Optical/UV and X-Ray Microwave Kinetic Inductance Strip Detectors

Microwave Kinetic Inductance Detectors (MKIDs) are superconducting detectors that sense the change in the surface impedance of a thin superconducting film when Cooper Pairs are broken by using a high quality factor resonant circuit. We are developing strip detectors that have aluminum MKID sensors on both ends of a rectangular tantalum strip. These devices can provide one dimensional spatial imaging with high quantum efficiency, energy resolution, and microsecond time resolution for single photons from the IR to the X-ray. We have demonstrated X-ray strip detectors with an energy resolution of 62 eV at 6 keV, and hope to improve this substantially. We will also report on our progress towards optical arrays for a planned camera for the Palomar 200″ telescope.     

Optical Propagation: Problems and Trends

During the past 15 years light propagation through the atmosphere has been investigated in depth, from both experimental and theoretical points of view, but many problems remain. This paper presents a critical review of some of these problems, such as those arising when constructing models for turbulence or for aerosols. The main trends of research in this area are outlined.     

Photography and Microelectronics

Only a minority of the public familiar with the silicon chip appreciate how deeply photographic processes are involved in ihe fabrication of these extraordinary devices. In fact two photographic materials were involved. Firstly, “grainless” emulsions were used to produce the hyper-line patterns 01 masks used lor each production stage. Secondly, photoresists received the imprint of these masks ami produced ihe stencils required for the photomechanical operations. Both materials were ready and wailing to provide for the needs of the electronics industry.     

Nano and Giga Challenges in Microelectronics

J. Greer, et al., (eds.).Elsevier (2003), 256 pp. ISBN: 0-444-51494-5 $99 / €99     

Lead-free Solders in Microelectronics

Practically all microelectronic assemblies in use today utilize Pb–Sn solders for interconnection. With the advent of chip scale packaging technologies, the usage of solder connections has increased. The most widely used Pb–Sn solder has the eutectic composition. Emerging environmental regulations worldwide, most notably in Europe and Japan, have targeted the elimination of Pb usage in electronic assemblies, due to the inherent toxicity of Pb. This has made the search for suitable “Pb-free” solders an important issue for microelectronics assembly. Approximately 70 Pb-free solder alloy compositions have been proposed thus far. There is a general lack of engineering information, and there is also significant disparity in the information available on these alloys. The issues involved can be divided into two broad categories: manufacturing and reliability/performance. A major factor affecting alloy selection is the melting point of the alloy, since this will have a major impact on the other polymeric materials used in microelectronic assembly and encapsulation. Other important manufacturing issues are cost, availability, and wetting characteristics. Reliability related properties include mechanical strength, fatigue resistance, coefficient of thermal expansion and intermetallic compound formation. The data available in the open literature have been reviewed and are summarized in this paper. Where data were not available, such as for corrosion and oxidation resistance, chemical thermodynamics was used to develop this information. While a formal alloy selection decision analysis methodology has not been developed, less formal approaches indicate that Sn-rich alloys will be the Pb-free solder alloys of choice, with three to four alloys being identified for each of the different applications. Research on this topic continues at the present time at a vigorous pace, in view of the imminence of the issue.     

硼酸类生物传感器的研究及应用

综述了国内外近几年硼酸类传感器的最新研究进展,包括工作原理、结构特点、制备方法、检测特性等,阐述了其在生物医药、食品工业、环保等领域的应用,并展望了未来的研究方向.     

导电高聚物在生物传感器中的应用

综述了导电高聚物用于生物传感器的研究进展。在简要介绍生物传感器原理、特点的基础上，概要回顾了生物传感器中运用导电高聚物如聚苯胺（PANI）、聚噻吩（PTH）和聚吡咯（PPy）进行电极化学修饰的基本方法，着重综述了近年来在荧光生物传感器中导电高分子如聚苯撑乙烯（PPV）、聚芴（PF）等水溶性衍生物应用的研究进展，分别对基于水溶性共轭高分子荧光淬灭及荧光共振能量转移（FRET）生物传感器等提高灵敏度和选择性的原理、特点和具体实例进行了介绍，并对导电高聚物生物传感器的研究做了展望。     

New Materials for Chemical and Biosensors

Wide band gap materials such as SiC, AlN, GaN, ZnO, and diamond have excellent properties such as high operation temperature when used as field effect devices and a high resonating frequency of the substrate materials used in piezoelectric resonator devices. Integration of FET and resonating sensors on the same chip enables powerful miniaturized devices, which can deliver increased information about a gas mixture or complex liquid. Examples of sensor devices based on different wide band gap materials will be given.     

Calibration of Radiation Sources and Detectors Over a Broad Range of Measurement of the Energy of Optical Radiation

Measurement Techniques - A method of calibration of devices used to measure energy by means of a calorimeter and reference photodiode is described. Experimental results of the calibration are...     

Optical Bistability,Instability and Optical Computing

The formation of a cone-type light beam structure in an amplifying medium exhibiting the Kerr-type non-linearity and two-photon absorption is considered. The dependences of the relative diameter, contrast, and the position of the origin of a filamentary light region (that formed on the beam axis) on the active medium parameters are investigated. The effects of additional factors, such as a dielectric tube covering the active medium cylinder, the inhomogeneity of the medium amplification in the cross-section, and a saturable absorber mixed with the active medium on the light propagation pattern, are also discussed. Here, it is shown that a cone-type light beam structure is highly stable under the influence of such factors. It is noted that picosecond and sub-picosecond spectroscopy, including the study of multiphoton transitions and the measurement of the Kerr-type non-linearity constant in a medium on observation of a cone-type light beam structure, are possible.     

墨水直写、喷墨打印和激光直写技术及其在微电子器件中的应用

直写技术是一种新型微加工技术,其加工过程不需模板并可在亚微米至厘米范围实现材料加工成型.墨水直写、喷墨打印和激光直写作为最常用的直写技术,具有强大的二维、三维成型能力和优异的成型精度,可实现金属、陶瓷、聚合物、水凝胶等复杂构型的程序化构筑,被广泛应用于微电子、组织工程、微流控等领域.阐述了这3种直写技术的构型原理和材料选择,重点介绍了其在微电子器件制造中的应用,讨论了当前研究的难点和热点问题,并对其未来发展趋势进行了展望.