一种基于多协议电流复用双频段压控振荡器的设计

.本文设计了一种基于IEEE 802.11 a/b/g和蓝牙多协议零中频收发机中双频段压控振荡器.该振荡器使用电流复用的方法,即将两个工作在不同频段的压控振荡器串联堆叠,达到了降低功耗的目的.通过Aglient ADS仿真,结果表明本文所设计的双频段压控振荡器功耗为12.22 mW,2.44和5.23 GHz载频处的相位噪声分别为-126.2和-120.1dBc/Hz@1 MHz,其性能完全符合IEEE 802.11a/b/g和蓝牙协议的要求.该振荡器将采用0.18 μm CMOS工艺实现,芯片面积为1.18 mm×0.67 mm.     

0.18-mm RF CMOS 工艺电感电容压控振荡器*

采用SMIC 0.18mm RF CMOS工艺设计实现了一种低相位噪声的压控振荡器。该电路采用了优化设计的电感电容谐振腔,差分耦合的放大器作为负阻补偿谐振腔的能量损耗。为了拓宽电路的频率调谐范围,在电路中设计了三比特开关电容阵列。测试结果表明：振荡器频率调谐范围为1.92GHz 到3.35GHz,在2.4GHz 频率处偏移载波1MHz处的相位噪声为-117.8dBc/Hz。电路直流供电电压为1.8V,电流为5.6mA.,芯片尺寸为600mm′900mm。芯片性能良好,可以应用于IEEE802.11b标准的无线局域网接收机中。.     

适用于零中频802.11a/b/g无线局域网以及蓝牙系统的工作在8.64-11.62GHz的压控振荡器和分频器

本文提出了工作在1.2V电压下用0.13um工艺实现的全集成压控振荡器和分频器。压控振荡器的工作频段是8.64GHz到11.62GHz,可以通过2分频产生适用于802.11a无线局域网（5.8GHz频段）的正交本振信号,通过4分频产生适用于802.11b/g无线局域网和蓝牙协议（2.4GHz频段）的正交本振信号。6位开关电容阵列用来调整所需要的工作频段。测试结果显示压控振荡器2分频后在距离5.5G载波1M频偏处的相位噪声是-113dBc,压控振荡器消耗了3.72mW的功耗,FOMT 是-192.6dBc/Hz。     

一种应用于多频接收机的宽带频率综合器

采用0.18µm 1P6M CMOS工艺实现了一种应用于多频接收机的整数分频频率综合器。该频率综合器为接收机提供频率分别为2.57GHz, 2.52GHz, 2.4GHz 和 2.25GHz的本振信号。为了覆盖要求的频点,其宽带压控振荡器同时采用了可变电容阵列和可变电感阵列。经测试,压控振荡器的频率调谐范围为1.76GHz~2.59GHz。对于频率为2.57GHz, 2.52GHz, 2.4GHz 和 2.25GHz的载波,在1MHz频偏处,相位噪声分别为-122.13dBc/Hz、-122.19dBc/Hz、-121.8dBc/Hz和-121.05dBc/Hz。其带内相位噪声分别为-80.09dBc/Hz、-80.29dBc/Hz、-83.05dBc/Hz 和-86.38dBc/Hz。包括驱动电路在内的芯片功耗约为70mW。芯片面积为1.5mm×1mm。     

变压器反馈的超低功耗低相位噪声CMOSLC-VCO设计

设计了一种全集成交叉耦合变压器反馈的LC压控振荡器(LC-VCO),该VCO在电源电压低于阈值电压的情况下实现了超低功率消耗和低相位噪声.该超低功耗的VCO采用SMIC 0.18μm数模混合RF 1P6M CMOS工艺进行了流片验证.测试结果表明:电路在0.4V电源供电和工作频率为2.433GHz时,相位噪声为-125.3dBc/Hz(频偏1MHz),核心直流功耗仅为720μW.芯片的工作频率为2.28～2.48GHz,调谐范围为200MHz(8.7%),电路的优值为-193.7dB,信号的输出功率约为1dBm.该VCO完全可以满足IEEE 802.11b接收机的应用要求.     

低相位噪声压控振荡器的设计及仿真

随着通信技术对射频收发机性能要求的提高,高性能压控振荡器已成为模拟集成电路设计、生产和实现的关键环节.针对压控振荡器设计过程中存在相位噪声这一核心问题,采用STMC 0.18μm CMOS工艺,提出了一种1.115GHz的电感电容压控振荡器电路,利用Cadence中的SpectreRF对电路进行仿真.仿真结果表明:在4~6V的电压调节范围内,压控振荡器的输出频率范围为1.114 69~1.115 38GHz,振荡频率为1.115GHz时,在偏离中心频率10kHz处、100kHz处以及1MHz处的相位噪声分别为-90.9dBc/Hz,-118.6dBc/Hz,-141.3dBc/Hz,以较窄的频率调节范围换取较好的相位噪声抑制,从而提高了压控振荡器的噪声性能.     

应用于无线局域网的低压低功耗2.5GHz VCO设计

采用交叉耦合结构,利用TSMC 90nm 1P9M1.2V RFCMOS工艺设计的全集成LC压控振荡器(VCO),符合IEEE802.11b/g WLAN通信标准。调谐电压为0～1.2V,具有150MHz的调谐范围(2.44GHz～2.59GHz)。利用Mentor Graphics Eldo对该电路进行仿真,仿真结果显示,在2.5GHz工作频率处,相位噪声约为-122.3dBc/Hz@1MHz,功耗仅为1.9mW。     

一种面向IEEE 802.11ac标准的5 GHz LC压控振荡器

基于TSMC RF 0.18 μm CMOS工艺,设计了一种可应用于IEEE 802.11ac标准的5 GHz宽带LC压控振荡器。该振荡器采用了NMOS交叉耦合结构,同时采用了5位开关电容阵列以扩展调谐范围。开关电容阵列使压控振荡器的增益KVCO保持在一个较小的值,有效地降低了压控振荡器的相位噪声。后仿真结果表明,该压控振荡器在1.8 V电源电压下,功耗为9 mW,频率调谐范围为4.52~5.56 GHz,在偏离中心频率1 MHz处仿真得到的相位噪声为-124 dBc/Hz。该LC 压控振荡器的版图尺寸为320 μm×466 μm。     

超低功耗低相位噪声CMOS LC-VCO的设计与实现

设计了一种全集成交叉耦合变压器反馈的LC压控振荡器（LC-VCO）,该VCO即使在电源电压低于阈值电压的情况下实现了低相位噪声和超低功率消耗。该超低功耗的VCO采用SMIC 0.18um 数模混合&RF 1P6M CMOS工艺进行了流片验证。测试结果表明：电路在0.4 V电源供电和工作频率为2.433 GHz时,相位噪声为-125.3 dBc/Hz@1MHz,核心直流功耗仅为640uW。芯片的工作频率为2.28-2.48 GHz,调谐范围为200 MHz (8.7%),电路的优值为-195.7dB。该VCO完全可以满足IEEE 802.11b接收机的应用要求。     

900 MHz压控振荡器设计

采用集总元件变容二极管和超高频三极管设计900 MHz压控振荡器,根据ADS2006A软件仿真确定了压控振荡器的电路参数,并对相关指标如相位噪声、调谐带宽、稳定系数、输出功率和谐波电平等进行了仿真,通过调整电路参数,优化电路结构,实现了工作频率为1 GHz、调谐带宽为90 MHz的压控振荡器,其相位噪声在偏移中心频率10 kHz处为-105 dBc/Hz,在100 kHz处为-120 dBc/Hz,该设计大大降低了系统成本.     

Performance improvement in tensile-strained In/sub 0.5/Al/sub 0.5/As/In/sub x/Ga/sub 1-x/As/In/sub 0.5/Al/sub 0.5/As metamorphic HEMT

This paper proposes a In/sub 0.5/Al/sub 0.5/As/In/sub x/Ga/sub 1-x/As/In/sub 0.5/Al/sub 0.5/As (x=0.3-0.5-0.3) metamorphic high-electron mobility transistor with tensile-strained channel. The tensile-strained channel structure exhibits significant improvements in dc and RF characteristics, including extrinsic transconductance, current driving capability, thermal stability, unity-gain cutoff frequency, maximum oscillation frequency, output power, power gain, and power added efficiency.     

Morphological and electrical characterization of SixCryCzBv thin films

Si_xCr_yC_zB_v thin films with several compositions have been studied for integration of high precision resistors in 0.8 μm BICMOS technology. These resistors, integrated in the back-end of line, have the advantage to provide high level of integration and attractive electrical behavior in temperature, for analog devices. The film morphology and the structure have been investigated through transmission electron microscopy analysis and have been then related to the electrical properties on the base of the percolation theory. According to this theory, and in agreement with experimental results, negative thermal coefficient of resistance (TCR) has been obtained for samples with low Cr content, corresponding to a crystalline volume fraction below the percolation threshold.Samples with higher Cr content exhibit, instead, a variation of the TCR as a function of film thickness: negative TCR values are obtained for thickness lower than 5 nm, corresponding to a crystalline volume fraction below the percolation threshold; positive TCR are obtained for larger thickness, indicating the establishment of a continuous conductive path between the Cr rich grains. This property seems to be determinant in order to assure the possibility to obtain thin film resistors almost independent on the temperature.     

Comparison between Pt/TiO2/Pt and Pt/TaOX/TaOY/Pt based bipolar resistive switching devices

Nonvolatile memories have emerged in recent years and have become a leading candidate towards replacing dynamic and static random-access memory devices. In this article, the performances of TiO₂ and TaO₂ nonvolatile memristive devices were compared and the factors that make TaO₂ memristive devices better than TiO₂ memristive devices were studied. TaO₂ memristive devices have shown better endurance performances (10⁸ times more switching cycles) and faster switching speed (5 times) than TiO₂ memristive devices. Electroforming of TaO₂ memristive devices requires~4.5 times less energy than TiO₂ memristive devices of a similar size. The retention period of TaO₂ memristive devices is expected to exceed 10 years with sufficient experimental evidence. In addition to comparing device performances, this article also explains the differences in physical device structure, switching mechanism, and resistance switching performances of TiO₂ and TaO₂ memristive devices. This article summarizes the reasons that give TaO₂ memristive devices the advantage over TiO₂ memristive devices, in terms of electroformation, switching speed, and endurance.     

The C-V-f and G/ω-V-f characteristics of Al/SiO2/p-Si (MIS) structures

The frequency dependence of capacitance-voltage (C-V) and conductance-voltage (G/ω-V) characteristics of the Al/SiO₂/p-Si metal-insulator-semiconductor (MIS) structures has been investigated taking into account the effect of the series resistance (R_s) and interface states (N_ss) at room temperature. The C-V and G/ω-V measurements have been carried out in the frequency range of 1 kHz to 1 MHz. The frequency dispersion in capacitance and conductance can be interpreted only in terms of interface states and series resistance. The N_ss can follow the ac signal and yield an excess capacitance especially at low frequencies. In low frequencies, the values of measured C and G/ω decrease in depletion and accumulation regions with increasing frequencies due to a continuous density distribution of interface states. The C-V plots exhibit anomalous peaks due to the N_ss and R_s effect. It has been experimentally determined that the peak positions in the C-V plot shift towards lower voltages and the peak value of the capacitance decreases with increasing frequency. The effect of series resistance on the capacitance is found appreciable at higher frequencies due to the interface state capacitance decreasing with increasing frequency. In addition, the high-frequency capacitance (C_m) and conductance (G_m/ω) values measured under both reverse and forward bias were corrected for the effect of series resistance to obtain the real diode capacitance. Experimental results show that the locations of N_ss and R_s have a significant effect on electrical characteristics of MIS structures.     

Very low-noise Al/sub 0.3/Ga/sub 0.7/As/Ga/sub 0.65/In/sub 0.35/As/GaAs single quantum-well pseudomorphic HEMTs

AlGaAs/GaInAs/GaAs pseudomorphic HEMTs with an InAs mole fraction as high as 35% in the channel has been successfully fabricated. The device exhibits a maximum extrinsic transconductance of 700 mS/mm. At 18 GHz, a minimum noise figure of 0.55 dB with 15.0 dB associated gain was measured. At 60 GHz, a minimum noise figure as low as 1.6 dB with 7.6 dB associated gain was also obtained. This is the best noise performance yet reported for GaAs-based HEMTs.<>     

A 12 /spl times/ 12 In/sub 0.53/Ga/sub 0.47/As-In/sub 0.52/Al/sub 0.48/As avalanche photodiode array

We report a 12 /spl times/ 12 In/sub 0.53/Ga/sub 0.47/As-In/sub 0.52/Al/sub 0.48/As avalanche photodiode (APD) array. The mean breakdown voltage of the APD was 57.9 V and the standard deviation was less than 0.1 V. The mean dark current was /spl sim/2 and /spl sim/300 nA, and the standard deviation was /spl sim/0.19 and /spl sim/60 nA at unity gain (V/sub bias/ = 13.5 V) and at 90% of the breakdown voltage, respectively. External quantum efficiency was above 40% in the wavelength range from 1.0 to 1.6 /spl mu/m. It was /spl sim/57% and /spl sim/45% at 1.3 and 1.55 /spl mu/m, respectively. A bandwidth of 13 GHz was achieved at low gain.     

Lanthanum diffusion in the TiN/LaOx/HfSiO/SiO2/Si stack

Band edge Complementary Metal Oxide Semiconductor (CMOS) devices are obtained by insertion of a thin LaO_x layer between the high-k (HfSiO) and metal gate (TiN). High temperature post deposition anneal induces Lanthanum diffusion across the HfSiO towards the SiO₂ interfacial layer, as shown by Time of Flight Secondary Ions Mass Spectroscopy (ToF-SIMS) and Atom Probe Tomography (APT). Fourier Transform Infrared Spectroscopy in Attenuated Total Reflexion mode (ATR-FTIR) shows the formation of La-O-Si bonds at the high-k/SiO₂ interface. Soft X-ray Photoelectron Spectroscopy (S-XPS) is performed after partial removal of the TiN gate. Results confirm La diffusion and changes in the La chemical environment.     

Al/sub 0.3/Ga/sub 0.7/As/In/sub x/Ga/sub 1-x/As (0/spl les/x/spl les/0.25) doped-channel field-effect transistors (DCFET's)

The properties of both lattice-matched and strained doped-channel field-effect transistors (DCFET's) have been investigated in AlGaAs/In/sub x/Ga/sub 1-x/As (0/spl les/x/spl les/0.25) heterostructures with various indium mole fractions. Through electrical characterization of grown layers in conjunction with the dc and microwave device characteristics, we observed that the introduction of a 150-/spl Aring/ thick strained In/sub 0.15/Ga/sub 0.85/As channel can enhance device performance, compared to the lattice-matched one. However, a degradation of device performance was observed for larger indium mole fractions, up to x=0.25, which is associated with strain relaxation in this highly strained channel. DCFET's also preserved a more reliable performance after biased-stress testings.<>     

Dielectric confinement on exciton binding energy and nonlinear optical properties in a strained Zn1-xinMgxinSe/Zn1-xoutMgxoutSe quantum well

The band offsets for a Zn1-xinMgxin Se/Zn1-xoutMgxout Se quantum well heterostructure are determined using the model solid theory.The heavy hole exciton binding energies are investigated with various M...