全Cu_(3)Sn焊点在高温时效下的组织及力学性能EI北大核心CSCD

对全Cu_(3)Sn焊点进行620℃下不同持续时间的时效处理,研究时效过程中接头微观组织演变,并利用纳米压痕实验及剪切实验表征时效后焊点的力学性能变化。结果表明:在时效过程中,Cu/Cu_(3)Sn界面以平面状析出Cu_(20)Sn_(6)并持续生长,直至Cu_(3)Sn被完全消耗。随后Cu_(20)Sn_(6)向Cu_(20)Sn_(6)和Cu_(13.7)Sn组成的两相层转变,Cu_(13.7)Sn通过消耗两相层在Cu/两相层的界面处以波浪状析出并继续生长,直至占据整个界面区,该过程中伴随着焊缝中间位置孔洞数量和尺寸的生长,最终聚合成微裂纹。Cu_(20)Sn_(6),Cu_(3)Sn,Cu_(13.7)Sn相的硬度分别为9.62,7.15,4.67 GPa,弹性模量分别为146.5,134.0,133.2 GPa。随时效时间的增加,焊点的抗剪强度呈先增大后减小的趋势,在120 min内保持大于20.1 MPa;其断口形貌和断裂路径也随之发生变化。     

凝固过程中枝晶组织形貌演变模拟进展

详细地介绍了近年来在凝固组织模拟上取得的进展,并介绍了在组织模拟中所选用的各种模拟方法,逐个分析了各种方法的优势与不足,进而提出凝固组织的发展方向,即朝着大规模、多尺度方向发展,使得组织模拟能够逐步与实际结合起来.     

Mg-7Zn-0.2Ti-xCu镁合金非枝晶组织的演变过程及机理

采用等温热处理法制备了Mg-7Zn-0.2Ti-xCu(x=0、0.5、1.0、1.5,质量分数/%)合金的半固态坯料,探讨了Cu元素及其含量对Mg-7Zn-0.2Ti-xCu合金铸态和半固态组织的影响,同时,研究了等温温度和保温时间对Mg-7Zn-0.2Ti-1Cu合金半固态组织演变的影响并分析了非枝晶组织的形成机理。结果表明：在半固态组织演变过程中,随着等温温度的升高和保温时间的延长,固相颗粒的尺寸和形状因子先减小后增大。铸态组织和溶质原子的扩散行为是影响等温热处理过程中非枝晶组织形貌及其演变的主要因素。当Cu含量为1.0%(质量分数)时,合金铸态组织细小,Cu对非枝晶组织的优化效果最佳。Mg-7Zn-0.2Ti-1Cu合金在600℃下保温30 min时获得的非枝晶组织较为理想,其固相颗粒的平均尺寸、形状因子和固相率分别为43.12μm、1.46和59.77%,满足半固态成形的要求。     

酒石酸还原Cu(Ⅱ)制备多种形貌Cu_2O晶体及形成机理

以CuSO_4·5H_2O为原料,KOH为添加剂,酒石酸为还原剂,在水热条件下通过调整相关的实验参数,制备了一系列不同形态的Cu_2O微-纳米晶体及三维十字形枝晶。采用XRD、SEM等手段对不同形态的Cu_2O晶体进行了表征,探讨了不同因素变化对Cu_2O晶体形态的影响。分析认为,晶体生长过程控制了晶体的具体形貌和大小,Cu_2O晶体显露的单形晶面随晶体生长条件的变化而不同。在低温、弱碱性、高浓度溶液中有利于形成八面体形态的Cu_2O晶体,而菱形十二面体单形晶面在高温、强碱性、低浓度溶液中形成的晶体中显露的面积有所增大。     

强磁场下Cu-50%Ag合金定向凝固过程中的组织及固液界面形貌演变

目的 研究强磁场下Cu-50%(质量分数)Ag合金定向凝固过程中的组织演变、固液界面形貌变化及溶质迁移行为,分析强磁场对金属凝固过程的作用机制,为强磁场下的金属材料制备提供理论借鉴和指导。方法 在不同的凝固速率与磁场条件下进行定向凝固和淬火实验,对合金的定向凝固组织、糊状区与固液界面形貌以及溶质分布行为进行考察。结果 强磁场破坏了凝固组织的定向生长,使凝固组织转变为枝晶与等轴晶共存的形貌;强磁场诱发了熔体对流,减少了糊状区中溶质的含量;强磁场改变了固液界面处的溶质分布和固液界面形貌,破坏了固液界面的稳定性。结论 强磁场通过洛伦兹力和热电磁力的共同作用,诱发了糊状区内液相的纵向环流,改变了固液界面及糊状区中的组织形貌与元素分布。     

自组装Cu6 Sn5超疏水冶金结合界面的构筑及其在铜缓蚀中的应用

采用热诱导Cu/Sn界面冶金反应以及简单化学浸泡处理工艺,在纯Cu基体上成功构筑高强度超疏水扇贝状Cu6 Sn5阵列微纳结构.利用场发射扫描电镜、X射线光电子能谱仪等设备对试样的微观结构、化学成分及耐腐蚀特性进行表征.结果表明:微米级扇贝状Cu6 Sn5与Cu之间的平均抗剪强度高于40 MPa.经过豆蔻酸和Cu2+改性后,Cu6 Sn5表面会生长出微纳结构,其化学成分为豆蔻酸铜;水滴在改性试样表面的润湿角大于150°,滚动角为7.2°;与纯Cu相比,经过豆蔻酸铜改性的试样在3.5％NaCl(质量分数)溶液中的自腐蚀电流密度约为改性前试样的1/10,表现出了较好的耐腐蚀特性.基于金属间化合物与基体之间的冶金结合机制,提出热诱导界面反应法,实现金属基体的铠甲化策略,成功解决人工超疏水界面机械稳定性较差的问题.     

添加稀土元素Nd对Mg-6Zn-3Cu镁合金微观组织和力学性能的影响

通过采用合金制备、组织分析、力学性能测试等手段研究了Nd的加入对Mg-6Zn-3Cu合金微观组织和力学性能的影响.结果表明,Nd的加入改变了组织和相的分布;随着Nd加入量的增加,合金抗拉强度、屈服强度及延伸率先提高,达到最大值后开始下降.     

高碳钢中珠光体在温楔横轧过程中的组织演变

采用温楔横轧方法制备出表层具有超微细复相组织的高碳珠光体钢棒件,研究了珠光体组织在温变形过程中的演变.结果表明,珠光体组织中的渗碳体片层主要以弯曲扭折的形式协调塑性变形,表现出较强的塑性变形能力;剧烈塑性变形促进了渗碳体片层的球化,表层球化完全的渗碳体颗粒粒径均小于0.2μm;温楔横轧后铁素体基体发生了动态连续再结晶,等轴铁素体平均晶粒尺寸为0.3～0.4 μm,0.5R处和心部的渗碳体球化不完全,铁素体再结晶也不完全;铁素体晶粒的超细化和渗碳体片层的球化明显改善高碳珠光体钢棒件的塑性,温变形过程中应变、应变速率及温度分布的不均匀是引起组织性能差异的根本原因.     

固溶温度对VAR制备传感器用Ti-6Ni-3Mo-1Sn合金组织和力学性能的影响

对真空自耗电极电弧熔炼制备的传感器用Ti-6Ni-3Mo-1Sn合金进行热处理,先经过不同温度的固溶处理在经过500℃时效处理4 h,通过实验测试手段研究固溶温度对固溶态和时效态合金组织和力学性能的影响。研究结果表明:固溶温度700℃时,在固溶态合金晶粒中产生了大量初生α相。随着固溶温度增加,形成了更大的β晶粒。以更高温度处理后固溶态合金获得更大拉伸强度以及屈服强度,而伸长率表现为先升高再减小。经过时效处理的时效态合金晶粒中产生了许多弥散态的细小α相。以700℃固溶处理后,形成了初生α相,在残余β相内产生更多β稳定元素。随着固溶温度增加,时效态Ti-6Ni-3Mo-1Sn合金的拉伸强度,屈服强度及伸长率均表现出先增加后减小,最大值发生在固溶温度700℃时,分别为1268,1192 MPa, 5.62%。在低于700℃固溶时效处理后的试样断口区域形成许多尺寸差异较大微孔,呈现脆性断裂特点。     

真空烧结时间对铝镍钴永磁材料Cu/Sn涂层组织及磁性能的影响

为了提高铝镍钴永磁材料表面磁控溅射Cu/Sn涂层的质量,对其进行真空烧结处理,以实现增强结合力并保持较高磁性的目的 .采用扫描电镜、万能拉伸机、NIM-2000分析系统考察了真空烧结时间对Cu/Sn涂层的组织、结合力及磁性能的影响.结果 表明:真空烧结时间选择1h的涂层表面质量较优.延长真空烧结时间后,会产生竖状坑结构...     

微电子表面组装焊点二维形态预测研究

微电子表面组装（Ｓｕｒｆａｃｅ Ｍｏｕｎｔ Ｔｅｃｈｎｏｌｏｇｙ，简称ＳＴＭ）焊点形态的预测和控制研究对提高ＳＭＴ工艺设计水平和决策效率，保证焊和组件的可靠性有重要意义，本文基于焊二维形态预测的Ｈｅｉｎｒｉｃｈ模型，考虑元件与基板的高度间隙对焊点形态的影响，建立了进一步完善的ＳＭＴ片式元件焊点形态预测模型，考察了熔融钎料性质、疸对焊点形态的影响。结果表明，焊点钎料量对焊点上下、处圆角形态有不同程度     

Sn基钎料/Cu焊点Kirkendall空洞抑制研究

无铅钎料Sn-3.5Ag/Cu焊点用于微电子封装电子器件的互连,随着电镀铜的使用,电镀铜中引入杂质,以及焊点尺寸减小,封装密度增大,产生的Kirkendall空洞会使焊点在服役过程中严重影响接头的可靠性.文章分析了Kirkendall空洞形成机制,研究了抑制Kirkendall空洞的措施.     

Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect

The intermetallic compound (IMC) growth kinetics in pure Sn/Cu and Sn10 wt%Bi/Cu solder joints was studied, respectively, after they were aged at 160-210°C for different time. It was found that the total IMC in Sn10 wt%Bi/Cu joint developed faster than it did in pure Sn/Cu solder joint, when they were aged at the same temperature. And the activation energy Qa for total IMC in Sn10 wt%Bi/Cu joint was lower than that for pure Sn/Cu interconnect. The IMC growth process was discussed. The IMC Cu6Sn5 was enhanced in compensation of reduced IMC Cu3Sn growth. The work reveals that Bi element containing in lead free solder alloys with 10 wt% can enhance IMC growth in lead free solder/Cu joint during service.     

Growth mechanism and kinetics of Cu3Sn in the interfacial reaction between liquid Sn and diversely oriented Cu substrates

Journal of Materials Science: Materials in Electronics - In this study, the effects of reflow temperature, reflow time, and substrates (polycrystalline and (001/110/111) monocrystalline Cu...     

Phase Analysis in the Solder Joint of Sn-Cu Solder/IMCs/Cu Substrate

A joint assembly of solder/IMCs/copper was prepared and experienced a thermal aging test for 50, 100, 400, and 600 hours at 150°C. The morphology at the interface of the assembly was investigated with an optical microscope (OM) to measure the thickness of the intermetallic layer, and with secondary electron images (SEI) to evaluate the interfacial microstructure. X-ray color mappings using an electron probe microanalyzer (EPMA) of copper and tin were also applied to study the concentration variations near the interfaces in the joint assembly. According to the intensities of Cu and Sn, collected by color mapping, software was employed to construct series of statistical graphs, and the detailed concentration profiles at the interfaces of the assembly were investigated from these graphs. Two important results were derived. The first, is that analyses of the interfacial profiles exhibit Cu₃Sn-rich, Cu₆Sn₅-rich, and tin-rich phases, which match with the boundaries of solder/Cu₆Sn₅, Cu₆Sn₅/Cu₃Sn, and Cu₃Sn/copper, respectively. The second, is that the semi-quantitative measurements with a peak-fitting model employed suffices to evaluate the interfacial concentration profiles with a statistical variation less than 5 mol %.     

Three Dimensional Morphology and Microstructural Evolution of Bainite in Steels

The 3-D morphology of bainite in steels has been studied by SEM with high resolution. Based on the dual-surface observation results, the bainite is divided into three sub-categories:upper,transient and lower bainites. The subplates composing upper bainite sheaf are lath-like while the whole morphology of lower bainite and that of its subplates are plate-shaped. The subunits in lower bainite seem to be lumpish. The 3-D morphology of transient bainite proves to resemble both upper and lower bainites on some aspects. The microStructural evolution of three types of bainite has been discussed.     

Cu/Sn37Pb/Cu钎焊接头界面微观结构及其剪切性能

本工作借助扫描电镜(SEM)等手段,针对Cu/Sn37Pb/Cu钎焊接头进行剪切断裂实验,考察并分析钎焊及等温时效处理后焊点接头金属间化合物(IMC)的生长情况以及搭接焊点的剪切强度和断裂模式,旨在深入研究高体积分数界面IMC层对钎焊接头剪切性能及断裂形貌的影响。实验结果表明:在时效处理过程中,界面Cu3Sn层逐渐增厚且逐渐变得平坦。此外,在Cu3Sn/Cu界面观察到柯肯达尔空洞现象,随着时效时间的延长,空洞数量增多且尺寸变大。随着界面IMC层厚度增加,接头的剪切强度先增加后下降,这可能是由于脆性IMC厚度过大或粗化的富Pb相和富Sn相增多引起的。当时效时间与钎焊时间较短时,焊点具有较高体积分数的本体焊料,焊点断裂模式为韧性断裂,随着时效时间或钎焊时间的延长,焊点内IMC体积分数逐渐升高,焊点断裂模式开始转变为韧脆混合断裂,最后转变为脆性断裂。     

Characteristics of Laser Reflow Bumping of Sn3.5Ag and Sn3.5Ag0.5Cu Lead-Free Solder Balls

ead-free Sn3.5Ag and Sn3.5Ag0.5Cu solder balls were reflowed by laser to form solder bumps. Shear test was performed on the solder bumps, and SEM/EDX （scanning electron microscopy/energy dispersive X-ray spectrometer） was used to analyze the formation of intermetallic compounds （IMCs） at interface region. A finite element modeling on the temperature gradient and distribution at the interface of solder bump during laser reflow process was conducted to elucidate the mechanism of the IMCs growth direction. The results show that the parameters window for laser reflow bumping of Sn3.5Ag0.5Cu was wider than that of Sn3.5Ag. The shear strength of Sn3.5Ag0.5Cu solder bump was comparable to that of Sn3.5Ag solder bump, and was not affected obviously by laser power and irradiation time when appropriate parameters were used. Both laser power and heating time had a significant effect on the formation of IMCs. A continuous AuSn4 intermetallic compound layer and some needle-like AuSn4 were observed at the interface of solder and Au/Ni/Cu metallization layer when the laser power is small. The formation of needle-like AuSn4 was due to temperature gradient at the interface, and the direction of temperature gradient was the preferred growth direction of AuSn4. With increasing the laser power and heating time, the needle-like AuSn4 IMCs dissolved into the bulk solder, and precipitated out once again during solidification along the grain boundary of the solder bump.     

Competitive growth of Cu3Sn and Cu6Sn5 at Sn/Cu interface during various multi-reflow processes

Journal of Materials Science: Materials in Electronics - The competitive growth of Cu3Sn and Cu6Sn5 in the multi-reflow processes induced by temperature, time, and cooling rate was systematically...