Optical emission, electron temperature, and microstructure of Cu film prepared by magnetron sputtering

Cu films are deposited on Si (001) substrates under various Ar deposition pressures by radio frequency (RF) magnetron sputtering. The crystallinity and orientation of Cu films is characterized by employing X-ray diffraction technique. It is found that the intensities of Cu peaks change with Ar pressure systematically, and ~ 5 Pa is the most favorable Ar pressure to get highly (111) oriented Cu films. Electron temperature and optical emission spectrum (OES) of plasma plume are measured using the double Langmuir probes, a monochromator and a PMT detector. We found that the electron temperature decreases exponentially with increasing deposition pressure, and there are strong correlations of optical emission, electron temperature, and the microstructure of Cu films. We define a Cu atomic relevant coefficient to describe the crystallinity and orientation of Cu films prepared under various pressures. This work may provide a method to understand the crystallinity and orientation evolution of the film prepared by sputtering via investigating optical emission and electron temperature.     

Ar压强对硅基Al膜应力和微结构的影响

用直流磁控溅射法在室温Si基片上制备了溅射时间分别为5 min和10 min,氩气压强分别为0.7、3、6 Pa的6种Al膜,用光学相移法和X射线衍射法对Al膜的应力和微结构随着压强的变化进行了研究.应力分析表明:在同一溅射时间,随着氩气压强的减小,Al膜厚度增大,在相同选区范围内,Al膜的应力差变小,应力分布趋于均匀.结构分析表明:制备的Al膜呈多晶状态,晶体结构仍为面心立方,在相同溅射时间下,压强为0.7 Pa的Al膜结晶度最好.随着压强的减小,平均晶粒尺寸和晶格常数增大.     

Kinetic process of phase separation in Co-SiO2 thin films and preparation of mesoporous SiO2 thin films with mesopore channels aligned perpendicularly to substrate surfaces

A physical co-sputter deposition process under a relevant working gas pressure condition was used to produce a multi-component thin film with a longitudinally self-organized microstructure. In this paper, Co-Si-O thin films were prepared by radio frequency (RF) magnetron sputtering, and their growth structures were studied by means of SEM, TEM, XRD and XPS. The microstructural changes in the Co-Si-O thin film and their dependence on Ar working gas pressure were investigated; the formation of Co-Si-O thin films, having a regular array of needle-like Co columns aligned perpendicularly to the substrate surfaces, was observed with appropriate Ar working gas pressure, and the diameter of the columns increased with increasing Ar pressure. Mesoporous silica thin films having perpendicular mesopore channels were obtained by chemical etching of the columnar Co parts in the Co-Si-O thin films. Through experimental observations, we propose that the phase separation and resultant microstructures in the thin films are determined by the surface mobility of the two components (Co and silica) on the film surface. A simple model, incorporating a diffusion process in the simultaneous deposition of two components, is presented. The model demonstrates the general trends of a kinetically self-organized microstructure in a two-component thin film.     

Deposition and heat treatment of CuAlNi shape memory thin films

CuAlNi thin films were fabricated by magnetron sputtering process. After heat treatment, the thin films presented a shape memory effect. Calowear method was used to measure the thickness of the thin films. SEM, XRD and TEM were used to characterize the thin films. The phase transformation in the thin films was examined by DSC. The deposition rate increased with increasing sputtering power and decreased with increasing Ar pressure. Compared to the composition of the target, both the content of Al and the content of Ni increased a little. The sputtering conditions had little influence on the content of Ni. The content of Al varied slightly with sputtering power, while decreased with increasing Ar pressure. The deposited thin films were columnar. The grain size was very fine. The phases were α‐Cu and α₂. After heat treatment at 800 ^oC/ 60 min + 300 ^oC/ 60 min in vacuum, CuAlNi shape memory thin films were obtained. The phase in the heat‐treated thin films was β₁’ martensite. Martensite transformation was observed and a two‐way shape memory effect could be shown.     

用AFM研究硅基上沉积铜膜生长过程

室温下,利用磁控溅射在P型Si(111)衬底上沉积了铜(Cu)膜.用原子力显微镜(AFM)对不同沉积时间制备的Cu膜形貌进行了观测,研究了磁控溅射沉积Cu膜时膜在硅衬底上成核和生长方式.Cu膜在Si衬底生长时,Cu的临界核以Volmer-Weber模式生长.溅射时,核长大增高为岛状,岛与岛相互连接构成岛的通道,最后形成连续膜.随着沉积的进行,Cu膜表面粗糙度由于晶粒凝聚和合并而增大.当形成连续致密的、具有一定晶向的Cu膜时,粗糙度反而减小.     

RF磁控溅射工艺对TiNi(1-x)Cux合金薄膜组织形貌的影响

采用RF磁控溅射技术制备了TiNi(1-x)Cux合金薄膜，利用扫描电镜，电子能谱仪和XRD技术分析研究了RF磁控溅射工艺对TiNi(1-x)Cux合金薄膜组织形貌的影响规律。结果表明：在基片不加热的条件下溅射薄膜组织结构为非晶，并呈柱状形貌垂直于基片生长；经650-720℃，3min退火处理后，薄膜均发生晶化转变；在他它条件相同的情况下，溅射功率和工作气压对薄膜组织形貌有很大影响；薄膜的柱状单胞直径，薄膜厚度和生长速度均随溅射功率的增长而增长，但当溅射功率一定时，工作气压增加使柱状单胞直径，薄膜厚度和薄膜的生长速率显著减小，RF磁控溅射过程中，沉积原子的活性及其沉积速率是影响薄膜组织形貌的主要原因。     

Deposition and characterization of reactive magnetron sputtered aluminum nitride thin films for film bulk acoustic wave resonator

This work studies the relationship between the deposition process parameters and the properties of sputtered c-axis-oriented aluminum nitride (AlN) thin films. AlN films were deposited on a Pt electrode by reactive magnetron sputtering under various deposition conditions. The films were characterized by X-ray diffraction (XRD) and field-emission scanning electron microscopy (FESEM). A polycrystalline AlN film with highly c-axis-preferred orientation was achieved. The XRD rocking curve was 2.7°. The FESEM photographs also show that the AlN film has a dense hexagonal surface texture with uniform grain size and a highly ordered column structure.     

Electrical,morphological and structural properties of RF magnetron sputtered Mo thin films for application in thin film photovoltaic solar cells

Molybdenum (Mo) thin films were deposited using radio frequency magnetron sputtering, for application as a metal back contact material in “substrate configuration” thin film solar cells. The variations of the electrical, morphological, and structural properties of the deposited films with sputtering pressure, sputtering power and post-deposition annealing were determined. The electrical conductivity of the Mo films was found to increase with decreasing sputtering pressure and increasing sputtering power. X-ray diffraction data showed that all the films had a (110) preferred orientation that became less pronounced at higher sputtering power while being relatively insensitive to process pressure. The lattice stress within the films changed from tensile to compressive with increasing sputtering power and the tensile stress increased with increasing sputtering pressure. The surface morphology of the films changed from pyramids to cigar-shaped grains for a sputtering power between 100 and 200 W, remaining largely unchanged at higher power. These grains were also observed to decrease in size with increasing sputtering pressure. Annealing the films was found to affect the resistivity and stress of the films. The resistivity increased due to the presence of residual oxygen and the stress changed from tensile to compressive. The annealing step was not found to affect the crystallisation and grain growth of the Mo films.     

Effects of Substrate Temperature on the Growth of Polycrystalline Si Films Deposited with SiH4+Ar

Polycrystalline silicon(poly-Si) films were deposited using Ar diluted SiH4 gaseous mixture by electron cyclotron resonance plasma-enhanced chemical vapor deposition(ECR-PECVD).The effects of the substrate temperature on deposition rate,crystallinity,grain size and the configuration of H existing in poly-Si film were investigated.The results show that,comparing with H2 dilution,Ar dilution could significantly decrease the concentration of H on the growing surface.When the substrate temperature increased,the...     

不同氩气与氢气流量比对硼掺杂纳米金刚石膜的影响

采用直流热阴极PCVD方法,以B(OCH3)3作为硼源,通过改变氩气与氢气流量比,在p型Si衬底上沉积了硼掺杂纳米金刚石膜.研究了不同氩气与氢气流最比对掺硼金刚石膜生长的影响.采用扫描电子显微镜、拉曼光谱仪、X射线衍射仪、霍尔系统等对样品的形貌、结构和导电性能进行了表征.结果表明,随着氩气与氢气流量比的增加,膜的晶粒尺寸由微米级向纳米级转变,并且膜中非晶碳成分增多,膜的导电性能变好.     

PI衬底上电沉积Cu薄膜的晶面择优取向

采用硫酸盐电沉积法,利用X射线衍射仪(XRD)、扫描电镜(SEM)等手段研究了不同电沉积条件下在PI膜表面制备的Cu薄膜的品而择优取向、平均晶粒尺寸及表面形貌.结果表明,沉积层的晶面择优取向受Cu薄膜厚度和电流密度影响,电流密度较小(0.2 A/dm2)和较大(3.5～5.5 A/dm2)时,电沉积Cu膜分别容易得到(111)和(220)晶面择优取向,较大电流密度有利于晶核的形成,薄膜表面平均颗粒尺寸较小.     

射频磁控溅射沉积高质量ZnO薄膜的工艺研究

在室温下利用射频磁控溅射法在硅(100)基片上制备ZnO薄膜,利用X射线衍射(XRD)和扫描电子显微镜(SEM)对其结晶性能进行分析。研究了制备条件对薄膜沉积速率的影响。分析了薄膜沉积速率对薄膜结晶状况的影响及源气体中的氧气和氩气的流量比对薄膜结晶状况的影响。研究结果表明,薄膜的生长速率强烈依赖于射频功率和工作气压,薄膜的结晶性能强烈依赖于薄膜的沉积速率和反应气体中氧气和氩气的流量比。制备高结晶质量的ZnO薄膜的最佳工艺参数为靶到衬底的距离为4cm,输入功率为250W,源气体中氩气和氧气的流量比n(Ar)∶n(O2)为5∶20,溅射工作气压为2Pa。在最佳工艺条件下所制备的薄膜表面平整致密,接近单晶,在可见光区的透射率高达90%。     

Effect of sputtering power on microstructure of dielectric ceramic thin films by RF magnetron sputtering method using (Ba<Subscript>0.3</Subscript>Sr<Subscript>0.7</Subscript>)(Zn<Subscript>1/3</Subscript>Nb<Subscript>2/3</Subscript>)O<Subscript>3</Subscript> as target

Radio frequency (RF) magnetron sputtering method was applied to prepare dielectric ceramic thin films on SiO₂ (110) substrates using (Ba_0.3Sr_0.7)(Zn_1/3Nb_2/3)O₃ microwave dielectric ceramics as target. The samples were deposited at different sputtering powers in Ar atmosphere. In particular, the microstructure and morphology of the thin films were investigated as a function of sputtering powers by X-ray diffraction (XRD), X-ray photoelectron spectroscope (XPS), scanning electron microscopy (SEM), atomic force microscopy (AFM) and transmission electron microscopy (TEM). The results show that the thin films are polycrystalline and the sputtering power significantly influences the surface morphology and microstructure of the thin films. On increasing the sputtering power, the crystallinity improves and the grain size and roughness of the thin films reach maximum values at 200 W.     

沉积气压对磁控溅射制备ZnO薄膜的结构与光学性能影响

采用CS-400型射频磁控溅射仪在Si(111)和石英基底上成功的制备了ZnO薄膜,分别用XRD、SEM、紫外-可见光分光光度计和荧光分光光度计表征样品的结构和光学性质.实验表明,采用射频磁控溅射制备的ZnO薄膜具有六角纤锌矿结构的(002)峰和(101)峰的两种取向.在沉积气压>1.0Pa时所制备的ZnO薄膜具有(002)择优取向,并且十分稳定.SEM图表明,ZnO薄膜颗粒大小较为均匀,晶粒尺寸随着气压升高而变小,沉积气压不同时,薄膜样品的生长方式有所差异.在400～1000nm范围内,可以看出除O.5Pa下制备的ZnO薄膜外,其余ZnO薄膜在可见光区域的平均透过率超过80%,吸收边在380nm附近,所对应的光学带隙约为3.23～3.27eV,并随着沉积气压上升而变大.ZnO薄膜的PL谱上观察到了392nm的近紫外峰和419nm的蓝峰;沉积气压对Zno薄膜的发光峰位和峰强有影响.     

O2/Ar气体流量比对射频磁控溅射HfO2薄膜的影响

采用射频磁控溅射法,以HfO2陶瓷作为靶材,在石英衬底上制备了HfO2薄膜.通过椭圆偏振光谱仪(SE)、X射线衍射(XRD)、场发射扫描电子显微镜(FE-SEM)研究了不同O2/Ar气体流量比对薄膜沉积速率、结构、形貌等的影响.结果表明,随着O2/Ar气体流量比从0增加到0.50,薄膜的沉积速率逐渐下降.O2/Ar气体...     

溅射气压对FeCoSiB非晶薄膜表面形貌及磁特性的影响

利用磁控溅射的方法，在玻璃基片上制备了FeCoSiB非晶薄膜，研究了溅射心气压强对薄膜表面形貌及磁特性的影响。结果表明，薄膜的表面形貌显著依赖于心气压强，随着山Ar压强的增加，薄膜表面颗粒增大，粗糙度增加并形成柱状微结构。心气压强对薄膜磁特性有显著的影响，随血压强增加，薄膜的矫顽力增加，而剩磁则呈下降趋势。从薄膜的磁滞回线、矫顽力以及剩磁随溅射气压的变化规律可知，溅射气压较小时制备的薄膜软磁性能较好．     

约瑟夫森结Nb电极的实验研究

通过溅射Nb膜张力与氩（Ar）压强的关系，超导转变温度Tc，室温阻扰与液氮温度阻抗比RRT／RLN2，沉积中Ar浓度CAr与负偏压关系的测量和扫描电子显微镜的观察分析，对约瑟夫森结Nb电极作了研究。发现Ar压强在1．1Pa时，Nb膜呈现无应力状态；低负偏压下沉积的Nb膜晶粒结构是由致密膜到圆柱状。在偏压Ub＝－50V时，获得表面致密均匀、晶粒结构合适的Nb膜。对Nb膜用阳极氧化电压谱图（AVS）分析，证实沉积的Nb膜内不存在氧化物、寄生结和分层界面。     

氢气与Cu中间层对GZO薄膜光电性能的影响

采用磁控溅射方法, 在H₂/Ar混合气氛下制备了GZO薄膜和在Ar气氛下制备了GZO/Cu/GZO多层结构薄膜, 分别研究了H2流量和Cu层厚度对薄膜透明导电性能的影响。在此基础上, 在H₂/Ar混合气氛下制备了GZO/Cu/GZO多层结构薄膜, 对Cu层厚度对其性能的影响进行了研究。结果表明, 沉积气氛中引入H₂能有效降低GZO薄膜的电阻率而提高其透光率, 在H₂流量为20 sccm时GZO薄膜具有最佳性能。随着Cu厚度的增加, GZO/Cu/GZO多层结构薄膜的电阻率和平均透过率显著下降。在H₂/Ar混合气氛下制备的氢化GZO/Cu/GZO多层结构薄膜的电阻率普遍低于Ar气氛下制备的GZO/Cu/GZO多层结构薄膜, 但其透光率却随Cu层厚度的增加而显著降低。另外, 薄膜的禁带宽度随H₂流量的增加而增加, 随Cu层厚度的增加而减小。     

快速热处理对(Ba,Sr)TiO3薄膜晶化行为的影响

采用射频溅射法在Si(111)基片上制备了(Ba,Sr)TiO3(BST)薄膜,并对制备的薄膜进行了快速退火热处理.采用X射线衍射和原子力显微镜分析了退火温度、退火时间和加热速度对BST薄膜晶化行为的影响.研究结果表明,BST薄膜的晶化行为强烈依赖于退火温度、退火时间和加热速度.BST薄膜的结晶度随退火温度的升高而提高.适当的热处理可降低BST薄膜的表面粗糙度,BST薄膜的表面粗糙度随退火温度的升高经历了一个先降低后增大的过程,但退火后BST薄膜的表面粗糙度都小于制备态薄膜的表面粗糙度.BST薄膜的晶粒尺寸随退火温度的升高经历了一个先增大后减小的过程.随退火时间的延长,BST薄膜的特征衍射峰越来越强,薄膜的晶化程度越来越高.随退火时问的延长,BST薄膜的晶粒尺寸和表面粗糙度也经历了一个先增大后减小的过程.BST薄膜的晶粒大小主要由退火温度决定.高的升温速率可获得较小的晶粒.     

Effects of sputtering pressure and nitrogen concentration on the preferred orientation of AIN thin films

Aluminium-nitride films were prepared on glass substrates by reactive radio frequency (r.f.) magnetron sputtering in argon/nitrogen gas mixtures containing 25 ~ 75 1/2; nitrogen at substrate temperatures below 150C. It is important to control the crystallographic orientation and the surface morphology of the films with the deposition parameters for surface-acoustic-wave (SAW) devices. The change of crystallographic orientation with the sputtering pressure and the nitrogen concentration was calculated from the texture coefficient of the (0002) plane based on X-ray diffraction (XRD) patterns. It was found that a change of the c-axis from a parallel to a normal orientation, with respect to the substrate surface, occurred with a decrease in the sputtering pressure and an increase in the nitrogen concentration. From observations of the cross-section and the surface morphology, aluminium-nitride films exhibited a columnar structure and the grain size at the film surface increased an increase in the sputtering pressure and with a decrease in the nitrogen concentration.