PAN基纤维热处理过程中的时间效应

以聚丙烯腈(PAN)纤维为研究对象,采用固体13C核磁共振(Solid-NMR)、X射线衍射(XRD)及拉曼散射光谱(Ra-man)等测试手段对不同热处理时间制得的纤维样品以及最终PAN基炭纤维的结构进行了分析与研究,并建立起热处理过程中形成的特征结构与炭纤维结构的相关性。研究结果表明,纤维特征结构的生成会随着热处理时间的延长而增加,且此类特征结构会对PAN基炭纤维石墨片层结构的生成和发展起到影响作用,使得石墨片层结构当中sp2杂化碳的含量增加以及石墨微晶的尺寸增大。     

热处理温度对聚酰亚胺基炭纤维结构性能影响

以聚酰亚胺(PI)纤维为前驱体,经800~2800℃连续高温处理,制备出不同性能的聚酰亚胺基炭(石墨)纤维。采用元素分析、SEM、HR-TEM、Raman、纤维强力仪、电阻率仪等分析手段研究热处理温度对炭纤维(CF)元素含量、结构形貌、力学性能、传导性能等方面的影响。结果表明,随着热处理温度的升高,聚酰亚胺基炭纤维中碳含量从78.97%(800℃)提高到99.72%(2 800℃),非碳原子含量降低;聚酰亚胺基炭纤维表面缺陷数目增加且尺寸增大。同时,纤维的微观结构也从二维乱层石墨结构向有序的三维层状结构发展,表现为石墨化程度的提高及石墨微晶尺寸的增大;炭纤维拉伸强度先增加后降低,最大拉伸强度924.4 MPa,断裂伸长率降低,电阻率减小,热导率增加,2 800℃石墨化处理后纤维热导率为228.4 W·m-1·K-1,是800℃处理后的50.4倍。     

预氧丝皮芯结构对碳纤维性能的影响

在使用PAN.F(聚丙烯腈原丝)为前躯体制备PAN.CF(聚丙烯腈基碳纤维)的过程中,经过预氧化反应生成的PAN.OF(聚丙烯腈基氧化纤维,俗称预氧丝)是其非常重要的中间过程,PAN.OF的皮芯结构直接影响着PAN.CF的力学性能。借助超薄切片机、电子显微镜、扫描电镜和材料试验机等表征测试手段,系统研究了PAN.OF的皮芯结构对PAN.CF力学性能的影响。研究认为:通过原丝的细旦化和预氧化过程条件的优化可以有效控制或消除PAN.OF的皮芯结构,得到抗拉强度5600MPa以上,弹性模量290GPa以上的碳纤维。     

用STM研究渗硼改性碳纤维结构与力学性能的相关性

研究了PAN基碳纤维浸渍不同硼化物溶液进行高温热处理后(2500℃)对力学性能的影响。采用扫描隧道显微镜观察了渗硼处理对碳纤维表面微观形态结构的影响,同时还采用X-ray衍射技术分析了渗硼处理对纤维结构参数的影响。结果表明渗硼处理可提高CF的力学性能,采用硼化物A浸渍热处理后CF的模量和强度分别提高了10.3 %和15.3 %。通过STM观察可以很清楚看到渗硼处理可提高CF的择优取向和晶体尺寸,减少表面缺陷。X-ray衍射分析结果与STM一致,渗硼热处理提高了CF的晶体尺寸。      

PAN纤维微观结构与其性能相关性的研究

利用碘吸附法、扫描电子显微镜(SEM)、透射电子显微镜(TEM)和小角x射线(SAXS)等测试方法对国内外企业生产的几种聚丙烯腈(PAN)基碳纤维原丝的形貌结构、组织结构和孔分布等微观结构进行了系统的测试与研究。结果表明,各种PAN纤维的表面均有沟槽、裂纹等缺陷;内部都存在着尺寸分布不均的孔结构,包括大孔和微孔。对各种纤维原丝碘吸附的数值进行对比分析发现,日本三菱和东丽公司生产的PAN纤维碘吸附数值小,纤维的致密性较高。对各种PAN纤维的SAXS测试结果分析发现,PAN纤维内都存在尺寸分布一定且具有一定取向性的微孔结构。这些微观结构对PAN纤维的性能有着不同的影响作用,并决定着由其生产的PAN基碳纤维的结构与性能。     

高温处理对中间相沥青基炭纤维结构与热导率的影响（英文）

采用扫描电子显微镜(SEM)、透射电子显微镜(TEM)、拉曼光谱仪(Raman)及X射线衍射仪(XRD)考察了中间相沥青基炭纤维在不同热处理温度下的结构及形貌变化,并采用3ω法对经不同温度处理后的纤维热导率进行了表征。结果表明,中间相沥青基炭纤维的石墨化度与热导率随着热处理温度的升高而增大,经3000℃处理后纤维的热导率最高可达518W/m·K。此外,还探讨了中间相沥青基炭纤维结构、热导率及热处理温度之间的相互关系,发现中间相沥青炭纤维的石墨化过程存在3个阶段,在不同温度区间内分别对应石墨微晶的生长和取向。     

预氧化时间对聚丙烯腈基碳纤维预氧丝结构与性能的影响

预氧化是制备碳纤维非常重要的一个环节,制得预氧化丝的性能直接决定最终碳纤维的性能,因此研究预氧化过程对预氧化丝结构性能的影响规律具有重要意义。通过广角X射线衍射点光源取向测试和小角X射线散射实验,计算得到了聚丙烯腈(PAN)基碳纤维原丝与不同处理时间下预氧丝取向度、线结晶度、长周期L、晶区厚度L_c、无定形区厚度L_a等微观结构参数。采用元素分析仪和单纤维强力仪研究了该系列PAN基碳纤维原丝、预氧丝的元素组成和力学性能随预氧化时间的变化,明确了PAN基碳纤维预氧丝内部微观结构参数、元素含量与其力学性能的关系。     

BN/EG纳米流体热导率影响因素的实验研究

以不同尺寸的BN纳米粒子及自制的BNNTs为添加物,通过两步法制备了不同体积分数的BN(140nm)/EG、BN(70nm)/EG及BNNTs/EG纳米流体,利用瞬态热线装置测试了其热导率,研究了添加物体积分数、长径比、尺寸、聚集形态、流体温度及分散剂等因素对纳米流体热导率的影响规律。结果表明,纳米流体热导率随纳米粒子体积分数、纳米粒子尺寸、纳米粒子长径比、流体温度的增加而增加,纳米粒子松散的链状聚集比紧密的云状聚集更有利于提高基液热导率,分散剂的加入不同程度降低了纳米流体热导率增加量,但降低幅度不大。     

导热型碳纤维增强聚合物基复合材料的研究进展

综述了导热型连续碳纤维增强聚合物基复合材料(CFRP)的研究与应用现状和进展,阐述了CFRP的声子导热和光子导热机理,介绍了不同铺层角度和铺层比的CFRP面内和厚度方向热导率计算模型及测试方法,分析了环氧树脂、氰酸酯、双马来酰亚胺等3类树脂体系和聚丙烯腈基(PAN)碳纤维、中间相沥青基碳纤维、气相生长碳纤维、碳纳米管纤维等4类增强体以及工艺方法等因素对CFRP热导率的影响。     

PAN基碳纤维微观结构与其性能相关性研究

借助扫描电子显微镜(SEM)、透射电子显微镜(TEM)和小角x射线衍射(SAXS)等微观结构表征手段,对国内不同厂家生产的3种聚丙烯腈(PAN)基碳纤维内部存在的大孔和微孔等微观结构进行了系统测试、分析。研究结果发现,3种PAN基碳纤维内部都存在着大孔和微孔结构,且这些孔隙结构对碳纤维的机械性能有很大影响,若碳纤维的大尺寸孔洞少,而微孔分布均匀、沿纤维轴取向度高,则碳纤维的综合性能较高。     

碳纤维表面特性对兼性及厌氧微生物固着的影响

聚丙烯腈(PAN)基碳纤维表面含氧官能团的种类和数量对固着在碳纤维表面的兼性反硝化菌平均生物膜的厚度有显著的作用,含氧官能团的数量过多或过少都影响碳纤维表面反硝化菌的固着通过对碳纤维的处理获得适量的表面含氧官能团和平衡含水率,可有效地改善碳纤维表面兼性反硝化菌的固着化行为,有助于使碳纤维表面的反硝化生物膜附着量达到最大值.处于同一水平平衡含水率的碳纤维比有机高分子载体对厌氧甲烷菌的固着能力强;同时,随着表面N、O元素含量的增加,平衡含水率增高,碳纤维载体对厌氧甲烷菌的固着能力减弱.高温空气氧化的PAN基高强度碳纤维是一种生物相容性好、固着化程度高、再生能力强、耐微生物分解和化学腐蚀的优异反硝化菌新型固着化载体,而未经表面处理的PAN基高强度碳纤维则是厌氧甲烷菌优异的固着化载体.     

Resistive heating of multidirectional and unidirectional dry carbon fibre preforms

The electrical conductivity (EC) of continuous carbon fibre (CF) layers is highly anisotropic and is expressed by a second order tensor. In the present work, using continuity equation for anisotropic media, the electrical conductivity of a dry CF multilayer preform can be predicted. Hence, the electrical conductivity tensor of the CF preform can be calculated for any stacking sequence. By means of the calculated electrical conductivity tensor of the multilayer preform, the elliptical form of the governing equation can be solved numerically. Based on this, the generated heat (Joule effect) can be determined. Introducing the generated heat into the heat transfer equation, the temperature field over the CF preform can be predicted. For the experimental verification, a thermal camera was used to record the temperature field developed on a CF multilayer preform under given electric potential field. The experimental results were compared to the respective numerical calculations of the temperature field, where the electrical conductivity tensor was calculated analytically based on the proposed methodology. In all the tested cases the calculated electrical conductivity tensor leads to a numerical model which is in excellent agreement with the experimental results.     

Thermal Conductivity of Cobalt-Based Catalyst for Fischer–Tropsch Synthesis

In this study, the thermal conductivity of cobalt-based catalyst specimens in the temperature range from 160 ^◦C to 255 ^◦C are measured via a steady-state apparatus. The apparatus and procedures are applied to several specimens of cobalt-based catalyst powder compacts. Specimens with different degrees of porosity are produced by pressing cobalt-based catalyst powder with a particle size of (80 to 360) mesh. The thermal conductivity of cobalt-based catalyst powder compacts is investigated as functions of temperature, specimen density, porosity, and powder size. The results indicate that the thermal conductivity of the catalyst specimens increases linearly with temperature and density and is practically independent of the particle size of the powder in an atmosphere of air, while the porosity dependence of the thermal conductivity is inverse to that of density. In addition, the effects of some measuring factors on the thermal conductivity show that the reliability of the thermal conductivity measurements of cobalt-based catalyst specimens are influenced easily by parallelism, specimen roughness, and moisture content, whereas the specimen thickness and water bath temperature have only a slight effect on the reliability.     

Thermal Conductivity of AlN and SiC Thin Films

The thermal conductivity of AlN and SiC thin films sputtered on silicon substrates is measured employing the 3ω method. The thickness of the AlN sample is varied in the range from 200 to 2000 nm to analyze the size effect. The SiC thin films are prepared at two different temperatures, 20 and 500°C, and the effect of deposition temperature on thermal conductivity is examined. The results reveal that the thermal conductivity of the thin films is significantly smaller than that of the same material in bulk form. The thermal conductivity of the AlN thin film is strongly dependent on the film thickness. For the case of SiC thin films, however, increased deposition temperature results in negligible change in the thermal conductivity as the temperature is below the critical temperature for crystallization. To explain the thermal conduction in the thin films, the thermal conductivity and microstructure are compared using x-ray diffraction patterns.     

Thermal Characterization of SiC Amorphous Thin Films

The cross-plane thermal conductivity of SiC amorphous films was measured employing the transient thermoreflectance technique. The SiC films were deposited on silicon substrates by RF magnetron sputtering at room temperature. The thickness of the films was varied in the range from 100?nm to 2500?nm to analyze the size effect. The results found that the thermal conductivity of the SiC thin films is significantly smaller than that of the SiC material in bulk form. The small thermal conductivity stems from the structural disorder of the films, which was confirmed by high-resolution transmission electron microscopy and X-ray diffraction. In addition, the contribution of the thermal boundary resistance to the thermal conductivity of the films is discussed.     

Computational analysis of the thermal conductivity of the carbon–carbon composite materials

Experimental data for carbon–carbon constituent materials are combined with a three-dimensional stationary heat-transfer finite element analysis to compute the average transverse and longitudinal thermal conductivities in carbon–carbon composites. Particular attention is given in elucidating the roles of various micro-structural defects such as de-bonded fiber/matrix interfaces, cracks and voids on thermal conductivity in these materials. In addition, the effect of the fiber precursor material is explored by analyzing PAN-based and pitch-based carbon fibers, both in the same type pitch-based carbon matrix. The finite element analysis is carried out at two distinct length scales: (a) a micro scale comparable with the diameter of carbon fibers and (b) a macro scale comparable with the thickness of carbon–carbon composite structures used in the thermal protection systems for space vehicles. The results obtain at room temperature are quite consistent with their experimental counterparts. At high temperatures, the model predicts that the contributions of gas-phase conduction and radiation within the micro-structural defects can significantly increase the transverse thermal conductivity of the carbon–carbon composites.     

Thermal characterization of gallium arsenic nitride epilayer on gallium arsenide substrate using pulsed photothermal reflectance technique

Thermal conductivity of gallium arsenic nitride (GaAsN) epilayer on gallium arsenide (GaAs) substrate prepared by molecular beam epitaxy technique was measured using pulsed photothermal reflectance technique. Three-layer model incorporated thermal boundary resistance was applied to extract the thermal properties from the sample's photothermal response. Within the thickness ranging from 20 to 80 nm, no thickness dependent relationship with thermal conductivity of GaAsN epilayer was found, and the average thermal conductivity is approximately 27 W/mK at room temperature. The thermal boundary resistance at the Au/GaAsN interface is in the order of 10⁻⁸ m²K/W.     

Influence of the Kapitza resistance on the thermal conductivity of filled epoxies

The thermal conductivity of epoxy resins filled with copper powder was measured as a function of grain size and filler concentration between 1.5 and 20 K. In addition, the thermal boundary layer resistance (Kapitza resistance) between epoxy resin and copper was measured. As a consequence of this resistance the thermal conductivity is strongly dependent on grain size in the lower temperature range. Below a characteristic temperature dependent on grain size, thermal conductivity is reduced by adding filler. A simple formula is presented for calculation of the thermal conductivity of filled resins.     

Numerical evaluation on heat transport characteristics between Al2O3 and ZnO materials in nanoscale situation

The aim of this article is to provide a systematic method to perform numerical evaluation on the cross-plane thermal conductivity of Al(2)O(3)/ZnO film interface. The Equilibrium Molecular Dynamics (EMD) simulations method is used to investigate the cross-plane thermal conductivity of Al(2)O(3)/ZnO film interface along the direction of Z axis at different equilibrium temperature and film interface thickness. The Buckingham two-body potential function and Green-Kubo linear response theory are used for modeling and calculation. The results show that the size effect is obvious. It implies the film interface thickness is 23.4-52 ? and the equilibrium temperature is 300-600 K. The cross section thermal conductivity of Al(2)O(3)/ZnO film interface increases with the increase of interface thickness, and decreases with the increase in equilibrium temperature.     

PAN-based carbon fibers/PMMA composites: thermal, dielectric, and DC electrical properties

The study deals with thermal, dielectric, and DC electrical properties of polyacrylonitrile (PAN)-based carbon fibers/poly(methyl methacrylate) composites. The polymer composites contain 0, 5, 10, 20 and 30 wt.% PAN-based carbon fibers. The thermal conductivity was studied as a function of filler content and temperature. It was found that the thermal conductivity is enhanced by addition of carbon fibers concentration and temperature. The dielectric properties were determined using impedance measurements. The results showed that the dielectric constant and dielectric loss are decreased with frequency, and increased with both temperature and fibers content. The DC electrical conductivity, temperature coefficient of resistance, and activation energy were studied as a function of fibers concentration in the temperature ranges 30–110?°C. It was found that the composites exhibit negative temperature coefficient of resistivity and enhancement of electrical conductivity with increasing temperature and carbon fibers concentration. The observed increase in the DC conductivity was explained according to the approach of conductive paths and connections between the carbon fibers.