Magnetic properties of Fe78.4Si9.5B9Cu0.6Nb2.5 nanocrystalline alloy powder cores

The microstructure and morphology of nanocrystalline Fe_78.4Si_9.5B₉Cu_0.6Nb_2.5 alloy powders prepared by ball milling technique were characterized by X-ray diffraction and scanning electron microscopy studies. The effective permeability (μ_e), quality factor (Q), DC bias property, and core losses of the corresponding powder cores were tested using low capacitance resonator meter and B–H analyzer in the range of 1–1000 kHz. The results show that the relative density and compression strength of the powder cores increased with increasing particle size. Powder cores from large size particles (150–300 μm) were found to exhibit higher μ_e and core loss, but lower Q level when compared to samples of small size ones (5–40 μm). Moreover, the μ_e of powder cores with large particles reached a peak value with the addition of 2 wt% glass binder. The Q value was also found to be proportional to the binder content except 10 wt%, while its peak position was shifted toward higher frequency.     

Influence of temperature gradient and growth rate on the mechanical properties of directionally solidified Sn–3.5 wt% Ag eutectic solder

The Sn–3.5 wt% Ag eutectic alloy was directionally solidified upward with a constant growth rate (V = 16.5 μm/s) at different temperature gradients (G = 1.43–4.28 K/mm) and with a constant temperature gradient (G = 3.93 K/mm) at different growth rates (V = 8.3–500 μm/s) in a Bridgman-type directional solidification furnace. The rod spacings (longitudinal section, λ _L and transverse section, λ _T ) and mechanical properties (microhardness, HV and ultimate tensile strength, σ _UTS ) of Sn–3.5 wt% Ag eutectic alloy were measured. The dependency of the microhardness, ultimate tensile strength on the temperature gradient, growth rate and rod spacings were determined. According to experimental results, the microhardness and ultimate tensile strength of the solidified samples increase with increasing G and V, but decrease with the increasing the rod spacing.     

Effects of nano-structured particles on microstructure and microhardness of Sn–Ag solder alloy

In this research, the typical nano-structured Polyhedral Oligomeric Silsesquioxane (POSS) particles were incorporated into the Sn–3.5Ag eutectic solder paste by mechanically mixing to form lead-free composite solder. The effects of nano-structured POSS additions on the microstructure and mechanical properties of as-fabricated composite solder alloys were systematically investigated. Experimental results indicated that the average size and spacing distance of Ag₃Sn intermetallic compounds (IMCs) in composite solder matrix decreased as compared to the Sn–3.5Ag eutectic solder. The 3 wt% addition of nano-structured POSS particles could enhance the microhardness of composite solder by 18.4% compared with the Sn–3.5Ag eutectic solder matrix. The average grain size and spacing distance of Ag₃Sn IMCs in Sn–Ag + 3 wt% POSS composite solder matrix reduced from 0.35 to 0.23 μm and from 0.54 to 0.32 μm, respectively. The refined Ag₃Sn IMCs, acting as a strengthening phase in the solder matrix, could enhance the microhardness of the composite solders.     

Evaluation of hydroxyapatite microspheres made from a borate glass to separate protein mixtures

A hydroxyapatite (HA, Ca₁₀(PO₄)₆(OH)₂), transformed from a calcium-containing borate glass, has been investigated for its protein adsorption and chromatographic characteristics. Microspheres of the borate glass were transformed into HA by reacting them with a 0.25 M phosphate (K₂HPO₄) solution for 24 h at 37 °C (pH 9.0). The HA microspheres with a diameter of 45–90 μm were hand packed into a steel column (4.6 mm × 80 mm) and used to separate a binary protein mixture of bovine serum albumin (BSA) and lysozyme. HA microspheres, with a diameter <45 μm, were used for separating a protein mixture of BSA, myoglobin, and lysozyme. These microspheres had a diameter that was 20–30 times larger than commercial HA column packing spherical particles, 2–3 μm, but these microspheres had a six times larger surface area and a more uniform spherical shape. These advantages compensated for their larger size and the separation results were comparable to those commercially available HA columns in the separation of the proteins studied. These unique HA microspheres, made from microspheres of a borate glass, are considered to be useful as packing materials for protein separation in chromatography.     

Dependence of electrical and thermal conductivity on temperature in directionally solidified Sn–3.5 wt% Ag eutectic alloy

Sn–3.5 wt% Ag alloy was directionally solidified upward with a constant growth rate (V = 16.5 μm/s) and a temperature gradient (G = 3.3 K/mm) in a Bridgman-type growth apparatus. The variations of electrical resistivity (ρ) with temperature in the range of 293–476 K for the directionally solidified Sn–3.5 wt% Ag eutectic alloy was measured. The measurements indicate that the electrical resistivity of the directionally solidified Sn–Ag eutectic solder increases with increasing temperature. The variations of thermal conductivity of solid phases versus temperature for the same alloy was determined from the Wiedemann-Franz and Smith-Palmer equations by using the measured values of electrical conductivity. From the graphs of electrical resistivity and thermal conductivity versus temperature, the temperature coefficient of electrical resistivity (α _TCR ) and the temperature coefficient of thermal conductivity (α _TCT ) for the same alloy were obtained. According to experimental results, the electrical and thermal conductivity of Sn–Ag eutectic solder linearly decrease with increasing the temperature. The enthalpy of fusion (ΔH) and the change of specific heat (ΔC _P ) during the transformation at the studied alloy were determined from heating curve during the transformation from eutectic solid to eutectic liquid by means of differential scanning calorimeter (DSC).     

The effects of temperature gradient and growth rate on the microstructure of directionally solidified Sn–3.5Ag eutectic solder

The mechanical properties (microhardness, tensile strength) of alloys are controlled by their microstructure, which depends strongly on temperature gradient (G) and growth rate (V). Thus, it is important to understand the relationships among G, V and microstructure (rod eutectic) of Sn–Ag solders. The Sn–3.5 wt% Ag eutectic alloy was directionally solidified upward with a constant growth rate, V (16.5 μm/s) at different temperature gradients, G (1.43–4.28 K/mm) and with a constant temperature gradient, G (3.93 K/mm) at different growth rates, V (8.3–500 μm/s) in a Bridgman–type directional solidification furnace. The rod spacings (λ) have been measured from both longitudinal section (parallel to the growth direction, λ _L ) and transverse section (perpendicular to the growth direction, λ _T ) of the samples. The undercooling values (ΔT) were calculated by using V, λ and system parameters (K ₁ and K ₂). It was found that the values of λ (λ _T , λ _L ) decrease while V and G are increasing. The relationships between rod spacing and solidification parameters (G and V) were obtained by linear regression analysis. The dependences of eutectic spacings λ on undercooling (ΔT) are also analyzed. λ² V, λΔT, ΔTV ^−0.5 and ΔTG ^−0.5 values were determined by using λ, ΔT, V and G values. The results obtained in this work are compared with the Jackson–Hunt eutectic theory and the similar experimental works. The experimental l_\textT ² \textV \lambda_{\text{T}}^{ 2} {\text{V}} value (159.3 μm³/s) is slightly lower than the result 174.6 μm³/s calculated from Jackson–Hunt eutectic theory.     

Preparation and characterization of glass composite using metal particles coated with semiconductive SnO2 fine particles obtained via sol—gel method

SnO₂—glass composites are promising materials for nitrogen-fireable thick film resistor systems. However, the SnO₂—glass composite has many undesirable properties which should be improved for industrial application, such as a high electrical resistivity and a large negative temperature coefficient of electrical resistance. This work was undertaken to make a survey of the methods for improvement in the electrical properties of the SnO₂—glass composites. The effect of the addition of Cu particles, with a large positive temperature coefficient of electrical resistance, on the electrical properties of SnO₂—glass composites has been investigated. Cu particles have been coated with semiconductive SnO₂ fine particles by hydrolysing tin and antimony ethoxides then firing. The coated particles have been applied as conductive components in the glass composite. Using SnO₂-coated Cu particles, Cu and SnO₂ particles are homogeneously dispersed in a glass matrix, and the electrical properties of the glass composites largely depend on the volume fraction of Cu in the glass composite. The volume fraction of Cu in the glass composite is determined by a Cu/SnO₂ volume ratio in the coated particles. From the experimental evidence, it is thought feasible to produce the glass composite having well-controlled electrical properties by the suitable selection of the Cu/SnO₂ ratio in the coated particles. This revised version was published online in July 2006 with corrections to the Cover Date.     

Influence of silver doping on the physical properties of Mg ferrites

The physical properties of silver substituted magnesium ferrite MgAg_xFe_2−x O₄ (0.0 ≤ x ≤1) have been studied as a function of silver ion concentration. The samples were prepared using the flash combustion technique. The effect of Ag content on microstructure and magnetic properties has been studied. X-ray diffraction (XRD) analysis reveals the spinel structure besides metallic silver particle at all concentrations. The decrease in the lattice constant with increasing Ag up to the critical concentration (x = 0.2) was discussed. The close agreement of the theoretical and experimental lattice constant ratio from XRD pattern supports the occupancy of silver on the tetrahedral sites. The morphological features were studied using scanning electron microscope. The magnetic susceptibility, Curie temperature (T _C), and effective magnetic moment (μ _eff) were decreased with compositional parameter. The DC electrical conductivity of the investigated samples was measured and the results indicated the increase in conductivity with increasing Ag content from 5.6 × 10⁴ at x = 0 to 12.6 × 10⁴Ω⁻¹ cm⁻¹ at x = 1. The transition from the ferrimagnetic to paramagnetic state is accompanied by an increase in the thermo EMF. Ag–Mg ferrite shows p-type conductivity at all concentrations of Ag particles where the creation of lattice vacancies is due to presence of Ag⁺ ions gives rise to the p-type conductivity.     

Studying diffusion in multilayer thin-film structures on silicon by the contact melting technique

Features of the contact melting in thin-film structures comprising an aluminum layer with a thickness of h ₁ = 5 μm and a metal (Ti, Ni, Mo) or semiconductor (Si, Ge) sublayer (h ₂ = 0.1 μm) on a single crystal silicon plate (h ₃ = 500 μm) have been studied. The contact melting was caused by single rectangular electric pulses with a current density of j < 9 × 10¹⁰ A/m² and a duration of τ = 100–1000 μs passing through the Al layer. The duration and rate of melting in the samples were determined using voltage waveforms measured by an oscillograph. A method has been developed based on an analysis of the mechanisms of contact interaction in the Al film—sublayer system (with allowance for experimental data on the time of sublayer dissolution in the Al film) for estimating the coefficients of mutiphase diffusion of the system components during the passage of a current pulse.     

Hydroxyapatite formation from cuttlefish bones: kinetics

Highly porous hydroxyapatite (Ca₁₀(PO₄)₆·(OH)₂, HA) was prepared through hydrothermal transformation of aragonitic cuttlefish bones (Sepia officinalis L. Adriatic Sea) in the temperature range from 140 to 220°C for 20 min to 48 h. The phase composition of converted hydroxyapatite was examined by quantitative X-ray diffraction (XRD) using Rietveld structure refinement and Fourier transform infrared spectroscopy (FTIR). Johnson–Mehl–Avrami (JMA) approach was used to follow the kinetics and mechanism of transformation. Diffusion controlled one dimensional growth of HA, predominantly along the a-axis, could be defined. FTIR spectroscopy determined B-type substitutions of CO₃ ²⁻ groups. The morphology and microstructure of converted HA was examined by scanning electron microscopy. The general architecture of cuttlefish bones was preserved after hydrothermal treatment and the cuttlefish bones retained its form with the same channel size (~80 × 300 μm). The formation of dandelion-like HA spheres with diameter from 3 to 8 μm were observed on the surface of lamellae, which further transformed into various radially oriented nanoplates and nanorods with an average diameter of about 200–300 nm and an average length of about 8–10 μm.     

Corrosion resistance evaluation of a Ca- and P-based bioceramic thin coating in Ti-6Al-4V

The objective of this study was to physico/chemically characterize and determine the corrosion resistance of a Calcium–Phosphate (Ca–P) based bioceramic thin coating processed by a sputtering process on titanium alloy (Ti-6Al-4V). The samples utilized in this study were uncoated and coated disks of 10 mm diameter by 3 mm thickness. The coating was characterized by SEM, XPS + ion beam milling (IBM), thin-film mode XRD, and atomic force microscope (AFM) (n = 3). Coated and uncoated Ti-6Al-4V disk surfaces were tested in Phosphate Buffered Saline (PBS) at 25°C through an area of 0.79 cm². A three-electrode cell set-up was used with a saturated calomel electrode (SCE) and a platinum wire as reference and counter electrodes. After 3, 17, and 25 days of immersion, electrochemical impedance spectroscopy (EIS) experiments were performed (n = 3). The EIS tests were carried out in potentiostatic mode at the open circuit potential (OCP). The frequency range considered was from 100 kHz to 10 mHz, using 10 mV root mean square as the amplitude of the perturbation signal. A potentiodynamic polarization scan using a frequency response analyzer potentiostat, was acquired following 3 days of immersion in PBS. The potentiodynamic polarization scans (n = 3) were carried out with a scan rate of 1 mV/s ranging from −0.8V(SCE) to 3.0V(SCE). Results: The physico/chemical characterization showed an amorphous Ca- and P-based coating of ~400–700 nm thickness with Ca–P nanometer size particles embedded in a Ca–P matrix. The Bode phase angle diagrams showed highly capacitive results at low and medium frequencies for both surfaces tested. The polarization curves showed low current densities at the corrosion potential (E _corr), in the order of 10⁻⁸A/cm², typical of passive materials with protective surface films. Coated sample current densities were comparable to the uncoated samples. Conclusion: Coated and uncoated samples were stable in the test solution with a protective film maintained throughout the 25 day immersion test period.     

Photoresponse of n -ZnO/ p -Si heterojunction towards ultraviolet/visible lights: thickness dependent behavior

A series of n-ZnO/p-Si thin film heterojunctions have been fabricated by a low cost sol–gel technique for different ZnO film thicknesses and the dark as well as photo current–voltage (I–V) characteristics have been investigated in details. The heterojunction with ZnO thickness of 0.46 μm shows the best diode characteristics in terms of rectification ratio, I _F/I _R = 5.7 × 10³ at 5 V and reverse leakage current density, J _R = 7.6 × 10⁻⁵ A cm⁻² at −5 V. From the photo I–V curves and wavelength dependent photocurrent of the heterojunctions, it is found that the junction with 0.46 μm ZnO thickness shows the highest sensitivity towards both UV and visible lights.     

Dissolution kinetics and diffusivity of silver in glassy layers for hybrid microelectronics

Silver and palladium/silver compositions are widely used in hybrid microelectronics, as electrodes for dielectric layers and multilayers, terminations of thick film resistors and interconnections. Interactions between Ag and the adjacent films are known to affect the microcircuit performances. The present study is aimed at collecting data on the behavior of Ag-based films in contact with glassy layers. Most experiments were performed with a glass with composition 68.2 PbO : 30.5 SiO₂ : 1.3 Al₂O₃ wt %. Two different systems were analyzed. The first system consists of thick films prepared from a paste containing glass and either 3 or 15 wt % silver particles; both fine (spherical grains, 0.5–1 m diameter) and coarse (flakes, 2–5 m, <1 m thick) Ag powders were used for these pastes. The distribution of Ag in the film was studied with X-ray diffraction, scanning electron microscopy and fluorescence analysis. The results show that Ag floats on the glassy layer. Diffraction of X-rays generated by a synchrotron radiation source allowed us to study the kinetics of silver dissolution in the glass; this phenomenon is consistent with the Avrami theory, with an apparent activation energy E _dis=0.69±0.04 eV. The second system analyzed, Ag-based terminations of glass layers fired at various peak temperatures, enabled us to obtain quantitative values for both Ag solid solubility (about 2.5 wt %) and Ag diffusion coefficients D _Ag(T ). Typical values of D _Ag(850 °C) are 30.3±11.9 10^–8 cm²/s; an apparent activation energy of the diffusion process is E _a=0.6±0.1 eV.     

Fabrication of spherical CaO–SrO–ZnO–SiO2 particles by sol–gel processing

This study was concerned with the fabrication of ceramic CaO–SrO–ZnO–SiO₂ spherical particles, which are novel candidates for the glass phase in glass polyalkenoate cements (GPCs). GPCs made from these glasses have potential as bone cements because, unlike conventional GPCs, they do not contain aluminum ions, which inhibit the calcification of hydroxyapatite in the body. The glass phase of GPCs require a controllable glass morphology and particle size distribution. Sol–gel processing can potentially be used to fabricate homogenous ceramic particles with controlled morphology. However, a thorough study on preparation conditions of spherical CaO–SrO–ZnO–SiO₂ particles by sol–gel processing has, to date, not been reported. In this study, gels were prepared by hydrolysis and polycondensation of tetraethoxysilane (TEOS) in an aqueous solution containing polyethylene glycol and nitrates of calcium, strontium and zinc. It was possible to control the morphology and size of the gels by varying the H₂O/TEOS molar ratio and the metal ion content in the starting compositions. An aliquot of 3–5 μm homogenous spherical particles were obtained at a H₂O/TEOS molar ratio of 42.6 when the starting composition molar ratios were Sr(NO₃):Ca(NO₃)₂:Zn(NO₃)₂:Si(OC₂H₅)₄ = x:0.12:(0.40 − x):0.48 (0 ≤ x ≤ 0.8). Starting composition limitations are caused by the low solubility of strontium ions in the minimal amount of water used and the acceleration of hydrolysis as well as polycondensation at higher water content.     

Microstructure, mechanical, and in vitro properties of mica glass-ceramics with varying fluorine content

The design and development of glass ceramic materials provide us the unique opportunity to study the microstructure development with changes in either base glass composition or heat treatment conditions as well as to understand processing-microstructure-property (mechanical/biological) relationship. In the present work, it is demonstrated how various crystal morphology can develop when F⁻ content in base glass (K₂O–B₂O₃–Al₂O₃–SiO₂–MgO–F) is varied in the range of 1.08–3.85% and when all are heat treated at varying temperatures of 1000–1120°C. For some selected heat treatment temperature, the heat treatment time is also varied over 4–24 h. It was established that with increase in fluoride content in the glass composition, the crystal volume fraction of the glass-ceramic decreases. Using 1.08% fluoride, more than 80% crystal volume fraction could be achieved in the K₂O–B₂O₃–Al₂O₃–SiO₂–MgO–F system. It was observed that with lower fluoride content glass-ceramic, if heated at 1040°C for 12 h, an oriented microstructure with ‘envelop like’ crystals can develop. For glass ceramics with higher fluorine content (2.83% or 3.85%), hexagonal-shaped crystals are formed. Importantly, high hardness of around 8 GPa has been measured in glass ceramics with maximum amount of crystals. The three-point flexural strength and elastic modulus of the glass-ceramic (heat treated at 1040°C for 24 h) was 80 MPa and 69 GPa of the sample containing 3.85% fluorine, whereas, similar properties obtained for the sample containing 1.08% F⁻ was 94 MPa and 57 GPa, respectively. Further, in vitro dissolution study of the all three glass-ceramic composition in artificial saliva (AS) revealed that leached fluoride ion concentration was 0.44 ppm, when the samples were immersed in AS for 8 weeks. This was much lower than the WHO recommended safety limits of 1.5 ppm. Among all the investigated glass-ceramic samples, the glass ceramic with 3.85% F⁻ content in base glass (heat treated at 1040°C for 12 h), exhibits the adherence of Ca–P layer, which consists of spherical particles of 2–3 μm. Other ions, such as Mg⁺² and K⁺¹ ion concentrations in the solution were found to be 8 and 315 ppm after 8 weeks of leaching, respectively. The leaching of all metal ions is recorded to decrease with time, probably due to time-dependent kinetic modification of sample surface. Summarizing, the present study illustrates that it is possible to obtain a good combination of crystallization, mechanical and in vitro dissolution properties with the careful selection of base glass composition and heat treatment conditions.     

High thermal conductivity composites consisting of diamond filler with tungsten coating and copper (silver) matrix

Tungsten coatings with thickness of 5–500 nm are applied onto plane-faced synthetic diamonds with particle sizes of about 430 and 180 μm. The composition and structure of the coatings are investigated using scanning electron microscopy, X-ray spectral analysis, X-ray diffraction, and atomic force microscopy. The composition of the coatings varies within the range W–W₂C–WC. The average roughness, R _a, of the coatings’ surfaces (20–100 nm) increases with the weight–average thickness of the coating. Composites with a thermal conductivity (TC) as high as 900 W m⁻¹ K⁻¹ are obtained by spontaneous infiltration, without the aid of pressure, using the coated diamond grains as a filler, and copper or silver as a binder. The optimal coating thickness for producing a composite with maximal TC is 100–250 nm. For this thickness the heat conductance of coatings as a filler/matrix interface is calculated as G = (2–10) × 10⁷ W m⁻² K⁻¹. The effects of coating composition, thickness and roughness, as well as of impurities, on wettability during the metal impregnation process and on the TC of the composites are considered.     

Comparison of oxidation resistance of NiCoCrAlTaY-coated and -uncoated Mar-M247 superalloys in the air at 1150 °C

Oxidation resistance of NiCoCrAlTaY coated and uncoated Mar-M247 superalloys were compared experimentally in the air at 1150 °C. It was found that the oxidation behavior of the NiCoCrAlTaY coated and uncoated Mar-M247 superalloys generally followed the parabolic kinetics with the rate of 1.5 and 9.8 × 10⁻³ mg²/cm⁴ h for each one. Microstructural observation and elemental analysis indicated that after 200 h the uncoated alloy covered with an oxide scale of 6–10 times thicker than the coated one, beneath which a fairly continuous and relatively thin α-Al₂O₃ could be found along the interface close to the substrate. Comparatively, the NiCoCrAlTaY coated alloy uniformly produced the continuous, dense and thick α-Al₂O₃ layer adhesive to the coating to prevent the metal elements against excessive oxidation, and finally formed the steady oxide scales: outer (Ni, Co)(Al, Cr)₂O₄ spinels, NiO, (Al, Cr)₂Ni₃; inner protective α-Al₂O₃ with a little Cr₂O₃. On the surface of the uncoated alloy, however, it mainly formed the Ni-rich oxides in which a large quantity of cracks propagated to result in the more oxidation.     

Structural and electrical studies of Cd<Subscript>1−x</Subscript>Zn<Subscript>x</Subscript> Te thin film by vacuum evaporation technique

Cd_1−xZn_xTe (where x = 0.02, 0.04, 0.06, 0.08) thin film have been deposited on glass substrate at room temperature by thermal evaporation technique in a vacuum at 2 × 10⁻⁵ torr. The structural analysis of the films has been investigated using X-ray diffraction technique. The scanning electron microscopy has been employed to know the morphology behaviour of the thin films. The temperature dependence of DC electrical conductivity has been studied. In low temperature range the thermal activation energy corresponding to the grain boundary—limited conduction are found to be in the range of 38–48 μeV, but in the high temperature range the activation energy varies between 86 and 1.01 meV. The built in voltage, the width of the depletion region and the operating conduction mechanism have been determined from dark current voltage (I–V) and capacitor-voltage (C–V) characteristics of Cd_1−xZn_xTe thin films.     

Morphology and band gap variations of oxynitride LaTaON2 depending on the ammonolysis temperature and precursor

Polycrystalline LaTaON₂ samples were prepared by the ammonolysis of LaTaO₄, where the oxide preparation temperatures (700, 900, and 1,400 °C) and ammonolysis temperatures (850, 950, and 1,000 °C) were varied to control the specific surface area and porosity. The resulting LaTaON₂ samples had a surface area of 15–20 m²/g and a pore volume of 0.045–0.059 cm³/g, as determined from the nitrogen adsorption–desorption isotherms. In particular, the ammonolysis of crystalline LaTaO₄ (prepared at 1,400 °C) can be described as a condensation from layered perovskite to three-dimensional perovskite, where mesoporous LaTaON₂ were produced with pore diameters of 5–50 nm and particle sizes of ≈1 μm. Diffuse-reflectance measurements demonstrated that these ammonolysis parameters also affected the optical band gap energy of LaTaON₂, which varied from 1.93 to 2.07 eV. Increasing the LaTaO₄ preparation temperature and/or ammonolysis temperature tended to decrease the band gap of LaTaON₂.     

Preparation and thermoelectric properties of BP films on SOI and sapphire substrates

The chemical vapor deposited (CVD) BP films on Si(100) (190 nm)/SiO _x (370 nm)/Si(100) (625 μm) (SOI) and sapphire (R-plane) (600 μm) substrates were prepared by the thermal decomposition of the B₂H₆–PH₃–H₂ system in the temperature range of 800–1050 °C for the deposition time of 1.5 h. The BP films were epitaxially grown on the SOI substrate, but a two-step growth method, i.e., a buffer layer at lower temperature and sequent CVD process at 1000 °C for 1.5 h was effective for obtaining a smooth film on the sapphire substrate. The electrical conduction types and electrical properties of these films depended on the growth temperature, gases flow rates and substrates. The thermal conductivity of the film could be replaced by the substrate, so that the calculated thermoelectric figure-of-merit (Z) for the BP films on the SOI substrate was 10⁻⁴–10⁻³/K at 700–1000 K. Those on the sapphire substrate were 10⁻⁶–10⁻⁵/K for the direct growth and 10⁻⁵–10⁻⁴/K for the two-step growth at 700–900 K, indicating that the film on a sapphire by two-step growth would reduce the defect concentrations and promote the electrical conductivity.