石墨表面TiC涂层对高定向石墨/Cu复合材料热导率和抗弯强度的影响

以高温盐浴法对天然鳞片石墨粉体(GF)进行表面TiC镀层处理,然后采用真空热压烧结法制备TiCGF/Cu复合材料,研究了粉体表面涂层和GF体积分数对复合材料微观结构、热导率及抗弯强度的影响。系列测试结果表明:随着GF体积分数的降低以及粉体表面TiC镀层的形成,TiC-GF/Cu复合材料平行于GF片层方向的热导率有所降低,抗弯强度有所提升。其中在GF的体积分数占TiC-GF/Cu复合材料70%时,这种变化最为明显,平行于GF片层方向的TiC-GF/Cu复合材料热导率下降幅度最大,从676W/(m·K)下降到526 W/(m·K)。同时,TiC-GF/Cu复合材料的微观结构进一步说明,GF表面的TiC涂层对GF/Cu复合材料的断裂模型起着重要的作用。     

石墨表面化学镀Cu对天然鳞片石墨/Al复合材料热物理性能的影响

对天然鳞片石墨（GF）进行化学镀Cu的表面处理,对化学镀Cu石墨（Cu-GF）和Al粉采用真空热压的工艺制备出镀Cu石墨/Al（Cu-GF/Al）复合材料。研究了Cu-GF/Al复合材料的微观结构和微观界面,同时也研究了Cu-GF对Cu-GF/Al复合材料热导率和抗弯性能的影响。结果表明,GF上的Cu层能抑制界面脆弱相Al₄C₃的产生,使Cu-GF/Al复合材料的抗弯性能有了显著提升。当Cu-GF体积分数从50%增加到70%时,Cu-GF/Al复合材料的抗弯强度也从104 MPa降低到74 MPa。当GF体积分数为70%时,Cu-GF/Al复合材料的热导率达到最高值为522 W/（m·K）。     

石墨镀Sn调控对石墨/Cu复合材料组织及力学性能的影响

石墨/Cu自润滑复合材料具有良好的摩擦学性能和耐腐蚀性能,在高速铁路领域具有广阔的应用前景.传统石墨/Cu自润滑复合材料中由于石墨与基体不润湿,复合材料界面结合强度低,在材料承受载荷时容易造成石墨相的剥离、脱落,导致复合材料在高载荷服役条件下性能较差.采用化学镀覆工艺在石墨表面镀覆软金属Sn元素调控石墨/Cu复合材料界...     

石墨表面镀Si对石墨/Al复合材料热物理性能的影响

研究了石墨粒径及表面镀Si处理对石墨/Al复合材料热物理性能的影响。结果表明:在盐浴过程中石墨表面形成了SiC层,这不仅增强了石墨-Si/Al复合材料的界面结合力,而且抑制了Al4C3相的产生。随着石墨鳞片体积分数从50%增加到70%,复合材料X-Y方向的热导率从492 W/(m·K)增加到654 W/(m·K),而且体积分数为50%的镀Si石墨/Al复合材料抗弯强度达到了81 MPa,相比未镀覆的提高了53%,是理想的定向导热电子封装材料。随着石墨粒径从500μm减小到150μm,石墨-Si/Al复合材料X-Y面方向的热导率由654 W/(m·K)降低到445 W/(m·K),但Z方向的热导率和复合材料抗弯强度变化不明显。     

高定向石墨/铜复合材料的制备和热物理性能

为了制备出具有优良热物理性能的石墨/铜复合材料,采用流延法将天然鳞片石墨定向排列在铜箔表面,并使用真空热压法制备具有层状结构的高定向石墨/铜复合材料。使用XRD和SEM等表征方法分析样品的微观形貌和成分,结果表明,在高温的作用下,流延所使用的溶剂充分挥发,热压后石墨仍高定向排列在相邻的两层铜箔之间,并相互搭接;部分熔化的铜在压力作用下渗透到石墨层的孔隙处,铜层之间相互贯穿。这种结构使石墨/铜复合材料具有优良的热物理性能。当石墨体积分数为20vol%~70vol%时,石墨/铜复合材料在高导热平面内热导率高达402~743 W/(m·K),抗弯强度达到126~48 MPa。深入讨论了石墨/铜复合材料的热传导机制,并建立了导热预测模型。      

热压烧结镀Cr碳纤维/Cu复合材料的制备及热性能

采用热压法将拥有超高导热率和负热膨胀系数（CTE）的中间相沥青基短碳纤维（CF_s）与Cu复合,并利用化学气相沉积技术对CF_s镀Cr以改善其与Cu的结合状况,研究了所制备的镀Cr CF_s/Cu复合材料的显微结构与热性能。结果表明：在制备中Cr层的大部分与CF_s表层的C反应形成连续、均匀的界面薄层Cr₇C₃,少量的扩散于Cu基体中,使CF_s与Cu之间的界面由结合极差的机械结合转化成良好的冶金结合,有效提升了复合材料的热性能。CF_s含量为40vol%~55vol%时,镀Cr CF_s/Cu复合材料致密度高于97.5%,平面方向上的热导率达393~419 W（mK）^-1,平面方向的CTE在5.1×10^-6~8.4×10^-6 K^-1之间。高的热导率、低的CTE以及优良的可加工性能使其成为极有潜力的电子封装材料。     

Interfacial characterization and thermal conductivity of diamond/Cu composites prepared by two HPHT techniques

With the aim of obtaining materials with high-thermal conductivities (TCs) for heat sink applications, diamond/Cu composites were produced via two different high-pressure-high-temperature (HPHT) techniques: powder metallurgy method (HPHT–PM) and infiltration method (HPHT–IM). The interfacial characteristics of composite materials are compared with respect to the sintering process and their effect on thermal properties is addressed. The HPHT–IM process is clearly more favorable than that of HPHT–PM and the obtained composites exhibited TCs as high as 717 W/mK for the former, but also as low as 200 W/mK for the latter. The advanced thermal property of HPHT–IM composites is attributed to a well-bonded interface layer with gradual and continuous element transition probably due to amorphous carbon detected by Raman spectra. EDS analysis indicate selective interfacial bonding between diamond {100} faces and Cu. Diamond skeleton with connected particles have been observed in this case, also resulting in enhanced interfacial bonding and thermal properties. The HPHT–PM composites with isolated diamond particles feature visible macro interfacial debonding, leading to rather low TC less than that of pure Cu.     

Preparation and thermal properties of layered porous carbon nanotube/epoxy resin composite films

A floating-catalyst spray pyrolysis method was used to synthesize carbon nanotube (CNT) thin films. With the use of ammonium chloride as a pore-former and epoxy resin (EP) as an adhesive, CNT/EP composite films with a porous structure were prepared through the post-heat treatment. These films have excellent thermal insulation (0.029--0.048 W·m⁻¹·K⁻¹) at the thickness direction as well as a good thermal conductivity (40--60 W·m⁻¹·K⁻¹) in the film plane. This study provides a new film material for thermal control systems that demand a good thermal conductivity in the plane but outstanding thermal insulation at the thickness direction.     

The thermal and mechanical properties of graphite foam/epoxy resin composites

A series of epoxy resin (EP) filled graphite foam (GF) composites were prepared to explore a new material with good heat transfer property. The effects of the mass fraction of EP and the network structure of GFs on the thermal diffusivity and the compression strength of the composites were investigated. The thermal diffusivity of the GF/EP composite with EP mass fraction of 91.45% was raised to 6.541 mm²/s, which was 45.7 times higher than the pure EP. The thermal conductivity reached to 14.67 W/(m K), which was 43.1 times higher than the pure EP. The compression strength of the GF/EP increased 55% above the value of pure EP. In addition, the thermal diffusivity of GF/EP increased with the decrease of the mass fraction of EP. A model was formulated to calculate the pressure needed for a mass fraction of EP.     

添加铜网对片层石墨/Al复合材料热物理性能的影响

使用盐浴法对片层石墨（GFs）进行表面镀Si处理,采用真空热压法制备片层石墨/Al复合材料（Si-GFs/Al）。向Si-GFs/Al复合材料中添加10vol%的铜网,研究了铜网对Si-GFs/Al复合材料热导率和力学性能的影响。使用SEM、聚焦离子束（FIB）和TEM对Si-GFs/Al复合材料的微观结构和微观界面进行表征,并分析了复合材料的断裂机制。结果表明,添加铜网使Si-GFs/Al复合材料内部出现了高聚集定向GFs带,形成高导热通道。当GFs体积分数为30vol%~40vol%时,Si-GFs/Al复合材料的热导率提升了约20%,弯曲强度提升了40%以上。当GFs体积分数为40vol%时,Si-GFs/Al复合材料热导率和弯曲强度同时达到一个优值,分别为512 W/（mK）和127 MPa。      

Preparation of carbon nanotube/epoxy composite films with high tensile strength and electrical conductivity by impregnation under pressure

Based on the production of a carbon nanotube (CNT) assembly, a new technique is developed for preparing CNT/epoxy (EP) composite films with high tensile strength and electrical conductivity. CNTs are synthesized by floating catalyst spray pyrolysis. After self-assembling into a hollow cylindrical assembly, CNTs are drawn and wound on a rotating drum to form a uniform CNT film. EP resin solutions of different concentrations are used to fill into the pores within the film under different pressures and form composite films after hot-press curing. The permeability of the EP resin and thus the interfacial bonding between the CNT and the EP resin are studied by varying the concentration of the EP resin solution and the pressure used for impregnation. Under optimal preparation conditions, the composite film contains CNTs of a high content of 59 wt.%, and shows a high tensile strength of 1.4 GPa and a high electrical conductivity of 1.4x10^5 S·m^-1, 159% and 309% higher than those of the neat CNT film, respectively.     

热循环对片层石墨/铝复合材料的强度和热导率的影响

采用粉末冶金法制备片层石墨增强Al基复合材料(50vol％Gf/6061Al),Gf与Al基体结合紧密,界面处无裂纹、孔洞等缺陷.复合材料在-50～120℃温度范围内分别循环10次、50次、100次和200次,研究不同的循环次数对材料组织和性能的影响.结果 表明,循环不同次数时材料的密度没有明显的变化,但随着循环次数的...     

Cu/Ti3SiC2 composite: a new electrofriction material

 Cu/Ti₃SiC₂ composite, a new electrofriction material, was prepared, for the first time, by PM method. The microstructure, mechanical and electrical properties of the Cu/Ti₃SiC₂ composites were investigated and were compared with those of Cu/graphite composites. The results demonstrated that Cu/Ti₃SiC₂ composites had superior mechanical properties over Cu/graphite composites. At filer content of less than 20 vol%, the electrical conductivity for Cu/Ti₃SiC₂ composites was higher than that for Cu/graphite composites; at high filer content, the electrical conductivity for Cu/Ti₃SiC₂ composites was lower than that for Cu/graphite composites because of the presence of residual pores. It was found that like Cu/graphite composite, Cu/Ti₃SiC₂ was a self-lubricated material. The compressive yield strength, Brinell hardness, relative ratio of compressive for Cu-30 vol% Ti₃SiC₂ composites are 307 MPa, 140, 15.7% respectively. Received: 29 December 1998/Accepted: 15 February 1999     

GNP-Ni/Cu复合材料的界面调控和强化机理

采用粉末冶金法,通过“湿法混合”、放电等离子烧结和热挤压相结合的三步工艺分别制备了石墨烯纳米片(GNP)增强铜基复合材料(GNP-Cu)和GNP-Ni增强铜基复合材料(GNP-Ni/Cu)。通过物相组成和显微组织表征,并结合致密度、电导率和力学性能测试,结果表明：GNP和Ni的含量(质量分数)分别为0.2%和1.5%的GNP-Ni/Cu复合材料,其显微硬度和屈服强度比纯Cu分别提高了38%和50%、比0.2GNP/Cu复合材料分别提高了14.0%和11.6%。这些结果表明,Ni的添加改善了GNP与Cu的界面结合,使GNP-Ni/Cu复合材料的力学性能显著提高。GNP的载荷传递强化和热失配强化以及Ni的固溶强化,是材料力学性能提高的主要原因。     

Highly thermal-conductive graphite flake/Cu composites prepared by sintering intermittently electroplated core-shell powders

Graphite flake/Cu composite has attracted tremendous attention as a promising heat sinks materials owing to its easy machinability and superior thermal properties. However, its preparation process still faces several technological limitations including complex, time-consuming and costly synthetic approaches. In this work, a facile and scalable intermittently electroplated method is applied to prepare Cu-coated graphite flake composite powders, which are subsequently sintered into dense composite bulks. The results show that the graphite flake is successfully coated with a uniform and compact Cu shell,which effectively inhibits the segregation accumulation of graphite flakes and contributes to homogeneous distribution of graphite in the sintered graphite flake/Cu composites. The as-sintered composites exhibit an excellent thermal conductivity of 710 W·m-1·K-1and an outstanding bending strength of 93 MPa. Such performance, together with the simple, efficient powder-preparation process, suggests that the present strategy may open up opportunities for the development of thermal management materials.     

Conductive polypyrrole incorporated nanocellulose/MoS2 film for preparing flexible supercapacitor electrodes

Conductive films have emerged as appealing electrode materials in flexible supercapacitors owing to their conductivity and mechanical flexibility. However, the unsatisfactory electrode structure induced poor output performance and undesirable cycling stability limited their application. Herein, a well-designed film was manufactured by the vacuum filtration and in-situ polymerization method from cellulose nanofibrils (CNFs), molybdenum disulfide (MoS₂), and polypyrrole. The electrode presented an outstanding mechanical strength (21.3 MPa) and electrical conductivity (9.70 S·cm⁻¹). Meanwhile, the introduce of hydrophilic CNFs induced a desirable increase in diffusion path of electrons and ions, along with the synergistic effect among the three components, further endowed the electrode with excellent specific capacitance (0.734 F·cm⁻²) and good cycling stability (84.50% after 2000 charge/discharge cycles). More importantly, the flexible all-solid-state symmetric supercapacitor delivered a high specific capacitance (1.39 F·cm⁻² at 1 mA·cm⁻²) and a volumetric energy density (6.36 mW·h·cm⁻³ at the power density of 16.35 mW·cm⁻³). This work provided a method for preparing composite films with desired mechanical and electrochemical performance, which can broaden the high-value applications of nanocellulose.     

原位在线监测多因素协同对玻璃纤维/环氧树脂复合材料热老化性能的影响

针对玻璃纤维增强聚合物(GFRP)复合材料作为火电烟囱内衬的服役老化问题,以玻璃纤维/环氧树脂(GF/EP)复合材料为研究对象,用正交试验法研究温度、偶联剂含量和热流老化时间等因素对GF/EP复合材料热损伤后的质量损失率、弯曲强度和剪切性能的影响。采用金相显微图像处理法测量计算GF/EP复合材料的孔隙率,使用自主设计并搭建的原位在线监测系统对GF/EP复合材料进行测试。结果表明,不同因素对GF/EP复合材料性能的影响程度不同。偶联剂含量的增加会有限改善GF/EP复合材料的质量损失率,而温度因素对复合材料弯曲强度的影响较大,复合材料本身存在的后固化行为会影响弯曲性能的变化趋势,随温度升高弯曲强度总体下降了11.8%。GF/EP复合材料的层间剪切强度与热老化时间密切相关,16 h相比8 h热流老化后的层间剪切强度均值提高了10.2%。      

Interfacial design of Cu/SiC composites prepared by powder metallurgy for heat sink applications

In order to dissipate the heat generated in electronic packages, suitable materials must be developed as heat spreaders or heat sinks. Metal matrix composites (MMCs) offer the possibility to tailor the properties of a metal (Cu) by adding an appropriate reinforcement phase (SiC) to meet the demands for high thermal conductivities in thermal management applications. Copper/SiC composites have been produced by powder metallurgy. Silicon carbide is not stable in copper at the temperature needed for the fabrication of Cu/SiC. The major challenge in development of Cu/SiC is the suppression of this reaction between copper and SiC. Improvements in bonding strength and thermo-physical properties of the composites have been achieved by a vapour deposited molybdenum coating on SiC powders to control the detrimental interfacial reactions.     

新型自润滑YBa_2Cu_3O_7/Cu复合材料的制备及性能

采用草酸盐共沉淀法制备了YBa2Cu3O7(YBCO)粉体,利用真空热压烧结法制备了不同质量分数的YBCO/Cu复合材料,测定了YBCO/Cu复合材料的密度、硬度和电导率,利用MMU-5GA磨损试验机对YBCO/Cu复合材料进行了摩擦磨损试验。采用XRD、SEM和TEM对YBCO粉体及YBCO/Cu复合材料的微观结构、磨损表面形貌及物相组成进行了表征。研究了YBCO质量分数对YBCO/Cu复合材料组织及性能的影响。结果表明:所制备的YBCO粉体物相为Y123相,其层状结构明显,粉体纯度高、杂质少,粒度达到纳米级;纳米YBCO可显著细化YBCO/Cu复合材料的基体组织,提高复合材料的摩擦学性能。随着YBCO质量分数增加,基体组织中纳米YBCO颗粒分布均匀度降低,逐渐出现团聚;YBCO/Cu复合材料的电导率和密度降低,硬度先升高后降低,摩擦系数逐渐减小。3%YBCO/Cu复合材料的摩擦磨损性能最好。YBCO/Cu复合材料强化机制为Orowan强化、热错配强化和细晶强化;其磨损机制主要为塑变磨损、磨粒磨损和疲劳剥落。     

微型超级电容器PPy/GO-RuO2复合膜电极的制备与电化学性能

为了解决氧化钌(RuO₂)沉积电位过高, 难以在三维微结构金属集流体上直接沉积的问题, 提出采用分步电沉积方法在微三维结构镍(Ni)集流体上制备RuO₂复合膜电极, 即先在三维微结构Ni集流体上沉积聚吡咯/氧化石墨烯(PPy/GO)薄膜作为基底, 经热处理后, 在基底上二次沉积出RuO₂颗粒, 最后再对RuO₂复合薄膜进行二次热处理。扫描电子显微镜(SEM)观察显示, 随着热处理温度的升高, 薄膜表面多孔结构增多, 达到了提高膜电极结构孔隙分布的目的。能量分散谱(EDS)和X射线光电子能谱分析(XPS)表明, 薄膜中无定形RuO₂·xH₂O的存在保证了膜电极的大比容量。电化学性能测试结果表明, 经105℃处理后的膜电极电化学性能最佳, 比电容为28.5 mF/cm², 能量密度为0.04 Wh/m², 功率密度为14.25 W/m²。采用分步电沉积方法制备出的RuO₂复合薄膜是一种良好的MEMS超级电容器电极材料。