石墨纤维表面镀铜工艺及性能研究

采用化学镀铜方法,以SnCl_2为敏化剂、银氨溶液为活化剂及甲醛为还原剂,并利用正交实验方法在石墨纤维表面镀铜,成功制备了铜基复合材料用石墨纤维增强体。研究了石墨纤维表面化学镀铜的最优工艺参数。实验结果表明,通过优化的正交试验参数,可以在石墨纤维表面获得质量良好,厚度均一的铜镀层,其最佳工艺参数为15g CuSO_4·5H_2O、30g EDTA-2Na、10mL甲醛、温度60℃;实验得到镀铜反应的最佳pH值为12.4;制备过程中,气流搅拌方法的引入使得所获镀层稳定性和均匀性更佳。采用优化后的工艺对镀铜后的纤维进行导电性能测试,结果表明纤维电导率大大提升。     

镀铜导电聚酰亚胺纤维的制备及其性能研究

采用化学镀方法在聚酰亚胺纤维表面进行镀铜,实现聚酰亚胺纤维表面金属化。通过场发射扫描电子显微镜、能谱仪、微电子测试仪等测试手段对所制备的样品进行表征。讨论了工艺条件对镀铜纤维镀层厚度和表面电阻的影响,确定了最佳的施镀时间和温度,并对镀层的形貌、成分、结合强度和导电性能进行了分析。实验结果表明,在时间为10min,温度为33℃条件下化学镀铜处理后,聚酰亚胺纤维表面的镀层覆盖均匀、致密,晶粒细致,厚度约为0.75μm,与纤维结合力好,导电性能优越。     

石墨化度及纤维含量对C/C复合材料性能的影响

以短切高模炭纤维为增强体.制备C/C复合材料,并采用XRD、SEM等方法研究了纤维体积含量和石墨化度对复合材料性能的影响.结果表明:当短切高模炭纤维体积含量小于7%时,随着炭纤维体积含量增加,C/C复合材料的力学性能逐渐升高,高于7%时力学性能降低;随着石墨化度提高,C/C复合材料的力学性能显著降低,短切高模炭纤维增强作用下降;C/C复合材料的石墨化度对电阻率影响大,纤维体积含量对电阻率几乎没有影响;C/C复合材料的石墨化度对材料的抗氧化性影响显著.     

连续炭纤维增强ABS界面性能研究

选用国产的连续炭纤维长丝与ABS树脂分别采用常规共混法、薄膜层叠法、溶液浸渍法三种工艺制备了连续炭纤维增强ABS热塑性树脂复合材料。通过对复合材料的力学性能、热性能、动态黏弹性及微观形貌的研究,分析了ABS热塑性树脂基复合材料的制备工艺对界面性能的影响。结果表明:不同制备工艺中复合材料随炭纤维含量的增加其各项力学性能都不断提高,当炭纤维含量为60%(质量分数)时力学性能达到最高,但不同制备工艺导致复合材料界面性能差异较大,影响其力学性能的增幅。溶液浸渍法制备的复合材料树脂对炭纤维的浸润性良好,其最大拉伸强度和层间剪切强度分别达到1100MPa和71MPa,较常规共混法复合材料性能提高约80%;其损耗角正切仅为常规共混法复合材料的40%;界面性能提高使复合材料的耐热性能提高。     

Cu-CF/EP复合材料导电与阻尼性能研究

研究不同长径比的碳纤维(CF)对环氧树脂阻尼性能的影响,从结构设计上对CF镀铜处理,采用SEM对镀铜CF(Cu-CF)进行验证,并研究Cu-CF/EP复合材料的力学、导电以及阻尼性能。结果表明:CF表面镀铜均匀;加入较少量大长径比CF能很好地提高复合材料的冲击强度,但是弯曲强度却明显降低,而加入较多的小长径比CF对材料的力学性能有所增强。此外CF-P3200能很好地提高复合材料的导电性能和阻尼性能。     

铜镀层复合材料的吸波性能

以2种织物材料为基材,采用化学镀铜的方法,进行铜镀层和吸波涂层复合材料的试验研究。分析了铜镀层的成分结构、织物种类、叠层顺序等因素对复合材料在9. 35 GHz下反射率的影响规律,并探讨了铜镀层对吸波特性的影响机制。研究表明,对于织物基材先涂敷吸波涂层再化学镀铜的复合结构,与未氧化的铜镀层相比,空气中氧化8天的铜镀层使无纺布吸波复合材料的反射率峰值由 - 11 dB降低至 - 13. 2 dB。对于织物基材先化学镀铜再涂敷吸波涂层的复合结构,40℃ 镀铜与常温镀铜相比,在反射率曲线峰值接近的情况下,吸波材料总厚度下降了约 1. 4 mm,说明铜镀层可用于改进吸波材料的微波吸收效果。      

涤纶织物纳米Fe3O4颗粒化学复合镀铜

采用化学镀技术,实现了涤纶织物纳米Fe3O4颗粒化学复合镀铜,借助SEM、EDX和TG对镀层表面形貌、成份以及织物热性能进行了研究,测试了化学镀铜织物的电磁波屏蔽、导电和耐磨性能.结果表明与普通镀铜织物相比,纳米Fe3O4复合镀铜织物的热起始分解温度没有明显变化;随着纳米Fe3O4添加量的增加,镀速先下降后上升,纳米Fe3O4复合镀铜织物的耐磨性能先增强后稍有所减弱;使用三聚磷酸钠作为分散剂时,镀层表面晶孢颗粒细小、分布均匀;当增重率接近时,纳米Fe3O4复合镀铜织物的电磁波屏蔽性能较普通镀铜织物为好.     

SiCp表面化学镀对SiCp/Al复合材料微结构及热性能影响

为了改善SiCp与Al基体之间的界面,在碱性条件下,甲醛作为还原剂,采用化学镀的方法在SiCp表面沉积铜层,然后采用无压渗透方法制备SiCp/Al复合材料。采用X射线衍射仪、3D立体视频显微镜、扫描电子显微镜来分析化学镀后SiCp和复合材料的表面、界面形貌、组织结构及物相,并通过EDS能谱对复合材料表面元素成分分析,利用激光闪光法测定复合材料导热系数。结果表明,相比酒石酸钾钠单一络合剂,采用酒石酸钾钠和EDTA-2Na组成的双络合剂的SiCp镀层更致密,且镀层未被氧化,复合材料界面结合良好,界面厚度为2.5~3μm,有AlCu2相生成,无Al4C3脆性相存在。室温下,镀铜后的复合材料热导率达到181 W/(m·K),远高于没有表面改性的复合材料热导率102 W/(m·K)。     

中间相沥青基石墨纤维表面化学镀铜及性能表征

采用化学镀法对中间相沥青基石墨纤维(MPGFs)进行镀铜,探究了镀液温度和pH值对镀铜工艺的影响,利用扫描电子显微镜-能谱仪(SEM-EDS)、X射线衍射仪(XRD)等表征了镀铜石墨纤维的表面形貌及成分,测试了其电阻率和镀铜层与石墨纤维的结合力。结果表明:当镀液温度为60℃、pH值为13.0时,MPGFs被均匀地镀上了一层致密的铜层,且两相之间结合良好。该镀铜石墨纤维的电阻率降低至7.52μΩ·cm。     

短纤维/ABS树脂复合材料导电导热性能研究

以沥青基短纤维为填料、ABS树脂为基体,采用热压成型工艺制备了短纤维/ABS树脂复合材料,研究了短纤维在复合材料中的分散形貌及其含量和长度对复合材料导电、导热和抗冲击性能的影响。研究结果表明:短纤维在复合材料中分散较为均匀,可以形成较好的导电和导热网络。复合材料沿垂直热压方向的室温电阻率和热导率随短纤维含量和长度的增加而分别呈降低和升高趋势,其电阻率具有明显的"渗逾"现象,添加0.5mm长的纤维粉的复合材料的导电突变用量约为13wt.%,其电阻率为0.6Ω·m,而填充长度为3mm和6mm短纤维的复合材料的渗逾值约为11wt.%,相应电阻率降低至9.0×10-3Ω·m和1.0×10-3Ω·m。当3mm长短纤维含量为29wt.%时,复合材料的室温热导率为23.3W/m·K,较纯ABS树脂提高了136倍。     

Study of electroless copper plating on ABS resin surface modified by heterocyclic organosilane self-assembled film

6-(3-triethoxysilylpropyl)amino-1, 3, 5-triazine-2, 4-dithiol monosodium (TES) was used to fabricate self-assembled film on corona pretreated acrylonitrile–butadiene–styrene (ABS) resin surface. The self-assembled film modified ABS resin was treated by electroless copper plating. Orthogonal test was carried out to study optimal condition of the process. The surface appearance, plating rate and thickness of electroless copper films were investigated to determine the optimal time of corona-discharge, self-assembly and electroless copper plating. SEM results indicated that porous morphology appeared on ABS resin surface modified by TES self-assembled film and the surface roughness also increased. The adhesion test showed that the adhesion property between ABS resin and copper was excellent. The surface of electroless copper film had high brightness under the optimal condition of 1 min corona-discharge, 30 min self-assembly and 10 min electroless copper plating. The electroless-copper plating temperature was 55 ～ 60°C and pH was 13 ～ 13·5.     

Electroless copper deposition on aluminum-seeded ABS plastics

We report a method of converting non-conductive plastic surfaces into conductive by coating either aluminum or aluminum-carbon black containing enamel pastes onto acrylonitrile-butadiene-styrene (ABS) plastics to create aluminum-seeded surfaces for a subsequent copper deposition. Through a simple electroless procedure, copper ions were reduced on the Al seeds and deposited on the ABS surface to develop a conductive layer in about 10-min deposition time. We demonstrate that addition of carbon black particles to the pastes shorten the time to reach the maximum conductivity and enhance the adhesion of electrolessly deposited copper layer to the ABS substrate surface. The electroless copper deposition process developed in this study may open up a new route of plating on plastics (POP) for printed circuit boards, electromagnetic interference shielding, and many other applications.     

Preparation and Research of Electroless Copper on Carbon Fibers

In this paper, Cu coated carbon fibers were prepared using the electroless plating method. Effects of pretreatment, dispersing capability, formaldehyde, temperature, and pH on electroless plating process were studied. The connection between the Cu²⁺ concentration in the electroless plating solution and the plating time at different temperatures was studied. The process of the electroless Cu plating was analyzed and calculated, which derived the activation energy of the electroless copper plating on carbon fibers: Ea = 32.68 kJ/mol. The effect of the mass of carbon fibers and Cu coated carbon fibers which were dispersed in 80 mL distilled water on the conductivity of the solution was also studied. And as a result, the conductivity of the solution increased with the amount increasing. However, when the amount of the fibers was more than 0.08 g, the fibers would be incompletely dispersed. Thus, it could be concluded that the best accession amount of carbon fibers in 80 mL distilled water was 0.08 g. The corresponding conductivity values of carbon fibers and copper-coated fibers were 12.5 and 20.5 µs/cm, respectively.     

镀Ag玻璃微珠-膨胀石墨/聚氯乙烯导电复合材料的制备与表征

采用一种无Pd无SnCl₂化学镀Ag新工艺对空心玻璃微珠（HGB）表面进行化学镀Ag,然后通过熔融共混方法制备镀Ag玻璃微珠（Ag-GB）-膨胀石墨（EG）/聚氯乙烯（PVC）复合材料。借助SEM、EDS和XRD测试手段对Ag-GB镀层的表面形貌与结构进行了表征,研究了Ag-GB和EG作为复合填料对Ag-GB-EG/PVC复合材料导电和力学性能的影响。结果表明:预处理的HGB的表面更易于Ag层的沉积,镀覆的镀层更为均匀、致密;Ag-GB表面的Ag层质量分数为81.15%;固定Ag-GB的质量分数为15%,随着EG质量分数的增加,Ag-GB（15%）-EG/PVC复合材料的体积电阻率呈非线性降低趋势,当EG的质量分数达到逾渗阈值12%时,Ag-GB（15%）-EG/PVC复合材料的体积电阻率为2.18×103 Ω·cm,满足抗静电PVC材料的应用要求。添加质量分数为12%的EG,Ag-GB（15%）-EG/PVC复合材料的体积电阻率与单独填充质量分数为50%的Ag-GB时Ag-GB/PVC复合材料的体积电阻率相当,此时其拉伸强度达到最大值。      

Evolution of microstructure and electrical conductivity of electroless copper deposits on a glass substrate

This paper describes the evolution of the microstructure and conductivity of electroless copper deposition on a glass substrate for applications in electronics manufacture. The glass was activated using a (3-aminopropyl)trimethoxysilane pre-treatment followed by a Pd/Sn catalyst. Surface morphology of the deposited copper films was characterized using a dual beam focused ion beam field emission scanning electron microscope, and together with atomic force microscopy, showed clearly that the roughness and grain size tended to increase with the plating time. Film thickness measurements showed a high initial deposition rate, which slowed to a constant level as the thickness increased above 100 nm. This corresponded with the resistivity of the films which decreased rapidly as the thickness increased from 20 to 100 nm, but then remained largely stable at a level approximately twice that of bulk copper.     

4 μm SiC颗粒表面化学镀铜工艺

为了增强微米级SiC陶瓷颗粒与金属基体的结合力,采用化学镀铜法对SiC颗粒表面进行了改性处理,使SiC颗粒在金属基体液中分散更均匀、镀覆更好。通过正交试验法优化了化学镀铜工艺的主要参数,研究了其主要工艺条件对化学镀铜的影响;分别通过JSM7500F,S-3400N扫描电镜(SEM)对微米级SiC颗粒镀铜前后的表观形貌进行了观察分析,利用X射线衍射仪(XRD)对其镀铜前后的组成进行了表征,并测试了镀铜层与SiC颗粒的结合力;同时对比了微米级SiC颗粒镀铜前后对锌基复合材料微观形貌的影响;讨论了镀液中配位剂、pH值、还原剂等对铜镀层的影响。结果表明:随着镀液中配位剂、还原剂含量的增加,单位时间内微米级SiC颗粒表面镀铜层的质量先增加后降低,pH值的升高显著降低了镀铜的诱导时间;可实现微米级SiC颗粒表面化学镀铜层的均匀镀覆,且结合良好。     

Sputter deposition of ZnO nanorods/thin-film structures on Si

Using a recently developed sputter deposition technique, ZnO deposits were grown at the room temperature on silicon wafers with various kinds of copper surface layers. The copper layers were prepared using sputter deposition, thermal evaporation, or electroless plating technique. It was found that the surface copper prepared using both sputter deposition and thermal evaporation technique grew only ZnO thin films, while the surface copper prepared using sputter deposition technique grew ZnO nanorods/thin-film deposits. The relation between the copper characteristics and the growth of ZnO nanorods/thin-film deposits was investigated. The growth kinetics of the ZnO nanorods/thin film structure is also discussed.     

高热导率Ag-AlN/聚丙烯酸酯导电胶黏剂的制备与性能

分别采用无钯化学镀法和溶液聚合法制备了Ag-AlN和聚丙烯酸酯胶黏剂,并采用超声辅助溶液共混法制备了高热导率Ag-AlN/聚丙烯酸酯导电胶黏剂。采用XRD、EDS和SEM等对Ag-AlN的结构进行分析。结果表明:经过高温和酸性清洗液清洗等处理, AlN表面的杂质被除去,并且在AlN表面形成致密的Al₂O₃层,采用无钯化学镀法制备的Ag-AlN具有优异的电导率和热导率,其电导率由AlN的10-13 S/cm提高到了7.06×102 S/cm,热导率由AlN的170 W/(m·K)提高到了230 W/(m·K)。经过计算, Ag-AlN表面的Ag镀层质量分数约为13%, Ag镀层的厚度约为80 nm。当导电胶黏剂中Ag-AlN填料的质量分数为50%时, Ag-AlN/聚丙烯酸酯导电胶黏剂的电导率为1.9 S/cm,热导率为3.1 W/(m·K)。      

Preparation of magnetic ZSM-5/Ni/fly-ash hollow microspheres using fly-ash cenospheres as the template

Magnetic ZSM-5/Ni/fly-ash hollow microspheres are prepared by using fly-ash cenospheres as the template. The preparation procedure mainly includes two steps, i.e., preparation of magnetic nickel/fly-ash composites by electroless plating and growth of the ZSM-5 layers on the nickel/fly-ash composites by a secondary growth method. The samples are characterized by scanning electron microscope, X-ray diffraction, nitrogen adsorption and vibrating sample magnetometer. The resulting ZSM-5/Ni/fly-ash hollow microspheres show integral hollow structure and magnetic property. They are floatable on water surface when the electroless plating time is 10 min and the hydrothermal synthesis time is 12 h at 180 °C. The floatability of these hollow microspheres can further be adjusted by changing the electroless plating and hydrothermal synthesis times. Furthermore, their magnetic property can also be managed by controlling the synthesis conditions.