六方氮化硼-立方氮化硼/环氧树脂复合材料的制备与热物性能

环氧树脂(EP)高分子复合材料具有较低的热导率,其绝缘器件因散热及耐热性较差长期使用会出现故障和失效等隐患。通过向EP中添加微米氮化硼(BN)来制备具有高耐热性、高热导率的复合绝缘材料,并研究了复合材料的导热性能和耐热性能。结果表明：在六方氮化硼(hBN)质量分数为30wt%时,复合材料的热导率为0.444 W/(m·K),是纯EP的2.3倍。使用KH560改性hBN制备的复合材料,在填料质量分数为30wt%时,复合材料的热导率为0.456 W/(m·K),比未改性略有提高。而对于hBN-cBN/EP热压复合材料,在填料质量分数为30wt%时,其面内热导率为1.32 W/(m·K),远大于法向热导率。通过混掺制备了两种粒径(1、5～10μm)的hBN/EP复合材料,结果表明：填料混掺能明显提高材料的耐热性,通过向hBN/EP复合材料中添加1μm和10μm两种不同粒径的立方氮化硼(cBN)制备复合材料及其热压复合材料,结果表明：加入cBN和热压都能提高复合材料的耐热性能。     

石墨/PTFE复合材料导热性能的数值模拟

有限元数值模拟可看作在计算机上进行的模型实验,在模型体系上获得的信息比在实际体系上所作的试验更为详细.介绍了利用ANSYS的参数化有限元分析技术数值模拟的模型、原理及精度,并获得了系列化的数据,为石墨/PTFE复合材料的导热性能设计提供了参考依据.     

氮化硼纳米片的制备及其增强环氧树脂复合材料导热性能的研究进展

随着对新型高导热、高绝缘热界面材料需求的显著增加,具有多种优异性能的环氧树脂(EP)已被广泛用作导热复合材料的基体,然而其固有的低热导率限制了其实际应用.通过向EP中引入具有高导热系数及高绝缘性的氮化硼纳米片(BNNS)可有效弥补EP的缺陷,从而显著提高复合材料的综合性能.基于国内外研究,介绍了BNNS的不同制备方法,...     

BN表面改性对BN/环氧树脂复合材料导热性能的影响

采用十八烷基三甲基溴化铵（OTAB）阳离子表面活性剂对BN微米片进行有机化改性,研究了BN表面改性对BN/环氧树脂复合材料导热性能的影响。当OTAB浓度为0.6 g · L^-1时,BN表面的OTAB吸附量接近饱和。BN表面改性提高了环氧树脂对BN的浸润性,降低了BN的导热系数。SEM观察及黏度测试结果表明：BN表面改性改善了BN/环氧树脂复合材料的界面性能及体系相容性。由于界面热阻的降低,改性BN/环氧树脂复合材料的导热系数高于未改性BN/环氧树脂复合材料,当BN填充量为30%（填料与树脂基体的质量比）时,改性BN/环氧树脂复合材料的导热系数为1.03 W （m · K）^-1,是未改性BN/环氧树脂导热系数（0.48 W （m · K）^-1）的2.15倍。     

利用蔗糖改性氮化硼提高环氧树脂复合材料的导热性能

环氧树脂具有质量较轻、防腐性能和绝缘性能优良等一系列优势,因而被广泛应用于电气装备、高电压绝缘系统和航空航天等诸多领域。但环氧树脂的本征热导率较低,约为0.11～0.19 W/(m·K),如此低的热导率不利于系统及时有效地散热。氮化硼纳米片(BNNS)由于其优良的导热性能和绝缘性能,在高电压绝缘系统中具有广阔的应用前景。然而,BNNS制备流程复杂以及在液体中分散性差是目前限制其广泛应用的主要原因。采用一种简单而有效的蔗糖辅助机械化学剥离(SAMCE)方法来同时实现BNNS的剥离和改性,将蔗糖剥离改性得到的六方氮化硼(h-BN)加入环氧树脂中,添加改性h-BN的质量分数为15%时,复合材料的热导率可以达到0.51 W/(m·K),此时复合材料的热导率是纯环氧树脂材料的3.2倍,导热性能明显提升。为解释改性h-BN提升环氧树脂复合材料导热性能的机理,根据有效介质近似(EMA)理论模型反推计算得到改性前后h-BN/环氧树脂复合材料中填料颗粒与基质之间的界面热阻值,计算得到h-BN/环氧树脂复合材料的界面热阻为2.44×10^-6m²·K/W,改性h-...     

聚合物基复合材料的导热性能研究

讨论了聚合物基高导热高绝缘纳米复合材料的导热机理与常用的导热理论模型。考虑到填充率、温度等的影响，用不同的理论模型计算了氧化铝纳米颗粒填充环氧树脂的热导率，并结合相关研究实验对不同的导热理论模型进行分析比较。     

氮化硼/石墨烯共混对环氧树脂复合材料导热性和形状记忆效应的影响

采用不同摩尔比的熔融氢氧化钠和氢氧化钾剥离六方氮化硼。分别利用原子力显微镜、扫描电子显微镜和透射电子显微镜观察剥离效果发现,氢氧化钠和氢氧化钾摩尔比为2∶1时,氮化硼被剥离成4个原子层的氮化硼纳米片,剥离效果较好。为了提高环氧树脂的导热性,研究了不同质量比的氮化硼纳米片(BNNS)和石墨烯(Gr)混合物对其导热性能的影响。实验结果表明,BNNS和Gr混合物对环氧树脂导热性的影响优于单一的BNNS和Gr。当m(BNNS)∶m(Gr)=1∶4时,环氧树脂的导热系数最高,从纯环氧树脂的0.22 W/(m·K)增加到0.42 W/(m·K)。同时,该混合物还改善了环氧树脂的形状记忆效果,当m(BNNS)∶m(Gr)=1∶4时,复合材料的形状回复率可达到100%;70℃时,纯环氧树脂的形状回复时间为30 s,复合材料的形状回复时间缩短为4 s。     

非共价改性石墨烯的制备及环氧树脂复合材料导热性能

采用非共价键表面修饰制备了聚乙烯吡咯烷酮（PVP）改性的石墨烯（GR@PVP）,通过共混方式将其作为填料与环氧树脂（EP）复合得到了不同填充量的EP/GR复合材料。红外光谱和热重分析结果表明,聚乙烯吡咯烷酮成功接枝到石墨烯表面。动态力学热分析和热性能测试结果表明,EP/GR@PVP复合材料的储能模量、玻璃化转变温度和损耗因子峰高度均比EP/GR复合材料有所降低,表明聚乙烯吡咯烷酮增强了环氧树脂复合材料的柔韧性。采用扫描电子显微镜观察复合材料断面形貌,GR@PVP在环氧树脂中分散均匀,且与基体相容性好。当填料质量分数为2.0%时,EP/GR@PVP复合材料的热导率比纯EP和EP/GR复合材料分别提高了205.3%和52.6%,25℃EP复合材料的表观黏度为13.29 Pa·s,符合电子封装材料对复合材料加工黏度的需求(<20 Pa·s)。其研究为进一步制备高导热、低黏度的电子封装材料提供了一种简便的方法。     

粒子填充聚合物基复合材料导热性能的数值模拟

根据电镜照片中观察的微观结构信息,基于两套新设计的算法建立了代表体积元(RVE)模型,基于此模型研究了粒子填充聚合物基复合材料的导热性能与微观结构的关系。通过对电镜照片的处理得到两个参数即稀疏区比重和稀疏区半径,建立了与实际体系相符的具有非均匀粒子分布结构的 RVE模型。制备了氧化铝/高温硫化硅橡胶导热复合材料,并测试了不同填充量下体系的热导率,用以验证模型的有效性。采用有限元方法求解RVE模型得到的热导率预测值与实验值进行对比,结果表明：填料用量在宽范围内预测结果与实验值均吻合很好; 与均匀分布或随机分布相比,存在稀疏区和富集区的非均匀分布的体系具有更高的热导率,这种差异在高填充量下当颗粒间形成导热网链时更为显著;在相同填充量下,不同的粒子空间分布结构可使体系热导率差别很大,是影响体系热导率的关键因素。     

氮化硼纳米管/聚合物纳米复合材料导热性能研究进展

随着电子信息技术和纳米技术快速的发展,高导热聚合物复合材料引起来国内外学者的广泛关注。氮化硼纳米管(boron nitride nanotubes, BNNTs)具有稳定的化学性质、优异的电绝缘性、热稳定性、高热导率、良好的机械强度等特点,与聚合物复合制备高导热聚合物复合材料,广泛应用于电子器件、航天航空、化学工程、微电子包装、生物医用材料和太阳能利用等领域。综述了BNNTs的性质、制备方法及其聚合物复合材料的导热性能研究进展。     

Synergetic effect of hybrid boron nitride and multi-walled carbon nanotubes on the thermal conductivity of epoxy composites

This study investigates the synergistic effect of combining multi-walled carbon nanotubes (MWCNTs) and boron nitride (BN) flakes on thermally conductive epoxy composite. The surface of the two fillers was functionalized to form covalent bonds between the epoxy and filler, thereby reducing thermal interfacial resistance. The hybrid filler provided significant enhancement of thermal conductivity, adding 30 vol% modified BN and 1 vol% functionalized MWCNTs achieving a 743% increase in thermal conductivity (1.913 W mK⁻¹, compared to 0.2267 W mK⁻¹ of neat epoxy).     

High thermal conductivity of suspended few-layer hexagonal boron nitride sheets

The thermal conduction of suspended few-layer hexagonal boron nitride （h-BN） sheets was experimentally investigated using a noncontact micro-Raman spectroscopy method. The first-order temperature coefficients for monolayer （1L）, bilayer （2L） and nine-layer （9L） h-BN sheets were measured to be -（3.41 ± 0.12）× 10-2, -（3.15 ± 0.14） × 10-2 and -（3.78 ±0.16）× 10-2 cm-1.K-1, respectively. The room-temperature thermal conductivity of few-layer h-BN sheets was found to be in the range from 227 to 280 W.m-1-K-1, which is comparable to that of bulk h-BN, indicating their potential use as important components to solve heat dissipation problems in thermal management configurations.     

The effect of boron nitride on electrical conductivity of nanocarbon-polymer composites

The electrical conductivity concentration and temperature dependences of polymer composite materials (CMs) with nanocarbon fillers [graphite nanoplatelets and multi-walled carbon nanotubes (MWCNTs)] were investigated. Epoxy resin modified with organosilicon compound was used as polymer matrix. The content of nanocarbon filler in varied from 1 to 10 wt%. To study of the synergetic properties the additional dispersed dielectric filler—boron nitride (BN) was added to given systems in content of 27 wt%. The electrical resistivity of CMs was investigated in the temperature range of 77–300 K. In the studied CMs the percolation transition at sufficient low filler content (0.01–0.022 vol. fr.) was observed. The values of critical index varied from 3.0 to 5.2. The electrical conductivity of investigated CMs was analyzed in the framework of proposed model that takes into consideration the morphology of filler particles. It was shown that the increase of electrical conductivity of GNP-polymer CM in the presence of BN is attributed to the decrease of contact resistance between filler particles, while for MWCNT-polymer CM is due to the increase of the number of conductive chains in this particular system.     

Synergistic effect of boron nitride flakes and tetrapod-shaped ZnO whiskers on the thermal conductivity of electrically insulating phenol formaldehyde composites

Tetrapod-shaped zinc oxide (T-ZnO) whiskers and boron nitride (BN) flakes were employed to improve the thermal conductivity of phenolic formaldehyde resin (PF). A striking synergistic effect on thermal conductivity of PF was achieved. The in-plane thermal conductivity of the PF composite is as high as 1.96 W m⁻¹ K⁻¹ with 30 wt.% BN and 30 wt.% T-ZnO, which is 6.8 times higher than that of neat PF, while its electrical insulation is maintained. With 30 wt.% BN and 30 wt.% T-ZnO, the flexural strength of the composite is 312.9% higher than that of neat PF, and 56.2% higher that of the PF composite with 60 wt.% BN. The elongation at break is also improved by 51.8% in comparison with that of the composite with 60 wt.% BN. Such a synergistic effect results from the bridging of T-ZnO whiskers between BN flakes facilitating the formation of effective thermal conductance network within PF matrix.     

Thermal conductivity of boron nitride reinforced polyethylene composites

The thermal conductivity of boron nitride (BN) particulates reinforced high density polyethylene (HDPE) composites was investigated under a special dispersion state of BN particles in HDPE, i.e., BN particles surrounding HDPE particles. The effects of BN content, particle size of HDPE and temperature on the thermal conductivity of the composites were discussed. The results indicate that the special dispersion of BN in matrix provides the composites with high thermal conductivity; moreover, the thermal conductivity of composites is higher for the larger size HDPE than for the smaller size one. The thermal conductivity increases with increasing filler content, and significantly deviates the predictions from the theoretic models. It is found also that the combined use of BN particles and alumina short fiber obtains higher thermal conductivity of composites compared to the BN particles used alone.     

Investigation of interfacial thermal resistance of hybrid graphene/hexagonal boron nitride

International Journal of Mechanics and Materials in Design - Hybrid graphene/hexagonal boron-nitride (G/h-BN) has shown significant physical properties and has been fabricated recently. Structural...     

混合溶剂分散法制备耐高温、高导热六方氮化硼/半芳香聚酰胺12T复合材料及其性能

制备兼具优异耐高温性能和导热性能的聚合物基复合材料对于电子元器件的封装保护、高效散热和稳定成型至关重要。本文通过混合溶剂分散法(MSD)制备了六方氮化硼(BN)/半芳香聚酰胺12T (PA12T)复合材料,并对复合材料的微观结构、导热、耐高温、介电和力学性能进行了表征。结果表明:混合溶剂分散法可以有效实现BN和PA12T粉末的均匀悬浮,并可协同真空辅助自组装法与真空热压法构筑具有均一分散和取向结构的复合材料。研究表明,当BN/PA12T复合材料中的BN含量为40wt%时,混合溶剂分散法制备的样品的平面导热率可以达到2.73 W/(m·K),是机械混合法(MM)制备的样品(1.59 W/(m·K))的1.72倍,同时其具有优异的力学性能、低介电常数(3.6)、介电损耗(0.016)和显著的耐高温性能(维卡软化点超过250℃且初始分解温度可达446℃)。综上所述,混合溶剂分散法制备的BN/PA12T复合材料在电子封装及热管理领域中具有广阔的应用前景。      

The effect of copper on the crystallization of hexagonal boron nitride

The crystallization process of hexagonal boron nitride in the presence of copper has been investigated. The positive effect of copper on the crystallinity of boron nitride was observed in the three studied systems of: nitrided boron, nitrided boron–carbon, and previously prepared turbostratic boron nitride. However, the presence of copper hindered the formation of boron carbonitride and produced graphite and boron nitride phases separately. Poor crystallinity was found as a conditio sine qua non for the existence of such a compound. Well-crystallized boron nitride had a very low spacing parameter 0.3328 nm and a regular hexagonal shape.     

氮化硼和氧化锌晶须共掺杂环氧树脂复合材料的导热与绝缘性能

双酚A环氧树脂（EP）因其具有优异电绝缘性能而被广泛应用于电子器件中,但EP的热导率较低,通过填充高导热无机填料而构建导热通路是当前提高聚合物复合材料热导率的有效策略。本文综合利用溶液共混与热压工艺制备得到了六方氮化硼（h-BN）-四针状氧化锌晶须（T-ZnOw）/EP复合材料,并对复合材料的微观形貌与物相结构、导热性能及绝缘性能进行了系统表征与分析。结果表明,复合填充h-BN-T-ZnOw/EP复合材料兼具良好的导热性和绝缘性,当h-BN-T-ZnOw的填充含量为30wt%/5wt%时,25℃下热导率为0.55 W/（m·K）,相比于纯EP提升了2.9倍,同时复合材料体积电阻率大于10¹⁵Ω·m,表现出良好的绝缘性。