国产SIS热熔压敏胶的研制

以国产SIS为主体原料 ,配合增粘树脂、增塑剂、软化剂、防老剂等研制出SIS热熔压敏胶。讨论了各组分对性能的影响 ,并对它的粘接性能进行了测试。实验结果证明 ,国产SIS性能良好 ,完全可以替代进口料用于生产热熔压敏胶     

SIS型热熔压敏胶影响因素分析

通过熔融混合制备SIS型热熔压敏胶,重点考察了增黏树脂、软化油、SIS结构参数等因素对热熔压敏胶黏度、初黏、剥离强度的影响。采用单因素实验法系统探讨软化油、增黏树脂、主体树脂等对热熔压敏胶黏度、初黏、剥离等性能的影响,并进一步探讨增黏树脂内在物理化学结构对热熔压敏胶的影响,结果表明:增黏树脂软化点高低对热熔压敏胶的黏度和剥离强度有重大影响。通过正交试验法得出:影响黏度的关键因素是油含量,影响剥离强度的关键因素是增黏树脂,影响初黏的关键因素是油含量和增黏树脂。     

SIS热熔压敏胶粘剂的研制

以SIS为主体原料,配合增粘树脂、增塑剂、防老剂等研制出SIS热熔压敏胶。通过实验对反应温度、反应时间、搅拌速度等工艺条件进行了优化;选择了合适的增塑剂、增粘树脂、软化剂、防老剂及填料,确定了胶粘剂的基本配方;讨论了各组分用量对粘接性能的影响,确定了其最适宜用量;通过正交优化设计,优化了SIS热熔压敏胶的配方,得出了包装用热熔压敏胶的最佳配方。     

便贴纸用热熔压敏胶的研制

介绍了以苯乙烯-丁二烯-苯乙烯嵌段共聚物(SBS)为基础材料制备便贴纸用热熔压敏胶的方法,讨论了其他原材料如:增粘树脂、软化剂、防老剂等的选择对热熔压敏胶性能的影响。     

苯乙烯-异戊二烯嵌段聚合物热熔压敏胶性能影响因素探讨

用不同种类增粘树脂、不同牌号苯乙烯-异戊二烯嵌段聚合物(简称SIS)制备SIS热熔压敏胶,考察不同种类增粘树脂、不同牌号SIS及萜烯树脂含量对SIS热熔压敏胶性能的影响,结果表明:萜烯树脂是改性SIS热熔压敏胶适宜的增粘树脂,当萜烯树脂在SIS热熔压敏胶中含量达50%时,SIS热熔压敏胶性能较佳,随不同牌号SIS中两嵌段SI含量的增加,SIS热熔压敏胶的剥离强度有所增加,持粘力有所下降。     

SIS、SEBS在热熔压敏胶中的应用

介绍了国产SIS性能及应用特点以及常用用增粘树脂、增塑剂的性能及应用特点;考查了复合增粘树脂、复合增塑剂对SIS热熔压敏胶性能的影响;研究了SEBS在热熔压敏中的应用,提供了SEBS热熔压敏胶基础配方。     

无溶剂型热熔压敏胶的制备及影响因素研究

本文阐述了苯乙烯-异戊二烯嵌段共聚物(SIS)在热熔压敏胶的应用,列举了热熔压敏胶所需原料组分,并展开对热熔压敏胶的影响因素作了进一步研究,探讨了着不同嵌段结构、增粘树脂选型及加入量、环烷油加入量及SIS加入量对热熔压敏胶性能的影响。     

冷链标签用热熔压敏胶的制备及性能研究

为制备低温性能优异、可应用于冷链标签用途的热熔压敏胶,研究了配方体系材料的种类及含量对热熔压敏胶性能及低温性能的影响。研究结果表明：弹性体最好选择苯乙烯-异戊二烯-苯乙烯三嵌段共聚物（SIS）体系,且质量分数在35%～40%之间时,具有优异的低温性能及涂布应用性能;增塑剂可由环烷油与脂类增塑剂混合,总含量在25%～30%之间;增黏树脂比例在25%～35%之间较为合适。     

SBS、SIS在热熔胶中的应用

SBS、SIS热熔胶主要包括SBS、SIS热塑性橡胶、增粘树脂、增塑剂、稳定剂等成分。文中对各成分进行了分析,并介绍了鞋跟用热熔胶、鞋帮用热熔胶、SIS热熔压敏胶、装配用热熔胶的应用实例等。     

SDS型挂钩用压敏胶的研制

以SIS、SBS为主体材料 ,配合适量的增粘树脂、软化剂、防老剂等研制出SDS型挂钩用压敏胶 ,探讨了主要组份的选择及其对胶接性能的影响。所得产品与市场同类产品相比 ,具有较高的持粘力。     

电缆半导电带接头用热熔压敏胶的研究

以线型SBS(苯乙烯-丁二烯-苯乙烯)热塑性弹性体为基体树脂,通过添加增黏树脂、软化剂、抗氧化剂以及导电炭黑等物质,成功制备出一种可满足环保要求和使用要求的电缆半导电带接头用SBS型热熔压敏胶(HMPSA)。以环烷油、增黏树脂用量为试验因素,以胶接件的粘接强度为考核指标,采用正交试验法优选出制备HMPSA的最佳配方。结果表明:制备HMPSA的最佳配方为m(SBS)∶m(萜烯树脂)∶m(石油树脂)∶m(环烷油)∶m(抗氧化剂1010)∶m(导电炭黑)=100∶80∶30∶50∶1.5∶1.0;由最佳配方制得的HMPSA,其接头处的粘接强度为166 N/cm。     

用SIS及SBS制备热熔压敏胶的工艺研究

本文探讨了用SIS和SBS制备热熔压敏胶的工艺条件及最佳组成问题,实验表明,当SBS与SIS用量为1：1时,其产品性能与SIS热坟敏胶性能相当,选用R100或聚萜烯树脂作为增粘剂,产品的粘接力较大,增塑剂的用量及材料的组成对产品的性能也有一定的影响。     

增黏树脂与弹性体SBS的相容性以及与热熔压敏胶性能的关系

热熔压敏胶(HMPSA)是一类不含溶剂的胶粘剂,在工业应用中占据很大的比重。工业上常用的增黏树脂有松香树脂、萜烯树脂和石油树脂三种。增黏树脂与热塑性弹性体SBS(苯乙烯/丁二烯/苯乙烯嵌段共聚物)的相容性存在一定的差异性,从工业角度重点研究和比较了增黏树脂的结构差异与性能之间的关系,并对其一般规律进行了探索。研究结果表明,当增黏树脂的软化点为100～110℃时,相应的HMPSA可获得较低的熔融黏度和较高的剥离强度,其初粘力为1～2cm;当增黏树脂的软化点为100℃时,剥离强度依次为含萜烯树脂HMPSA>含松香树脂HMPSA>含石油树脂HMPSA;当W(增黏树脂)= 210%时(相对于弹性体SBS而言),含石油树脂HMPSA的综合性能劣于含松香树脂(或含萜烯树脂)的HMPSA;当W(增黏树脂)≥210%时,HMPSA的熔融黏度低于10000mPa·s,但持粘力增强(即意味着内聚力增强)。     

SDS型热熔压敏胶的研制

以ＳＩＳ，ＳＢＳ为主体原料，配合增粘树脂，软化剂，防老剂等研制出ＳＤＳ型热熔压敏胶，讨论了各组分对性能的影响，确定了合理的配方和工艺，在制备方法上也有新的改进。     

耐低温SBS热熔压敏胶的研制与应用

以长链高级脂肪酸(H18)、松香和甘油为原料,合成了低软化点、低酸值、低黏度和高透明性的H18改性松香甘油酯;然后以此作为SBS(苯乙烯-丁二烯-苯乙烯热塑性弹性体)基热熔压敏胶(HMPSA)的增黏树脂,探讨了H18改性松香甘油酯含量对HMPSA性能的影响。结果表明:当w(H18改性松香甘油酯)=10%时,HMPSA的环形初粘力、180°剥离强度相对最大,比未改性体系分别增加了54.81%、35.29%;适量的H18改性松香甘油酯可有效降低HMPSA的玻璃化转变温度(T_g)、提高HMPSA的耐寒性。     

Composition and Performance of Styrene-Isoprene-Styrene (SIS) and Styrene-Butadiene-Styrene (SBS) Hot Melt Pressure Sensitive Adhesives

Styrenic block copolymers are widely used in HMPSA formulations, with tackifier resins and oil plasticizer. Although most commercial formulations are based on SIS, mixtures of SIS and SBS are also used to reduce cost. However, the use of SBS is restricted because it generally leads to decrease in tack. In this work, pure SIS and SBS and a SIS/SBS mixture were used in formulations with aliphatic, aromatic, aliphatic hydrogenated, and aliphatic-aromatic copolymer resins, at three different oil contents, according to a 3^3–1 factorial design. Interaction effects among the components were evaluated, showing a strong dependence of the HMPSA final properties on the combination of resin/rubber used. It was found that a blend of aliphatic and aromatic resins is the best tackifier for SIS, while for SBS the best choice is an aromatic-aliphatic copolymer. These results were explained in terms of specific compatibility, which was correlated to the polarizability of the material.     

中药贴片用ESIS热熔压敏胶的制备与性能研究

以ESIS(环氧化苯乙烯-异戊二烯-苯乙烯嵌段共聚物)为基体树脂、环氧大豆油为增塑剂和高度氢化松香为增黏树脂,制备出一种ESIS型HMPSA(热熔压敏胶)。以ESIS、增塑剂和增黏树脂用量作为试验因素,HMPSA的初粘力、剥离强度和持粘力作为考核指标,采用正交试验和载药量试验法优选出制备中药贴片用ESIS型HMPSA的最佳配方。结果表明:当m(ESIS)∶m(环氧大豆油)∶m(高度氢化松香)∶m(抗氧剂1010)=100∶80∶100∶1.4时,ESIS型HMPSA的综合性能满足中药贴片的使用要求,并且其最大载药量(34%)和水蒸气透过率[1.297 g/(m2.d)]均高于同类产品(医用SIS型压敏胶和传统天然橡胶膏)。     

Rheological properties of hot melt pressure-sensitive adhesives based on styrene--isoprene copolymers. Part 1: A rheological model for [sis-si] formulations

The viscoelastic properties of hot melt pressure-sensitive adhesives (HMPSA) based on formulations of block copolymers and tackifying resins have been studied in detail, through the variation of the complex shear modulus, G*, as a function of frequency, y . In this first article, we analyze the individual behavior of the components of HMPSA blends: (1) the two copolymers, styrene-isoprene (SI) diblock copolymer and styrene-isoprene-styrene (SIS) triblock copolymer and (2) two tackifying resins. The viscoelastic behavior of the overall formulation is also presented. We have mainly studied the effects of (1) the molecular characteristics of the SI and SIS copolymers and (2) the composition of the blends (mainly the effect of SI content, S content in SIS and SI, resin content) on the viscoelastic properties. A theoretical approach based on concepts of molecular dynamics leads to a model which describes reasonably well the linear viscoelastic properties of individual components and their formulations. Our systematic study can be used to design new copolymer molecules which can mimic the rheological behavior and end-user properties of regular formulations at room temperature.