In situ ultrasonic force signals during low-temperature thermosonic copper wire bonding

Ultrasonic in situ force signals from integrated piezo-resistive microsensors were used previously to describe the interfacial stick-slip motion as the most important mechanism in thermosonic Au wire ball bonding to Al pads. The same experimental method is applied here with a hard and a soft Cu wire type. The signals are compared with those obtained from ball bonds with standard Au wire. Prior to carrying out the microsensor measurements, the bonding processes are optimized to obtain consistent bonded ball diameters of 60 μm yielding average shear strengths of at least 110 MPa at a process temperature of 110 °C. The results of the process optimization show that the shear strength c_pk values of Cu ball bonds are almost twice as large as that of the Au ball bonds. The in situ ultrasonic force during Cu ball bonding process is found to be about 30% higher than that measured during the Au ball bonding process. The analysis of the microsensor signal harmonics leads to the conclusion that the stick-slip frictional behavior is significantly less pronounced in the Cu ball bonding process. The bond growth with Cu is approximately 2.5 times faster than with Au. Ball bonds made with the softer Cu wire show higher shear strengths while experiencing about 5% lower ultrasonic force than those made with the harder Cu wire.     

High-temperature wire sweep characteristics of semiconductor package for variable loop-height wirebonding technology

This paper studies the elevated-temperature sweep characteristics of wire bond during the transfer molding process for semiconductor packages. The material properties of gold wire are obtained experimentally at various temperatures. A set of sweep experiments is also performed to acquire the sweep stiffness of wire bond for several bond spans and bond heights. The linearity of the load-transverse displacement curves from sweep experiments indicates that the ranges of the allowance bond pitch in most semiconductor packages may be within linear elasticity limits. The elastic numerical analysis may be applied to predict the sweep behavior of the wire bond. In order to predict the elevated temperature behavior of wire bond sweep, a methodology is proposed in this study. With the aids of geometry factor defined in Eq. (6) and the three drag force models, Lamb’s, Sherman’s and Takaisi’s, the predictions of the elevated-temperature sweep deflections of wire bond can be tested. The results show that the increase of the sweep deflections is more related to bond span than bond height.     

Determination of ordering induced birefringence in (Al)GaInP

In this paper, the first measurement of the ordering induced birefringence in GaInP and (Al_0.33Ga_0.67)InP is presented. It is found that these ordered crystals are positively birefringent far below the bandgap and become negatively birefringent at the bandgap. The method to measure the birefringence is based on the modifications introduced by ordering to the mode structure of planar waveguides. The change of the sign of birefringence at the bandgap is due to the highly anisotropic interband matrix element. The dispersion of the measured birefringence is in good agreement with six-band k·p calculations.     

Development of a parallel wire mechanism for measuring position and orientation of a robot end-effector

This paper presents a parallel wire mechanism developed for measuring six degrees of freedom of a robot end-effector. The mechanism consists of six parallel wire links. The position and orientation of a robot are obtained from the wire lengths measured in the parallel wire mechanism. The complex nonlinear equations of the forward kinematics are solved by using a Newton–Raphson method, and a unique solution is determined from the geometric configuration of the developed mechanism. The wire length error caused by longitudinal deformation of the wires is compensated by a wire compensation factor. Through the experiment, it is verified that the developed mechanism has an accuracy of ±0.05 mm, ±0.1° in the position and the orientation, respectively. The developed parallel wire mechanism can be used effectively for measuring the position and orientation of a six degree of freedom (DOF) of robot end-effector with low cost and effort.     

Nanoparticle ordering by dewetting of Co on SiO2

Most metals on SiO₂ have a finite contact angle and are therefore subject to dewetting during thermal processing. The resulting dewetting morphology is determined primarily by nucleation and growth or instabilities. The dewetting mechanism implies a disordered spatial arrangement for homogeneous nucleation, but an ordered one for instabilities such as spinodal decomposition. Here, we show that the morphology of laser-melted ultrathin Co film (4-nm thick) can be attributed to dewetting via an instability. Dewetting leads to breakup of the continuous Co film into nanoparticles with a monomodal size distribution with an average particle diameter of 75 nm±23 nm. These nanoparticles have short-range order (SRO) of 130 nm in their separation. This result has important implications for nanomanufacturing with a robust spacing or size selection of nanoparticles in addition to spatial ordering.     

网络订票的移动支付协议的研究与设计

本文给出一个网络订票的移动支付模型,在这一模型上,基于CEMBS的设计思想,在尽量满足移动网络特性的情况下,设计了一个能在移动终端实现网络订票的高效、安全协议.通过分析,该协议满足不可否认性,认证性以及保密性等一些性质,并且协议较为简单,应用范围较广.     

The effect of Pd and Cu in the intermetallic growth of alloy Au wire

This is the new wire evaluation work for the reliability of the wire-bonding process. There is a trend for the plastic integrated-circuit package to function at higher junction temperature with thinner wire. New alloy Au wires have been developed to meet the reliability requirements. Two types of alloy Au wires, Au-Pd and Au-Cu, were evaluated in this study. These samples were aged between 155°C and 205°C under air from 0 h to 3,000 h. According to this study, the phase-formation sequence of Au₂Al, Au₅Al₂, and Au₄Al intermetallic is similar to the pure Au wire. There is a Pd-rich layer working as a diffusion barrier to slow down the growth rate of intermetallic phases in the Au-Pd wire. The Au-Cu wire also slowed down the growth rate with a different mechanism. Both wires have better reliability based on the microstructure examination. The reliability test results show longer working life at higher temperatures in comparison with the regular Au wire.     

临床便捷化点菜系统的设计与实践

医疗服务信息化是国际发展趋势。随着信息技术的快速发展,国内越来越多的医院正加速实施基于信息化平台、HIS系统的整体建设,以提高医院的服务水平与核心竞争力。医院的后勤保障及服务也需要紧密贴合信息化,对原有流程进行信息化改造,从而提高医疗服务的质量和效率。文章设计的系统有发布菜单功能、员工注册功能、资源搜索下载功能、论坛功能等主要模块,还有强大的后台管理可以随时更改网站的一些数据,开发语言ASP,PHP,全方面运用Dreamwerver,Photoshop等主要开发程序,更有强大的Access,MySQL数据库支持。     

基于SPCE3200藏、汉、英电子点菜系统的设计

基于西藏地区旅游业的迅速发展以及其带动下的西藏餐饮行业的实际需求,采用SPCE3200微控制芯片,外扩Zigbee模组和TFT液晶模组,结合嵌入式设计方法,设计出了具备藏、汉、英三种语言文字的实时点菜系统,旨在为中外游客在藏旅游时提供方便快捷的餐饮服务。实际测试结果表明,该系统反应快速、客户服务端与后台主机端网络互联简单且稳定、菜单及顾客的需求信息做到了准确的收发,符合西藏餐饮业的实际需求,适合在西藏地区推广。     

High-speed video analysis for kink formation in a bond wire looping

1. Download : Download full-size image

     

Control of ordering in GaInP and effect on bandgap energy

Ga_xIn_1-x P layers with x ≈ 0.5 have been grown by atmospheric pressure organometallic vapor phase epitaxy on GaAs substrates with 10 micron wide, [110]-oriented grooves produced photolithographically on the surface. The [110] steps and the misorientation produced at the edges of the grooves have been found to have important effects on the formation of the Cu-Pt ordered structure (ordering on {111} planes) in the GaInP layers during growth. In this work, the groove shape is demonstrated to be critically important. For the optimum groove shape, with a maximum angle to the (001) surface of between 10 and 16°, single domains of the (-111) and (1-11) variants of the Cu-Pt ordered structure are formed on the two sides of the groove. Shallow (≤0.25 μm deep) grooves, with maximum angles of <10°, are less effective. Within the large domains on each side of the groove, small domains of the other variant are observed. The boundary between the two domains is seen to wander laterally by a micron or more during growth, due to the change in shape of the groove during growth. For deep (1.5 μm) grooves, with maximum angles to the (001) plane of 35°, only a single variant is formed on each side of the groove. However, the domains are small, dispersed in a disordered matrix. For substrates with deep grooves on a GaAs substrate misoriented by 9° toward the [-110] direction, an interesting and useful pattern is produced. One half of the groove is a single domain which shrinks in size as the growth proceeds. The other half of the groove, where the misorientation is larger, is disordered. Thus, every groove contains large (>1 μm² cross-sectional area and several mm long) regions of highly ordered and completely disordered material separated by no more than a few microns. This allows a direct determination of the effect of ordering on the bandgap of the material using cathodoluminescence (CL) spectroscopy. The 10K photoluminescence (PL) consists of three distinct peaks at 1.94, 1.88, and 1.84 eV. High resolution CL images reveal that the peaks come from different regions of the sample. The high energy peak comes from the disordered material and the low energy peak comes from the large ordered domains. Electron microprobe measurements of the solid composition demonstrate that the shift in emission energy is not due to changes in solid composition. This is the firstdirect verification that ordering causes a reduction in bandgap of any III/V alloy. Decreasing the Ga_0.5In_0.5P growth rate from the normal 2.0 to 0.5 μ/h is found to enhance ordering in layers grown on planar GaAs substrates. Transmission electron diffraction results show that the domain size also increases significantly. For material grown on exactly (001)-oriented substrates, a pronounced [001] streaking of the superlattice spots is observed. This is correlated with the presence of a dense pattern of fine lines lying in the (001) plane in the transmission electron micrographs. The PL of this highly ordered material consists of a single peak that shifts to higher energy by > 110 meV as the excitation intensity is increased by several orders of magnitude.     

多台水泵并联的最优化方法

在城市污水处理系统中,由于来水流量的变化,往往需要开启多台水泵,传统的控制方法是基于专业人士依据自身经验对其进行控制,精确度不够,而且耗能巨大。通过对水泵各参数之间的关系进行较为系统的分析,建立水泵系统的数学模型,依据最优控制的方法,求出轴功率的最小值,并以此确定了开启水泵的台数、频率和流量等参数,实现了耗能最低。上述控制方法不仅适用于同一型号水泵并联,同时也为不同型号水泵并联提供了依据,达到了节能的目的。     

Effects of GaAs-spacer strain on vertical ordering of stacked InAs quantum dots in a GaAs matrix

Vertical ordering in stacked layers of InAs/GaAs quantum dots is currently the focus of scientific research because of its potential for optoelectronics applications. Transmission electron microscopy was applied to study InAs/GaAs stacked layers grown by molecular-beam-epitaxy with various thicknesses of GaAs spacer. Thickness dependencies of quantum dot size and their ordering were observed experimentally and, then, compared with the results of strain calculations based on the finite element method. The vertical ordering did occur when the thickness of the GaAs spacer was comparable with the dot height. The ordering was found to be associated with relatively large InAs dots on the first layer. Quantum dots tend to become larger in size and more regular in plane with increasing numbers of stacks. Our results suggest that the vertical ordering is not only affected by strain from the InAs dots on the lower layer, but by total strain configuration in the multi-stacked structure.     

Conductance of a quantum wire in a parallel magnetic field

Ballistic electron transport in a three-dimensional quantum wire with elliptic cross section is investigated. The potential of the single-particle Hamiltonian of the system under consideration was chosen to be parabolic. Using the Landauer-Buttiker formalism, we find an expression for the conductance at zero temperature. We show that the number and width of the steps in the dependence of the conductance on the electron energy are determined by the ratio of the characteristic frequencies of the potential. In the case of nonzero temperature we show that the conductance consists of two terms. The first is monotonic and depends quadratically on the energy; the oscillating second term gives sawtooth-shaped peaks. The height of the conductance steps is equal to the conductance quantum, and the width of the plateau depends on the energy, the field, and the frequency ratio. We stress that the picture of the conductance is extremely sensitive to the ratio of hybrid frequencies. Fiz. Tekh. Poluprovodn. 33, 1141–1143 (September 1999)     

Mechanical and electrical characterisation of Au wire interconnects in electronic packages under the combined vibration and thermal testing conditions

This paper concerns the reliability of thermosonically bonded 25 μm Au wires in the combined high temperature with vibration conditions, under which the tests have been carried out on wire-bonded 48-pin Dual-in-Line (DIL) High Temperature Co-fired Ceramic (HTCC) electronic packages. Mechanical, optical and electrical analysis has been undertaken in order to identify the failure mechanisms of bonded wires due to the combined testing. The results indicated a decrease in the electrical resistance after a few hours of testing as a result of the annealing process of the Au wire during testing. In general, ball shear and wire pull strength levels remained high after testing, showing no significant deterioration due to the tests under the combined high temperature and vibration conditions. However, a trend of the variation in the strength values is identified with respect to the combined conditions for all wire-bonded packages, which may be summarised as: (i) increase of the testing temperature has led to a decrease of both the shear and pull strength of the wire bonds; (ii) the mechanical behaviour of the wires is affected due to crystallisation that leads to material softening and consequently the deformation of wire.     

On optimal linear estimation of signals with general spectral distribution (Corresp.)

It is standard practice to assume that second-order stationary signal and noise processes involved in a linear estimation procedure have spectral densities. A heuristic justification may be based on the reasoning that the part of the signal having singular spectral distribution can be precisely determined, and the part of the noise having singular spectral distribution can be completely eliminated. Rigorous phrasing and proof of this claim are given here for the most general case, i.e., where the singular parts of the spectral distributions may contain continuous components, in which situation the intuitive picture is obscure. The discussion includes both discrete-time and continuous-time processes, and the multivariable case is also treated.     

基于云计算的网络订餐系统的设计与实现

基于国内“民以食为天”的饮食要求,人们对于高科技产生下对网络交互式餐饮服务的要求越来越高。因此,针对信息量庞大,安全性,快捷性以及时空性的原则,本文通过研究云计算的网络订餐系统的设计与实现,实现功能维护,系统运营与维护,以及实现客户导向型餐饮服务需求。通过Java Server Pages,SQLserver2010以及云计算下的云服务等技术的结合,运用系统开发中的可行性分析以及详细架构设计,实现系统的开发,运营以及测试使用,为网络订餐系统的发展提供一个发展平台,打开创新脉络。     

Electronic coupling and structural ordering of quantum dots using InAs quantum dot columns

In this article, recent investigations of vertically aligned quantum dot columns conducted at Stanford University are reviewed. The quantum dots are InAs in a matrix of GaAs. Both the quantum dots and quantum dot columns are formed through strain-induced islanding, without lithography. Two aspects of these columns are discussed. First, the electronic coupling of quantum dots within columns of up to ten quantum dots is demonstrated. The coupling is adjusted and improvements to a simple light-emitting diode are shown. Second, increased uniformity of a surface quantum dot layer is shown when a subsurface layer of these columns are used. The most impressive results occur when the columns contain a large number of islands. Reduced variations in average ensemble height and diameter, called size uniformity, and average nearest neighbor distances, called structural uniformity, are shown. A surface unit cell of islands is demonstrated and the lack of a surface lattice is discussed.     

Interface microstructure effects in Au thermosonic ball bonding contacts by high reliability wire materials

Palladium-doped and (Cu, Pt)-doped high reliability gold wires were used to form wire bond interconnects on aluminum IC metallization. By isothermal annealing of wire bond samples the formation of intermetallic Au–Al phases was stimulated. SEM/EBSD investigations of the phase regions exhibited significantly slower isothermal growth rates compared to a reference gold wire. Correlated TEM, STEM–EDXS and nanobeam diffraction analyses revealed that Pd is preferentially incorporated into the Au₈Al₃ intermetallic forming a new stable phase but additionally can obviously form a new Pd-rich ternary intermetallic. In comparison, Cu dopants are also accumulated into a new Al–Au–Cu phase while Pt is rather found agglomerating within grain boundaries and interfaces. These results suggest a diffusion barrier model that allows discussing how wire doping can affect the bond contact microstructure, thus increasing the lifetime of bond contacts.     

Effects of metallization characteristics on gold wire bondability of organic printed circuit boards

Organic printed circuit boards (PCBs) with Au/Ni plates on bond pads are widely used in chip-on-board (COB), ball grid array (BGA), and chip-scale packages. These packages are interconnected using thermosonic gold wire bonding. The wire bond yield relies on the bondability of the Ni/Au pads. Several metallization parameters, including elemental composition, thickness, hardness, roughness, and surface contamination, affect the success of the solid state joining process. In this study, various characterization and mechanical testing techniques are employed to evaluate these parameters for different metallization schemes with varying Ni and Au layer thicknesses. The pull force of Au wires is measured as a function of plasma treatment applied before wire bonding to clean the bond pads. Close correlations are established between metallization characteristics and wire bond quality.