钒化合物稳定剂对锡电沉积过程的影响等

电镀与精饰(双月刊),2001,23(3):1研究了Shiff碱型光亮剂在酸性镀锡体系中,钒化合物稳定剂对锡电沉积的电流效率和镀层外观及织构的影响.当稳定剂质量浓度为0.10g/L时,镀层的光亮范围向低电流端扩展,在2.5～5.0 A/dm2电流密度范围内,电流效率及沉积速度都有所提高.镀层显示β-Sn(101)和(112)晶面的织构,但含钒稳定剂的镀液中得到的镀层,(101)晶面的织构系数降低而(112)晶面的织构系数增加.     

采用新型组合光亮剂的碱性镀铜研究

将一种新型组合光亮剂用于碱性镀铜工艺中,利用极化曲线、赫尔槽样板法、扫描电子显微镜(SEM)及X射线衍射(XRD)等分析了组合光亮剂中各添加剂对镀液极化能力的影响,研究了镀液的分散、覆盖能力,镀层的结合能力、表面形貌、组成及晶体结构.结果表明:组合光亮剂中4种添加剂均能提高镀液的极化能力,在铜沉积过程中具有不同的作用;电流密度为1～10 A/dm~2时,铜镀层晶粒均匀细致;镀层厚度较薄时满足(111)和(220)晶面择优取向协同生长的方式,而中等厚度的镀层趋向于(111)晶面择优取向生长.     

国内期刊纵览

20 0 10 70 1　钒化合物稳定剂对锡电沉积过程的影响———牛振江 .电镀与精饰 (双月刊 ) ,2 0 0 1,2 3( 3) :1研究了Ｓｈｉｆｆ碱型光亮剂在酸性镀锡体系中 ,钒化合物稳定剂对锡电沉积的电流效率和镀层外观及织构的影响。当稳定剂质量浓度为 0 .10ｇ/Ｌ时 ,镀层的光亮范围向低电流端扩展 ,在2 .5～ 5.0Ａ/ｄｍ2 电流密度范围内 ,电流效率及沉积速度都有所提高。镀层显示 β Ｓｎ( 10 1)和 ( 112 )晶面的织构 ,但含钒稳定剂的镀液中得到的镀层 ,( 10 1)晶面的织构系数降低而 ( 112 )晶面的织构系数增加。2 0 0 10 70 2　电沉积Ｎｉ Ｐ合金镀…     

温度和搅拌对甲基磺酸亚锡电镀亚光锡的影响

为提高甲基磺酸盐体系镀锡的质量,在甲基磺酸亚锡镀液中加入自主研发的亚光添加剂进行电镀亚光锡,采用电化学试验、Hull槽试验、扫描电镜等考察了温度和搅拌对甲基磺酸盐体系电镀亚光锡的阴极极化行为、镀层形貌、电流密度范围、沉积效率、沉积速度及镀液成分的影响。结果表明:亚光添加剂能够显著提高电镀亚光锡的阴极过电位、改善镀层质量;搅拌镀液可使浓差极化减小,增大了电镀亚光锡的电流密度范围;镀液温度升高,锡沉积电位正移,晶粒变粗,电流密度范围、电流效率和锡沉积速度均有所提高;温度过高(40～50℃)时,随着电镀时间的延长,镀液中Sn2+浓度升高,甲基磺酸浓度下降,镀液成分变化较大,不利于镀液维护及连续生产。     

哑光纯锡电镀层的制备工艺研究

介绍了一种新的甲基磺酸盐电镀哑光纯锡工艺,研究了各工艺条件变化对镀层沉积速度的影响,并用环境扫描电镜(SEM)观察了镀层形貌.研究发现,随着镀液中甲基磺酸锡浓度的增加,镀层的沉积速度逐渐增大.电流密度大小几乎与镀层的沉积速度成线性关系.镀液温度对沉积速度有较大影响,温度低时,镀层的沉积速度快且结晶细密,镀层光亮;随着镀液温度的升高,镀层的沉积速度先减小再逐渐增大,但温度过高时,析氢严重,电流效率下降.     

聚乙烯亚胺添加剂对碱性镀铜电沉积行为的影响

为了研究碱性镀铜中添加剂对铜电沉积行为的影响,采用一种新型柠檬酸碱性镀铜工艺制备了铜镀层,研究了聚乙烯亚胺添加剂在新型柠檬酸盐碱性镀铜中的作用机理.运用SEM,XRD和电化学方法对镀液、镀层进行了分析.结果表明:聚乙烯亚胺有利于获得较宽的电流密度范围和均匀细致的镀层,使铜镀层表现出(111)晶面的择优取向,铜的沉积为侧向生长;聚乙烯亚胺优先吸附在阴极高电流密度处,并对铜沉积产生较强的阻化作用;铜电沉积的初期行为服从扩散控制和三维连续成核方式生长规律.     

铝合金Ni-Co-P合金电镀工艺优化

在铝及其合金表面沉积Ni或Ni基合金,可以提高基体表面的硬度和耐磨性.通过正交试验,研究了铝硅合金基体上电镀Ni-Co-P镀层的工艺,得到了电流密度、镀液温度、pH值、电镀时间、镀液成分对镀层厚度、硬度、成分和沉积速率的影响规律,同时,还考察了镀层的耐磨性.结果表明:延长电镀时间、提高镀液温度和pH值时,镀层厚度和镀层硬度均增大;提高电流密度时,镀层厚度增大,但镀层硬度减小.提高电流密度、升高温度和提高pH值时,沉积速率增大.     

pH值对涤纶织物化学镀银的影响

研究了用葡萄糖作还原剂、氨水作络合剂在平纹涤纶织物上的化学镀银。分别采用场发射电镜(FE-SEM)、电子能谱(EDS)和X射线衍射(XRD)表征化学镀银层的表面形貌、镀层成分及结晶情况。考察了pH值对化学镀银镀液稳定性、镀层表面形貌、化学成分、结晶情况、镀银速率、增重率、表面电阻以及电磁屏蔽效能的影响。结果表明:pH值对化学镀银有非常重要的影响,pH值越高,溶液稳定性越差,镀银速率越快;随着pH值的升高,银的晶粒尺寸先增大后减小,晶面(111)的择优取向降低,晶面(220),(311)的择优取向升高。当pH值为12.8时,镀层堆积紧密、结晶性和电磁屏蔽效能较好。     

用脉冲喷射电沉积法制备纳米晶镍镀层

采用脉冲喷射电沉积方法制备了纳米晶镍镀层,用扫描电子显微镜(SEM)、透射电子显微镜(TEM)和X射线衍射(XRD)等方法研究了镀层的生长形貌和微观结构,并考察了脉冲电流密度对镀层微观结构如晶粒尺寸、织构等的影响.结果表明:镀层内表面(基体一侧)具有比外表面(镀液一侧)更为精细的晶粒结构,说明随着厚度的增加,镀层中的晶粒逐渐粗化.随着电流密度从45 A/dm2增加到180 A/dm2,镀层中晶粒生长的择优取向由(111)织构逐渐转变为强(220)织构.当电流密度从45 A/dm2增加到120 A/dm2时,镀层平均晶粒尺寸逐渐减小;而进一步增加电流密度到180 A/dm2,镀层晶粒尺寸又会有轻微的增大.     

以三乙醇胺为辅助配位剂碱性电沉积锌镍合金的电化学行为

碱性镀液中镍离子的配位剂对镀层影响很大,目前对其多种配位剂共同使用的研究较少。研究了以四乙烯五胺为镍离子的主配位剂,三乙醇胺(TEA)为镍离子辅助配位剂的锌镍合金碱性电沉积体系,在不同三乙醇胺含量和电流密度下在Q235低碳钢表面电沉积锌镍合金的电化学过程。结果表明:随着镀液中三乙醇胺含量增加,电流效率和沉积速率下降,溶液电阻、电荷传递电阻和电感先增加后降低,在n(TEA)∶n(Ni2+)=2.0时阴极极化最大;增加阴极电流密度使镀液的沉积电位变负,阴极极化增大,同时使电荷传递电阻和电感变小;该碱性电沉积锌镍合金的过程受电化学步骤和扩散步骤混合控制。     

Influence of Deposition Conditions on the Crystal Structure of MoS2 Coating

MoS2 coatings were prepared using an unbalanced bipolar pulsed DC （direct current） magnetron sputtering apparatus under different targets, cathode current densities, power modes and bias voltages. The morphology, structure and growth characteristics of MoS2 coatings were observed and identified respectively by scanning electron microscopy, X-ray diffractometry and mass spectrometry. The results show that MoS2 coatings evolve with the （002） basal plane parallel to the surface by using cold pressed target with lower density, lower cathodic current density, bipolar pulse DC power and minus bias voltage, whereas the coatings deposited under hot pressed target, higher cathodic current density, simple DC power and positive bias voltage have the （002） basal plane perpendicular to the surface. The influence of deposition conditions on the crystal structure of MoS2 coating is implemented by altering its growth rate and the energy of sputtering-deposition particles.     

电沉积铜的电阻率和硬度的时间效应

为了研究钢基体上电沉积铜的电阻率和硬度随阴极电流密度及时间的变化规律,通过制备不同电流密度的电沉积铜样品,分别采用直流电桥式电阻仪和显微硬度计测定样品的电阻率和硬度.结果表明,电沉积铜的硬度和电阻率随阴极电流密度增大而提高,然而经时效时理后会下降.阴极电流密度增加,电沉积铜层的晶粒变小,而时效处理能够提高晶粒度和降低缺陷密度.     

Titanium film deposition by high-power impulse magnetron sputtering: Influence of pulse duration

Surface modification with high-power glow discharges is a promising physical vapor deposition (PVD) technology for industrial usage. A metal ion density higher than 10¹⁸ m⁻³ can be obtained due to a high-power input in the plasma. In the present paper, titanium films were deposited on Si (100) substrates using high-power impulse magnetron sputtering (HIPIMS). The pulse duration was varied to investigate the deposition rate and the titanium film structure. The plasma source was an unbalanced magnetron sputtering (UBMS) discharge generation system. The deposition rate was correlated to the electrical characteristics. There was an instantaneous power threshold of approximately 36 kW to significantly increase the deposition rate by 4-5 times. The deposition rate increased linearly with respect to the average power until the average power reached 5.6 kW (about 30 W/cm² for a total area of the target), and an 83% increase of the deposition rate from the linear relationship was observed. The increase of the deposition rate was possibly closely related to the so-called thermal spike, where the target temperature increases due to a high power input to the target. The surface morphology and the crystalline structure of the films were studied for a variety of pulse durations, and the results were compared to the case of the direct-current magnetron sputtering (dcMS) process. The titanium films at an average power of 1.2 kW and a pulse duration of 50 μs have a smaller crystalline size and a smoother surface than those at an average power of 825 W by dcMS. The crystal orientation (101) was dominated when the pulse duration was lengthened to 180 μs, although the (002) orientation was dominant in dcMS. The crystal size and the surface roughness increased significantly when the pulse duration was increased from 50 μs to 180 μs in HIPIMS. The consumed power in the plasma by HIPIMS can be an important parameter for the crystal size and the structure.     

脉冲电镀铁中平均电流密度对镀层的影响

应用现代脉冲电镀技术,分别在钢和铜基体上电镀铁层,以期获得性能优良的镀层.研究了平均电流密度对铁镀层的沉积速度、外貌、显微硬度和显微结构的影响.结果显示:随着平均电流密度的增加,铁镀层外貌先变好后变差;脉冲电沉积速度加快,以16 A/dm2的沉积效率最高;不同条件下的镀层显微硬度呈近似的"正态分布"关系;铁镀层的显微结构为立方晶型,有明显的择优取向.     

调制比对C/C多层膜结构及性能的影响

考察了C(硬)/C(软)调制比对多层膜结构和性能的影响。采用磁过滤直流阴极真空弧源沉积技术制备了C/C多层膜,通过Raman光谱对多层膜的结构进行了表征;用硬度计和销盘式摩擦磨损试验机测试了多层膜的硬度及摩擦学性能。结果表明:所制备的多层膜呈现类金刚石结构并具有良好的耐磨性,其摩擦系数均小于0.15;随多层膜中软膜比例的增大,薄膜中sp2簇的数量逐渐增多,薄膜显维硬度呈现下降趋势,多层膜的耐磨性能下降。     

添加剂及电源波形对镍钴合金电铸液分散能力的影响

通过正交试验研究了添加荆TN1、电源波形(全波、半波、直流)、电流密度和pH值对镍钴合金电铸液分散能力的影响.结果表明,添加剂TN1的加入可以很大程度地提高分散能力;电源渡形为全波时分散能力最好.添加剂TN1提高分散能力的原因主要是提高了阴极极化和降低了高电流密度区的电流效率;电源波形影响铸液分散能力主要是由于它对溶液导电性和电流效率有影响.添加剂和波形对分散能力的影响实质上是对双电层影响的结果.     

溅射功率对ZnO：Si透明导电薄膜性能的影响

采用直流磁控溅射法在室温玻璃基片上制备出了掺硅氧化锌（ZnO：Si）透明导电薄膜,研究了溅射功率对ZnO：Si薄膜结构、形貌、光学及电学性能的影响,实验结果表明,溅射功率对ZnO：Si薄膜的生长速率、结晶质量及电学性能有很大影响,而对其光学性能影响不大。实验制备的ZnO：LSi薄膜为六方纤锌矿结构的多晶薄膜,且具有垂直于基片方向的c轴择优取向。当溅射功率从45W增加到105W时,薄膜的晶化程度提高、晶粒尺寸增大,薄膜的电阻率减小;当溅射功率为105W时,薄膜的电阻率达到最小值3．83~104n·cm,其可见光透过率为94．41％。实验制备的ZnO：Si薄膜可以用作薄膜太阳能电池和液晶显示器的透明电极。     

Current passage in a vacuum diode with field-and laser-controlled ferroelectric cathode

We present the results of experimental investigation of a planar vacuum diode with field-and laser-controlled ferroelectric cathode based on prepolarized ceramics of the TsTS-23 (TsTS-19) grade. The diode current passes when the spontaneous polarization vector is oriented both toward the anode and in the opposite direction. It is established that an increase in the laser power density on the ceramic surface leads to a decrease in the diode current pulse duration. The maximum currents achieved in a field-controlled diode exceed the Langmuir current values by two to three orders of magnitude. The current pulse characteristics are determined by the mutual orientation of the polarization vector and the control electric field.     

Jet electrodeposition with movable,flexible friction on quality of nanocrystalline nickel coatings

To improve the deposition rate and quality of nanocrystalline nickel coatings, a method involving movable, flexible friction, jet electrodeposition (MFFJE) was proposed in this paper. The effects of cathode scanning speed and current density on electrodeposited nickel coatings prepared by MFFJE were investigated. Compared with traditional jet electrodeposition, the results showed that MFFJE exerted remarkable effects, improving the deposition rate and quality of nickel coatings, and, when the cathode scanning speed was 1000?mm?min^?1, the coating surface morphology was best. The maximum processing current density of nickel plating was more than 250?A?dm^?2. The grain size was decreased to 11.7?nm, hardness increased to 546?HV, and coating corrosion resistance significantly improved.