A 2.0-/spl mu/m pixel pitch MOS image sensor with 1.5 transistor/pixel and an amorphous Si color filter

In this paper, an ultrafine pixel size (2.0/spl times/2.0 /spl mu/m/sup 2/) MOS image sensor with very high sensitivity is developed. The key technologies that realize the MOS image sensor are a newly developed pixel circuit configuration (1.5 transistor/pixel), a fine 0.15-/spl mu/m design rule, and an amorphous Si color filter (Si-CF). In the new pixel circuit configuration, a unit pixel consists of one photodiode, one transfer transistor, and an amplifier circuit with two transistors that are shared by four neighboring pixels. Thus, the unit pixel has only 1.5 transistors. The fine design rule of 0.15 /spl mu/m enables reduction of wiring area by 40%. As a result, a high aperture ratio of 30% is achieved. A newly developed Si-CF realizes the 1/10 thickness of that of the conventional organic-pigment CF, giving rise to high light-collection efficiency. With these three technologies combined, a high sensitivity of 3400 electrons/lx/spl middot/s is achieved even with a pixel size of 2.0/spl times/2.0 /spl mu/m/sup 2/.     

CMOS active pixel image sensor

A new CMOS active pixel image sensor is reported. The sensor uses a 2.0 μm double-poly, double-metal foundry CMOS process and is realized as a 128×128 array of 40 μm×40 μm pixels. The sensor features TTL compatible voltages, low noise and large dynamic range, and will be useful in machine vision and smart sensor applications     

A 1.5-V 45-mW direct-conversion WCDMA receiver IC in 0.13-/spl mu/m CMOS

A 2-GHz direct-conversion receiver for wide-band code division multiple access (WCDMA) is presented. It includes two low-noise amplifiers (LNAs), an I/Q demodulator, and two sixth-order baseband channel select filters with programmable gain. Quadrature local oscillator (LO) signals are generated on chip in a frequency divider flip-flop. An external interstage filter between the LNAs rejects transmitter leakage to relax demodulator linearity requirements. A low-voltage demodulator topology improves linearity as well as demodulator output pole accuracy. The active-RC baseband filter uses a programmable servo loop for offset compensation and provides an adjacent channel rejection of 39 dB. Programmable gain over 71-dB range in 1-dB steps is merged with the filter to maximize dynamic range. An automatic on-chip frequency calibration scheme provides better than 1.5% corner frequency accuracy. The receiver is integrated in a 0.13-/spl mu/m CMOS process with metal-insulator-metal (MIM) capacitors. Measured receiver performance includes a 6.5-dB noise figure, IIP2 of +27 dBm, and IIP3 of -8.6 dBm. Power consumption is 45 mW.     

1.2-V 5-/spl mu/W class-AB CMOS log-domain integrator with multidecade tuning

An integrator employing the log-domain principle and fabricated in a 0.8-/spl mu/m CMOS process is presented. It uses floating-gate MOS transistors biased in weak inversion to achieve low-voltage operation and low power consumption. The circuit does not suffer from initial charge trapped in the floating gates, thus not requiring postfabrication charge removal. It can be frequency tuned over more than three decades, from 25 Hz to 35 kHz, and uses a 1.2-V single supply to achieve a dynamic range at 1% THD of 75 dB thanks to its balanced class-AB operation. For cutoff frequencies in the range of 100 Hz, the supply voltage can be reduced down to 1 V. The circuit occupies an active area of 0.1 mm/sup 2/ and dissipates 4.7 /spl mu/W. The technique employed can be readily extended to high-order filters.     

A 1.5-V direct digital synthesizer with tunable delta-sigma modulator in 0.13-/spl mu/m CMOS

In direct digital synthesizer (DDS) applications, the drawback of the conventional delta sigma (/spl Delta//spl Sigma/) modulator structure is that its signal band is fixed. In the new architecture presented in this paper, the signal band of the /spl Delta//spl Sigma/ modulator is tuned according to the DDS output frequency. We use a hardware-efficient phase-to-sine amplitude converter in the DDS that approximates the first quadrant of the sine function with 16 equal-length piecewise second-degree polynomial segments. The DDS is capable of frequency, phase, and quadrature amplitude modulation. The die area of the chip is 2.02 mm/sup 2/ (0.13 /spl mu/m CMOS technology). The total power consumption is 138 mW at 1.5 V with an output frequency of 63.33 MHz at a clock frequency of 200 MHz (D/A converter full-scale output current: 11.5 mA).     

A 0.5-V 1-/spl mu/W successive approximation ADC

A successive approximation analog-to-digital converter (ADC) is presented operating at ultralow supply voltages. The circuit is realized in a 0.18-/spl mu/m standard CMOS technology. Neither low-V/sub T/ devices nor voltage boosting techniques are used. All voltage levels are between supply voltage V/sub DD/ and ground V/sub SS/. A passive sample-and-hold stage and a capacitor-based digital-to-analog converter are used to avoid application of operational amplifiers, since opamp operation requires higher values for the lowest possible supply voltage. The ADC has signal-to-noise-and-distortion ratios of 51.2 and 43.3 dB for supply voltages of 1 and 0.5 V, at sampling rates of 150 and 4.1 kS/s and power consumptions of 30 and 0.85 /spl mu/W, respectively. Proper operation is achieved down to a supply voltage of 0.4 V.     

A 1-V 140-/spl mu/W 88-dB audio sigma-delta modulator in 90-nm CMOS

A single-loop third-order switched-capacitor /spl Sigma/-/spl Delta/ modulator in 90-nm standard digital CMOS technology is presented. The design is intended to minimize the power consumption in a low-voltage environment. A load-compensated OTA with rail-to-rail output swing and gain enhancement is chosen in this design, which provides higher power efficiency than the two-stage OTA. To lower the power consumption further, class-AB operation is also adapted in the OTA design. Due to the relatively low threshold voltage of the advanced technology, no clock bootstrapping circuits are needed to drive the switches and the power consumption of the digital circuits is reduced. All the capacitors are implemented using multilayer metal-wall structure, which can provide high-density capacitance. The modulator achieves 88-dB dynamic range in 20-kHz signal bandwidth with an oversampling ratio of 100. The power consumption is 140 /spl mu/W under 1-V supply voltage and the chip core size is 0.18 mm/sup 2/.     

A 1.5 V CMOS 4-bit microcomputer needs only 100 /spl mu/W

Describes a new 4-bit microcomputer fabricated using a low-power silicon gate CMOS process and working from a supply voltage down to 1.2 V. The /spl mu/C can directly drive up to seven 3:1 multiplexed LCD digits, scan up 48 keys, and perform 4-bit handshaking data transfer with external devices. 16-bit, single-word instructions and eight stack levels permit efficient use of the 640-word ROM. Operating from a 4.19 MHz crystal, the device has an instruction cycle time of 15 /spl mu/s. An operating power of 100 /spl mu/W at 1.5 W makes the chip ideal for performing control and timing functions in battery operated applications.     

A true-1-V 300-/spl mu/W CMOS-subthreshold log-domain hearing-aid-on-chip

This paper presents a true very low-voltage low-power complete analog hearing-aid system-on-chip as a demonstrator of novel analog CMOS circuit techniques based on log companding processing and using MOS transistors operating in subthreshold. Low-voltage circuit implementations are given for all of the required functions including amplification and automatic gain control filtering, generation, and pulse-duration modulation. Based on these blocks, a single 1-V 300-/spl mu/A application specific integrated circuit integrating a complete hearing aid in a standard 1.2-/spl mu/m CMOS technology is presented along with exhaustive experimental data. To the authors' knowledge, the presented system is the only CMOS hearing aid with true internal operation at the battery supply voltage and with one of the lowest current consumptions reported in literature. The resulting low-voltage CMOS circuit techniques may also be applied to the design of A/D converters for digital hearing aids.     

A 3-V, 0.35-/spl mu/m CMOS Bluetooth receiver IC

A fully integrated CMOS low-IF Bluetooth receiver is presented. The receiver consists of a radio frequency (RF) front end, a phase-locked loop (PLL), an active complex filter, a Gaussian frequency shift keying (GFSK) demodulator, and a frequency offset cancellation circuit. The highlights of the receiver include a low-power active complex filter with a nonconventional tuning scheme and a high-performance mixed-mode GFSK demodulator. The chip was fabricated on a 6.25-mm/sup 2/ die using TSMC 0.35-/spl mu/m standard CMOS process. -82 dBm sensitivity at 1e-3 bit error rate, -10 dBm IIP3, and 15 dB noise figure were achieved in the measurements. The receiver active current is about 65 mA from a 3-V power supply.     

A CMOS image sensor with a double-junction active pixel

A CMOS image sensor that employs a vertically integrated double-junction photodiode structure is presented. This allows color imaging with only two filters. The sensor uses a 184*154 (near-QCIF) 6-transistor pixel array at a 9.6-/spl mu/m pitch implemented in 0.35-/spl mu/m technology. Results of the device characterization are presented. The imaging performance of an integrated two-filter color sensor is also projected, using measurements and software processing of subsampled images from the monochrome sensor with two color filters.     

A 9-V/Lux-s 5000-frames/s 512/spl times/512 CMOS sensor

A high-responsivity 9-V/Lux-s high-speed 5000-frames/s (at full 512/spl times/512 resolution) CMOS active pixel sensor (APS) is presented in this paper. The sensor was designed for a 0.35-/spl mu/m 2P3M CMOS sensor process and utilizes a five-transistor pixel to provide a true parallel shutter. Column-parallel analog-to-digital converter (ADC) architecture yields fast readout from pixels and digitization of the data simultaneously with acquiring a new frame. The chip has a two-row SRAM to store data from the ADC and read previous rows of data out of the chip. There are a total of 16 parallel ports operating up to 90 MHz delivering /spl sim/1.3 Gpixel/s or 13 Gb/s of data at the maximum rate. In conclusion, a comparison between two high-speed digital CMOS sensor architectures, which are a column-parallel APS and a digital pixel sensor (DPS), is conducted.     

A low voltage hybrid bulk/SOI CMOS active pixel image sensor

A hybrid bulk/silicon-on-insulator (SOI) complementary metal oxide semiconductor (CMOS) active pixel image sensor has been fabricated and studied. The active pixel comprised of reset and source follow transistors on the SOI thin film while the photodiode is fabricated on the SOI handling substrate after removing the buried oxide. The bulk photodiode can be optimized for efficiency with the use of lightly doped SOI substrate without compromising the circuit performance. On the other hand, the elimination of wells on the SOI thin-film allows the use of PMOSFET without increasing the pixel size. The addition of a PMOSFET in the active pixel structure can reduce the minimum operating voltage of the circuit beyond that of conventional designs. With the combination of the high quantum efficiency of bulk photodiode and the low power advantage of SOI technology, the hybrid technology is attractive for scaled low voltage imaging applications     

Readout circuit for CMOS active pixel image sensor

The design and simulation results of a new readout circuit for a CMOS active pixel image sensor are presented. This scheme removes the fixed pattern noise and reduces the signal degradation while offering an increase in readout speed, compared with the conventional approach     

A 10-/spl mu/W standby power 256K CMOS SRAM

A 32K/spl times/8-bit CMOS static RAM using titanium polycide technology has been developed. The RAM has a standby power of 10 /spl mu/W, an active power of 175 mW, and an access time of 55 ns. The standby power has been achieved by an optimization of polysilicon resistors in a memory cell. A digit line circuit controlled by three internal clocks contributes to reduction of active power. The cell size has been reduced to 89.5 /spl mu/m/SUP 2/ by using both a buried isolation and a polycide GND line. Furthermore a simplified address-transition detection circuit and a single data bus configuration result in a small layout area, thus offering a 40.7 mm/SUP 2/ die size.     

A high-voltage output driver in a 2.5-V 0.25-/spl mu/m CMOS technology

The design of a high-voltage output driver in a digital 0.25-/spl mu/m 2.5-V technology is presented. The use of stacked devices with a self-biased cascode topology allows the driver to operate at three times the nominal supply voltage. Oxide stress and hot carrier degradation is minimized since the driver operates within the voltage limits imposed by the design rules of a mainstream CMOS technology. The proposed high-voltage architecture uses a switching output stage. The realized prototype delivers an output swing of 6.46 V to a 50-/spl Omega/ load with a 7.5-V supply and an input square wave of 10 MHz. A PWM signal with a dual-tone sinusoid at 70 kHz and 250 kHz results in an IM3 of -65 dB and an IM2 of -67 dB. The on-resistance is 5.9 /spl Omega/.     

A 2-V 23-/spl mu/A 5.3-ppm//spl deg/C curvature-compensated CMOS bandgap voltage reference

A high-order curvature-compensated CMOS bandgap reference, which utilizes a temperature-dependent resistor ratio generated by a high-resistive poly resistor and a diffusion resistor, is presented in this paper. Implemented in a standard 0.6-/spl mu/m CMOS technology with V/sub thn//spl ap/|V/sub thp/|/spl ap/0.9 V at 0/spl deg/C, the proposed voltage reference can operate down to a 2-V supply and consumes a maximum supply current of 23 /spl mu/A. A temperature coefficient of 5.3 ppm//spl deg/C at a 2-V supply and a line regulation of /spl plusmn/1.43 mV/V at 27/spl deg/C are achieved. Experimental results show that the temperature drift is reduced by approximately five times when compared with a conventional bandgap reference in the same technology.     

A 300-/spl mu/W 1.9-GHz CMOS oscillator utilizing micromachined resonators

A low-power low-phase-noise 1.9-GHz RF oscillator is presented. The oscillator employs a single thin-film bulk acoustic wave resonator and was implemented in a standard 0.18-/spl mu/m CMOS process. This paper addresses design issues involved in codesigning micromachined resonators with CMOS circuitry to realize ultralow-power RF transceiver components. The oscillator achieves a phase-noise performance of -100 dBc/Hz at 10-kHz offset, -120 dBc/Hz at 100-kHz offset, and -140 dBc/Hz at 1-MHz offset. The startup time of the oscillator is less than 1 /spl mu/s. The oscillator core consumes 300 /spl mu/A from a 1-V supply.     

A 1.8-V 2.4/5.15-GHz dual-band LCVCO in 0.18-/spl mu/m CMOS technology

A dual band, fully integrated, low phase-noise and low-power LC voltage-controlled oscillator (VCO) operating at the 2.4-GHz industrial scientific and medical band and 5.15-GHz unlicensed national information infrastructure band has been demonstrated in an 0.18-/spl mu/m CMOS process. At 1.8-V power supply voltage, the power dissipation is only 5.4mW for a 2.4-GHz band and 8mW for a 5.15-GHz band. The proposed VCO features phase-noise of -135dBc/Hz at 3-MHz offset frequency away from the carrier frequency of 2.74GHz and -126dBc/Hz at 3-MHz offset frequency away from 5.49GHz. The oscillator is tuned from 2.2 to 2.85GHz in the low band (2.4-GHz band) and from 4.4 to 5.7GHz in the high band (5.15-GHz band).