ornaments and display items and also in electronic industries. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 103: 1554–1565, 2007     

Neue Fettrohstoffe für oleochemische Reaktionen

New Raw Materials for Oleochemical Reactions Presently oleochemistry has access to new raw materials obtained either through modifications of existing oil crops or through selection of new crops. In this way higher yields of one fatty acid as well as fatty acids with uncommon structures were often obtained, such as the oils from new sunflower varieties with about 85% of oleic acid, or from new oilcrops synthesizing functional groups in their fat molecules ready for chemical modifications, such as Coriandrum, Calendula or Limnanthes. With such new raw materials new and improved products can be derived for oleo-chemical applications through epoxidation, ozonolysis and sulfonization.     

空心微珠基复合吸波材料研究进展

介绍了空心微珠基复合吸波材料的化学气相沉积法、化学镀法、真空镀膜法、溶胶-凝胶法等制备方法和研究动态。重点分析了化学气相沉积法与化学镀法实现空心微珠包覆铁磁性金属并用于吸收电磁波领域的趋势与特点,研究证明,改性后的空心微珠在8-18GHz具有较好的吸波性能。     

电镀铜技术在电子材料中的应用

电镀铜层具有良好的导电、导热、延展性等优点,因此,电镀铜技术被广泛应用于电子材料制造领域。本文概括了几种常用电镀铜体系的特点,重点介绍了在电子制造中应用较广的酸性硫酸盐电镀铜镀液的组成和各成分作用。简述了电镀铜在铜箔粗化、印制电路制作、电子封装、超大规模集成电路(ULSI)铜互连领域的应用,并对近年来电子工业中应用的几种先进电镀铜技术,包括脉冲电镀铜技术、水平直接电镀铜技术、超声波电镀铜技术、激光电镀铜技术等进行了评述。     

冷热两用碳载铂金双金属修饰电极的制备和应用

在集成到半导体制冷片上的504胶表面不同分区分别进行化学镀金、铂,制备了集成化的电极系统,其中化学镀金部分作为工作电极,化学镀铂部分作为对电极,将碳载铂金双金属修饰到镀金表面,制备冷热两用修饰电极,该方法利用环保的无氰化学镀技术,绿色环保,集成的电极可用于绿原酸含量测定,结合纸芯片等技术可以方便的进行含绿原酸的菊花等中药材的检测。     

化学镀制备激光ICF磁性PS靶材的研究

为了制备可以在磁场中悬浮的ICF靶丸材料,采用化学镀法对PS微球包覆Ni-P合金磁性镀层,并用正交实验确定了最佳工艺条件。采用XRD、SEM、DSC、VSM分析了镀层结构、形貌以及磁性。结果表明,Ni-P镀层在PS微球表面沉积均匀,表面光滑;微球的饱和磁化强度为2.130 A/m,所具有的磁性可使其在磁场中悬浮;化学镀Ni-P合金层最佳工艺条件为:ρ(NiSO4.6H2O)=40 g/L,ρ(NaH2PO2)=25 g/L,ρ(柠檬酸钠)=50 g/L,pH=10,温度为40℃。     

表面活性剂与钕离子对金属表面化学镀镍磷的影响

采用紫外-可见分光光度计,研究了固定工艺条件下十二烷基二甲基甜菜碱(BS-12)与琥珀酸二(2-乙基己基)酯磺酸钠(SDOS)两种表面活性剂及钕离子对金属表面化学镀镍磷的影响,得到较佳的工艺条件:SDOS与BS-12摩尔比为1:1,Ni~(2+)与H_2PO_2-摩尔比为0.3,pH=8,70℃施镀并添加适量的硫酸钕.探讨了表面活性剂的作用机制.结果表明,在固定的基础镀液中加入SDOS与BS-12混合表面活性剂,镀液会产生明显的温度效应和很强的协同效应,其镀速的增加比相应的单一表面活性剂所产生的增幅要大;加入稀土金属钕离子后,镀速下降,但镀层质量得到改善.     

电镀清洁生产技术改造宜从何处入手

阐述了电镀企业进行清洁生产系统技术改造的必然性,提出了企业进行清洁生产技术改造时必须从源头采取措施(如采取间歇式逆流漂洗与喷淋清洗组合的清洗方式、设置回收槽、使用高频开关电源、改造加热设备等),以节约水资源、回收流失的资源、减少污染物的产生、降低能耗、提高电镀生产过程的质量控制能力。     

化学镀镍规律及机理探讨

基于化学反应所遵循的物质守恒原理,在已知主要反应物、生成物条件下,利用化学方程式配平法,探讨了不同条件下化学镀镍的基本规律,首次提出了与目前经典化学镀镍理论不同的反应方程式;在此基础上找出了次磷酸利用率规律;利用P-H键断裂理论分析探讨了化学镀镍溶液成分及工艺条件,如稳定剂、pH、装载量、加速剂及络合剂等对化学镀镍的影...     

铜基上化学镀锡工艺分析

介绍了铜基化学镀锡工艺技术及其特点,详细分析了铜基上化学镀锡中还原剂、促进剂、络合剂、防氧化剂等各种化学药剂作用。     

Prevention of blister formation in electrolessly deposited copper film on organic substrates

Electroless copper (Cu) plating is a key process to provide seed layers for the subsequent Cu electroplating in the printed wiring boards (PWBs). Due to the demand for lower power dissipation at higher temperatures and high signal frequencies, various kinds of organic materials have been newly introduced as substrates. However, they have come with defects such as delamination and/or blisters in the Cu layers on organic substrates, i.e., weak adhesion. Here we demonstrate the root cause and a prevention method of the blister formation. Various parameters affecting the blister formation have been investigated combined with the deposit thickness (internal stress), hydrogen gas evolution, and codeposited Ni content in the electroless Cu plating. It was not obvious that the compressive internal stress in deposits was directly related to the blister formation. Instead, the hydrogen gas evolution clearly turned out to be the key factor, and it was observed that Ni added plating solutions reduced the hydrogen gas evolution significantly and thus produced no blisters in the Cu deposits. The control of blisters would be more critical as the line and space become narrower in the production lines such as ball grid array (BGA) and high density interconnection (HDI).     

High-speed plating for electronic applications

A permanent task of the electronic industry is to find methods in order to reduce production costs which are characterised by higher mass-production output. Besides the choice of less expensive coating materials, high-speed plating is a further possibility. High-speed plating brings about an increase in output or a minimisation of ground space and/or investment. The publication describes the principles, possibilities and limitations of high-speed plating technology in the scope of four different applications. These applications are: the selective coating of contact materials in reel-to-reel continuous plating lines, the continuous copper plating of printed circuit boards, the high-speed plating in product-specific plating tools integrated into an inter-linked production and the electroforming of microstructures.     

Accelerating effect of NaNO2 on the polymer plating of 6‐substituted‐1,3,5‐triazine‐2,4‐dithiol mono sodium salts

Organic polymer plating properties of 6‐substituted‐1,3,5‐triazine‐2,4‐dithiol mono sodium salts were investigated in the presence of various supporting electrolytes. Among these, the NaNO₂ supporting electrolyte greatly accelerated the film formation rate in polymer plating. The accelerating effect of NaNO₂ was further confirmed by comparing plating potentials in the presence of NaNO₂ and Na₂CO₃. The potentiostatic polymer plating of DAN in the presence of the NaNO₂ supporting electrolyte took place in the potential range of 1.65–1.8 V (compared against saturated calomel electrode reference). Film formation was influenced by such factors as the pH of solution and both the chemical structure and the concentration of triazine dithiol. In polymer platings, NO anions are thought to be electrochemically oxidized to yield NO radicals and these radicals react with DAN to yield new thiyl radicals. The thiyl radicals in the DAN molecules couple with each other by means of disulfide bonds, resulting in the growth of polymer film. Organic polymer plating films are shown to contain disulfide bonds, monosulfide bonds obtained by the reaction between allyl groups and thiyl radicals, and network chains. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 82: 2300–2309, 2001     

延长化学镀镍液寿命的研究

随着施镀的进行,化学镀镍液中的硫酸钠和亚磷酸钠的积累越来越多,从而影响镀液的使用寿命。提出了镀液中硫酸钠和亚磷酸钠的处理方法。对于硫酸镍体系,首先将镀液冷却至室温除去过量的硫酸钠晶体,接着在常温下添加Ca(OH)2沉淀除去亚磷酸根离子;对于次磷酸镍体系,直接采用常温下Ca(OH)2沉淀除去亚磷酸根离子的方法。分别测试和对比了2种体系镀液处理前后,镀液和镀层的性能,如镀液各组分浓度、镀液的密度、镀速、镀层应力等。采用化学沉淀法延长化学镀镍液寿命是切实可行的。     

Synthesis of Metal–Organic Frameworks Quantum Dots Composites as Sensors for Endocrine-Disrupting Chemicals

Hazardous chemical compounds such as endocrine-disrupting chemicals (EDCs) are widespread and part of the materials we use daily. Among these compounds, bisphenol A (BPA) is the most common endocrine-disrupting chemical and is prevalent due to the chemical raw materials used to manufacture thermoplastic polymers, rigid foams, and industrial coatings. General exposure to endocrine-disrupting chemicals constitutes a serious health hazard, especially to reproductive systems, and can lead to transgenerational diseases in adults due to exposure to these chemicals over several years. Thus, it is necessary to develop sensors for early detection of endocrine-disrupting chemicals. In recent years, the use of metal–organic frameworks (MOFs) as sensors for EDCs has been explored due to their distinctive characteristics, such as wide surface area, outstanding chemical fastness, structural tuneability, gas storage, molecular separation, proton conductivity, and catalyst activity, among others which can be modified to sense hazardous environmental pollutants such as EDCs. In order to improve the versatility of MOFs as sensors, semiconductor quantum dots have been introduced into the MOF pores to form metal–organic frameworks/quantum dots composites. These composites possess a large optical absorption coefficient, low toxicity, direct bandgap, formidable sensing capacity, high resistance to change under light and tunable visual qualities by varying the size and compositions, which make them useful for applications as sensors for probing of dangerous and risky environmental contaminants such as EDCs and more. In this review, we explore various synthetic strategies of (MOFs), quantum dots (QDs), and metal–organic framework quantum dots composites (MOFs@QDs) as efficient compounds for the sensing of ecological pollutants, contaminants, and toxicants such as EDCs. We also summarize various compounds or materials used in the detection of BPA as well as the sensing ability and capability of MOFs, QDs, and MOFs@QDs composites that can be used as sensors for EDCs and BPA.     

The Role of Lignin in Surface-Activated Bonding of Lignocellulose—Characterized by Differential Scanning Calorimetryt

The study of surface modification to prepare an optimum surface for bonding is of practical importance for the production of glued materials. Lignocellulosic materials contain many chemical groupings such as phenolic and alcoholic hydroxyls, carbonyl groups, etc., capable of being readily activated by physical or chemical methods. These active sites can then react under heat and pressure, either with active sites from another surface, or through a crosslinking agent to form a glued product.

This paper reports the role of lignin in the reactions between lignocellulosic materials and hydrogen peroxide studied by a differential scanning calorimetry method. The results showed that lignin is much more reactive toward hydrogen peroxide than is cellulose, and that the lignin-hydrogen peroxide reaction yields the highest enthalpy. Correlation between lignin and enthalpy, and enthalpy and bonding will also be discussed.