Compact Wide Stopband Ultra Wideband Bandpass Filter Using Multilayer Liquid Crystal Polymer Technology

Novel ultra-wideband (UWB) bandpass filters (BPFs) are proposed based on broadside coupled capacitive-loaded transmission line resonators (C-L TLR) in this letter. By utilizing the wideband harmonic suppression behavior of C-L TLR, the proposed UWB BPFs were designed with wide stopband and implemented using multilayer organic liquid crystal polymer (LCP) technology. As demonstrations, a vialess five-pole BPF was designed first, and then by adopting shunt short-circuited microstrip stubs at input/output ports, a compact UWB BPF was designed to meet FCC-defined UWB indoor mask. The proposed UWB BPFs were fabricated using multilayer LCP technology. Good agreements between simulated and measured results of fabricated filters were observed. The measured results show that the fabricated BPFs have good selectivity, wide stopband and high rejection level. The fabricated UWB BPFs have compact sizes of 15.15 mm by 4.7 mm (about $0.55lambda_{rm g0}$ by $0.17lambda_{rm g0}$); and 9.6 mm by 9.2 mm (about $0.35lambda_{rm g0}$ by $0.33lambda_{rm g0}$), respectively, where $lambda_{rm g0}$ is the guided wavelength of $50~Omega$ microstrip line at 6.85 GHz. They are attractive for UWB communications and radar systems.      

A 60 kb/s–10 Mb/s Adaptive Frequency Hopping Transceiver for Interference-Resilient Body Channel Communication

An interference-resilient 60 kb/s–10 Mb/s body channel transceiver using the human body as a signal transmission medium is designed for multimedia and medical data transaction in body-area network. The body antenna effect which interferes with signals in the human body channel is examined. The body-induced interferences degrade the SIR of the signal to $-$22 dB in the worst case. In order to overcome the body antenna effect, a 4-channel adaptive frequency hopping scheme using the 30–120 MHz band is introduced to the body channel transceiver. A direct-switching modulator using dual frequency synthesizers and a DLL-based demodulator are proposed for 10 Mb/s FSK and the 4.2 $mu hbox{s}$ hopping time. The transceiver fabricated with 0.18 $mu hbox{m}$ CMOS withstands $-$28 dB SIR and its operating distance is over 1.8 m with $-$ 25 dB SIR. Its energy consumption is 0.37 nJ/b with $-$65 dBm sensitivity.      

Q-Band pHEMT and mHEMT Subharmonic Gilbert Upconversion Mixers

This letter makes a comparison between Q-band 0.15 $mu{rm m}$ pseudomorphic high electron mobility transistor (pHEMT) and metamorphic high electron mobility transistor (mHEMT) stacked-LO subharmonic upconversion mixers in terms of gain, isolation and linearity. In general, a 0.15 $mu{rm m}$ mHEMT device has a higher transconductance and cutoff frequency than a 0.15 $mu{rm m}$ pHEMT does. Thus, the conversion gain of the mHEMT is higher than that of the pHEMT in the active Gilbert mixer design. The Q-band stacked-LO subharmonic upconversion mixers using the pHEMT and mHEMT technologies have conversion gain of $-$7.1 dB and $-$0.2 dB, respectively. The pHEMT upconversion mixer has an ${rm OIP}_{3}$ of $-$12 dBm and an ${rm OP}_{1 {rm dB}}$ of $-$24 dBm, while the mHEMT one shows a 4 dB improvement on linearity for the difference between the ${rm OIP}_{3}$ and ${rm OP}_{1 {rm dB}}$. Both the chip sizes are the same at 1.3 mm $times$ 0.9 mm.      

A 47 GHz Cross-Coupled VCO Employing High- Island-Gate Varactor for Phase Noise Reduction

A 47 GHz $LC$ cross-coupled voltage controlled oscillator (VCO) employing the high-$Q$ island-gate varactor (IGV) based on a 0.13 $mu{rm m}$ RFCMOS technology is reported in this work. To verify the improvement in the phase noise, two otherwise identical VCOs, each with an IGV and a conventional multi-finger varactor, were fabricated and the phase noise performance was compared. With $V_{DD}$ of 1.2 V and core power consumption of 3.86 mW, the VCOs with the IGV and the multi-finger varactor have a phase noise of $-$95.4 dBc/Hz and $-$91.4 dBc/Hz respectively, at 1 MHz offset, verifying the phase noise reduction with the introduction of the high-$Q$ IGV. The VCO with IGV exhibited an output power of around $-$15 dBm, leading to a FoM of $-$182.9 dBc/Hz and a tuning range of 3.35% (45.69 to 47.22 GHz).      

10-GHz and 20-GHz Channel Spacing High-Resolution AWGs on InP

This letter reports on 10-GHz and 20-GHz channel-spacing arrayed waveguide gratings (AWGs) based on InP technology. The dimensions of the AWGs are 6.8$,times,$8.2 mm$^{2}$ and 5.0$,times,$6.0 mm$^{2}$, respectively, and the devices show crosstalk levels of $-$12 dB for the 10-GHz and $-$17 dB for the 20-GHz AWG without any compensation for the phase errors in the arrayed waveguides. The root-mean-square phase errors for the center arrayed waveguides were characterized by using an optical vector network analyzer, and are 18 $^{circ}$ for the 10-GHz AWG and 28$^{circ}$ for the 10-GHz AWG.      

Integrated Quadrature Couplers and Their Application in Image-Reject Receivers

Several fully-integrated multi-stage lumped-element quadrature hybrids that enhance bandwidth, amplitude and phase accuracies, and robustness are presented, and a fully-integrated double-quadrature heterodyne receiver front-end that uses two-stage Lange/Lange couplers is described. The Lange/Lange cascade exploits the inherent wide bandwidth characteristic of the Lange hybrid and enables a robust design using a relatively low transformer coupling coefficient. The measured image-rejection ratio is $>$ 55 dB over a 200 MHz bandwidth centered around 5.25 $~$GHz without any tuning, trimming, or calibration; the front-end features 23.5 dB gain, $-$79 dBm sensitivity, 5.6 dB SSB NF, $-$7$~$ dBm IIP3, $-$18 dB $S_{11}$ and a 1 mm $times$ 2 mm die area in 0.18$ mu{hbox {m}}$ CMOS.      

CMOS Avalanche Photodiode Embedded in a Phase-Shift Laser Rangefinder

This paper presents the design and the characterization of a CMOS avalanche photodiode (APD) working as an optoelectronic mixer. The $hbox{P}^{+}hbox{N}$ photodiode has been implemented in a commercial 0.35-$muhbox{m}$ CMOS technology after optimization with SILVACO. The surface of the active region is $ hbox{3.78} cdot hbox{10}^{-3} hbox{cm}^{2}$. An efficient guard-ring structure has been created using the lateral diffusion of two n-well regions separated by a gap of 1.2 $mu hbox{m}$. When biased at $-$2 V, the best responsitivity $S_{lambda ,{rm APD}} = hbox{0.11} hbox{A/W}$ is obtained at $lambda = hbox{500} hbox{nm}$. This value can easily be improved by using an antireflection coating. At $lambda = hbox{472} hbox{nm}$, the internal gain is about 75 at $-$6 V and 157 at $-$7 V. When biased at $-$6 V, the APD achieves a dark current of 128 $muhbox{A} cdot hbox{mm}^{-2}$ and an excess noise factor $F = hbox{20}$ . Then, the APD is successfully used as an optoelectronic mixer to improve the signal-to-noise ratio of a low-voltage embedded phase-shift laser rangefinder.      

17 GHz RF Front-Ends for Low-Power Wireless Sensor Networks

A 17 GHz low-power radio transceiver front-end implemented in a 0.25 $mu{hbox {m}}$ SiGe:C BiCMOS technology is described. Operating at data rates up to 10 Mbit/s with a reduced transceiver turn-on time of 2 $mu{hbox {s}}$, gives an overall energy consumption of 1.75 nJ/bit for the receiver and 1.6 nJ/bit for the transmitter. The measured conversion gain of the receiver chain is 25–30 dB into a 50 $Omega$ load at 10 MHz IF, and noise figure is 12 $pm$0.5 dB across the band from 10 to 200 MHz. The 1-dB compression point at the receiver input is $-$37 dBm and ${hbox{IIP}}_{3}$ is $-$25 dBm. The maximum saturated output power from the on-chip transmit amplifier is $-$1.4 dBm. Power consumption is 17.5 mW in receiver mode, and 16 mW in transmit mode, both operating from a 2.5 V supply. In standby, the transceiver supply current is less than 1 $mu{hbox {A}}$.      

Analysis and Design of a CMOS UWB LNA With Dual- -Branch Wideband Input Matching Network

A wideband low-noise amplifier (LNA) based on the current-reused cascade configuration is proposed. The wideband input-impedance matching was achieved by taking advantage of the resistive shunt–shunt feedback in conjunction with a parallel LC load to make the input network equivalent to two parallel $RLC$-branches, i.e., a second-order wideband bandpass filter. Besides, both the inductive series- and shunt-peaking techniques are used for bandwidth extension. Theoretical analysis shows that both the frequency response of input matching and noise figure (NF) can be described by second-order functions with quality factors as parameters. The CMOS ultra-wideband LNA dissipates 10.34-mW power and achieves ${ S}_{11}$ below $-$8.6 dB, ${ S}_{22}$ below $-$10 dB, ${ S}_{12}$ below $-$26 dB, flat ${ S}_{21}$ of 12.26 $pm$ 0.63 dB, and flat NF of 4.24 $ pm$ 0.5 dB over the 3.1–10.6-GHz band of interest. Besides, good phase linearity property (group-delay variation is only $pm$22 ps across the whole band) is also achieved. The analytical, simulated, and measured results agree well with one another.      

A Sub-100 $mu{rm W}$ Ku-Band RTD VCO for Extremely Low Power Applications

This letter presents the microwave performance of a sub-100 $mu{rm W}$ Ku-band differential-mode resonant tunneling diode (RTD)-based voltage controlled oscillator (VCO) with an extremely low power consumption of 87 $mu{rm W}$ using an InP-based RTD/HBT MMIC technology. In order to achieve the extremely low-power Ku-band RTD VCO, the device size of RTD is scaled down to $0.6times 0.6 mu{rm m}^{2}$. The obtained dc power consumption of 87 $mu{rm W}$ is found to be only 1/18 of the conventional-type MMIC VCOs reported in the Ku-band. The fabricated RTD VCO has a phase noise of $-$100.3 dBc/Hz at 1 MHz offset frequency and a tuning range of 140 MHz with the figure-of-merit (FOM) of $-$194.3 dBc/Hz.      

Novel NiGe MSM Photodetector Featuring Asymmetrical Schottky Barriers Using Sulfur Co-Implantation and Segregation

We report the first demonstration of a novel germanium (Ge) metal–semiconductor–metal (MSM) photodetector featuring asymmetrical Schottky-barrier height for low dark current and high-speed photodetection applications. Through co-implantation and segregation of valence-mending adsorbate such as sulfur at the NiGe/Ge interface, the germanide Fermi level can be pinned close to the conduction band edge. This results in an effective modulation of hole Schottky-barrier height, leading to a significant dark current suppression by $≫$3 orders of magnitude over a conventional MSM photodetector. When operated at a bias voltage $V_{A}$ of 1.0 V, a detector with an area of 804 $muhbox{m}^{2}$ shows a spectrum response of $sim$0.36 A/W or a corresponding quantum efficiency of $sim$34%. In addition, a frequency response measurement reveals the achievement of a $-$3-dB bandwidth of $sim!$15 GHz at an illumination photon wavelength of 1550 nm.      

Ultrathin Si Thin-Film Transistor on Glass

We have studied the fabrication of ultrathin single-crystalline-silicon thin-film transistors (TFTs) on glass. The single-crystalline Si layer was transferred to glass by hydrogen implantation and anodic bonding. The thickness of the silicon-on-glass (SiOG) was controlled down to 10 nm by dry etching. The p-channel SiOG TFTs with 10-nm-thick Si exhibited the field-effect mobility of 134.9 $hbox{cm}^{2}/hbox{V}cdot hbox{s}$, threshold voltage of $-$1.5 V, and gate voltage swing of 0.13 V/dec. The TFTs were found to be stable against gate bias stress of $+$30 or $-$30 V.      

Bending and Strain Sensitivities in a Helicoidal Long-Period Fiber Gratings

In this letter, we report bending and strain sensitivities of helicoidal long-period fiber gratings fabricated by twisting single-mode fibers during $hbox{CO}_{2}$ laser irradiation. Linear spectral shifts of the resonant wavelengths under the bending and tensile strain were observed with the sensitivities of $-$11.7 nm/m$^{-1}$ and $-$1.1 $hbox{pm}/muvarepsilon$, respectively. The corresponding transmission power variations at the resonance wavelength were 4.1 $hbox{dB/m}^{-1}$ and $2.2times 10^{-4} hbox{dB}/muvarepsilon$, respectively. Detailed measurement techniques and sensor applications are discussed.      

Polymeric Substrate Spin-Cast diF-TESADT OTFT Circuits

We report 7- and 15-stage spin-cast contact-crystallized 2, 8-difluoro-5, 11-bis(triethylsilylethynyl) anthradithiophene (diF-TESADT) organic thin-film transistor (OTFT) ring oscillators on plastic substrates with a maximum frequency of more than 22 kHz and a propagation delay of less than 3.3 $ muhbox{s/stage}$ at a supply bias of $-$80 V. The circuits have stable operation for a supply bias as small as $-$ 3 V (25–30 $muhbox{s/stage}$). Spin-cast diF-TESADT OTFTs from a toluene solution on plastic substrates have a mobility of 0.1–0.2 $hbox{cm}^{2}/hbox{V} cdot hbox{s}$ with a contact-related microstructure from pentafluorobenzenethiol-treated Au source and drain electrodes.      

14-GHz GaNAsSb Unitraveling-Carrier 1.3-$muhbox{m}$ Photodetectors Grown by RF Plasma-Assisted Nitrogen Molecular Beam Epitaxy

We report on picosecond pulsed response and 3-dB cutoff frequency of 1.3-$ muhbox{m}$ GaNAsSb unitraveling-carrier photodetectors (PDs) grown by molecular beam epitaxy using a radio-frequency plasma-assisted nitrogen source. The 0.1-$muhbox{m}$ -thick GaNAsSb photoabsorption layer contains 3.5% of N and 9% of Sb, resulting in a bandgap of 0.88 eV. The dark current densities at 0 and $-$9 V are 6 and 34 $hbox{mA}/hbox{cm}^{2}$, respectively. The GaNAsSb UTC PDs exhibit a temporal response width of 46 ps and a record 3-dB cutoff frequency of 14 GHz at $-$9 V.      

125-GHz Diode Frequency Doubler in 0.13-$mu{hbox {m}}$ CMOS

The first mm-wave Schottky diode frequency doubler fabricated in CMOS is demonstrated. The doubler built in 130-nm CMOS uses a balanced topology with two shunt Schottky barrier diodes, and exhibits $sim$10-dB conversion loss as well as $-$1.5-dBm output power at 125 GHz. The input matching is better than $-$10$~$dB from 61 to 66 GHz. The rejection of fundamental signal at output is greater than 12 dB for input frequency from 61 to 66$~$GHz. The doubler can generate signals up to 140 GHz.      

A Linearization Technique for RF Receiver Front-End Using Second-Order-Intermodulation Injection

A linearization technique is proposed in which low-frequency second-order-intermodulation $({rm IM}_{2})$ is generated and injected to suppress the third-order intermodulation $({rm IM}_{3})$. The proposed linearization technique is applied to both a low-noise amplifier (LNA) and a down-conversion mixer in an RF receiver front-end (RFE) working at 900 MHz. Fabricated in a 0.18$ mu{hbox{m}}$ CMOS process and operated at 1.5 V supply with a total current of 13.1 mA, the RFE delivers 22 dB gain with 5.3 dB noise figure (NF). The linearization technique achieves around 20 dB ${rm IM}_{3}$ suppression and improves the RFE's ${rm IIP}_{3}$ from $-$ 10.4 dBm to 0.2 dBm without gain reduction and noise penalty while requiring only an extra current of 0.1 mA.      

A 10:1 Unequal Wilkinson Power Divider Using Coupled Lines With Two Shorts

A novel unequal Wilkinson power divider is presented. A coupled-line section with two shorts is proposed to realize the high characteristic impedance line, which cannot be implemented by conventional microstrip fabrication technique due to fabrication limitation. The proposed coupled-line structure is compatible with single layer integration and can be easily designed based on an even-odd mode analysis. As a design example, a 10:1 Wilkinson power divider at 2 GHz is fabricated and measured. The measured $-10~{rm dB}$ bandwidth of $S_{11}$ is about 16%, and the isolation $S_{32}$ is better than $-20~{rm dB}$ . The measured amplitude balance between output port 2 and port 3 is between $-10.20~{rm dB}$ and $-9.52~{rm dB}$, and the corresponding phase difference is between 0$^{circ}$ and 4.6$^{circ}$.      

Effective Crosstalk Isolation With Post-CMOS Selectively Grown Porous Silicon Technique for Radio Frequency System-on-Chip (SOC) Applications

In this letter, post-CMOS substrate selective-transformation engineering based on the selectively grown porous silicon (SGPS) technique is demonstrated to effectively suppress substrate crosstalk. The testing structures for crosstalk isolation are fabricated in a standard 0.18-$muhbox{m}$ CMOS process, and porous silicon trenches are selectively grown after processing from the backside of the silicon wafer. For a testing structure with 250-$muhbox{m}$ separation on Si, a 42.8-dB improvement (from $-$23.5 to $-$66.3 dB) for crosstalk isolation is achieved at 2 GHz. The characteristics of the SGPS substrate have been extracted using the conventional lump element model, which shows that our SGPS technique increases the substrate impedance by one order of magnitude. These results demonstrate that our post-CMOS substrate selective-transformation engineering is very promising for radio frequency system-on-chip applications.      

A 5-GHz CMOS Type-II PLL With Low $K_{rm VCO}$ and Extended Fine-Tuning Range

A 5-GHz dual-path integer-$N$ Type-II phase-locked loop (PLL) uses an LC voltage-controlled oscillator and softly switched varactors in an overlapped digitally controlled integral path to allow a large fine-tuning range of approximately 160 MHz while realizing a low susceptibility to noise and spurs by using a low $K_{rm VCO}$ of 3.2 MHz/V. The reference spur level is less than $-$70 dBc with a 1-MHz reference frequency and a total loop-filter capacitance of 26 pF. The measured phase noise is $-$75 and $-$115 dBc/Hz at 10-kHz and 1-MHz offsets, respectively, using a loop bandwidth of approximately 30 kHz. This 0.25-${hbox{mm}}^{2}$ PLL is fabricated in a 90-nm digital CMOS process and consumes 11 mW from a 1.2-V supply.